polyfet rf devices
SM724
10
Single Ended
AM
220.0
14.0
180.0
0.85
C/W
40
5.2
38.00
4.0
75
0.20
10.00
19.0
190
0.40
50
PARAMETERSYMBOL MIN TYP MAX UNITS TEST CONDITIONS
Common Source Power Gain
Drain Efficiency
Total
Device
Dissipation
Junction to
Case Thermal
Resistance
Maximum
Junction
Temperature
Storage
Temperature
DC Drain
Current
Drain to
Source
Voltage
Gate to
Source
Voltage
-65 C to 150 C200 C A V
Load Mismatch ToleranceVSWR
Drain to
Gate
Voltage
20:1 Relative
0.80
80.00Ids = mA, Vgs = 0V
V, Vgs = 0V
Ciss
Crss
Coss
Vds =
Idq = A, Vds = V, F =
0.80
Bvdss
Idss
Drain Breakdown Voltage
V
mA
pF
pF
pF
Common Source Output Capacitance
Common Source Feedback Capacitance
Idq =
Idq = 0.80
175
Vgs = 20V, Ids = Rdson Saturation Resistance
Forward TransconductancegM Vds = 10V, Vgs = 5V
POLYFET RF DEVICES
1110 Avenida Acaso, Camarillo, Ca 93012 Tel:(805) 484-4210 FAX: (805) 484-3393 EMAIL:Sales@polyfet.com URL:www.polyfet.com
175
175
Common Source Input Capacitance
50 V
Igss
Vgs
Idsat
Zero Bias Drain Current
Gate Leakage Current
Gate Bias for Drain Current
Saturation Current
1 7
uA
V
Mho
Ohm
Amp
PARAMETERSYMBOL MIN TYP MAX UNITS TEST CONDITIONS
ELECTRICAL CHARACTERISTICS ( EACH SIDE )
RF CHARACTERISTICS (
60.0
ABSOLUTE MAXIMUM RATINGS ( T =
Gps
12.5
A, Vds = V, F =
A, Vds = V, F =
12.5
12.5
Watts V
1
MHz
MHz
MHz
Watts
Package Style
60.0
Vds = 0V Vgs = 30V
Vgs = 20V, Vds = 10V
HIGH EFFICIENCY, LINEAR
HIGH GAIN, LOW NOISE
General Description
12.5
Vds =
A, Vgs = VdsIds =
A
η
dB
%
o
o
oo
o
Silicon VDMOS and LDMOS
transistors designed specifically
for broadband RF applications.
Suitable for Militry Radios,
Cellular and Paging Amplifier Base
Stations, Broadcast FM/AM, MRI,
Laser Driver and others.
"Polyfet" process features
low feedback and output capacitances
resulting in high F transistors with high
input impedance and high efficiency.
TM
t
SILICON GATE ENHANCEMENT MODE
RF POWER TRANSISTORVDMOS
Vgs = 0V, F = 1 MHz12.5
Vds =
Vgs = 0V, F = 1 MHz12.5
Vds =
Vgs = 0V, F = 1 MHz12.5
REVISION 09/25/2001
20
25 C )
WATTS OUTPUT )