Page 1
QUAD 2 INPUT H C C/ HCF 4011B
DUAL 4 INPUT HCC/HCF 4012B
TRIPLE 3 INPU T HCC/HCF 4023B
.PROPAGATIONDELAY TIME = 60ns (typ.) AT
CL= 50pF, VDD= 10V
.BUFFERED INPUTS AND OUTPUTS
.QUIESCENT CURRENT SPECIFIED TO 20V
FOR HCC DEVICE
.INPUT CURRENTOF100nA AT18V AND25°C
FOR HCC DEVICE
.100% TESTEDFOR QUIESCENTCURRENT
.5V, 10V AND 15V PARAMETRIC RATINGS
.MEETSALLREQUIREMENTSOFJEDECTEN-
TATIVE STANDARD No. 13A, ”STANDARD
SPECIFICATIONS FOR DESCRIPTIONOF ”B”
SERIESCMOS DEVICES”
HCC4011B/12B/23B
HCF4011B/12B/23B
NAND GATES
EY
(Plastic Package)F(Ceramic Frit Seal Package)
M1
(MicroPackage)C1(PlasticChipCarrier)
ORDER CODES :
HCC40XXBF HCF40XXBM1
HCF40XXBEY HCF40XXBC1
DESCRIPTION
The HCC4011B, HCC4012B and HCC4023B (ex-
tended temperature range) and HCF4011B,
HCF4012B and HCF4023B (intermediate temperature range) are monolithic, integrated circuit, available in 14-lead dual in-line plastic or ceramic
package and plastic micropackage.
PIN CONNECTIONS
4011B 4012B 4023B
The HCC/HCF4011B, HCC/HCF4012B and
HCC/HCF4023B NAND gates provide the system
designer with direct implementation of the NAND
function and supplement the existing family of
COS/MOS gates. All inputs and outputs are buffered.
June 1989
1/12
Page 2
HCC/H FC4011B/12B/23B
ABSOLUTE M AXI MU M RATI NGS
Symbol Parameter Val ue Unit
V
* Supply Voltage : HCC Types
DD
HCF Types
V
Input Voltage – 0.5 to VDD+ 0.5 V
i
I
DC Input Current (any one input) ± 10 mA
I
P
Total Power Dissipation (per package)
tot
Dissipation per Output Transistor
for Top= Full Package-temperature Range
T
Operating Temperature : HCC Types
op
HCF Types
T
Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functionaloperationofthedeviceattheseorany otherconditions above thoseindicatedin theoperationalsections of thisspecificationisnotimplied.
Exposure to absolute maximum rating conditions forexternal periodsmay affectdevice reliability.
* Allvoltage values arereferredto VSSpinvoltage.
Storage Temperature – 65 to + 150 °C
stg
RECOMMENDED OPERATING CONDITIONS
Symbol Pa ramet er Valu e Un i t
V
T
Supply Voltage : HC C Types
DD
HCF Types
V
Input Voltage 0 to V
I
Operating Temperature : HCC Types
op
HCF Types
– 0.5 to + 20
– 0.5 to + 18
200
100
–55to+125
–40to+85
3to18
3to15
DD
–55to+125
–40to+85
V
V
mW
mW
°C
°C
V
V
V
°C
°C
2/12
Page 3
SCHEMATIC AND LOGIC DIAGRAMS
4011B
4012B
HCC/HCF4011B/12B/23B
4023B
3/12
Page 4
HCC/H FC4011B/12B/23B
STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions)
Test Conditions Valu e
Symbol Parameter
Quiescent
I
L
Current
HCC
Types
HCF
Types
V
OH
Output High
Voltage
V
OL
Output Low
Voltage
V
IH
Input High
Voltage
V
IL
Input Low
Voltage
I
OH
Output
Drive
Current
HCC
Types
HCF
Types
I
OL
Output
Sink
Current
HCC
Types
HCF
Types
I
IH,IIL
Input
Leakage
Current
HCC
Types
HCF
Types
C
Input Capacitance Any Input 5 7.5 pF
I
*T
=–55°Cfor HCC device : – 40°CforHCFdevice.
LOW
*T
=+ 125°C forHCC device : + 85°C for HCF device.
HIGH
TheNoise Margin for both ”1” and ”0” levelis : 1V min. withVDD=5V,2V min. withVDD= 10V,2.5V withVDD= 15V.
V
V
O
|IO|V
I
(V) (V) (µA) (V)
T
DD
* 25°CT
Low
Min. Max. Min. Typ. Max. Min. Max.
High
0/5 5 0.25 0.01 0.25 7.5
0/10 10 0.5 0.01 0.5 15
0/15 15 1 0.01 1 30
0/20 20 5 0.02 5 150
0/ 5 5 1 0.01 1 7.5
0/10 10 2 0.01 2 15
0/15 15 4 0.01 4 30
0/5 < 1 5 4.95 4.95 4.95
0/10 < 1 10 9.95 9.95 9.95
0/15 < 1 15 14.95 14.95 14.95
5/0 < 1 5 0.05 0.05 0.05
10/0 < 1 10 0.05 0.05 0.05
15/0 < 1 15 0.05 0.05 0.05
0.5/4.5 < 1 5 3.5 3.5 3.5
1/9 < 1 10 7 7 7
1.5/13.5 < 1 15 11 11 11
4.5/0.5 < 1 5 1.5 1.5 1.5
9/1 < 1 10 3 3 3
13.5/1.5 < 1 15 4 4 4
0/5 2.5 5 – 2 – 1.6 – 3.2 – 1.15
0/5 4.6 5 – 0.64 – 0.51 – 1 – 0.36
0/10 9.5 10 – 1.6 – 1.3 – 2.6 – 0.9
0/15 13.5 15 – 4.2 – 3.4 – 6.8 – 2.4
0/5 2.5 5 – 1.53 – 1.36 – 3.2 – 1.1
0/5 4.6 5 – 0.52 – 0.44 – 1 – 0.36
0/10 9.5 10 – 1.3 – 1.1 – 2.6 – 0.9
0/15 13.5 15 – 3.6 – 3.0 – 6.8 – 2.4
0/5 0.4 5 0.64 0.51 1 0.36
0/10 0.5 10 1.6 1.3 2.6 0.9
0/15 1.5 15 4.2 3.4 6.8 2.4
0/5 0.4 5 0.52 0.44 1 0.36
0/10 0.5 10 1.3 1.1 2.6 0.9
0/15 1.5 15 3.6 3.0 6.8 2.4
0/18
Any Input
0/15 15 ± 0.3 ±10
18 ± 0.1 ±10–5± 0.1 ± 1
–5
± 0.3 ± 1
Unit
*
µA
V
V
V
V
mA
mA
µA
4/12
Page 5
HCC/HCF4011B/12B/23B
DYNAMIC ELECTRICAL CHARACTERISTICS(T
=25°C, CL= 50pF, RL= 200kΩ,
amb
typical temperature coefficient for all VDDvalues is 0.3%/°C, all input rise and fall times = 20ns)
Symbol Parameter
t
PLH,tPHL
t
THL,tTLH
Propagation Delay Time 5 125 250
Transition Time 5 100 200
Test Conditions
V
(V) Min. Typ. Max.
DD
10 60 120
15 45 90
10 50 100
15 40 80
Val ue
TEST CIRCUITS
QuiescentDevice Current. Noise Immunity.
Unit
ns
ns
Input Leakage Current.
5/12
Page 6
HCC/H FC4011B/12B/23B
Minimum Output High (source) Current Characteristics.
TypicalOutputHigh (source) Current Characteristics.
Minimum Output Low(sink) Current Characteristics.
TypicalOutput Low (sink) Current Characteristics.
TypicalPropagation Delay Time per Gate as a
Function of Load Capacitance.
6/12
TypicalTransition Time vs. Load Capacitance.
Page 7
HCC/HCF4011B/12B/23B
TypicalVoltage Transfer Characteristics. Typical Power Dissipation/gate vs Frequency.
7/12
Page 8
HCC/H FC4011B/12B/23B
Plastic DIP14 MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
a1 0.51 0.020
B 1.39 1.65 0.055 0.065
b 0.5 0.020
b1 0.25 0.010
D 20 0.787
E 8.5 0.335
e 2.54 0.100
e3 15.24 0.600
F 7.1 0.280
I 5.1 0.201
L 3.3 0.130
Z 1.27 2.54 0.050 0.100
mm inch
8/12
P001A
Page 9
HCC/HCF4011B/12B/23B
Ceramic DIP14/1 MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 20 0.787
B 7.0 0.276
D 3.3 0.130
E 0.38 0.015
e3 15.24 0.600
F 2.29 2.79 0.090 0.110
G 0.4 0.55 0.016 0.022
H 1.17 1.52 0.046 0.060
L 0.22 0.31 0.009 0.012
M 1.52 2.54 0.060 0.100
N 10.3 0.406
P 7.8 8.05 0.307 0.317
Q 5.08 0.200
mm inch
P053C
9/12
Page 10
HCC/H FC4011B/12B/23B
SO14 MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.75 0.068
a1 0.1 0.2 0.003 0.007
a2 1.65 0.064
b 0.35 0.46 0.013 0.018
b1 0.19 0.25 0.007 0.010
C 0.5 0.019
c1 45° (typ.)
D 8.55 8.75 0.336 0.344
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 7.62 0.300
F 3.8 4.0 0.149 0.157
G 4.6 5.3 0.181 0.208
L 0.5 1.27 0.019 0.050
M 0.68 0.026
S8°(max.)
mm inch
10/12
P013G
Page 11
PLCC20 MECHANICAL DATA
HCC/HCF4011B/12B/23B
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 9.78 10.03 0.385 0.395
B 8.89 9.04 0.350 0.356
D 4.2 4.57 0.165 0.180
d1 2.54 0.100
d2 0.56 0.022
E 7.37 8.38 0.290 0.330
e 1.27 0.050
e3 5.08 0.200
F 0.38 0.015
G 0.101 0.004
M 1.27 0.050
M1 1.14 0.045
mm inch
P027A
11/12
Page 12
HCC/H FC4011B/12B/23B
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of useof such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license isgranted byimplication or otherwiseunder any patent or patentrights of SGS-THOMSON Microelectronics. Specificationsmentioned
in this publication are subject to changewithout notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronicsproductsare notauthorizedforuse ascritical componentsin life supportdevices orsystems without express
written approval of SGS-THOMSON Microelectonics.
1994 SGS-THOMSON Microelectronics - All RightsReserved
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Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - UnitedKingdom - U.S.A
SGS-THOMSON Microelectronics GROUP OF COMPANIES
12/12
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