Datasheet SF1530DP, SF1530LGT Datasheet (SiFirst) [ru]

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High Performance Current Mode PWM Controller
Proprietary “Zero OCP/OPP Recovery Gap”
Control
Built-in Soft Start Function
All Pins Floating Protection
Very Low Startup Current
High Voltage CMOS Process with Excellent
ESD Protection
Frequency Reduction and Burst Mode Control
for Energy Saving
Current Mode Control
Built-in Frequency Shuffling
Programmable Switching Frequency
Built-in Synchronous Slope Compensation
Cycle-by-Cycle Current Limiting
Built-in Leading Edge Blanking (LEB)
Constant Power Limiting
Audio Noise Free Operation
VDD OVP & Clamp
VDD Under Voltage Lockout (UVLO)
APPLICATIONS
Offline AC/DC Flyback Converter for
AC/DC Adaptors
Open-frame SMPS
Set-Top Box Power Supplies
ATX Standby Power
SF1530
GENERAL DESCRIPTION
SF1530 is a high performance, low cost, highly integrated current mode PWM controller for offline flyback converter applications. PWM switching frequency with shuffling is externally programmable, which can reduce conduction EMI emission of a power supply. When the output power demands decrease, the IC automatically decreases switching frequency for high power conversion efficiency. When the current set-point falls below a given value, e.g. the output power demand diminishes, the IC enters into burst mode and provides excellent efficiency without audio noise.
The IC can achieve “Zero OCP/OPP Recovery Gap
using SiFirst’s proprietary control algorithm. Meanwhile, the OCP/OPP variation versus universal line input is compensated. The IC has built-in synchronized slope compensation to prevent sub-harmonic oscillation at high PWM duty output. The IC also has built-in soft start function to soften the stress on the MOSFET during power on period. SF1530 integrates functions and protections of Under Voltage Lockout (UVLO), VCC Over Voltage Protection (OVP), Cycle-by-cycle Current Limiting (OCP), All Pins Floating Protection, Over Load Protection (OLP), RT Pin Short-to-GND Protection, Gate Clamping, VCC Clamping, Leading Edge Blanking (LEB). SF1530 is available in SOT23-6, SOP-8 and DIP-8 packages.
TYPICAL APPLICATION
AC IN
GATE
GND
5 46
VDD
SF1530
FB
2
DC Out
CS
RT
31
TL431
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SF1530
Pin Configuration
GND
FB
NC
RT
GND
FB
RT
1
SOT23-6
2
3
6
GATE
GATE
1
8
DIP8
VDD
5
VDD
NC
4
CS
2
3
4
7
6
5CS
Ordering Information
Part Number Top Mark Package Tape & Reel
SF1530LGT .30YWW SOT26 Green Yes
SF1530DP SF1530DP DIP8 RoHS
Marking Information
YWW: Year&Week code
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Block Diagram
RT
Zero OCP Recovery
RT short/floating
protection
Trimmed Voltage &
Current Reference
VDD
9V/14V
33V
Gap Control
POR
27.5V
Internal
blocks
VDD OVP
GND
Oscillator with
Frequency Shuffling
OLP
Reduction Control
OCP
Burst Mode
Control
43ms Delay
S
R
Frequency
Q
CS floating
protection
Soft start
Slope
compensation
Soft Gate
Driver
3.7V
SF1530
GATE
LEB
CS
5.3V
FB
Pin Description
Pin Num Pin Name I/O Description
1 GND P Ground 2 FB I Voltage feedback pin. The loop regulation is achieved by connecting a
photo-coupler to this pin. PWM duty cycle is determined by this pin voltage and the current sense signal at Pin 3.
3 RT I Set the switching frequency by connecting a resistor between RT and
GND. This pin has floating/short-to-GND protection.
4 CS I Current sense input pin. 5 VDD P IC power supply pin. 6 GATE O Totem-pole gate driver output to drive the external MOSFET.
Absolute Maximum Ratings (Note 1)
Parameter Value Unit
VDD DC Supply Voltage 33 V VCC DC Clamp Current 10 mA GATE pin 20 V FB, RT, CS voltage range -0.3 to 7 V Package Thermal Resistance (SOT-26) 250 Package Thermal Resistance (DIP-8) 90 Package Thermal Resistance (SOP-8) 150 Maximum Junction Temperature 150 Operating Temperature Range -40 to 85
o
C/W
o
C/W
o
C/W
o
C
o
C
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Storage Temperature Range -65 to 150 Lead Temperature (Soldering, 10sec.) 260
SF1530
o
C
o
C ESD Capability, HBM (Human Body Model) 3 kV ESD Capability, MM (Machine Model) 250 V
Recommended Operation Conditions (Note 2)
Parameter Value Unit
Supply Voltage, VDD 11 to 25 V Operating Frequency 50 to 130 kHz Operating Ambient Temperature -40 to 85
o
C
ELECTRICAL CHARACTERISTICS
(TA = 25
O
C, RT=100K ohm, VDD=18V, if not otherwise noted)
Symbol Parameter Test Conditions Min Typ Max Unit Supply Voltage Section (VDD Pin)
UVLO(ON) VDD Under Voltage
Lockout Exit (Startup)
UVLO(OFF) VDD Under Voltage
Lockout Enter
I_Startup VDD Start up Current VDD =12.5V, Measure
I_VDD_Op Operation Current VFB=3V,CL=1nF 2.5 3.5 mA VDD_OVP
VDD Over Voltage Protection trigger
VDD_Clamp VDD Zener Clamp
Voltage
T_Softstart Soft Start Time 3 mSec
13 14 15 V
8 9 10 V
5 20 uA
current into VDD
25 27.5 30 V
I(V
) = 15 mA 33 V
DD
Feedback Input Section(FB Pin)
V
Open FB Open Voltage 5.3
FB_
V
IFB_Short FB short circuit
current
A
VCS
PWM Input Gain ΔV
VFB_min_duty FB under voltage gate
Short FB pin to GND,
1.1 mA
measure current
/ΔVcs 2.0 V/V
FB
1.0 V
clock is off.
VTH_PL Power Limiting FB
3.7 V
Threshold Voltage
TD_PL Power limiting
Note 3 43 mSec
Debounce Time
ZFB_IN Input Impedance 5 Kohm
Current Sense Input Section (CS Pin)
Vth_OC_min Internal current
limiting threshold
T_blanking SENSE Input Leading
Edge Blanking Time
TD_OC Over Current
Detection and Control Delay
Zero duty cycle 0.70 0.75 0.80 V
250 nSec
CL=1nF at GATE, 70 nSec
Oscillator Section (RT Pin)
F
Normal Oscillation
OSC
Frequency RT_range Operating RT Range 50 100 150 Kohm V_RT_open RT open voltage 2.0 V F(shuffle)/Fosc Frequency shuffling
range f_Temp Frequency
Temperature Stability ∆f_VDD Frequency Voltage VDD = 12-25V, 5 %
60 65 70 KHZ
Note 4 -4 4 %
-20oC to 100oC (Note 4) 5 %
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Stability Duty_max Maximum Duty cycle 75 80 85 % F_BM Burst Mode Base
Frequency
22 KHZ
SF1530
Gate Drive Output (GATE Pin)
VOL Output Low Level Io = 20 mA (sink) 1 V VOH Output High Level Io = 20 mA (source) 7.5 V VG_Clamp Output Clamp Voltage
Level T_r Output Rising Time CL = 1nF 200 nSec T_f Output Falling Time CL = 1nF 60 nSec
Note 1. Stresses beyond those listed under Absolute Maximum Ratingsmay cause permanent damage to
the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Note 2. The device is not guaranteed to function outside its operating conditions. Note 3. The OLP debounce time is proportional to the period of switching cycle. Note 4. Guaranteed by design.
VDD=24V 17.5 V
CHARACTERIZATION PLOTS
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OPERATION DESCRIPTION
SF1530 is a high performance, low cost, highly integrated current mode PWM controller for offline flyback converter applications. The built-in advanced energy saving with high level protection features improves the SMPS reliability and performance without increasing the system cost.
UVLO and Startup Operation
Fig.1 shows a typical startup circuitn. Before the IC begins switching operation, it consumes only startup current (typically 5uA) and current supplied through the startup resistor Rst charges the VDD hold-up capacitor Cdd. When VDD reaches UVLO turn-on voltage of 14V(typical), SF1530 begins switching and the IC current consumed increased to 2mA (typical). The hold-up capacitor Cdd continues to supply VDD before the energy can be delivered from auxiliary winding Na. During this process, VDD must not drop below UVLO turn-off voltage (typical 9V). The selection of Rst and Cdd should be a trade off between the power loss and startup time.
SF1530
“Zero OCP/OPP Recovery Gap” Control
The definition of OCP or OPP recovery gap of a power adaptor is illustrated in Fig.2. At T0, assuming an adaptor is at full loading mode. If the loading keeps increasing, then the system will output maximum power P_opp, which will trigger OPP protection at the same time. After the OPP protection is triggered, usually the system will enter into the auto-recovery mode, in burst manner. If the system power demand decreases below P_recovery, then system will enter into normal mode again, as shown in Fig.2. The difference
between P_opp and P_recovery is defined as “OPP Recovery Gap”, which can cause system startup
failure especially in 90VAC full load startup.
AC IN
Np
Cbulk
Rst
Fig.2
SF1530
1
GND
GATE
6
Cdd
Na
SF1530 can achieve “Zero OCP/OPP Recovery Gap” in the whole universal AC input range using
SiFirst’s proprietary control algorithm.
Synchronous Slope Compensation
FB
2
VDD
5
InSF1530, the synchronous slope compensation circuit is integrated by adding voltage ramp onto the
RT
3
CS
4
current sense input voltage for PWM generation. This greatly improves the close loop stability at CCM and prevents the sub-harmonic oscillation
Fig.1
Low Operating Current
The operating current in SF1530 is as small as
1.3mA (typical). The small operating current results in higher efficiency and reduces the VDD hold-up capacitance requirement.
Soft Start
SF1530 features an internal 3ms (typical) soft start that slowly increases the threshold of cycle-by­cycle current limiting comparator during startup sequence. It helps to prevent transformer saturation and reduce the stress on the secondary diode during startup. Every restart attempt is followed by a soft start activation.
and thus reduces the output ripple voltage.
Oscillator with Frequency Shuffling
Connecting a resistor from RT pin to GND according to the equation below to program the normal switching frequency:
()
KHzF
OSC
6500
=
Ω
)RT(K
It can typically operate between 50kHz to 130kHz. To improve system EMI performance, SF1530 operates the system with ±4% frequency shuffling around setting frequency.
Leading Edge Blanking (LEB)
Each time the power MOSFET is switched on, a turn-on spike occurs across the sensing resistor. The spike is caused by primary side capacitance and secondary side rectifier reverse recovery. To avoid premature termination of the switching pulse,
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an internal leading edge blanking circuit is built in. During this blanking period (350ns, typical), the PWM comparator is disabled and cannot switch off the gate driver. Thus, external RC filter with a small time constant is enough for current sensing.
Frequency Reduction for Green Mode
Operation
When the loading is light, the IC will automatically reduce the PWM switching frequency to achieve high efficiency. In the whole frequency reduction process, there is no audio noise generated.
PWM Frequency
Burst mode
(RT=100kΩ)
Frequency
Reduction mode
Normal
mode
VFB
65kHz
22kHz
0
Fig.3
Burst Mode Control
When the loading is very small, the system enters into burst mode. When VFB drops below Vskip, SF1530 will stop switching and output voltage starts to drop, which causes the VFB to rise. Once VFB rises above Vskip, switching resumes. Burst mode control alternately enables and disables switching, thereby reducing switching loss in standby mode.
Fig.4
SF1530
Auto Recovery Mode Protection
As shown in Fig.5, once a fault condition is detected, switching will stop. This will cause VDD to fall because no power is delivered form the auxiliary winding. When VDD falls to UVLO(off) (typical 9V), the protection is reset and the operating current reduces to the startup current, which causes VDD to rise, as shown in Fig.4. However, if the fault still exists, the system will experience the above mentioned process. If the fault has gone, the system resumes normal operation. In this manner, the auto restart can alternatively enable and disable the switching until the fault condition is disappeared.
Fig.5
VDD OVP(Over Voltage Protection)
VDD OVP (Over Voltage Protection) is implemented in SF1530 and it is a protection of auto-recovery mode.
Over Load Protection (OLP)
When over load occurs, a fault is detected. If this fault is present for more than 43ms (typical), the protection will be triggered, the IC will experience an auto-recovery mode protection as mentioned above. The 43mS delay time is to prevent the false trigger from the power-on and turn-off transient
All Pins Floating Protection and RT Pin
Short-to-GND Protection
In SF1530, if pin floating situation or RT pin short­to-GND occurs, the protection is triggered immediately and the system will experience the process of auto-recovery mode protection.
Soft Gate Drive
SF1530 has a fast totem-pole gate driver with 300mA capability. Cross conduction has been avoided to minimize heat dissipation, increase efficiency, and enhance reliability. An internal 17V clamp is added for MOSFET gate protection at higher than expected VDD input. A soft driving waveform is implemented to minimize EMI.
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PACKAGE MECHANICAL DATA
SF1530
Symbol
Dimensions In Millimeters Dimensions In Inches
Min Max Min Max
A 1.000 1.300 0.039 0.051 A1 0.000 0.150 0.000 0.006 A2 1.000 1.200 0.039 0.047
b 0.300 0.500 0.012 0.020
c 0.100 0.200 0.004 0.008 D 2.800 3.020 0.110 0.119 E 1.500 1.700 0.059 0.067
E1 2.600 3.000 0.102 0.118
e 0.950 (BSC) 0.037 (BSC)
e1 1.800 2.000 0.071 0.079
L 0.300 0.600 0.012 0.024 θ 0º 8º 0º 8º
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SF1530
Symbol
Dimensions In Millimeters Dimensions In Inches
Min Max Min Max
A 3.710 5.334 0.146 0.210
A1 0.381 0.015 A2 3.175 3.600 0.125 0.142
B 0.350 0.650 0.014 0.026
B1 1.524 (BSC) 0.06 (BSC)
C 0.200 0.360 0.008 0.014 D 9.000 10.160 0.354 0.400 E 6.200 6.600 0.244 0.260
E1 7.320 7.920 0.288 0.312
e 2.540 (BSC) 0.1 (BSC) L 2.921 3.810 0.115 0.150
E2 8.200 9.525 0.323 0.375
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SF1530
Symbol
Dimensions In Millimeters Dimensions In Inches
Min Max Min Max
A 1.350 1.750 0.053 0.069 A1 0.050 0.250 0.002 0.010 A2 1.250 1.650 0.049 0.065
b 0.310 0.510 0.012 0.020
c 0.170 0.250 0.006 0.010 D 4.700 5.150 0.185 0.203 E 3.800 4.000 0.150 0.157
E1 5.800 6.200 0.228 0.244
e 1.270 (BSC) 0.05 (BSC) L 0.400 1.270 0.016 0.050 θ 0º 8º 0º 8º
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SF1530
IMPORTANT NOTICE
SiFirst Technology Nanhai, Ltd (SiFirst) reserves the right to make corrections, modifications, enhancements, improvements and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
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