Preliminary Datasheet SHT21P
1.0 1.0 2.4
0.3
0.4
1.5
0.4
0.75
1.1
0.2
SCL SDA
NC NC
VSS VDD
Bottom View
P0AC4
3.0
2.2 0.8 typ
1.4
typ
3.0
0.3 typ
, the data
signal is provided on SDA line. Pulling SCL high or low
,
Every sensor is individually calibrated and tested. Lot
With made improvements and the miniaturization of the
has been improved.
SDM interface
analog
Humidity and Temperature Sensor
Fully calibrated
Analog output, PWM interface
Low power consumption
Excellent long term stability
DFN type package – reflow solderable
Product Summary
SHT21P, the new humidity and temperature sensor of
Sensirion is about to set new standards in terms of size
and intelligence: Embedded in a reflow solderable Dual
Flat No leads (DFN) package of 3 x 3mm foot print and
1.1mm height it provides calibrated, linearized signals in
analog Pulse Width Modulated (PWM) format.
With a completely new designed CMOSens® chip, a
reworked capacitive type humidity sensor and a standard
band gap temperature sensor the performance level has
been lifted even beyond the outstanding reliability level of
the previous sensor generation (SHT1x and SHT7x). For
example, measures have been taken to stabilize the
behavior at high humidity levels.
Dimensions
2.0 typ
SHT21
PWM signal runs on a base frequency of 120Hz
allows for switching between humidity and temperature
respectively. The sensor measures once per second.
identification is printed on the sensor.
sensor the performance-to-price ratio
SHT21 is also available with digital I2C or
of which the latter may be converted to an
ratiometric interface by adding a low pass filter.
Sensor Chip
SHT21P features a generation 4C CMOSens® chip.
Besides the capacitive relative humidity sensor and the
band gap temperature sensor, the chip contains an
amplifier, A/D converter, OTP memory and a digital
processing unit.
Figure 1: Drawing of SHT21P sensor package, dimensions
are given in mm (1mm = 0.039inch), tolerances are ±0.1mm.
NC and die pad (center pad) are internally connected to VSS.
They may be left floating. VSS = GND, SDA = DATA.
www.sensirion.com Version 0.6 – August 2009 1/8
Material Contents
While the sensor itself is made of Silicon the sensors’
housing consists of a plated Cu lead-frame and green
epoxy-based mold compound. The device is free of Pb, Cd
and Hg – hence it is fully RoHS and WEEE compliant.
Roadmap of Product Launch
SHT21P samples at design freeze status are available –
please check www.sensirion.com/sht21. Volume supply
will be started in May 2010. For more information please
contact Sensirion at info@sensirion.com.
Please note that this is a preliminary Datasheet – all
details are subject to change.
Sensor Performance
Relative Humidity
123
Temperature
456
Parameter Condition min typ max Units
Resolution 10 bit 0.12 %RH
Accuracy
tolerance 1
typ
max see Figure 2 %RH
Repeatability
Hysteresis
1.5
0.1
1
%RH
%RH
%RH
Nonlinearity <0.1 %RH
Response time 2
63%
8 s
Operating Range extended 3 0 100 %RH
Long Term Drift
4
normal < 0.5 %RH/yr
RH (%RH)
± 10
± 8
± 6
± 4
± 2
SHT21
Parameter Condition min typ max Units
Resolution 12 bit 0.04 °C
Accuracy
tolerance 1
typ
max see Figure 3 °C
Repeatability
Operating Range extended 3
-40 125 °C
0.3
0.1
°C
°C
-40 257 °F
Response Time
6
63%
5 30 s
Long Term Drift < 0.04 °C/yr
T (°C)
± 2.5
± 2.0
± 1.5
± 1.0
± 0.5
± 0
0 10 20 30 40 50 60 70 80 90 100
Relative Humidity (%RH)
Figure 2 Maximal accuracy at 25°C for relative humidity
Electrical Specification
Parameter Condition min typ max Units
Supply Voltage, VDD
Supply Current, IDD
Power Dissipation 5
5
2.1 3.0 3.6 V
180 µA
0.54 mW
PWM frequency 40 °C 108 120 132 Hz
Temperature drift of
PWM frequency
Measurement
Frequency
-0.07 -0.12 Hz/°C
1 Hz
Switch RH/T on SDA SCL up RH; SCL down T
Table 1 Electrical specification. For absolute maximum
values see Chapter 3 of Users Guide.
1
Accuracies are tested at Outgoing Quality Control at 25°C (77°F) and 3.0V.
Values exclude hysteresis and non-linearity and are applicable to noncondensing environments only.
2
Time for achieving 63% of a step function, valid at 25°C and 1 m/s airflow.
3
Normal operating range: 0-80%RH, beyond this limit sensor may read a
reversible offset with slow kinetics (<3%RH after 200hours at 90%RH).
Operating range is further restricted to values with dew point at -40 – 80°C.
± 0.0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
Temperature (°C)
Figure 3 Maximal temperature accuracy
Packaging Information
Sensor Type Packaging Quantity Order Number
Tape & Reel 400 Not defined yet
SHT21P
Tape & Reel 1500 Not defined yet
Tape & Reel 5000 Not defined yet
4
Value may be higher in environments with vaporized solvents, out-gassing
tapes, adhesives, packaging materials, etc. For more details please refer to
Handling Instructions.
5
Min and max values of Supply Current and Power Dissipation are based upon
fixed VDD = 3.0V and T<60°C (average value at one 10bit measurement per
one seconds) and with the load equivalent to a cable of 1cm length.
6
Response time depends on heat conductivity of sensor substrate.
www.sensirion.com Version 0.6 – August 2009 2/8
Normal
1.0 1.0 0.3
1.6
0.4
0.7
0.2
2.4
Temperature
Time
TP
TL
TS (max)
preheating
critical zone
Datasheet SHT21P
Users Guide SHT21P
1 Application Information
1.1 Operating Conditions
Sensor works stable within recommended normal range –
see Figure 4. Long term exposures to conditions outside
normal range, especially at humidity >80%RH, may
temporarily offset the RH signal (+3 %RH after 60h). After
return to normal range it will slowly return towards
calibration state by itself. See Section 1.4 “Reconditioning
Procedure” to accelerate eliminating the offset. Prolonged
exposure to extreme conditions may accelerate ageing.
100
80
60
40
20
Relative Humidity (%)
Max. Range
0
-40 -20 0 20 40 60 80 100 120
Figure 4 Operating Conditions
1.2 Soldering instructions
The DFN’s die pad (centre pad) and perimeter I/O pads
are fabricated from a planar copper lead-frame by overmolding leaving the die pad and I/O pads exposed for
mechanical and electrical connection. Both the I/O pads
and die pad should be soldered to the PCB.
The I/O lands should be 0.2mm longer than the package
I/O pads. Inward corners may be rounded to match the I/O
pad shape. The I/O land width should match the package
I/O pads width 1:1 and the thermal land for the die pad
should match 1:1 with the package - see Figure 5.
Range
Temperature (°C)
For land pattern and solder mask design Non-Solder Mask
Defined (NSMD) with solder mask openings larger than
metal pads is recommended: It allows for better control of
the copper etching process, it reduces stress
concentrations near the solder mask overlap region and it
improves the reliability of solder joints as solder is allowed
to “wrap around” the sides of the metal pads on the board.
For NSMD pads, the solder mask opening should be about
120µm to 150µm larger than the pad size, providing a
60µm to 75µm design clearance between the copper pad
and solder mask. Rounded portions of package pads
should have a matching rounded solder mask-opening
shape, especially at corner leads to allow for enough
solder mask web to prevent solder bridging. For the actual
pad dimensions, each pad on the PCB should have its
own solder mask opening with a web of solder mask
between adjacent pads.
A laser-cut, stainless steel stencil with electro-polished
trapezoidal walls is recommended. Electro-polishing
“smoothes” aperture walls, resulting in reduced surface
friction, good paste release and void reduction. A
0.125mm stencil thickness is recommended.
For the I/O pads the stencil aperture is 0.1mm longer than
PCB pads with 0.1 mm offset away from the centre of the
package. The die pad aperture should cover about 7090% of the pad area – say up to 1.4mm x 2.3mm centered
on the thermal land area. It could also be split in two
openings.
Due to the low mounted height of the QFN, “no clean” type
3 paste is recommended as well as Nitrogen purge during
reflow.
t
P
t
L
0.4
0.2
Figure 6 Soldering profile according to JEDEC standard. TP <=
260°C and tP < 40sec for Pb-free assembly. TL < 220°C and tL <
Figure 5 Recommended land pattern for SHT2x. Values in mm.
Die pad (centre pad) is internally connected to VSS. NC Pads
may be left floating. The outer dotted line represents the outer
dimension of the DFN package.
150sec. Ramp-up/down speeds shall be < 5°C/sec.
It is important to note that the diced edge or side faces of
the I/O pads may oxidise over time, therefore a solder fillet
may or may not form. Hence there is no guarantee for
solder joint fillet heights of any kind.
www.sensirion.com Version 0.6 – August 2009 3/8
Datasheet SHT21P
For soldering SHT2x standard reflow soldering ovens may
be used. The sensor is qualified to withstand soldering
For more detailed information please consult the
document “Handling Instructions” or contact Sensirion.
profile according to IPC/JEDEC J-STD-020C with peak
temperatures at 260°C during up to 40sec including Pbfree assembly in IR/Convection reflow ovens.
For soldering in Vapor Phase Reflow (VPR) ovens the
peak conditions are limited to TP < 233°C during tP <
60sec and ramp-up/down speeds shall be limited to
10°C/sec. For manual soldering contact time must be
1.4 Reconditioning Procedure
As stated above extreme conditions or exposure to solvent
vapors may offset the sensor. The following reconditioning
procedure may bring the sensor back to calibration state:
Baking: 100 – 105°C at < 5%RH for 10h
Re-Hydration: 20 – 30°C at ~ 75%RH for 12h 9.
limited to 5 seconds at up to 350°C7.
IMPORTANT: After soldering the devices should be stored
at >75%RH for at least 12h to allow the polymer to rehydrate. Otherwise the sensor may read an offset that
slowly disappears if exposed to ambient conditions.
In no case, neither after manual nor reflow soldering, a
board wash shall be applied. Therefore, and as mentioned
above, it is strongly recommended to use “no-clean” solder
paste. In case of application with exposure of the sensor to
corrosive gases the soldering pads shall be sealed to
prevent loose contacts or short cuts.
For the design of the SHT2x footprint it is recommended to
use dimensions according to Figure 5. In order to prevent
oxidation and to optimize soldering, sensor pads are
plated with Ni/Pd/Au. Please note that this protective
coating is not present at side walls – hence fillets may or
1.5 Temperature Effects
Relative humidity reading strongly depends on
temperature. Therefore, it is essential to keep humidity
sensors at the same temperature as the air of which the
relative humidity is to be measured. In case of testing or
qualification the reference sensor and test sensor must
show equal temperature to allow for comparing humidity
readings.
If the sensor shares a PCB with electronic components
that produce heat it should be mounted in a way that
prevents heat transfer or keeps it as low as possible.
Measures to reduce heat transfer can be ventilation,
reduction of copper layers between the sensor and the
rest of the PCB or milling a slit into the PCB around the
sensor (see Figure 7).
may not form depending on oxidation at diced edge.
1.3 Storage Conditions and Handling Instructions
Moisture Sensitivity Level (MSL) is 2, hence storage time
is limited to one year.
It is of great importance to understand that a humidity
sensor is not a normal electronic component and needs to
be handled with care. Chemical vapors at high
concentration in combination with long exposure times
may offset the sensor reading.
For these reasons it is recommended to store the sensors
in original packaging including the sealed ESD bag at
following conditions: Temperature shall be in the range of
10°C – 50°C and humidity at 20 – 60%RH (sensors that
are not stored in ESD bags). For sensors that have been
removed from the original packaging we recommend to
store them in ESD bags made of PE-HD8.
In manufacturing and transport the sensors shall be
prevented of high concentration of chemical solvents and
long exposure times. Out-gassing of glues, adhesive tapes
and stickers or out-gassing packaging material such as
bubble foils, foams, etc. shall be avoided. Manufacturing
area shall be well ventilated.
Figure 7 Top view of example of mounted SHT21P with slits
milled into PCB to minimize heat transfer.
1.6 Light
The SHT21P is not light sensitive. Prolonged direct
exposure to sunshine or strong UV radiation may age the
housing.
1.7 Materials Used for Sealing / Mounting
Many materials absorb humidity and will act as a buffer
increasing response times and hysteresis. Materials in the
vicinity of the sensor must therefore be carefully chosen.
Recommended materials are: Any metals, LCP, POM
(Delrin), PTFE (Teflon), PEEK, PP, PB, PPS, PSU, PVDF,
PVF.
For sealing and gluing (use sparingly): Use high filled
epoxy for electronic packaging (e.g. glob top, underfill),
and Silicone. Out-gassing of these materials may also
7
233°C = 451°F, 260°C = 500°F, 350°C = 662°F
8
For example, 3M antistatic bag, product “1910” with zipper.
www.sensirion.com Version 0.6 – August 2009 4/8
9
75%RH can conveniently be generated with saturated NaCl solution.
100 – 105°C correspond to 212 – 221°F, 20 – 30°C correspond to 68 – 86°F
tal IO Pins (SDA, SCL)
SDA
VDD
C = 100nF
PWM bit stream
Select RH or T
6
2 5 1
Datasheet SHT21P
contaminate the sensor (see Section 1.3). Therefore try to
3 Electrical Characteristics
add the sensor as a last manufacturing step to the
assembly, store the assembly well ventilated after
manufacturing or bake at >50°C for 24h to outgas
contaminants before packing.
3.1 Absolute Maximum Ratings
The electrical characteristics of SHT21P are defined in
Table 1. The absolute maximum ratings as given in Table
3 are stress ratings only and give additional information.
1.8 Wiring Considerations and Signal Integrity
Carrying the SCL and SDA signal parallel and in close
proximity (e.g. in wires) for more than 10cm may result in
cross talk and loss of communication. This may be
resolved by routing VDD and/or VSS between the two
SDA signals and/or using shielded cables. Power supply
pins (VDD, VSS) must be decoupled with a 100nF
capacitor, close to the sensor.
Functional operation of the device at these conditions is
not implied. Exposure to absolute maximum rating
conditions for extended periods may affect the sensor
reliability (e.g. hot carrier degradation, oxide breakdown).
Parameter min max Units
VDD to VSS -0.3 5 V
Digi
to VSS
Input Current on any Pin -100 100 mA
-0.3 VDD + 0.3 V
2 Interface Specifications
Pin Name Comment
5 VSS Ground
6 SDA Data bit-stream
3 SCL Selector for RH or T
2 VDD Supply Voltage
1,4 NC Not connected
Table 2 SHT21P pin assignment, NC remain floating
2.1 Power Pins (VDD, VSS)
The supply voltage of SHT21P must be in the range of 2.1
– 3.6V, recommended supply voltage is 3.0V. Power
supply pins Supply Voltage (VDD) and Ground (VSS) must
be decoupled with a 100nF capacitor, that shall be placed
as close to the sensor as possible – see Figure 8.
2.2 SCL – Output Selector Pad
SCL is used to select humidity or temperature output. SCL
high yields humidity output, SCL low yields temperature
output. Please note that a change of SCL will effect the
output on SDA after maximal 1.2 seconds.
Table 3 Electrical absolute maximum ratings
ESD immunity is qualified according to MIL STD 883E,
method 3015 (Human Body Model at 2kV). Latch-up
immunity is provided at a force current of 100mA with
T
= 80°C according to JEDEC78A.
amb
3.2 Input / Output Characteristics
The electrical characteristics such as power consumption,
low and high level input and output voltages depend on
the supply voltage. For proper communication with the
sensor it is essential to make sure that signal design is
strictly within the limits given in Table 4.
Parameter min typ max Units
Output Low Voltage, VOL 0 V
Output High Voltage, VOH VDD V
Output Sink Current, IOL 40 µA
Table 4 DC characteristics of output pad. VDD = 2.1 V to 3.6 V,
T = -40 °C to 125 °C, unless otherwise noted.
4 Communication with Sensor
Figure 8 Typical application circuit, including decoupling of
VDD and VSS by a capacitor.
2.3 SDA – Bit Stream Pad
On SDA the sensor is providing PWM output. The signal is
carrying humidity or temperature data depending on SCL
being high or low, respectively. See Table 4 for detailed
I/O characteristic of the sensor.
www.sensirion.com Version 0.6 – August 2009 5/8
SHT2x
4.1 Start up Sensor
As a first step, the sensor is powered up to VDD (between
2.1V and 3.6V). After power-up, the sensor needs at most
90ms for reaching idle state. Then the sensor starts
measuring and providing data on PWM bit-stream.
4.2 PWM Specification
Pulse Width Modulation runs on a constant frequency and
the measured information is provided as duty cycle on that
frequency – see Figure 9. Such information is measured
humidity for SCL pulled high and temperature for SCL
pulled low.
SDA
VDD
0V
tF
tPW
Datasheet SHT21P
5.2 Temperature Conversion
The temperature T is calculated by inserting the ratio of
tPW and tF into the following formula (result in °C):
t
PW
ccT
32
t
F
Figure 9 PWM signal. Base frequency runs constantly at
approximately 120 Hz, hence tF is about 8.3ms. The signal is
provided on tPW as a ratio of tF.
The corresponding coefficients given in Table 6:
The measured data – either humidity or temperature – is
provided as ratio of tPW and tF: tF = tPW denotes measured
data is at upper edge of full range.
tPW shall always be given as ratio of tF to make it
independent of variations of the base frequency.
5 Conversion of Signal Output
Resolution is set to 10 bit relative humidity and 12 bit
temperature reading and cannot be changed. The sensor
reading is linear and hence it can be converted to a
physical value by an easy linear equation.
5.1 Relative Humidity Conversion
With the relative humidity signal output the relative
humidity RH is obtained by the following formula (result in
%RH):
t
PW
ccRH
10
t
F
The corresponding coefficients are given in Table 5:
Coefficient Value
c0 -5
c1 125
Table 5 Preliminary humidity conversion coefficients (final
values by 15 Dec 2009).
The physical value RH given above corresponds to
the relative humidity above liquid water according to
World Meteorological Organization (WMO). For
relative humidity values above ice RHi the values need to
be transformed as from relative humidity above water RHw
at a certain temperature t follows – compare also
Application Note “Introduction to Humidity”:
RHRH
wi
tβ
w
expexp
tλ
w
tβ
i
tλ
i
Coefficient Value
c2 -46.83
c3 175.72
Table 6 Preliminary temperature conversion coefficients (final
values by 15 Dec 2009).
6 Environmental Stability
The sensors are planned to be qualified according to AEC-
Q100 standard, grade 1 which corresponds to the
temperature range of -40 – 125°C. Details will be given
when qualification results are available.
7 Packaging
7.1 Packaging type
SHT21 sensors are provided in DFN packaging (in
analogy with QFN packaging). DFN stands for Dual Flat
No leads.
The sensor chip is mounted to a lead frame made of Cu
and coated with Ni/Pd/Au. Chip and lead frame are over
molded by green epoxy-based mold compound. Please
note that side walls of sensors are sawed and hence lead
frame is not covered with respective protective coating.
Side fences hence may corrode slightly and therefore the
wetability at soldering may degrade over time.
7.2 Traceability Information
All SHT21 are laser marked with an alphanumeric, five-
digit code on the sensor – see Figure 10.
SHT21
P0AC4
Figure 10 Laser marking on sensor. For details see text.
Units are %RH for relative humidity and °C for
temperature. The corresponding coefficients are defined
as follows: βw = 17.62, λw = 243.12°C, βi = 22.46, λi =
272.62°C.
The marking on the sensor consists of two lines with five
digits each. The first line denotes the sensor type
(SHT21). The first digit of the second line defines the
output mode (D = digital, Sensibus and I2C, P = PWM, S =
SDM). The second digit defines the manufacturing year (0
www.sensirion.com Version 0.6 – August 2009 6/8
8.0 2.0
4.0
0.3
1.3 R0.3 MAX
R0.25
Ø0.15 MIN
Ø0.15 MIN
3.3
0.25
3.3 1.75
12.0
Datasheet SHT21P
= 2010, 1 = 2011, etc.). The last three digits eventually
represent an alphanumeric tracking code. That code can
be decoded by Sensirion only and allows for tracking on
batch level through production, calibration and testing –
and will be provided upon justified request.
Reels are also labeled, as displayed in Figures 19 and 20,
and give additional traceability information.
Lot No.: XXO-NN-YRRRRTTTT
Quantity: RRRR
RoHS: Compliant
Lot No.
Figure 11: First label on reel: XX = Sensor Type (21 for SHT21),
O = Output mode (D = Digital, P = PWM, S = SDM), NN = Chip
Version, Y = last digit of year, RRRR = number of sensors on
reel, TTTT = Traceability Code.
Device Type: 1-100PPP-NN
Description: Humidity & Temperature Sensor
SHTxx
Part Order No. 1-100PPP-NN or Customer Number
Date of Delivery: DD.MM.YYYY
Order Code: 45CCCC / 0
Figure 12: Second label on reel: For Device Type and Part
Order Number is not defined yet, Delivery Date (also Date Code)
is date of packaging of sensors (DD = day, MM = month, YYYY
= year), CCCC = Sensirion order number.
7.3 Shipping Package
SHT2x are provided in tape & reel shipment packaging,
sealed into antistatic ESD bags. Standard packaging sizes
are 400, 1500 and 5000 units per reel. The drawing of the
packaging tapes with sensor orientation is shown in Figure
13. The reels are provided in sealed antistatic bags.
5.5
Figure 13 Sketch of packaging tape and sensor orientation.
www.sensirion.com Version 0.6 – August 2009 7/8
Datasheet SHT21P
Revision History
Date Version Page(s) Changes
6 May 2009 0.3 1 – 9 Initial preliminary release
3 June 2009 0.5 1 – 7 Adaptation to PWM communication
19 Aug 2009 0.6 1, 6 Figure 1 adapted, add details to Section 1.2, 5.1 and Chapter 7
Important Notices
Warning, Personal Injury
Do not use this product as safety or emergency stop devices or in
any other application where failure of the product could result in
personal injury. Do not use this product for applications other
than its intended and authorized use. Before installing, handling,
using or servicing this product, please consult the data sheet and
application notes. Failure to comply with these instructions could
result in death or serious injury.
If the Buyer shall purchase or use SENSIRION products for any
unintended or unauthorized application, Buyer shall defend, indemnify
and hold harmless SENSIRION and its officers, employees,
subsidiaries, affiliates and distributors against all claims, costs,
damages and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated
with such unintended or unauthorized use, even if SENSIRION shall be
allegedly negligent with respect to the design or the manufacture of the
product.
ESD Precautions
The inherent design of this component causes it to be sensitive to
electrostatic discharge (ESD). To prevent ESD-induced damage and/or
degradation, take customary and statutory ESD precautions when
handling this product.
See application note “ESD, Latchup and EMC” for more information.
Warranty
SENSIRION warrants solely to the original purchaser of this product for
a period of 12 months (one year) from the date of delivery that this
product shall be of the quality, material and workmanship defined in
SENSIRION’s published specifications of the product. Within such
period, if proven to be defective, SENSIRION shall repair and/or
replace this product, in SENSIRION’s discretion, free of charge to the
Buyer, provided that:
notice in writing describing the defects shall be given to
SENSIRION within fourteen (14) days after their appearance;
such defects shall be found, to SENSIRION’s reasonable
satisfaction, to have arisen from SENSIRION’s faulty design,
material, or workmanship;
the defective product shall be returned to SENSIRION’s factory at
the Buyer’s expense; and
the warranty period for any repaired or replaced product shall be
limited to the unexpired portion of the original period.
This warranty does not apply to any equipment which has not been
installed and used within the specifications recommended by
SENSIRION for the intended and proper use of the equipment.
EXCEPT FOR THE WARRANTIES EXPRESSLY SET FORTH
HEREIN, SENSIRION MAKES NO WARRANTIES, EITHER EXPRESS
OR IMPLIED, WITH RESPECT TO THE PRODUCT. ANY AND ALL
WARRANTIES, INCLUDING WITHOUT LIMITATION, WARRANTIES
OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR
PURPOSE, ARE EXPRESSLY EXCLUDED AND DECLINED.
SENSIRION is only liable for defects of this product arising under the
conditions of operation provided for in the data sheet and proper use of
the goods. SENSIRION explicitly disclaims all warranties, express or
implied, for any period during which the goods are operated or stored
not in accordance with the technical specifications.
SENSIRION does not assume any liability arising out of any application
or use of any product or circuit and specifically disclaims any and all
liability, including without limitation consequential or incidental
damages. All operating parameters, including without limitation
recommended parameters, must be validated for each customer’s
applications by customer’s technical experts. Recommended
parameters can and do vary in different applications.
SENSIRION reserves the right, without further notice, (i) to change the
product specifications and/or the information in this document and (ii) to
improve reliability, functions and design of this product.
Copyright© 2009, SENSIRION.
CMOSens® is a trademark of Sensirion
All rights reserved
Headquarter and Sales Offices
Headquarter
SENSIRION AG Phone: +41 44 306 40 00
Laubisruetistr. 50 Fax: +41 44 306 40 30
CH-8712 Staefa ZH info@sensirion.com
Switzerland http://www.sensirion.com/
Sales Office USA:
SENSIRION Inc. Phone: +1 805 409 4900
2801 Townsgate Rd., Suite 204 Fax: +1 805 435 0467
Westlake Village, CA 91361 michael.karst@sensirion.com
USA http://www.sensirion.com/
Sales Office Japan:
SENSIRION JAPAN Co. Ltd. Phone: +81 3 3444 4940
Postal Code: 108-0074 Fax: +81 3 3444 4939
Shinagawa Station Bldg. 7F, info@sensirion.co.jp
4-23-5, Takanawa, Minato-ku http://www.sensirion.co.jp
Tokyo, Japan
www.sensirion.com Version 0.6 – August 2009 8/8
Sales Office Korea:
SENSIRION KOREA Co. Ltd. Phone: +82 31 440 9925~27
#1414, Anyang Construction Tower B/D, Fax: +82 31 440 9927
1112-1, Bisan-dong, Anyang-city info@sensirion.co.kr
Gyeonggi-Province http://www.sensirion.co.kr
South Korea
Sales Office China:
Sensirion China Co. Ltd. phone: +86 755 8252 1501
Room 2411, Main Tower fax: +86 755 8252 1580
Jin Zhong Huan Business Building, info@sensirion.com.cn
Futian District, Shenzhen, www.sensirion.com.cn
Postal Code 518048
PR China
Find your local representative at: http://www.sensirion.com/reps
Loading...