Datasheet IRFL214, SiHFL214 DataSheet (Vishay)

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SOT-223

G

D

S

D

IRFL214, SiHFL214

Vishay Siliconix

Power MOSFET

PRODUCT SUMMARY

VDS (V) 250

R

()V

DS(on)

Q

(Max.) (nC) 8.2

g

Q

(nC) 1.8

gs

Q

(nC) 4.5

gd

Configuration Single

= 10 V 2.0

GS

FEATURES

• Surface mount

• Available in tape and reel

• Dynamic dV/dt rating

• Repetitive avalanche rated

• Fast switching

• Ease of paralleling

• Simple drive requirements

• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912

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DESCRIPTION

Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.

G

The SOT-223 package is designed for surface-mounting
using vapor phase, infrared, or wave soldering techniques.
Its unique package design allows for easy automatic
pick-and-place as with other SOT or SOIC packages but

Marking code: FD

N-Channel MOSFET

S

has the added advantage of improved thermal performance
due to an enlarged tab for heatsinking. Power dissipation of
greater than 1.25 W is possible in a typical surface mount
application.

ORDERING INFORMATION

Package SOT-223 SOT-223

Lead (Pb)-free and Halogen-free SiHFL214-GE3

Lead (Pb)-free

IRFL214PbF IRFL214TRPbF
SiHFL214-E3 SiHFL214T-E3

Note

a. See device orientation.

SiHFL214TR-GE3

Available

a

a

a

ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)

PARAMETER SYMBOL LIMIT UNIT

Drain-Source Voltage V

Gate-Source Voltage V

Continuous Drain Current V

Pulsed Drain Current

a

Linear Derating Factor 0.025

Linear Derating Factor (PCB Mount)

Single Pulse Avalanche Energy

Repetitive Avalanche Current

Repetitive Avalanche Energy

e

b

a

a

Maximum Power Dissipation T

Maximum Power Dissipation (PCB Mount)

Peak Diode Recovery dV/dt

c

e

Operating Junction and Storage Temperature Range T

Soldering Recommendations (Peak Temperature)

Notes

a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V

= 50 V, starting TJ = 25 °C, L = 128 mH, Rg = 25 , IAS = 0.79 A (see fig. 12).

DD

c. I

 2.7 A, dI/dt  65 A/μs, VDD  VDS, TJ  150 °C.

SD

d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).

S14-1685-Rev. E, 18-Aug-14

For technical questions, contact: [e-mail]

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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

at 10 V

GS

= 25 °C

C

TA = 25 °C 2.0

d

for 10 s 300

DS

± 20

GS

T

= 25 °C

C

= 100 °C 0.50

C

I

D

IDM 6.3

E

AS

I

AR

E

AR

P

D

dV/dt 4.8 V/ns

, T

J

stg

-55 to +150

1

250

0.79

0.017

W/°C

50 mJ

0.79 A

0.31 mJ

3.1

Document Number: 91194

V

AT

W

°C

IRFL214, SiHFL214

D

G

S

D

G

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THERMAL RESISTANCE RATINGS

PARAMETER SYMBOL MIN. TYP. MAX. UNIT

Maximum Junction-to-Ambient 
(PCB Mount)

a

Maximum Junction-to-Case (Drain) R

R

thJA

thJC

--60

--40

Note

a. When mounted on 1" square PCB (FR-4 or G-10 material).

SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)

PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT

Static

Drain-Source Breakdown Voltage V

V

Temperature Coefficient VDS/TJ Reference to 25 °C, ID = 1 mA - 0.39 - V/°C

DS

Gate-Source Threshold Voltage V

Gate-Source Leakage I

Zero Gate Voltage Drain Current I

Drain-Source On-State Resistance R

Forward Transconductance g

DS

GS(th)

V

GSS

DSS

VGS = 10 V ID = 0.47 A

DS(on)

fs

Dynamic

Input Capacitance C

Reverse Transfer Capacitance C

Total Gate Charge Q

Gate-Drain Charge Q

Turn-On Delay Time t

Rise Time t

Turn-Off Delay Time t

Fall Time t

Internal Drain Inductance L

Internal Source Inductance L

iss

-42-

oss

-9.6-

rss

g

--1.8

gs

--4.5

gd

d(on)

r

-16-

d(off)

-7.0-

f

D

S

V

Between lead,
6 mm (0.25") from
package and center of
die contact

Drain-Source Body Diode Characteristics

Continuous Source-Drain Diode Current I

Pulsed Diode Forward Current

a

Body Diode Voltage V

Body Diode Reverse Recovery Time t

Body Diode Reverse Recovery Charge Q

Forward Turn-On Time t

S

I

SM

SD

rr

rr

on

MOSFET symbol
showing the 
integral reverse
p - n junction diode

TJ = 25 °C, IF = 2.7 A, dI/dt = 100 A/μs

Notes

a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width  300 μs; duty cycle  2 %.

VGS = 0 V, ID = 250 μA 250 - - V

VDS = VGS, ID = 250 μA 2.0 - 4.0 V

= ± 20 V - - ± 100 nA

GS

VDS = 250 V, VGS = 0 V - - 25

= 200 V, VGS = 0 V, TJ = 125 °C - - 250

V

DS

b

VDS = 50 V, ID = 0.47 A 0.50 - - S

VGS = 0 V,

V

= 25 V,

DS

f = 1.0 MHz, see fig. 5

= 2.7 A, VDS = 200 V,

I

= 10 V

GS

V

R

= 24 , RD = 45 , see fig. 10

g

TJ = 25 °C, IS = 0.79 A, VGS = 0 V

D

see fig. 6 and 13

= 125 V, ID = 2.7 A,

DD

b

b

b

b

Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)

Vishay Siliconix

°C/W

--2.0

- 140 -

--8.2

-7.0-

-7.6-

-4.0-

-6.0-

- - 0.79

--6.3

--2.0V

- 190 390 ns

-0.641.3μC

μA

pFOutput Capacitance C

nC Gate-Source Charge Q

ns

nH

A

S14-1685-Rev. E, 18-Aug-14

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

For technical questions, contact: [e-mail]

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Document Number: 91194

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TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)

IRFL214, SiHFL214

Vishay Siliconix

Fig. 1 - Typical Output Characteristics

Fig. 2 - Typical Output Characteristics

Fig. 4 - Normalized On-Resistance vs. Temperature

Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage

Fig. 3 - Typical Transfer Characteristics

S14-1685-Rev. E, 18-Aug-14

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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

3

Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage

Document Number: 91194

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Pulse width ≤ 1 µs
Duty factor ≤ 0.1 %

R

D

V

GS

R

g

D.U.T.

10 V

+

-

V

DS

V

DD

V

DS

90 %

10 %

V

GS

t

d(on)

t

r

t

d(off)

t

f

IRFL214, SiHFL214

Vishay Siliconix

Fig. 7 - Typical Source-Drain Diode Forward Voltage

Fig. 8 - Maximum Safe Operating Area

Fig. 9 - Maximum Drain Current vs. Case Temperature

Fig. 10a - Switching Time Test Circuit

Fig. 10b - Switching Time Waveforms

S14-1685-Rev. E, 18-Aug-14

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case

4

Document Number: 91194

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R

g

I

AS

0.01 Ω

t

p

D.U.T.

L

V

DS

+

-

V

DD

10 V

Var y t

p

to obtain

required I

AS

Q

GS

Q

GD

Q

G

V

G

Charge

V

GS

IRFL214, SiHFL214

Vishay Siliconix

V

DS

t

p

V

DS

I

AS

V

DD

Fig. 12a - Unclamped Inductive Test Circuit

Fig. 12c - Maximum Avalanche Energy vs. Drain Current

Fig. 12b - Unclamped Inductive Waveforms

Fig. 13a - Basic Gate Charge Waveform Fig. 13b - Gate Charge Test Circuit

S14-1685-Rev. E, 18-Aug-14

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Current regulator

Same type as D.U.T.

50 kΩ

0.2 µF

12 V

V

GS

3 mA

Current sampling resistors

5

For technical questions, contact: [e-mail]

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

0.3 µF

+

V

D.U.T.

I

G

I

DS

-

D

Document Number: 91194

www.vishay.com

IRFL214, SiHFL214

Vishay Siliconix

Peak Diode Recovery dV/dt Test Circuit

D.U.T.

+

-

R

g

Driver gate drive

P.W.

+

-

Period

Circuit layout considerations

• Low stray inductance

• Ground plane

• Low leakage inductance

current transformer

• dV/dt controlled by R

• Driver same type as D.U.T.

I

controlled by duty factor “D”

•

SD

• D.U.T. - device under test

-

D =

g

P.W.

Period

+

+

V

DD

-

V

= 10 Va

GS

D.U.T. l

Reverse
recovery
current

D.U.T. V

Re-applied
voltage

Inductor current

Note

a. V

waveform

SD

Body diode forward

waveform

DS

Body diode forward drop

Ripple ≤ 5 %

= 5 V for logic level devices

GS

current

dI/dt

Diode recovery

dV/dt

V

DD

I

SD

Fig.14 - For N-Channel








Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?91194

.

S14-1685-Rev. E, 18-Aug-14

6

Document Number: 91194

For technical questions, contact: [e-mail]

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

SOT-223 (HIGH VOLTAGE)

Package Information

Vishay Siliconix

3

B

B1

0.10 (0.004)

0.10 (0.004)

0.20 (0.008)

3 x B

0.10 (0.004)

H

D

3

A

4

3

E

1

2

e

e1

MILLIMETERS INCHES

DIM. MIN. MAX. MIN. MAX.

A 1.55 1.80 0.061 0.071

B 0.65 0.85 0.026 0.033

B1 2.95 3.15 0.116 0.124

C 0.25 0.35 0.010 0.014

D 6.30 6.70 0.248 0.264

E 3.30 3.70 0.130 0.146

e 2.30 BSC 0.0905 BSC

e1 4.60 BSC 0.181 BSC

H 6.71 7.29 0.264 0.287

L 0.91 - 0.036 -

L1 0.061 BSC 0.0024 BSC

θ - 10' - 10'

ECN: S-82109-Rev. A, 15-Sep-08
DWG: 5969

Notes

1. Dimensioning and tolerancing per ASME Y14.5M-1994.

2. Dimensions are shown in millimeters (inches).

3. Dimension do not include mold flash.

4. Outline conforms to JEDEC outline TO-261AA.

A

M

M

M

M

C

C B

M

M

C A

M

M

C B

C

L1

4 x L

θ

0.08 (0.003)

4 x C

Document Number: 91363 www.vishay.com
Revision: 15-Sep-08 1

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Revision: 13-Jun-16

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Document Number: 91000