Datasheet SKM400GA12E4 DataSheet (Semikron)

Page 1
SKM400GA12E4
SEMITRANS® 4
IGBT4 Modules
SKM400GA12E4
• IGBT4 = 4. generation medium fast trench IGBT (Infineon)
• CAL4 = Soft switching 4. generation CAL-diode
• Isolated copper baseplate using DBC technology (Direct Bonded Copper)
• Increased power cycling capability
• With integrated gate resistor
• For higher switching frequenzies up to 12kHz
• UL recognized, file no. E63532
Typical Applications*
•AC inverter drives
•UPS
• Switched reluctance motor
Remarks
• Case tem peratur e limited to T
= 125°C max.
c
• Recommended T
• Product reliability results valid for T
= 150°C
j
= -40 ... +150°C
op
Absolute Maximum Ratings
Symbol Conditions Values Unit
IGBT
V
I
C
I
Cnom
I
CRM
V
CES
GES
Tj=25°C
Tj= 175 °C
I
= 3xI
CRM
Cnom
T
=25°C
c
T
=80°C
c
1200 V
616 A
474 A
400 A
1200 A
-20 ... 20 V
VCC= 800 V V
t
psc
T
j
GE
V
CES
15 V
1200 V
=150°C
T
j
10 µs
-40 ... 175 °C
Inverse diode
T
I
F
I
Fnom
I
FRM
I
FSM
T
Tj= 175 °C
I
= 3xI
FRM
Fnom
tp= 10 ms, sin 180°, Tj=25°C
j
=25°C
c
T
=80°C
c
440 A
329 A
400 A
1200 A
1980 A
-40 ... 175 °C
Module
T
I
t(RMS)
T
stg
V
isol
terminal
=80°C
500 A
-40 ... 125 °C
AC sinus 50 Hz, t = 1 min 4000 V
Characteristics
Symbol Conditions min. typ. max. Unit
IGBT
V
CE(sat)
V
CE0
r
CE
V
GE(th)
I
CES
C
ies
C
oes
C
res
Q
R
Gint
t
d(on)
t
r
E
on
t
d(off)
t
f
E
off
R
th(j-c)
IC=400A V
=15V
GE
chiplevel
chiplevel
VGE=15V chiplevel
VGE=VCE, IC= 15.2 mA 5 5.8 6.5 V
VGE=0V V
= 1200 V
CE
VCE=25V V
=0V
GE
G
VGE= - 8 V...+ 15 V
Tj=25°C VCC= 600 V
I
=400A
C
V
=±15V
GE
R
=1
G on
R
=1
G off
di/dt
= 7100 A/µs
on
di/dt
=3900A/µs
off
per IGBT 0.072 K/W
T
=25°C
j
=150°C
T
j
T
=25°C
j
T
=150°C
j
T
=25°C
j
T
=150°C
j
T
=25°C
j
T
=150°C
j
f=1MHz
f=1MHz
f=1MHz
T
=150°C
j
Tj=150°C
Tj=150°C
Tj=150°C
Tj=150°C
Tj=150°C
1.80 2.05 V
2.20 2.40 V
0.8 0.9 V
0.7 0.8 V
2.50 2.88 m
3.75 4.00 m
5mA
mA
24.6 nF
1.62 nF
1.38 nF
2260 nC
1.9
264 ns
56 ns
28 mJ
575 ns
117 ns
59 mJ
GA
© by SEMIKRON Rev. 5 – 21.08.2013 1
Page 2
SKM400GA12E4
SEMITRANS® 4
IGBT4 Modules
SKM400GA12E4
• IGBT4 = 4. generation medium fast trench IGBT (Infineon)
• CAL4 = Soft switching 4. generation CAL-diode
• Isolated copper baseplate using DBC technology (Direct Bonded Copper)
• Increased power cycling capability
• With integrated gate resistor
• For higher switching frequenzies up to 12kHz
• UL recognized, file no. E63532
Characteristics
Symbol Conditions min. typ. max. Unit
Inverse diode
V
V
r
F
I
RRM
Q
E
R
= V
F
F0
rr
rr
th(j-c)
IF= 400 A
EC
V
=0V
GE
chiplevel
chiplevel
chiplevel
IF= 400 A di/dt
=7200A/µs
off
V
=±15V
GE
V
= 600 V
CC
per diode 0.14 K/W
T
=25°C
j
=150°C
T
j
=25°C
T
j
T
=150°C
j
T
=25°C
j
T
=150°C
j
T
=150°C
j
Tj=150°C
Tj=150°C
2.20 2.52 V
2.15 2.47 V
1.3 1.5 V
0.9 1.1 V
2.3 2.5 m
3.1 3.4 m
440 A
78 µC
37 mJ
Module
L
CE
R
CC'+EE'
R
th(c-s)
M
s
M
t
=25°C
T
terminal-chip
C
T
=125°C
C
per module 0.02 0.038 K/W
to heat sink M6 3 5 Nm
to terminals
M6
M4
2.5 5 Nm
1.1 2 Nm
15 20 nH
0.18 m
0.22 m
w 330 g
Typical Applications*
•AC inverter drives
•UPS
• Switched reluctance motor
Remarks
• Case tem peratur e limited to T
= 125°C max.
c
• Recommended T
• Product reliability results valid for T
= 150°C
j
= -40 ... +150°C
op
GA
2 Rev. 5 – 21.08.2013 © by SEMIKRON
Page 3
SKM400GA12E4
Fig. 1: Typ. output characteristic, inclusive R
Fig. 3: Typ. turn-on /-off energy = f (IC) Fig. 4: Typ. turn-on /-off energy = f (RG)
CC'+ EE'
Fig. 2: Rated current vs. temperature IC = f (TC)
Fig. 5: Typ. transfer characteristic Fig. 6: Typ. gate charge characteristic
© by SEMIKRON Rev. 5 – 21.08.2013 3
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SKM400GA12E4
Fig. 7: Typ. switching times vs. I
C
Fig. 8: Typ. switching times vs. gate resistor R
G
Fig. 9: Transient thermal impedance Fig. 10: Typ. CAL diode forward charact., incl. R
CC'+ EE'
Fig. 11: CAL diode peak reverse recovery current Fig. 12: Typ. CAL diode peak reverse recovery charge
4 Rev. 5 – 21.08.2013 © by SEMIKRON
Page 5
SKM400GA12E4
SEMITRANS 4
GA
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.
© by SEMIKRON Rev. 5 – 21.08.2013 5
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