
1
High Density - Board Mounted Power Division
Powering Communications and Technology
45
50
55
60
65
70
75
80
85
90
10 20 30 40 50 60 70 80 90 100
65
70
75
80
85
90
10 20 30 40 50 60 70 80 90 100
Setpoint Accuracy ±1%
Line Regulation VinMin. - VinMax., I
out
Rated ±0.1% V
out
Load Regulation I
out
Min. - I
out
Max., VinNom ±0.2% V
out
Minimum Output Current 10 % I
out
Rated
Dynamic Regulation, Loadstep 25% I
out
Pk Deviation 4% V
out
Settling Time 500 ms
Short Circuit / Overcurrent Protection Shutdown / Hiccup
Current Limit Threshold Range, % of I
out
Rated 110 - 130%
TECHNICAL SPECIFICATIONS
Voltage Range
24 VDC Nominal 18 - 36 VDC
48 VDC Nominal 36 - 72 VDC
Reflected Ripple 25 mA
Input Reverse Voltage Protection Shunt Diode
SMS surface-mountable DC/DC converters feature up to
12 Watts of output power. The SMS is a fully isolated
converter with 1500 VDC isolation, short circuit, and
undervoltage lockout protection. The SMS is available with
remote shutdown, as well as an optional active current
share, to allow for high power distributed operation.
Available in 24 or 48 VDC input versions, the SMS is well
suited to telecom and networking applications.
• Industry Standard
Package
• Industry Standard Pinout
• 85°C Case Operation
• Short Circuit Protection
• 6-Sided Shielding
• 24V and 48V Input
Versions
• Input Pi Filter
• Regulated Outputs
• 1500V Isolation
Input
Output
Turn-On Time 10 ms
Remote Shutdown Positive Logic
Switching Frequency 400 kHz
Isolation
Input - Output 1500 VDC
Temperature Coefficient ±0.03%/°C
Operating Temperature
Ambient Operating Range 100 LFM -40 To +85°C
Ambient Operating Range Convection -40 To +70°C
Storage Range -40 To +100°C
Humidity Max., Non-Condensing 95%
Vibration, 3 Axes, 5 Min Each 5 g, 10 - 55 Hz
MTBF†(Bellcore TR-NWT-000332) Consult Factory
Safety Consult Factory
Weight (approx.) 0.4 oz
General
DESCRIPTION
FEATURES
Efficiency vs. Load (48V Input)
Efficiency vs. Load (24V Input)
SMS SERIES
12 WATT
Notes
†
MTBF predictions may vary slightly from model to model.
Specifications typically at 25°C, normal line, and full load, unless
otherwise stated.
Soldering Conditions: I/O pins, 260°C, ten seconds; fully compatible with commercial wave-soldering equipment.
Safety: Agency approvals may vary from model to model.
Please consult factory for specific model information.Units are
water-washable and fully compatible with commercial spray or
immersion post wave-solder washing equipment.

2
MECHANICAL DRAWING
Thermal Impedance
Natural Convection 21.1 °C/W
100 LFM 10.4 °C/W
200 LFM 6.8 °C/W
300 LFM 5.6 °C/W
400 LFM 4.3 °C/W
Tolerances
Note:
Thermal impedance data is
dependent on many environmental
factors. The exact thermal
performance should be validated
for specific application.
Pin Function
SMS SERIES
12 WATT
1- V
in
2 S/D
3+ V
out
4- V
out
5- V
out
6+ V
out
7 OPTION
8+V
in
Inches:
(Millimeters)
.XX ± 0.020 .X ± 0.5
.XXX ± 0.010 .XX ± 0.25
Pin:
± 0.002 ± 0.05
(Dimensions as listed unless
otherwise specified.)
MODELS - (See the last page of Section for options.)
-0.06"(-1.5mm)
0.875"(22.2mm)
0
(0.6mm)
(24.9mm)(21.6mm)
(9.5mm)
1.00"
(25.4mm)
2.00"
(50.8mm)
0.025" TYP.
0.98"
0.85"
0.375"
TOP VIEW
5
6
7
8
4
3
2
1
LAND PATTERN
0
-0.40"
(-10.2mm)
0.400"
(10.2mm)
0.800"
(20.3mm)
1.200"
(30.5mm)
trahCnoitceleS
ledoM
niV
)stloV(
egnaRniV
)stloV(
*.xaMniI
)spmA(
tuoV
)stloV(
detaRtuoI
)spmA(
esioN&elppiR
)Vm(kP-kP
ycneiciffE
**.pyT
CY700SMS
EY210SMS
GY210SMS
CZ700SMS
DZ900SMS
EZ210SMS
GZ210SMS
42
42
42
84
84
84
84
63-81
63-81
63-81
27-63
27-63
27-63
27-63
25.0
28.0
28.0
62.0
23.0
14.0
14.0
1.2
3.3
0.5
1.2
5.2
3.3
0.5
3.3
6.3
4.2
3.3
6.3
6.3
4.2
05
05
05
05
05
05
05
%48
%68
%88
%28
%58
%78
%88
.rewoptuptuodetarmumixam,egatlovtupnimuminimtatnerructupnimumixaM*
.tuptuodetar,niVlanimontA**
High Density - Board Mounted Power Division
Powering Communications and Technology

OPTIONS
When ordering equipment options, use the following suffix information. Select the option(s) that you prefer and
add them to the model number. Example ordering options are located below the options table.
Example Options:
HBS050ZG-ANT3V = HBS050ZG-A with negative logic, Lucent compatible trim, and 0.95” vertical heatsink.
LES015YJ-3N = LES015YJ with optional trim and enable, negative logic.
QBS066ZG-AT8 = QBS066ZG-A with Lucent compatible trim and 0.110” pin length.
NUCLEAR AND MEDICAL APPLICATIONS - Power-One products are not authorized for use as critical components in life support systems, equipment used
in hazardous environments, or nuclear control systems without the express written consent of the President of Power-One, Inc.
TECHNICAL REVISIONS - The appearance of products, including safety agency certifications pictured on labels, may change depending on the date manufactured. Specifications are subject to change without notice.
OPTIONS SUFFIX APPLICABLE SERIES REMARKS
Negative Logic N HAS, HBD, HBS, HES, HLS, LES, TTL "Low" Turns Module ON
QBS, QES, QLS, TES, TQD TTL "High" Turns Module OFF
Lucent Compatible Trim T
HAS, HBD, HBS, HES, HLS, QBS, QES,
QLS
Terminal Strip TS XWS, XWD, XWT
Trim 1 IAS, LES
Enable 2 IAD, IAS, LES, SMS
Trim and Enable 3 IAS, LES
Current Share 4 SMS
Headerless Y Encapsulated EWS, IWS, OWS
PIN LENGTH AND HEATSINK
OPTIONS
Standard Pin Length is 0.180"
(4.6mm)
0.110" (2.8mm) Pin Length 8 All Units (Except SMS)
0.150" (3.8mm) Pin Length 9 All Units (Except SMS)
0.24" (6.1mm) Horizontal Heatsink
1H
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
Includes Thermal Pad
0.24" (6.1mm) Vertical Heatsink 1V
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
0.45" (11.4mm) Horizontal Heatsink
2H
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
Includes Thermal Pad
0.45" (11.4mm) Vertical Heatsink 2V
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
0.95" (24.1mm) Horizontal Heatsink
3H
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
Includes Thermal Pad
0.95" (24.1mm) Vertical Heatsink 3V
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
High Density - Board Mounted Power Division
Powering Communications and Technology
3