Latch-Up Performance Exceeds 500 mA Per
JEDEC Standard JESD-17
D
Typical V
(Output Ground Bounce)
OLP
< 1 V at VCC = 5 V, TA = 25°C
D
High-Impedance State During Power Up
and Power Down
D
Distributed VCC and GND Pin Configuration
Minimizes High-Speed Switching Noise
D
Flow-Through Architecture Optimizes PCB
Layout
D
Package Options Include Plastic 300-mil
Shrink Small-Outline (DL), Thin Shrink
Small-Outline (DGG), and Thin Very
Small-Outline (DGV) Packages and 380-mil
Fine-Pitch Ceramic Flat (WD) Package
Using 25-mil Center-to-Center Spacings
description
The ’ABT162244 are 16-bit buffers and line
drivers designed specifically to improve both the
performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented
receivers and transmitters. These devices can be
used as four 4-bit buffers, two 8-bit buffers, or one
16-bit buffer . These devices provide noninverting
outputs and symmetrical active-low outputenable (OE
) inputs.
SN54ABT162244 . . . WD PACKAGE
SN74ABT162244 . . . DGG, DGV, OR DL PACKAGE
1OE
1Y1
1Y2
GND
1Y3
1Y4
V
CC
2Y1
2Y2
GND
2Y3
2Y4
3Y1
3Y2
GND
3Y3
3Y4
V
CC
4Y1
4Y2
GND
4Y3
4Y4
4OE
(TOP VIEW)
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
2OE
1A1
1A2
GND
1A3
1A4
V
CC
2A1
2A2
GND
2A3
2A4
3A1
3A2
GND
3A3
3A4
V
CC
4A1
4A2
GND
4A3
4A4
3OE
The outputs, which are designed to source or sink up to 12 mA, include equivalent 25-Ω series resistors to
reduce overshoot and undershoot.
When V
is between 0 and 2.1 V , the device is in the high-impedance state during power up or power down.
CC
However, to ensure the high-impedance state above 2.1 V, OE should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54ABT162244 is characterized for operation over the full military temperature range of –55°C to 125°C.
The SN74ABT162244 is characterized for operation from –40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus and EPIC-ΙΙB are trademarks of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1997, Texas Instruments Incorporated
1
Page 2
SN54ABT162244, SN74ABT162244
16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
1.5 V1.5 V
t
PLH
t
PHL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
S1
t
PHL
1.5 V
t
PLH
3 V
0 V
V
V
V
V
7 V
OH
OL
OH
OL
Open
GND
3 V
0 V
Timing Input
Data Input
Output
Control
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
TESTS1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
t
su
1.5 V1.5 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
t
PZL
t
PLZ
1.5 V
t
t
PZH
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
PHZ
1.5 V
Open
Open
1.5 V
t
7 V
h
1.5 V1.5 V
VOL + 0.3 V
VOH – 0.3 V
3 V
0 V
3 V
0 V
3 V
0 V
3.5 V
V
OL
V
OH
≈ 0 V
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
7
Page 8
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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