OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
D
Choice of Eight Latches or Eight D-Type
Flip-Flops in a Single Package
D
3-State Bus-Driving Outputs
D
Full Parallel Access for Loading
D
Buffered Control Inputs
D
Clock-Enable Input Has Hysteresis to
Improve Noise Rejection (’S373 and ’S374)
D
P-N-P Inputs Reduce DC Loading on Data
Lines (’S373 and ’S374)
description
These 8-bit registers feature 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. The
high-impedance 3-state and increased
high-logic-level drive provide these registers with
the capability of being connected directly to and
driving the bus lines in a bus-organized system
without need for interface or pullup components.
These devices are particularly attractive for
implementing buffer registers, I/O ports,
bidirectional bus drivers, and working registers.
The eight latches of the ’LS373 and ’S373 are
transparent D-type latches, meaning that while
the enable (C or CLK) input is high, the Q outputs
follow the data (D) inputs. When C or CLK is taken
low, the output is latched at the level of the data
that was set up.
The eight flip-flops of the ’LS374 and ’S374 are
edge-triggered D-type flip-flops. On the positive
transition of the clock, the Q outputs are set to the
logic states that were set up at the D inputs.
SN54LS373, SN54LS374, SN54S373,
SN74LS373, SN74S374 . . . DW, N, OR NS PACKAGE
SN54S374 . . . J OR W PACKAGE
SN74LS374 . . . DB, DW, N, OR NS PACKAGE
SN74S373 . . . DW OR N PACKAGE
†
C for ’LS373 and ’S373; CLK for ’LS374 and ’S374.
SN54LS373, SN54LS374, SN54S373,
SN54S374 . . . FK PACKAGE
2D
2Q
3Q
3D
4D
†
C for ’LS373 and ’S373; CLK for ’LS374 and ’S374.
(TOP VIEW)
1
OC
2
1Q
3
1D
4
2D
5
2Q
6
3Q
7
3D
8
4D
9
4Q
GND
10
(TOP VIEW)
1D1QOC
3212019
4
5
6
7
8
910111213
4Q
†
GND
20
V
CC
19
8Q
18
8D
17
7D
16
7Q
15
6Q
14
6D
13
5D
12
5Q
†
11
C
CC
8Q
V
8D
18
7D
17
7Q
16
6Q
15
6D
14
5D
C
5Q
Schmitt-trigger buffered inputs at the enable/clock lines of the ’S373 and ’S374 devices simplify system design
as ac and dc noise rejection is improved by typically 400 mV due to the input hysteresis. A buffered
output-control (OC
) input can be used to place the eight outputs in either a normal logic state (high or low logic
levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines
significantly.
OC
does not affect the internal operation of the latches or flip-flops. That is, the old data can be retained or new
data can be entered, even while the outputs are off.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 2002, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
PACKAGE
–
–
–
–
†
TubeSN74LS373NSN74LS373N
TubeSN74LS374NSN74LS374N
TubeSN74S373NSN74S373N
TubeSN74S374NSN74S374N
TubeSN74LS373DW
Tape and reelSN74LS373DWR
TubeSN74LS374DW
Tape and reelSN74LS374DWR
TubeSN74S373DW
Tape and reelSN74S373DWR
TubeSN74S374DW
Tape and reelSN74S374DWR
Tape and reelSN74LS373NSR74LS373
Tape and reelSN74LS374NSR74LS374
Tape and reelSN74S374NSR74S374
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. V oltage values are with respect to network ground terminal.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Voltage values are with respect to network ground terminal.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
Outputs high160
Outputs low160
Outputs disabled190
Outputs high110
Outputs low140
Outputs disabled160
CLK and OC at 4 V, D inputs at 0 V180
‡
TYP
2V
MAXUNIT
0.8V
mA
m
A
m
A
m
A
m
A
switching characteristics, V
FROMTO
(INPUT)(OUTPUT)
f
max
t
PLH
t
PHL
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
NOTE 3. Maximum clock frequency is tested with all outputs loaded.
f
= maximum clock frequency
max
t
= propagation delay time, low-to-high-level output
PLH
t
= propagation delay time, high-to-low-level output
PHL
t
= output enable time to high level
PZH
t
= output enable time to low level
PZL
t
= output disable time from high level
PHZ
t
= output disable time from low level
PLZ
= 5 V, TA = 25°C (see Figure 2)
CC
RL = 280 Ω, CL = 15 pF,
See Note 3
R
= 280 Ω,C
See Note 3
R
= 280 Ω,C
See Note 3
R
= 280 Ω,C
See Note 3
=
L
= 15 pF,
= 15 pF,
= 15 pF,
p
=
L
’S373’S374
MINTYPMAXMINTYPMAX
75100MHz
712
712
714815
12181117
815815
11181118
6959
812712
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Page 11
From Output
Under Test
(see Note A)
SN54LS373, SN54LS374, SN54S373, SN54S374,
SN74LS373, SN74LS374, SN74S373, SN74S374
OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
PARAMETER MEASUREMENT INFORMATION
SERIES 54LS/74LS DEVICES
V
Test
Point
C
L
V
CC
R
L
(see Note B)
From Output
Under Test
(see Note A)
CC
V
CC
R
L
Test
Point
C
L
From Output
Under Test
(see Note A)
Test
R
Point
C
L
L
S1
(see Note B)
5 kΩ
S2
FOR 2-STATE TOTEM-POLE OUTPUTS
High-Level
Low-Level
In-Phase
(see Note D)
Out-of-Phase
(see Note D)
NOTES: A. CL includes probe and jig capacitance.
LOAD CIRCUIT
Pulse
Pulse
Input
t
PLH
Output
t
PHL
Output
PROPAGATION DELAY TIMES
B. All diodes are 1N3064 or equivalent.
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
D. S1 and S2 are closed for t
E. Phase relationships between inputs and outputs have been chosen arbitrarily for these examples.
F. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω, tr ≤ 1.5 ns, tf ≤ 2.6 ns.
G. The outputs are measured one at a time with one input transition per measurement.
H. All parameters and waveforms are not applicable to all devices .
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
D. S1 and S2 are closed for t
E. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω; tr and tf ≤ 7 ns for Series
54/74 devices and tr and tf ≤ 2.5 ns for Series 54S/74S devices.
F. The outputs are measured one at a time with one input transition per measurement.
G. All parameters and waveforms are not applicable to all devices .
1.5 V1.5 V
t
w
1.5 V1.5 V
VOLTAGE WAVEFORMS
PULSE DURATIONS
1.5 V1.5 V
1.5 V1.5 V
1.5 V1.5 V
VOLTAGE WAVEFORMS
, t
PLH
PHL
t
PHL
t
PLH
, t
FOR OPEN-COLLECTOR OUTPUTS
PHZ
LOAD CIRCUIT
3 V
0 V
V
OH
V
OL
V
OH
V
OL
, and t
PLZ
Timing
Input
Data
Input
Output
Control
(low-level
enabling)
t
PZL
Waveform 1
(see Notes C
and D)
t
PZH
Waveform 2
(see Notes C
and D)
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
; S1 is open and S2 is closed for t
LOAD CIRCUIT
FOR 3-STATE OUTPUTS
1.5 V
t
su
1.5 V1.5 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
1.5 V1.5 V
1.5 V
1.5 V
VOLTAGE WAVEFORMS
; S1 is closed and S2 is open for t
PZH
3 V
0 V
t
h
3 V
0 V
3 V
0 V
t
PLZ
≈1.5 V
VOL + 0.5 V
V
OL
t
PHZ
V
OH
VOH – 0.5 V
≈1.5 V
.
PZL
12
Figure 2. Load Circuits and Voltage Waveforms
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Page 13
SN54LS373, SN54LS374, SN54S373, SN54S374,
SN74LS373, SN74LS374, SN74S373, SN74S374
OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
TYPICAL APPLICATION DATA
Bidirectional Bus Driver
Output
Control 1
1Q
2Q
3Q
4Q
or
5Q
6Q
7Q
C
8Q
1D
C
2D
3D
4D
or
5D
6D
7D
8D
Bidirectional
Data Bus 2
Clock 2
Output
Control 2
Bidirectional
Data Bus 1
Clock 1
Bus
Exchange
Clock
Clock 1
Clock 2
1D
2D
3D
4D
5D
6D
7D
8D
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
’LS374
’S374
’LS374
’S374
H
H
Enable Select
Clock Circuit for Bus Exchange
Expandable 4-Word by 8-Bit General Register File
1/2 SN74LS139
or SN74S139
Y0
G
Y1
A
Y2
B
Y3
1/2 SN74LS139
or SN74S139
’LS374 or ’S374
’LS374 or ’S374
’LS374 or ’S374
’LS374 or ’S374
Y0Y1Y2Y3
ABG
Clock
Select
Clock
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
13
Page 14
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable DeviceStatus
78011022AACTIVELCCCFK201Non-RoHS
7801102RAACTIVECDIPJ201Non-RoHS
7801102SAACTIVECFPW201Non-RoHS
JM38510/32502B2AACTIVELCCCFK201Non-RoHS
JM38510/32502BRAACTIVECDIPJ201Non-RoHS
JM38510/32502BSAACTIVECFPW201Non-RoHS
JM38510/32502SRAACTIVECDIPJ2020Non-RoHS
JM38510/32502SSAACTIVECFPW201Non-RoHS
JM38510/32503B2AACTIVELCCCFK201Non-RoHS
JM38510/32503BRAACTIVECDIPJ201Non-RoHS
JM38510/32503BSAACTIVECFPW201Non-RoHS
M38510/32502B2AACTIVELCCCFK201Non-RoHS
M38510/32502BRAACTIVECDIPJ201Non-RoHS
M38510/32502BSAACTIVECFPW201Non-RoHS
M38510/32502SRAACTIVECDIPJ2020Non-RoHS
M38510/32502SSAACTIVECFPW201Non-RoHS
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
& Green
& Green
& Green
& Green
& Green
& Green
& Green
& Green
& Green
& Green
& Green
& Green
& Green
& Green
& Green
& Green
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C)Device Marking
SNPBN / A for Pkg Type-55 to 12578011022A
SNJ54LS
374FK
SNPBN / A for Pkg Type-55 to 1257801102RA
SNJ54LS374J
SNPBN / A for Pkg Type-55 to 1257801102SA
SNJ54LS374W
SNPBN / A for Pkg Type-55 to 125JM38510/
32502B2A
SNPBN / A for Pkg Type-55 to 125JM38510/
32502BRA
SNPBN / A for Pkg Type-55 to 125JM38510/
32502BSA
SNPBN / A for Pkg Type-55 to 125JM38510/
32502SRA
SNPBN / A for Pkg Type-55 to 125JM38510/
32502SSA
SNPBN / A for Pkg Type-55 to 125JM38510/
32503B2A
SNPBN / A for Pkg Type-55 to 125JM38510/
32503BRA
SNPBN / A for Pkg Type-55 to 125JM38510/
32503BSA
SNPBN / A for Pkg Type-55 to 125JM38510/
32502B2A
SNPBN / A for Pkg Type-55 to 125JM38510/
32502BRA
SNPBN / A for Pkg Type-55 to 125JM38510/
32502BSA
SNPBN / A for Pkg Type-55 to 125JM38510/
32502SRA
SNPBN / A for Pkg Type-55 to 125JM38510/
32502SSA
21-Jul-2022
Samples
(4/5)
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Addendum-Page 1
Page 15
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable DeviceStatus
M38510/32503B2AACTIVELCCCFK201Non-RoHS
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C)Device Marking
SNPBN / A for Pkg Type-55 to 125JM38510/
& Green
M38510/32503BRAACTIVECDIPJ201Non-RoHS
SNPBN / A for Pkg Type-55 to 125JM38510/
& Green
M38510/32503BSAACTIVECFPW201Non-RoHS
SNPBN / A for Pkg Type-55 to 125JM38510/
& Green
SN54LS373JACTIVECDIPJ201Non-RoHS
SNPBN / A for Pkg Type-55 to 125SN54LS373J
& Green
SN54LS374JACTIVECDIPJ201Non-RoHS
SNPBN / A for Pkg Type-55 to 125SN54LS374J
& Green
SN54S373JACTIVECDIPJ201Non-RoHS
SNPBN / A for Pkg Type-55 to 125SN54S373J
& Green
SN54S374JACTIVECDIPJ201Non-RoHS
SNPBN / A for Pkg Type-55 to 125SN54S374J
& Green
SN74LS373DWACTIVESOICDW2025RoHS & GreenNIPDAULevel-1-260C-UNLIM0 to 70LS373
SN74LS373DWRACTIVESOICDW202000RoHS & GreenNIPDAULevel-1-260C-UNLIM0 to 70LS373
SN74LS373NACTIVEPDIPN2020RoHS &
NIPDAUN / A for Pkg Type0 to 70SN74LS373N
Non-Green
SN74LS373NE4ACTIVEPDIPN2020RoHS &
NIPDAUN / A for Pkg Type0 to 70SN74LS373N
Non-Green
SN74LS373NSRACTIVESONS202000RoHS & GreenNIPDAULevel-1-260C-UNLIM0 to 7074LS373
SN74LS374DBRACTIVESSOPDB202000RoHS & GreenNIPDAULevel-1-260C-UNLIM0 to 70LS374A
SN74LS374DWACTIVESOICDW2025RoHS & GreenNIPDAULevel-1-260C-UNLIM0 to 70LS374
SN74LS374DWRACTIVESOICDW202000RoHS & GreenNIPDAULevel-1-260C-UNLIM0 to 70LS374
SN74LS374NACTIVEPDIPN2020RoHS & GreenNIPDAUN / A for Pkg Type0 to 70SN74LS374N
SN74LS374NE4ACTIVEPDIPN2020RoHS & GreenNIPDAUN / A for Pkg Type0 to 70SN74LS374N
SN74LS374NSRACTIVESONS202000RoHS & GreenNIPDAULevel-1-260C-UNLIM0 to 7074LS374
SN74LS374NSRG4ACTIVESONS202000TBDCall TICall TI0 to 70
32503B2A
32503BRA
32503BSA
21-Jul-2022
Samples
(4/5)
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Addendum-Page 2
Page 16
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable DeviceStatus
SN74S373NACTIVEPDIPN2020RoHS &
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
NIPDAUN / A for Pkg Type0 to 70SN74S373N
Non-Green
SN74S374NACTIVEPDIPN2020RoHS &
NIPDAUN / A for Pkg Type0 to 70SN74S374N
Non-Green
SNJ54LS373FKACTIVELCCCFK201Non-RoHS
SNPBN / A for Pkg Type-55 to 125SNJ54LS
& Green
SNJ54LS373JACTIVECDIPJ201Non-RoHS
SNPBN / A for Pkg Type-55 to 125SNJ54LS373J
& Green
SNJ54LS373WACTIVECFPW201Non-RoHS
SNPBN / A for Pkg Type-55 to 125SNJ54LS373W
& Green
SNJ54LS374FKACTIVELCCCFK201Non-RoHS
SNPBN / A for Pkg Type-55 to 12578011022A
& Green
SNJ54LS374JACTIVECDIPJ201Non-RoHS
SNPBN / A for Pkg Type-55 to 1257801102RA
& Green
SNJ54LS374WACTIVECFPW201Non-RoHS
SNPBN / A for Pkg Type-55 to 1257801102SA
& Green
SNJ54S373FKACTIVELCCCFK201Non-RoHS
SNPBN / A for Pkg Type-55 to 125SNJ54S
& Green
SNJ54S373JACTIVECDIPJ201Non-RoHS
SNPBN / A for Pkg Type-55 to 125SNJ54S373J
& Green
SNJ54S374FKACTIVELCCCFK201Non-RoHS
SNPBN / A for Pkg Type-55 to 125SNJ54S
& Green
SNJ54S374JACTIVECDIPJ201Non-RoHS
SNPBN / A for Pkg Type-55 to 125SNJ54S374J
& Green
SNJ54S374WACTIVECFPW201Non-RoHS
SNPBN / A for Pkg Type-55 to 125SNJ54S374W
& Green
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
21-Jul-2022
Op Temp (°C)Device Marking
(4/5)
373FK
SNJ54LS
374FK
SNJ54LS374J
SNJ54LS374W
373FK
374FK
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Addendum-Page 3
Page 17
PACKAGE OPTION ADDENDUM
www.ti.com
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54LS373, SN54LS373-SP, SN54LS374, SN54S373, SN54S374, SN74LS373, SN74LS374, SN74S373, SN74S374 :
Military : SN54LS373, SN54LS374, SN54S373, SN54S374
•
Space : SN54LS373-SP
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 4
Page 18
PACKAGE OPTION ADDENDUM
www.ti.com
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
•
21-Jul-2022
Addendum-Page 5
Page 19
PACKAGE MATERIALS INFORMATION
Reel Width (W1)
REEL DIMENSIONS
A0
B0
K0
W
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Dimension designed to accommodate the component width
TAPE DIMENSIONS
K0 P1
B0
W
A0
Cavity
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-150.
www.ti.com
2 MAX
0.05 MIN
Page 24
EXAMPLE BOARD LAYOUT
SSOP - 2 mm max heightDB0020A
SMALL OUTLINE PACKAGE
20X (0.45)
18X (0.65)
1
10
20X (1.85)
SYMM
(R0.05) TYP
20
SYMM
11
(7)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
EXPOSED METAL
0.07 MAX
ALL AROUND
NON-SOLDER MASK
DEFINED
(PREFERRED)
METAL
15.000
SOLDER MASK DETAILS
METAL UNDER
SOLDER MASK
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
SOLDER MASK
OPENING
EXPOSED METAL
4214851/B 08/2019
Page 25
EXAMPLE STENCIL DESIGN
SSOP - 2 mm max heightDB0020A
SMALL OUTLINE PACKAGE
20X (0.45)
18X (0.65)
1
10
20X (1.85)
SYMM
(R0.05) TYP
20
SYMM
11
(7)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4214851/B 08/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
Page 26
Page 27
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Page 30
PACKAGE OUTLINE
A
13.0
12.6
NOTE 3
SCALE 1.200
10.63
TYP
9.97
PIN 1 ID
AREA
1
20
18X 1.27
2X
11.43
SOIC - 2.65 mm max heightDW0020A
SOIC
C
SEATING PLANE
0.1 C
10
B
7.6
7.4
NOTE 4
SEE DETAIL A
11
0.51
20X
0.31
0.25C A B
0.33
TYP
0.10
GAGE PLANE
0 - 8
2.65 MAX
0.25
1.27
0.40
DETAIL A
TYPICAL
4220724/A 05/2016
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side.
5. Reference JEDEC registration MS-013.
0.3
0.1
www.ti.com
Page 31
EXAMPLE BOARD LAYOUT
SOIC - 2.65 mm max heightDW0020A
SOIC
20X (2)
20X (0.6)
18X (1.27)
(R)
0.05
TYP
10
SYMM
1
20
SYMM
11
(9.3)
LAND PATTERN EXAMPLE
SCALE:6X
SOLDER MASK
OPENING
METAL
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
METAL UNDER
SOLDER MASK
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SOLDER MASK
OPENING
4220724/A 05/2016
www.ti.com
Page 32
EXAMPLE STENCIL DESIGN
SOIC - 2.65 mm max heightDW0020A
SOIC
20X (2)
20X (0.6)
18X (1.27)
10
SYMM
1
20
SYMM
11
(9.3)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
4220724/A 05/2016
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
Page 33
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