High-Impedance State During Power Up
and Power Down
D
State-of-the-Art
EPIC-ΙΙB
BiCMOS Design
Significantly Reduces Power Dissipation
D
Typical V
< 1 V at V
D
High-Impedance State During Power Up
(Output Ground Bounce)
OLP
= 5 V, TA = 25°C
CC
and Power Down
D
Distributed VCC and GND Pin Configuration
Minimizes High-Speed Switching Noise
D
Flow-Through Architecture Optimizes PCB
Layout
D
Latch-Up Performance Exceeds 500 mA Per
JEDEC Standard JESD-17
D
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
D
Package Options Include Plastic 300-mil
Shrink Small-Outline (DL), Thin Shrink
Small-Outline (DGG), and Thin Very
Small-Outline (DGV) Packages and 380-mil
Fine-Pitch Ceramic Flat (WD) Package
description
The ’ABT162827A are noninverting 20-bit buffers
composed of two 10-bit buffers with separate
output-enable signals. For either 10-bit buffer , the
two output-enable (1OE1
2OE2) inputs must both be low for the
corresponding Y outputs to be active. If either
output-enable input is high, the outputs of that
10-bit buffer are in the high-impedance state.
The outputs, which are designed to source or sink up to 12 mA, include equivalent 25-Ω series resistors to
reduce overshoot and undershoot.
When VCC is between 0 and 2.1 V , the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 2.1 V, OE
should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54ABT162827A is characterized for operation over the full military temperature range of –55°C to
125°C. The SN74ABT162827A is characterized for operation from –40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus and EPIC-ΙΙB are trademarks of Texas Instruments Incorporated.
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1997, Texas Instruments Incorporated
1
Page 2
SN54ABT162827A, SN74ABT162827A
20-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
Input clamp current, I
Output clamp current, I
Package thermal impedance, θ
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
Page 4
SN54ABT162827A, SN74ABT162827A
PARAMETER
TEST CONDITIONS
UNIT
V
V
V
4.5 V
VOLV
V
V
V
CC
#
,
20-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS248E – JULY 1993 – REVISED MAY 1997
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
TA = 25°CSN54ABT162827A SN74ABT162827A
MIN TYP†MAXMINMAXMINMAX
V
IK
OH
V
hys
I
I
‡
I
OZPU
‡
I
OZPD
§
I
OZH
§
I
OZL
I
off
I
CEX
¶
I
O
I
CC
Data
∆I
C
C
†
All typical values are at VCC = 5 V.
‡
This parameter is characterized, but not production tested.
§
The parameters I
¶
Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
#
This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Page 5
(INPUT)
(OUTPUT)
A
Y
ns
OE
Y
ns
OE
Y
ns
SN54ABT162827A, SN74ABT162827A
20-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS248E – JULY 1993 – REVISED MAY 1997
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, C
PARAMETER
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
= 50 pF (unless otherwise noted) (see Figure 1)
L
FROM
TO
VCC = 5 V,
TA = 25°C
MINTYPMAXMINMAXMINMAX
12.13.614.113.9
1.12.84.21.151.14.7
1.53.46.31.57.21.56.9
1.63.55.31.66.61.66.3
2.14.16.52.16.82.16.6
1.53.55.91.57.31.56.3
SN54ABT162827A SN74ABT162827A
UNIT
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
Page 6
SN54ABT162827A, SN74ABT162827A
20-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS248E – JULY 1993 – REVISED MAY 1997
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
CL = 50 pF
(see Note A)
Input
500 Ω
500 Ω
LOAD CIRCUIT
t
w
1.5 V1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
S1
7 V
Open
GND
3 V
0 V
Timing Input
Data Input
TESTS1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
t
su
1.5 V1.5 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Open
Open
1.5 V
t
7 V
h
3 V
0 V
3 V
0 V
Input
t
PLH
Output
t
PHL
Output
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
1.5 V1.5 V
1.5 V
1.5 V1.5 V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
Figure 1. Load Circuit and Voltage Waveforms
t
PHL
1.5 V
t
PLH
3 V
0 V
V
V
V
V
OH
OL
OH
OL
Output
Control
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
1.5 V
t
PZL
t
PLZ
1.5 V
t
t
PZH
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
PHZ
1.5 V
VOLTAGE WAVEFORMS
1.5 V
VOL + 0.3 V
VOH – 0.3 V
3 V
0 V
3.5 V
V
OL
V
OH
≈ 0 V
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Page 7
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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