ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Pb-free
Available
ParameterSymbol5 secSteady StateUnit
Drain-Source VoltageV
Gate-Source VoltageV
a
Continuous Drain Current(TJ = 150_C)
Pulsed Drain Current
Avalanche Current
Single Avalanche Energy
Continuous Source Current (Diode Conduction)
Power Dissipation
Operating Junction and Storage Temperature RangeTJ, T
b
b
a
_
a
TA= 25_C
TA= 70_C
L = 0.1 mH
TA= 25_C
TA= 70_C
THERMAL RESISTANCE RATINGS
ParameterSymbolTypicalMaximumUnit
Maximum Junction-to-Ambient
Maximum Junction-to-FootSteady StateR
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
b. Pulse width limited by maximum junction temperature
a
t v 5 sec
Steady State
DS
GS
I
D
I
DM
I
AS
E
AS
I
S
P
D
stg
R
thJA
thJF
4.93.77
3.93.0
1.250.75
0.800.48
75100
120166
4050
20
"12
15
15
11.25mJ
1.0A
−55 to 150
A
W
_C
_C/W
Document Number: 71611
S-50574—Rev. C, 04-Apr-05
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1
Page 2
Si2314EDS
mA
SO
DS(on)
W
DSGSD
V
DD
= 10 V, RL = 10 W
g
Vishay Siliconix
SPECIFICATIONS (TA = 25_C UNLESS OTHERWISE NOTED)
ParameterSymbolTest ConditionsMinTypMaxUnit
Static
Drain-Source Breakdown VoltageV(
BR)DSS
Gate-Threshold VoltageV
Gate-Body LeakageI
Zero Gate Voltage Drain CurrentI
On-State Drain Current
Drain-Source On-Resistance
Forward Transconductance
a
a
a
I
r
DS(on)
Diode Forward VoltageV
Dynamic
b
Total Gate ChargeQ
Gate-Source ChargeQ
Gate-Drain ChargeQ
Switching
Turn-On Delay Timet
Rise Timet
Turn-Off Delay Timet
Fall-Timet
Source-Drain Reverse Recovery Timet
GS(th)
GSS
DSS
D(on)
g
fs
SD
g
gs
gd
d(on)
r
d(off)
f
rr
VGS = 0 V, ID = 250 mA
VDS = VGS, ID = 250 mA
VDS = 0 V, VGS = "4.5 V"1.5
VDS = 20 V, VGS = 0 V1
VDS = 20 V, VGS = 0 V, TJ = 70_C
VDS w 10 V, VGS = 4.5 V15A
VGS = 4.5 V, ID = 5.0 A0.0270.033
VGS = 2.5 V, ID = 4.5 A0.0330.040
VGS = 1.8 V, ID = 4.0 A0.0420.051
VDS = 15 V, ID = 5.0 A40S
IS = 1.0 A, VGS = 0 V0.81.2V
VDS = 10 V, VGS = 4.5 V, ID = 5.0 A1.5nC
V
= 10 V, RL = 10 W
DD
ID ^ 1.0 A, V
= 4.5 V, Rg = 6 W
GEN
IF = 1.0 A, di/dt = 100 A/ms
20
0.45
Limits
0.95
75
11.014.0
2.1
0.530.8
1.42.2
13.520
5.99
1325ns
V
mA
W
ms
Notes
a. Pulse test: PW v300 ms duty cycle v2%.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only , and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability .
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Gate Current vs. Gate-Source Voltage
10
1
TJ = 150_C
TJ = 25_C
0.1110100
V
− Gate-to-Source Voltage (V)
GS
− Gate Current (mA)I
GSS
1200
Gate-Current vs. Gate-Source Voltage
1000
800
600
400
200
0
024681012
VGS − Gate-to-Source Voltage (V)
mA)
− Gate Current (I
GSS
10,000
1,000
100
0.1
0.01
0.001
0.0001
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Document Number: 71611
S-50574—Rev. C, 04-Apr-05
Page 3
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output CharacteristicsTransfer Characteristics
15
VGS = 4.5 thru 2.0 V
12
Si2314EDS
Vishay Siliconix
15
12
− Drain Current (A)I
D
W )
− On-Resistance (r
DS(on)
9
6
3
0.5 V
0
01234
VDS − Drain-to-Source Voltage (V)
1.5 V
1.0 V
On-Resistance vs. Drain Current
0.15
0.12
0.09
0.06
0.03
VGS = 1.8 V
VGS = 2.5 V
VGS = 4.5 V
9
− Drain Current (A)I
6
D
3
0
0.00.51.01.52.0
1500
1200
900
600
C − Capacitance (pF)
300
TC = 125_C
25_C
VGS − Gate-to-Source Voltage (V)
−55_C
Capacitance
C
iss
C
oss
C
rss
0.00
03691215
8
VDS = 10 V
= 5.0 A
I
D
6
4
− Gate-to-Source Voltage (V)
2
GS
V
0
048121620
Document Number: 71611
S-50574—Rev. C, 04-Apr-05
− Drain Current (A)
I
D
Gate Charge
Qg − Total Gate Charge (nC)
0
1.6
1.4
1.2
− On-Resiistance
DS(on)
r
1.0
(Normalized)
0.8
0.6
−50 −250255075100 125 150
048121620
VDS − Drain-to-Source Voltage (V)
On-Resistance vs. Junction Temperature
VGS = 4.5 V
= 5.0 A
I
D
T
− Junction Temperature (_C)
J
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Page 4
Si2314EDS
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
− Source Current (A)I
S
Variance (V)V
GS(th)
20
Source-Drain Diode Forward VoltageOn-Resistance vs. Gate-to-Source Voltage
10
TJ = 150_C
1
TJ = 25_C
0.1
0.01
0.00.20.40.60.81.01.2
VSD − Source-to-Drain Voltage (V)VGS − Gate-to-Source Voltage (V)
Vishay Siliconix maintains worldw ide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and
Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see
http://www.vishay .com/ppg?7161 1.
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Document Number: 71611
S-50574—Rev. C, 04-Apr-05
Page 5
Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
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