Page 1
Product Description
Stanford Microdevices SGA-2286 is a high performance SiGe
Heterojunction Bipolar Transistor MMIC Amplifier. A Darlington
configuration featuring 1 micron emitters provides high FT and
excellent thermal perfomance. The heterojunction increases
breakdown voltage and minimizes leakage current between
junctions. Cancellation of emitter junction non-linearities results
in higher suppression of intermodulation products. At 850 Mhz
and 20mA , the SGA-2286 typically provides +20 dBm output
IP3, 15.0 dB of gain, and +9.3 dBm of 1dB compressed power
using a single positive voltage supply. Only 2 DC-blocking
capacitors, a bias resistor and an optional RF choke are required
for operation.
Gain & Return Loss vs. Freq. @TL=+25°C
18
15
12
GAIN
IRL
0
-8
-16
SGA-2286
DC-3500 MHz, Cascadable
SiGe HBT MMIC Amplifier
Product Features
High Gain : 14 dB at 1950 MHz
Cascadable 50 Ohm
Patented SiGe Technology
Operates From Single Supply
Low Thermal Resistance Package
9
Gain (dB)
6
3
012345
ORL
Frequency (GHz)
-24
Return Loss (dB)
-32
-40
Applications
Cellular, PCS, CDPD
Wireless Data, SONET
Satellite
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Test Conditions:
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VS = 5 V ID = 20 mA Typ. OIP3 Tone Spacing = 1 MHz, Pout per tone = -10 dBm
R
= 140 Ohms TL = 25ºC ZS = ZL = 50 Ohms
BIAS
5.310.51
5.61
0.41
6.21
3.8
0.7
0.02
4.91
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or omissions.
Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the users own risk. Prices and specifications are
subject to change without notice. No patent right s or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not
authorize or warrant any Stanford Microdevices product for use in life-support devices and/or systems.
Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.
Phone: (800) SMI-MMIC http://www.stanfordmicro.com726 Palomar Ave., Sunnyvale, CA 94085
1
EDS-100625 Rev B
Page 2
Preliminary
SGA-2286 DC-3500 MHz Cascadable MMIC Amplifier
Typical RF Performance at Key Operating Frequencies
Frequency (MHz)
Frequency (MHz)
Frequency (MHz)
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LROssoLnruteRtuptuOBd8.222.521.725.911.020.42
S
21
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VS = 5 V ID = 20 mA Typ. OIP3 Tone Spacing = 1 MHz, Pout per tone = -10 dBm
Test Conditions:
VS = 8 V ID = 80 mA Typ. OIP3 Tone Spacing = 1 MHz, Pout per tone = 0 dBm
R
= 140 Ohms TL = 25ºC ZS = ZL = 50 Ohms
R
= 39 Ohms TL = 25ºC ZS = ZL = 50 Ohms
BIAS
BIAS
Frequency (MHz)
Noise Figure vs. Frequency
VD= 2.2 V, ID= 20 mA
5
4
3
2
Noise Figure (dB)
1
0
00.511.522.53
Frequency (GHz)
TL=+25ºC
TL=+25ºC
OIP3 vs. Frequency
VD= 2.2 V, ID= 20 mA
30
T
25
20
(dBm)
3
OIP
15
10
0 0.5 1 1.5 2 2.5 3
Frequency (GHz )
L
TL=+25ºC
Absolute Maximum Ratings
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Bias Conditions should also satisfy the following
expression: IDVD (max) < (TJ - TL)/R
10
8
6
(dBm)
4
1dB
P
2
0
00.511.522.53
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vs. Frequency
1dB
VD= 2.2 V, ID= 20 mA
Frequency (GHz)
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Phone: (800) SMI-MMIC http://www.stanfordmicro.com726 Palomar Ave., Sunnyvale, CA 94085
2
EDS-100625 Rev B
Page 3
Preliminary
SGA-2286 DC-3500 MHz Cascadable MMIC Amplifier
S21 vs. Frequency
20
16
12
(dB)
21
8
S
4
0
012345
VD= 2.2 V, ID= 20 mA
Frequency ( G Hz)
+25°C
-40°C
T
L
+85°C
S12 vs. Frequency
-10
-15
(dB)
-20
12
S
-25
-30
012345
VD= 2.2 V, ID= 20 mA
Frequency (GHz)
+25°C
T
-40°C
L
+85°C
S11 vs. Frequency
0.0
-5.0
-10.0
(dB)
-15.0
11
S
-20.0
-25.0
-30.0
0.0 1.0 2.0 3.0 4.0 5.0
VD= 2.2 V, ID= 20 mA
Freq uency (GHz)
T
L
S22 vs. Frequency
-5
-10
-15
(dB)
-20
22
S
-25
-30
-35
012345
VD= 2.2 V, ID= 20 mA
Fre q uency (GHz )
T
L
+25°C
-40°C
+85°C
+25°C
-40°C
+85°C
Phone: (800) SMI-MMIC http://www.stanfordmicro.com726 Palomar Ave., Sunnyvale, CA 94085
3
EDS-100625 Rev B
Page 4
Basic Application Circuit
Preliminary
SGA-2286 DC-3500 MHz Cascadable MMIC Amplifier
V
S
RF in
R
BIAS
1 uF
1000
pF
C
D
L
C
Application Circuit Element Values
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C
B
C
D
L
C
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1
C
B
C
B
SGA-2286
2
A22
3
C
V
S
R
BIAS
L
C
B
1 uF
1000 pF
C
D
C
B
RF out
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Am02=
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R
SAIB
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SAIB
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Mounting Instructions
1. Use a large ground pad area under device pins 2
and 4 with many plated through-holes as shown.
3. We recommend 1 or 2 ounce copper. Measurements
for this data sheet were made on a 31 mil thick FR-4
board with 1 ounce copper on both sides.
Part Identification Marking
The part will be marked with an A22 designator on
the top surface of the package.
3
4
A22
2
1
For package dimensions, refer to outline drawing at
www.stanfordmicro.com
Caution: ESD sensitive
Appropriate precautions in handling, packaging
and testing devices must be observed.
Phone: (800) SMI-MMIC http://www.stanfordmicro.com726 Palomar Ave., Sunnyvale, CA 94085
4
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Part Number Ordering Information
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EDS-100625 Rev B
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