ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
D
Latch-Up Performance Exceeds 500 mA Per
JEDEC Standard JESD-17
D
T ypical V
(Output Ground Bounce) < 1 V
OLP
at VCC = 5 V, TA = 25°C
D
High-Drive Outputs (–32-mA IOH, 64-mA IOL)
D
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, Ceramic Chip Carriers (FK),
Plastic (N) and Ceramic (J) DIPs, and
Ceramic Flat (W) Package
description
The ’ABT540 octal buffers and line drivers are
ideal for driving bus lines or buffer memory
address registers. The devices feature inputs and
outputs on opposite sides of the package that
facilitate printed circuit board layout.
The 3-state control gate is a 2-input AND gate with
active-low inputs so that if either output-enable
(OE1
or OE2) input is high, all corresponding
outputs are in the high-impedance state.
SN54ABT540 ...J OR W PACKAGE
SN74ABT540 . . . DB, DW, N, OR PW PACKAGE
SN54ABT540 . . . FK PACKAGE
A3
A4
A5
A6
A7
(TOP VIEW)
OE1
1
A1
2
A2
3
A3
4
A4
5
A5
6
A6
7
A7
8
9
A8
GND
10
(TOP VIEW)
A2A1OE1
3212019
4
5
6
7
8
910111213
A8
GND
Y8
20
19
18
17
16
15
14
13
12
11
V
CC
Y7
V
CC
OE2
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
18
17
16
15
14
Y6OE2
Y1
Y2
Y3
Y4
Y5
T o ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54ABT540 is characterized for operation over the full military temperature range of –55°C to 125°C. The
SN74ABT540 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
OE1OE2A
LLLH
LLH L
HXX Z
XHXZ
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC-ΙΙB is a trademark of Texas Instruments Incorporated.
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
INPUTS
OUTPUT
Y
Copyright 1997, Texas Instruments Incorporated
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
Page 2
SN54ABT540, SN74ABT540
UNIT
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS188C – FEBRUARY 1991 – REVISED JANUARY 1997
1
19
2
3
4
5
6
7
8
9
†
&
EN
1
18
17
16
15
14
13
12
11
logic symbol
OE1
OE2
A1
A2
A3
A4
A5
A6
A7
A8
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and
IEC Publication 617-12.
logic diagram (positive logic)
OE1
OE2
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
1
19
218
A1
Y1
To Seven Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51, except for through-hole packages,
which use a trace length of zero.
–0.5 V to 5.5 V. . . . . . . . . . . . . . . . . . .
O
‡
recommended operating conditions (see Note 3)
SN54ABT540SN74ABT540
MINMAXMINMAX
V
V
V
V
I
OH
I
OL
∆t/∆vInput transition rise or fall rateOutputs enabled55ns/V
T
NOTE 3: Unused inputs must be held high or low to prevent them from floating.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, C
PARAMETER
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
= 50 pF (unless otherwise noted) (see Figure 1)
L
FROM
TO
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
VCC = 5 V,
TA = 25°C
MINTYPMAXMINMAXMINMAX
12.94.1114.8
13.14.3114.8
1.13.44.91.11.15.9
1.135.81.11.16.4
1.55.36.81.51.57.3
1.24.45.71.21.26.2
SN54ABT540SN74ABT540
UNIT
3
Page 4
SN54ABT540, SN74ABT540
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS188C – FEBRUARY 1991 – REVISED JANUARY 1997
PARAMETER MEASUREMENT INFORMATION
500 Ω
t
w
1.5 V
500 Ω
1.5 V
1.5 V1.5 V
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
Input
Input
Output
Output
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
1.5 V1.5 V
t
PLH
t
PHL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
S1
t
PHL
1.5 V
t
PLH
3 V
0 V
V
V
V
V
7 V
GND
OH
OL
OH
OL
Open
3 V
0 V
Timing Input
Data Input
Output
Output
Control
Control
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
TESTS1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
t
su
1.5 V1.5 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
t
PZL
t
PLZ
1.5 V
t
t
PZH
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
PHZ
1.5 V
Open
Open
1.5 V
t
7 V
h
1.5 V1.5 V
VOL + 0.3 V
VOH – 0.3 V
3 V
0 V
3 V
0 V
3 V
0 V
3.5 V
V
OL
V
OH
≈ 0 V
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Page 5
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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