Datasheet SH8J66 Datasheet (ROHM)

Page 1
SH8J66
Structure Dimensions (Unit : mm) Silicon P-channel MOSFET
Features
1) Low On-resistance.
2) Built-in G-S Protection Diode.
3) Small Surface Mount Package (SOP8).
Applications Switching
Packaging specifications Inner circuit
Type
SH8J66
Package Code Basic ordering unit (pieces)
Taping
TB
2500
Absolute maximum ratings (Ta=25C) <It is the same ratings for Tr1 and Tr2.>
Parameter Drain-source voltage Gate-source voltage
Drain current Source current
(Body diode) Total power dissipation Channel temperature
Range of Storage temperature
∗1 Pw≤10μs, Duty cycle≤1% ∗2 Mounted on a ceramic board
Continuous Pulsed Continuous Pulsed
Symbol
DSS GSS
D
DP
S
SP
P
D
Limits Unit
−30 ±20
±9
∗1
±36
−1.6
∗1
−36
∗2
2.0
VV VV AI AI AI AI
W / TOTAL
W / ELEMENT1.4
°CTch 150 °CTstg −55 to +150
SOP8
(8) (7)
∗2
∗1
(1) (2)
∗1 ESD PROTECTION DIODE ∗2 BODY DIODE
(6) (5)
∗2
(3) (4)
Each lead has same dimensions
∗1
(1) Tr1 Source (2) Tr1 Gate (3) Tr2 Source (4) Tr2 Gate (5) Tr2 Drain (6) Tr2 Drain (7) Tr1 Drain (8) Tr1 Drain
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2010.01 - Rev.A
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Electrical characteristics (Ta=25C) <It is the same characteristics for Tr1 and Tr2.>
Parameter Symbol Gate-source leakage Drain-source breakdown voltage
V
(BR) DSS
Zero gate voltage drain current
V
Static drain-source on-state resistance
R
Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
∗Pulsed
Body diode characteristics (Source-drain) (Ta=25C) <It is the same characteristics for Tr1 and Tr2.>
Parameter Symbol
∗ Pulsed
I
GSS
I
DSS
GS (th)
DS (on)
Y
fs
C
iss
C
oss
C
rss
t
d (on)
t
r
t
d (off)
t
f
Q
Q
gs
Q
gd
V
SD
∗
∗
∗
∗
∗
∗
∗
g
∗
∗
∗
Min.
Typ. Max.
−−±10 μAV
−30 −−VID= −1mA, VGS=0V
−−−1 μAVDS= −30V, VGS=0V
−1.0 −−2.5 V VDS= −10V, ID= −1mAGate threshold voltage
− 13.5 18.5 I
− 17.5 23.6 mΩ
− 19.0 24.7 I
11 −−SV
− 3000 − pF VDS= −10V
− 400
−
−
−
−
−
−
−
−−nC
− pF VGS=0V
400
− pF f=1MHz
− ns
20 60
− ns
− ns
170 100
− ns
35
− nC
9
− nC
12
Min. Typ. Max.
−−−1.2 V IS= −9A, VGS=0VForward voltage
Unit
=±20V, VDS=0V
GS
mΩ
= −9A, VGS= −10V
D
ID= −4.5A, VGS= −4.5V
= −4.5A, VGS= −4.0V
mΩ
D
= −10V, ID= −9A
DS
VDD −15V
ID= −4.5A
GS
= −10V
V
L
=3.3Ω
R
G
=10Ω
R V
−15V
DD
I
= −9A
D
V
= −5V
GS
=1.7Ω / RG=10Ω
R
L
Unit
Data Sheet SH8J66
Conditions
Conditions
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2010 ROHM Co., Ltd. All rights reserved.
2010.01 - Rev.A
Page 3
Electrical characteristic curves
20
18
16
[A]
D
14
12
10
8
6
DRAIN CURRENT : -I
4
2
0
0.0 0.2 0.4 0.6 0.8 1.0
DRAIN -SOUR CE VOLTAGE : -VDS[V] DRAIN-SOURCE VOLTAGE : -VDS[V]
Fi g.1 Typic al output char acteri stic s() Fi g.2 T ypical output char acteri stic s() Fig.3 Typical Transfer Characteristics
VGS= -10V
= -4.5V
V
GS
= -4.0V
V
GS
VGS= -2.5V
VGS= -3.5V
= -3.0V
V
GS
Ta=25°C Pulsed
20
18
[A]
16
D
14
12
10
8
6
DRAIN CURRENT : -I
4
2
0
02 46 810
VGS= -10V
= -4.0V
V
GS
= -3.0V
V
GS
VGS= -2.5V
VGS= -2.2V
Ta= 25°C Pulsed
100
VDS= - 10V Pulsed
[A]
10
D
DRAIN CURRENT : -I
0.01
Ta= 125°C
Ta= 75°C
Ta= 25°C
1
Ta= - 25°C
0.1
1.01.52.02.53.0
GATE- SOURC E VOLTAGE : - VGS[V]
Data Sheet SH8J66
100
Ta= 25°C Pulsed
]
Ω
[m
DS(on)
10
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
1
0.1 1 10
DRAIN-CURRENT : -I
Fi g.4 Stati c Dr ain-Sour ce On-Stat e
Res istance vs. Drai n Curr ent(I)
100
VGS= -4.0V Pulsed
]
Ω
[m
DS(on)
10
Ta= 125°C
Ta= 75°C Ta= 25°C
Ta= -25°C
RESIST ANCE : R
STATIC DRAIN- SOURCE ON -STATE
1
0.1 1 10
DRAIN-CURRENT : -I
Fi g.7 Stat ic Dr ain- Source On- State
Res istance vs. Drai n Curr ent(V)
VGS= -4.0V V V
GS
GS
D
[A]
D
= -4.5V = -10V
[A]
100
VGS= - 10V Pulsed
]
Ω
[m
DS(on)
10
RESISTAN CE : R
STATIC DRAIN-SOURCE ON-STATE
1
0.1 1 10
DRAIN-CURRENT : -ID[A] DRAIN-CURRENT : -ID[A]
Fi g.5 Stati c Dr ain- Source On- State
Res istance vs. Drai n Curr ent()
100
VDS= -10V Pulsed
10
|Yfs| [S]
1
FORWARD TRANSFER ADMITTANCE :
0
0.1110 DRAIN-CURRENT : -ID[A]
Fi g.8 For ward Tr ansfer Admi ttance
vs. Drain Current
Ta= 125°C Ta=75°C Ta=25°C Ta= -25°C
Ta= -25°C Ta=25°C Ta=75°C Ta=125°C
100
]
Ω
[m
DS(on)
10
RESISTAN CE : R
STAT IC DR AIN-SO URCE ON-ST ATE
1
100
10
1
0.1
REVERSE DRAIN CURRENT : -Is [A]
0.01
VGS= -4.5V Pulsed
Ta= 125°C Ta= 75°C Ta= 25°C Ta= -25°C
0.1 1 10
Fi g.6 Stati c Dr ain-Sour ce On-Stat e
Res istance vs. D rain C urrent (
VGS=0V Pulsed
Ta= 125°C
Ta= 75°C Ta= 25°C
Ta= -25°C
0.0 0.2 0.4 0. 6 0.8 1.0 1.2 SOUR CE-D RAIN VOLT AGE : -VSD [V]
Fi g.9 Rever se Drai n Curr ent
vs. Sour se-Dr ain Vol tage
)

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2010 ROHM Co., Ltd. All rights reserved.
2010.01 - Rev.A
Page 4
L
Data Sheet SH8J66
50
45
]
Ω
40
[m
35
DS(on)
30
25
20
RESISTAN CE : R
15
STATIC DRAIN-SOURCE ON-STATE
10
051015
GATE-SOU RCE VOLTAGE : - V
Fi g.10 Stat ic Dr ain- Source On- State
Resistance vs. Gate Source Voltage
10000
1000
100
CAPACITANCE : C [pF]
10
0.01 0.1 1 10 100
DRAIN-SOURCE VOLTAGE : -V
ID= -9.0A
ID= -4.5A
Crss
Coss
Fi g.13 Typi cal Capac itance
vs. Dr ain-S ource Vol tage
Ciss
Ta= 25°C Pulsed
[V]
GS
Ta= 25°C f=1M Hz V
=0V
GS
[V]
DS
10000
1000
100
Switching Tim e : t [ns]
10
1
0.01 0.1 1 10
1000
100
(A)
D
10
1
0.1
DRAIN CURRENT : -I
0.01
t
r
DRAIN-CURRENT : -ID[A]
Fi g.11 Swi tching Char acteri sti cs
Operation in this area is l imited by R
(VGS=-10V)
Ta = 25°C
Single Pulse
MOUNT ED ON CE RAMIC B OARD
0.1 1 10 100
DRAIN -SOUR CE VOLTAGE : -VDS[V]
Fi g. 14 Maxi mum Safe O perat ing Aer a
Ta= 25°C V
t
d(off)
DD
V
GS
t
R
=10Ω
f
G
Pulsed
t
d(on)
DS(on)
= - 15V =- 10V
PW=100us
PW = 10m s
PW=1ms
DC operation
10
[V]
8
GS
6
4
2
GATE-SOU RCE VOLTAGE : - V
0
0 10203040506070
TOTAL GATE CHARGE : Qg [nC]
Fi g.12 D ynamic I nput Charac teri stics
Ta= 25°C V
DD
= -9.0A
I
D
R
=10Ω
G
Pulsed
= -15V
10
1
0.1
0.01
RESIST ANC E : r (t)
0.001
0.001 0. 01 0.1 1 10 100 1000
NORM ARI ZED TRAN SIEN T T HERM A
Ta = 25°C
Single Pu lse : 1Unit
Rth(ch-a)(t) = r(t)×Rth(ch-a)
Rth(ch-a) = 89.3 °C/W
<Mounted on a CERAMIC board>
PULSE WI DTH : Pw(s)
Fi g.15 N ormali zed Trans ient Ther mal Res istanc e vs. Pul se Width
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2010 ROHM Co., Ltd. All rights reserved.
2010.01 - Rev.A
Page 5
Fig.1-1 Switching Time Test Circuit
S
Fig.1-2 Switching Time Waveforms
%
V
V
Fig.2-1 Gate Charge Test Circuit
I
S
Fig.2-2 Gate Charge Waveform
V
Measurement circuits
R
G
Data Sheet SH8J66
Pulse Width
V
GS
I
D.U.T.
D
V
D
R
L
GS
10%
50% 50%
90%
10% 10
V
DD
DS
t
90% 90%
d(on)
t
r
t
on
t
d(off)
t
f
t
off
V
G
V
G(Const.)
GS
R
G
D
I
D.U.T.
V
D
R
L
GS
Q
V
DD
Q
g
gs
Q
gd
Charge
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2010 ROHM Co., Ltd. All rights reserved.
2010.01 - Rev.A
Page 6
Notes
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Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage.
The technical information specied herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other par ties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information.
Notice
The Products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu­nication devices, electronic appliances and amusement devices).
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Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual.
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