Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
A FIFO memory is a storage device that allows data to be written into and read from its array at independent
data rates. The SN74ABT7819 is a high-speed, low-power BiCMOS bidirectional clocked FIFO memory . Two
independent 512 ×18 dual-port SRAM FIFOs on the chip buffer data in opposite directions. Each FIFO has flags
to indicate empty and full conditions, a half-full flag, and a programmable almost-full/almost-empty flag.
The SN74ABT7819 is a clocked FIFO, which means each port employs a synchronous interface. All data
transfers through a port are gated to the low-to-high transition of a continuous (free-running) port clock by enable
signals. The continuous clocks for each port are independent of one another and can be asynchronous or
coincident. The enables for each port are arranged to provide a simple bidirectional interface between
microprocessors and/or buses with synchronous control.
The state of the A0–A17 outputs is controlled by CSA
are active. The A0–A17 outputs are in the high-impedance state when either CSA
written to FIFOA–B from port A on the low-to-high transition of CLKA when CSA
is high, and the IRA flag is high. Data is read from FIFOB–A to the A0–A17 outputs on the low-to-high transition
of CLKA when CSA
is low, W/RA is low, RENA is high, and the ORA flag is high.
and W/RA. When both CSA and W/RA are low, the outputs
or W/RA is high. Data is
is low, W/RA is high, WENA
2
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Page 3
A0–A17
PORT-A OPERATION
B0–B17
PORT-B OPERATION
SN74ABT7819
512 × 18 × 2
CLOCKED BIDIRECTIONAL FIRST-IN, FIRST-OUT MEMORY
SCBS125G – JULY 1992 – REVISED JULY 1998
description (continued)
The state of the B0–B17 outputs is controlled by CSB and W/RB. When both CSB and W/RB are low, the outputs
are active. The B0–B17 outputs are in the high-impedance state when either CSB
written to FIFOB–A from port B on the low-to-high transition of CLKB when CSB
is high, and the IRB flag is high. Data is read from FIFOA–B to the B0–B17 outputs on the low-to-high transition
of CLKB when CSB
is low, W/RB is low, RENB is high, and the ORB flag is high.
or W/RB is high. Data is
is low, W/RB is high, WENB
The setup- and hold-time constraints for the chip selects (CSA
, CSB) and write/read selects (W/RA, W/RB)
enable write and read operations on memory and are not related to the high-impedance control of the data
outputs. If a port read enable (RENA or RENB) and write enable (WENA or WENB) are set low during a clock
cycle, the chip select and write/read select can switch at any time during the cycle to change the state of the
data outputs.
The input-ready (IR) and output-ready (OR) flags of a FIFO are two-stage synchronized to the port clocks for
use as reliable control signals. CLKA synchronizes the status of the input-ready flag of FIFOA–B (IRA) and the
output-ready flag of FIFOB–A (ORA). CLKB synchronizes the status of the input-ready flag of FIFOB–A (IRB)
and the output-ready flag of FIFOA–B (ORB). When the IR flag of a port is low, the FIFO receiving input from
the port is full and writes are disabled to its array . When the OR flag of a port is low , the FIFO that outputs data
to the port is empty and reads from its memory are disabled. The first word loaded to an empty memory is sent
to the FIFO output register at the same time its OR flag is asserted (high). When the memory is read empty and
the OR flag is forced low, the last valid data remains on the FIFO outputs until the OR flag is asserted (high)
again. In this way, a high on the OR flag indicates new data is present on the FIFO outputs.
The SN74ABT7819 is characterized for operation from 0°C to 70°C.
Function Tables
PORT A
SELECT INPUTS
CLKACSAW/RA WENARENA
XHXXXHigh ZNone
↑LHHXHigh ZWrite A0–A17 to FIFOA–B
↑LLXHActiveRead FIFOB–A to A0–A17
PORT B
SELECT INPUTS
CLKBCSBW/RB WENBRENB
XHXXXHigh ZNone
↑LHHXHigh ZWrite B0–B17 to FIFOB–A
↑LLXHActiveRead FIFOA–B to B0–B17
I/OPort-A data. The 18-bit bidirectional data port for side A.
I/OPort-B data. The 18-bit bidirectional data port for side B.
REN FIFOB–A
CSB
W/RB
WENB
RENB
Terminal Functions
FIFOA–B almost-full/almost-empty flag. Depth offsets can be programmed for AF/AEA or the default
value of 128 can be used for both the almost-empty offset (X) and the almost-full offset (Y). AF/AEA is
high when X or fewer words or (512 – Y) or more words are stored in FIFOA–B. AF/AEA is forced high
when FIFOA–B is reset.
FIFOB–A almost-full/almost-empty flag. Depth offsets can be programmed for AF/AEB or the default
value of 128 can be used for both the almost-empty offset (X) and the almost-full offset (Y). AF/AEB is
high when X or fewer words or (512 – Y) or more words are stored in FIFOB–A. AF/AEB is forced high
when FIFOB–A is reset.
Port-A clock. CLKA is a continuous clock that synchronizes all data transfers through port A to its
low-to-high transition and can be asynchronous or coincident to CLKB.
Port-B clock. CLKB is a continuous clock that synchronizes all data transfers through port B to its
low-to-high transition and can be asynchronous or coincident to CLKA.
Port-A chip select. CSA must be low to enable a low-to-high transition of CLKA to either write data from
A0–A17 to FIFOA–B or read data from FIFOB–A to A0–A17. The A0–A17 outputs are in the
high-impedance state when CSA
Port-B chip select. CSB must be low to enable a low-to-high transition of CLKB to either write data from
B0–B17 to FIFOB–A or read data from FIFOA–B to B0–B17. The B0–B17 outputs are in the
high-impedance state when CSB
is high.
is high.
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Page 7
I/O
DESCRIPTION
TERMINAL
NAMENO.
HFA4O
HFB61O
IRA5O
IRB60O
ORA74O
ORB71O
PENA
PENB
RENA75I
RENB70I
RSTA
RSTB
WENA77I
WENB68I
W/RA
W/RB
†
Terminals listed are for the PH package.
†
2I
63I
1I
64I
79I
66I
SN74ABT7819
512 × 18 × 2
CLOCKED BIDIRECTIONAL FIRST-IN, FIRST-OUT MEMORY
SCBS125G – JULY 1992 – REVISED JULY 1998
Terminal Functions (Continued)
FIFOA–B half-full flag. HFA is high when FIFOA–B contains 256 or more words and is low when
FIFOA–B contains 255 or fewer words. HFA is set low after FIFOA–B is reset.
FIFOB–A half-full flag. HFB is high when FIFOB–A contains 256 or more words and is low when
FIFOB–A contains 255 or fewer words. HFB is set low after FIFOB–A is reset.
Port-A input-ready flag. IRA is synchronized to the low-to-high transition of CLKA. When IRA is low,
FIFOA–B is full and writes to its array are disabled. IRA is set low during a FIFOA–B reset and is set high
on the second low-to-high transition of CLKA after reset.
Port-B input-ready flag. IRB is synchronized to the low-to-high transition of CLKB. When IRB is low,
FIFOB–A is full and writes to its array are disabled. IRB is set low during a FIFOB–A reset and is set high
on the second low-to-high transition of CLKB after reset.
Port-A output-ready flag. ORA is synchronized to the low-to-high transition of CLKA. When ORA is low,
FIFOB–A is empty and reads from its array are disabled. The last valid word remains on the FIFOB–A
outputs when ORA is low. Ready data is present for the A0–A17 outputs when ORA is high. ORA is set
low during a FIFOB–A reset and goes high on the third low-to-high transition of CLKA after the first word
is loaded to an empty FIFOB–A.
Port-B output-ready flag. ORB is synchronized to the low-to-high transition of CLKB. When ORB is low,
FIFOA–B is empty and reads from its array are disabled. The last valid word remains on the FIFOA–B
outputs when ORB is low. Ready data is present for the B0–B17 outputs when ORB is high. ORB is set
low during a FIFOA–B reset and goes high on the third low-to-high transition of CLKB after the first word
is loaded to an empty FIFOA–B.
AF/AEA program enable. After FIFOA–B is reset and before a word is written to its array, the binary value
on A0–A7 is latched as an AF/AEA offset when PENA
AF/AEB program enable. After FIFOB–A is reset and before a word is written to its array, the binary value
on B0–B7 is latched as an AF/AEB offset when PENB
Port-A read enable. A high level on RENA enables data to be read from FIFOB–A on the low-to-high
transition of CLKA when CSA
Port-B read enable. A high level on RENB enables data to be read from FIFOA–B on the low-to-high
transition of CLKB when CSB
FIFOA–B reset. T o reset FIFOA–B, four low-to-high transitions of CLKA and four low-to-high transitions
of CLKB must occur while RSTA
FIFOB–A reset. T o reset FIFOB–A, four low-to-high transitions of CLKA and four low-to-high transitions
of CLKB must occur while RSTB
Port-A write enable. A high level on WENA enables data on A0–A17 to be written into FIFOA–B on the
low-to-high transition of CLKA when W/R
Port-B write enable. A high level on WENB enables data on B0–B17 to be written into FIFOB–A on the
low-to-high transition of CLKB when W/R
Port-A write/read select. A high on W/RA enables A0–A17 data to be written to FIFOA–B on a low-to-high
transition of CLKA when WENA is high, CSA
read from FIFOB–A on a low-to-high transition of CLKA when RENA is high, CSA
The A0–A17 outputs are in the high-impedance state when W/R
Port-B write/read select. A high on W/RB enables B0–B17 data to be written to FIFOB–A on a low-to-high
transition of CLKB when WENB is high, CSB
read from FIFOA–B on a low-to-high transition of CLKB when RENB is high, CSB
The B0–B17 outputs are in the high-impedance state when W/R
is low, W/RA is low, and ORA is high.
is low, W/RB is low, and ORB is high.
is low. This sets HFA low, IRA low, ORB low, and AF/AEA high.
is low. This sets HFB low, IRB low, ORA low, and AF/AEB high.
A is high, CSA is low, and IRA is high.
B is high, CSB is low, and IRB is high.
is low, and IRA is high. A low on W/RA enables data to be
is low, and IRB is high. A low on W/RB enables data to be
A. CSA, CSB = 0, W/RA = 1, W/RB = 0
B. X is the almost-empty offset and Y is the almost-full of fset for AF/AEA.
C. HFB and AF/AEB function in the same manner for FIFO B–A.
CLOCKED BIDIRECTIONAL FIRST-IN, FIRST-OUT MEMORY
WY+2W257W258W512–XW513–X
SCBS125G – JULY 1992 – REVISED JULY 1998
SN74ABT7819
512 × 18 × 2
13
Figure 8. FIFOA – B (HFA, AF/AEA) Asynchronous Flag Timing
The AF/AE flag of each FIFO has two programmable limits: the almost-empty offset value (X) and the almost-full
offset value (Y). They can be programmed from the input of the FIFO after it is reset and before a word is written
to its memory. An AF/AE flag is high when its FIFO contains X or fewer words or (512 – Y) or more words.
To program the offset values for AF/AEA, PENA
is brought low after FIFOA–B is reset and only when CLKA is
low. On the following low-to-high transition of CLKA, the binary value on A0–A7 is stored as the almost-empty
offset value (X) and the almost-full offset value (Y). Holding PENA
low for another low-to-high transition of CLKA
reprograms Y to the binary value on A0–A7 at the time of the second CLKA low-to-high transition.
During the first two CLKA cycles used for offset programming, PENA
low. PENA
can be brought high at any time after the second CLKA pulse used for offset programming returns
can be brought high only when CLKA is
low. A maximum value of 255 can be programmed for either X or Y (see Figure 9). To use the default values
of X = Y = 128, PENA
The AF/AEB flag is programmed in the same manner, with PENB
must be tied high. No data is stored in FIFOA–B while the AF/AEA offsets are programmed.
enabling CLKB to program the offset values
taken from B0–B7.Figure 8
RESET
CLKA
PENA
34
IRA
CSA
W/R
WENA
A
YX and YA0–A7
Figure 9. Programming X and Y Separately for AF/AEA
14
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Page 15
V
I
V
CC
GND
SN74ABT7819
512 × 18 × 2
CLOCKED BIDIRECTIONAL FIRST-IN, FIRST-OUT MEMORY
SCBS125G – JULY 1992 – REVISED JULY 1998
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Input voltage range, V
Voltage range applied to any output in the high state or power-off state, V
Current into any output in the low state, I
Input clamp current, I
Output clamp current, I
Package thermal impedance, θ
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51.
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MA Y INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
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intellectual property right of TI covering or relating to any combination, machine, or process in which such
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Copyright 1999, Texas Instruments Incorporated
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