Datasheet SM15T75A Datasheet (SGS Thomson Microelectronics)

Page 1
SM15T6V8A/220A
®
FEATURES
PEAK PULSE POWER : 1500 W (10/1000µs)
From 6.8 V to 220 V UNI AND BIDIRECTIONAL TYPES
LOW CLAMPING FACTOR
FAST RESPONSE TIME
UL RECOGNIZED
DESCRIPTION
Transil diodes provide high overvoltage protection by clamping action. Their instantaneous response to transient overvoltages makes them particularly suited to protect voltage sensitive devices such as MOS Technology and low voltage supplied IC’s.
ABSOLUTE MAXIMUM RATINGS (T
amb
= 25°C)
SM15T6V8CA/220CA
TRANSIL
SMC
TM
Symbol Parameter Value Unit
P
PP
P
I
FSM
T
stg
T
j
T
L
Note 1 :For a surge greater than the maximum values, the diode will fail in short-circuit.
Peak pulse power dissipation (see note1) Tj initial = T
Power dissipation on infinite heatsink T
Non repetitive surge peak forward current for unidirectional types
= 50°C
amb
tp = 10ms Tj initial = T
Storage temperature range Maximum junction temperature
Maximum lead temperature for soldering during 10 s.
amb
amb
1500 W
6.5 W
200 A
-65to+175 150
260 °C
THERMAL RESISTANCES
Symbol Parameter Value Unit
R
R
th (j-l)
th (j-a)
Junction to leads
Junction to ambient on printed circuit on recommended pad
15 °C/W
75 °C/W
layout
°C °C
September 2001 Ed : 3B
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Page 2
SM15Txx
ELECTRICAL CHARACTERISTICS
= 25°C)
(T
amb
Symbol Parameter
V
RM
V
BR
V
CL
I
RM
I
PP
Stand-off voltage Breakdown voltage
Clamping voltage Leakage current @ V
Peak pulse current
RM
αT Voltage temperature coefficient
V
F
Uni
directional
SM15T6V8A MDE SM15T7V5A MDG SM15T10A MDP SM15T12A MDT SM15T15A MDX SM15T18A MEE SM15T22A MEK SM15T24A MEM SM15T27A MEP SM15T30A MER SM15T33A MET SM15T36A MEV SM15T39A MEX SM15T68A MFP SM15T75A MFO SM15T100A MFX SM15T150A MGK SM15T200A MGV SM15T220A MGX
Forward Voltage drop
Types
Mar-
kingBidirectional
SM15T6V8CA BDE SM15T7V5CA BDG
SM15T10CA BDP SM15T12CA BDT SM15T15CA BDX SM15T18CA BEE SM15T22CA BEK SM15T24CA BEM SM15T27CA BEP SM15T30CA BER SM15T33CA BET SM15T36CA BEV SM15T39CA BEX SM15T68CA BFP
SM15T75CA BFO SM15T100CA BFX SM15T150CA BGK SM15T200CA BGV SM15T220CA
Mar-
king
BGX 1 188 209 220 231 1 328 4.6 388 26 10.8 625
I
I
F
VVCLV
BR
I
RM@VRM
V
RM
VBR@IRVCL@IPPVCL@IPPαTC
I
I
RM
PP
V
F
V
max min nom max max max max typ
note2 10/1000µs 8/20µs note3 note4
µAVVVVmAVAVA10-4/°C pF
1000
5.8 6.45 6.8 7.14 10 10.5 143 13.4 746 5.7 9500
500
6.4 7.13 7.5 7.88 10 11.3 132 14.5 690 6.1 8500
10
8.55 9.5 10 10.5 1 14.5 103 18.6 538 7.3 7000
5
10.2 11.4 12 12.6 1 16.7 90 21.7 461 7.8 6000
1
12.8 14.3 15 15.8 1 21.2 71 27.2 368 8.4 5000
1
15.3 17.1 18 18.9 1 25.2 59.5 32.5 308 8.8 4300
1
18.8 20.9 22 23.1 1 30.6 49 39.3 254 9.2 3700
1
20.5 22.8 24 25.2 1 33.2 45 42.8 234 9.4 3500
1
23.1 25.7 27 28.4 1 37.5 40 48.3 207 9.6 3200
1
25.6 28.5 30 31.5 1 41.5 36 53.5 187 9.7 2900
1
28.2 31.4 33 34.7 1 45.7 33 59.0 169 9.8 2700
1
30.8 34.2 36 37.8 1 49.9 30 64.3 156 9.9 2500
1
33.3 37.1 39 41.0 1 53.9 28 69.7 143 10.0 2400
1
58.1 64.6 68 71.4 1 92 16.3 121 83 10.4 1550
1
64.1 71.3 - 78.8 1 103 14.6 134 75 10.5 1450
1
85.5 95.0 100 105 1 137 11 178 56 10.6 1150
1
128 143 150 158 1 207 7.2 265 38 10.8 850
1
171 190 200 210 1 274 5.5 353 28 10.8 675
%I
PP
100
50
0
Note 2 : Pulse test:tp<50ms. Note 3 : VBR= αT*(T Note 4 : VR= 0 V, F=1 MHz. For bidirectional types,
capacitance value is divided by 2.
10 s
PULSE WAVEFORM 10/1000 s
1000 s
- 25)*VBR(25°C).
amb
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Fig. 1: Peak pulse power dissipation versus initial junction temperature (printed circuit board).
t
Page 3
Fig. 2 : Peak pulse power versus exponential pulse duration.
SM15Txx
Fig. 3 : Clamping voltage versus peak pulse current.
Exponential waveform t
=20µs
p
= 1 ms ——————-
t
p
= 10 ms ...............
t
p
Note : The curves of the figure 3 are specified for a junction temperature of 25 C before surge. The given results may be extrapolated for other junction temperatures by using the following formula : V
= αT*[T
BR
-25]*VBR(25°C).
amb
For intermediate voltages, extrapolate the given results.
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Page 4
SM15Txx
Fig. 4a : Capacitance versus reverse applied
voltage for unidirectional types (typical values).
Fig. 4b : Capacitance versus reverse applied voltage for bidirectional types (typical values).
Fig. 5 : Peak forward voltage drop versus peak forward current (typical values for unidirectional types).
Fig. 7 : Relative variation of leakage current versus junction temperature.
Fig. 6 : Transient thermal impedance junc­tion-ambient versus pulse duration. Mounting on FR4 PC Board with recommended pad layout.
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Page 5
ORDER CODE
SURFACE MOUNT
SM15Txx
SM 15 T 100 C A
1500 WATT
BIDIRECTIONAL
BREAKDOWN VOLTAGE
MARKING : Logo, Date Code, Type Code, Cathode Band (for unidirectional types only). PACKAGE MECHANICAL DATA
SMC (Plastic)
DIMENSIONS
E1
REF.
Millimeters Inches
Min. Max. Min. Max.
D
A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008
b 2.90 3.2 0.114 0.126
E
A1
c 0.15 0.41 0.006 0.016 E 7.75 8.15 0.305 0.321
E1 6.60 7.15 0.260 0.281
C
L
E2
A2
b
E2 4.40 4.70 0.173 0.185
D 5.55 6.25 0.218 0.246
L 0.75 1.60 0.030 0.063
Weight = 0.25 g. FOOTPRINT DIMENSIONS (Millimeters)
SMC
3.3
2.0 4.2 2.0
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© 2001 STMicroelectronics - Printed in Italy - All rights reserved.
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Packaging : standard packaging is in tape and reel.
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