Page 1
TO–247AD Package Outline.
D
S
G
Dimensions in mm (inches)
4.69 (0.185)
5.31 (0.209)
1.49 (0.059)
2.49 (0.098)
15.49 (0.610)
16.26 (0.640)
SML30B40
N–CHANNEL
ENHANCEMENT MODE
6.15
BSC
(0.242)
BSC
32
3.55 (0.140)
3.81 (0.150)
1.65 (0.065)
2.13 (0.084)
2.87 (0.113)
3.12 (0.123)
0.40 (0.016)
0.79 (0.031)
2.21 (0.087)
2.59 (0.102)
20.80 (0.819)
19.81 (0.780)
21.46 (0.845)
4.50
20.32 (0.800)
1.01 (0.040)
1.40 (0.055)
1
Max.
(0.177)
5.25 (0.215)
Pin 1 – Gate Pin 2 – Drain Pin 3 – Source
HIGH VOLTAGE
POWER MOSFETS
V
DSS
I
D(cont)
R
DS(on)
• Faster Switching
• Lower Leakage
• 100% Avalanche Tested
• Popular TO–247 Package
StarMOS is a new generation of high voltage
N–Channel enhancement mode power MOSFETs.
This new technology minimises the JFET effect,
increases packing density and reduces the
on-resistance. StarMOS also achieves faster
switching speeds through optimised gate layout.
300V
40A
0.085
ΩΩ
ABSOLUTE MAXIMUM RATINGS (T
V
DSS
I
D
I
DM
V
GS
V
GSM
P
D
TJ, T
T
L
I
AR
E
AR
E
AS
STG
Drain – Source Voltage
Continuous Drain Current
Pulsed Drain Current
1
Gate – Source Voltage
Gate – Source Voltage Transient
Total Power Dissipation @ T
Derate Linearly
Operating and Storage Junction Temperature Range
Lead Temperature : 0.063” from Case for 10 Sec.
1
Avalanche Current
(Repetitive and Non-Repetitive)
Repetitive Avalanche Energy
Single Pulse Avalanche Energy
= 25°C unless otherwise stated)
case
= 25°C
case
1
2
1) Repetitive Rating: Pulse Width limited by maximum junction temperature.
2) Starting TJ= 25°C, L = 1.63mH, RG= 25Ω, Peak IL= 40A
Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: sales@semelab.co.uk
Website: http://www.semelab.co.uk
300
40
160
±20
±30
300
2.4
–55 to 150
300
40
30
1300
V
A
A
V
W
W/°C
°C
A
mJ
6/99
Page 2
SML30B40
STATIC ELECTRICAL RATINGS (T
Characteristic Test Conditions Min. Typ. Max. Unit
BV
DSS
Drain – Source Breakdown Voltage
Zero Gate Voltage Drain Current
I
DSS
I
GSS
V
GS(TH)
I
D(ON)
R
DS(ON)
(VGS= 0V)
Gate – Source Leakage Current
Gate Threshold Voltage
On State Drain Current
2
Drain – Source On State Resistance
DYNAMIC CHARACTERISTICS
Characteristic Test Conditions Min. Typ. Max. Unit
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
3
Gate – Source Charge
Gate – Drain (“Miller”) Charge
Turn–on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
= 25°C unless otherwise stated)
case
VGS= 0V , ID= 250µA
VDS= V
VDS= 0.8V
VGS= ±30V , VDS= 0V
VDS= VGS, ID= 1.0mA
VDS> I
VGS= 10V
2
VGS= 10V , ID= 0.5 ID[Cont.]
VGS= 0V
VDS= 25V
f = 1MHz
VGS= 10V
VDD= 0.5 V
ID= ID[Cont.] @ 25°C
VGS= 15V
VDD= 0.5 V
ID= ID[Cont.] @ 25°C
RG= 1.6Ω
DSS
D(ON)
, TC= 125°C
DSS
x R
DS(ON)
DSS
DSS
Max
300
V
250
µA
1000
±100
24
40
0.085
nA
V
A
Ω
3970
750
pF
230
145
25
nC
59
12
10
ns
43
7
SOURCE – DRAIN DIODE RATINGS AND CHARACTERISTICS
Characteristic Test Conditions Min. Typ. Max. Unit
I
I
V
t
Q
S
SM
SD
rr
rr
Continuous Source Current
Pulsed Source Current
Diode Forward Voltage
1
2
Reverse Recovery Time
Reverse Recovery Charge
(Body Diode)
(Body Diode)
VGS= 0V , IS= – ID[Cont.]
IS= – ID[Cont.] , dls / dt = 100A/µs
IS= – ID[Cont.] , dls / dt = 100A/µs
THERMAL CHARACTERISTICS
Characteristic Min. Typ. Max. Unit
R
R
θJC
θJA
Junction to Case
Junction to Ambient
1) Repetitive Rating: Pulse Width limited by maximum junction temperature.
2) Pulse Test: Pulse Width < 380µS , Duty Cycle < 2%
3) See MIL–STD–750 Method 3471
CAUTION — Electrostatic Sensitive Devices. Anti-Static Procedures Must Be Followed.
Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: sales@semelab.co.uk
Website: http://www.semelab.co.uk
390
6
40
160
1.3
0.42
40
A
V
ns
µC
°C/W
6/99
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