Page 1

S DU/D3055L2
S amHop Microelectronics C orp.
Augus t , 20 02
N-C hannel E nhancement Mode Field E ffect Trans is tor
PR ODUC T SUMMAR Y
VDS S
20V
ID
15A
R DS (O N) ( m
34 @ V GS = 4. 5V
45 @ V GS = 2. 5V
D
G
S
S DU S E RIE S
TO-252AA(D-PAK )
W
) TY P
G
D
S
S DD SE R IE S
TO-251(l-PA K)
AB S OLUT E MA XIMUM R AT ING S (TA=25 C unles s otherwis e noted)
F E ATUR E S
S uper high dense cell des ign for low R
R ugged and reliable.
TO-252 and T O -251 P ackage.
D
G
S
DS (O N
).
P arameter
Drain-S ource Voltage
G ate-S ource Voltage
Drain C urrent-C ontinuous @ TJ=125 C
-P ulsed
a
b
(300ms P uls e Width)
Drain-S ource Diode F orward C urrent
Maximum P ower Dissipation
a
Operating Junction and S torage
Temperature R ange
THE R MA L C HA R A C TE R IS TICS
Thermal R esistance, J unction-to-C ase
Thermal R esistance, J unction-to-Ambient
S ymbol
V
DS
V
G S
I
D
I
DM
a
P
TJ, T
R
R
I
S
D
S TG
J C
J A
Limit Unit
20
12
15
45
15
50
-55 to 150
3
50
V
V
A
A
A
W
C
C
C
/W
/W
1
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S DU/D3055L2
E LE C TR IC AL C HAR AC TE R IS TIC S (T A 25 C unless otherwise noted)
P arameter
S ymbol
=
C ondition
Min
Typ
C
OF F C HAR AC T E R IS TIC S
Drain-S ource B reakdown Voltage
Zero G ate Voltage Drain C urrent
G ate-Body Leakage
ON C HAR AC T E R IS T IC S
b
G ate Threshold Voltage
Drain-S ource On-S tate R es is tance
On-S tate Drain C urrent
0V, ID 250uA
B V
DS S
I
DS S
I
G S S
V
G S (th)
R
DS (ON)
I
D(ON)
g
F S
c
VDS 20V, V
V
G S
V
DS VG S
V
G S
V
G S
V
DS
V
DS
=
=
= =
=
= 5V, V
G S
8V, VDS 0V
=
, ID = 250uA
=
=
= =
4.5V, I
2.5V, I
10V, I
D
D
G S
D
=
=
= 4.5V
0V
=
6.0A
5.2A
6.0A
20
0.7
20
34
45
17
V
G S
DYNAMIC C HAR AC TE R IS T ICS
Max
1
100
60
70
Unit
V
uA
nA
V
m-ohm
m-ohm
A
SF orward Transconductance
Input C apacitance
Output Capacitance
R evers e Trans fer C apacitance
S WIT C HING C HAR AC TE R IS T ICS
Turn-On Delay Time
R ise Time
Turn-Off Delay T ime
F all Time
Total G a te C harge
G ate-S ource Charge
G ate-Drain Charge
C
IS S
V
DS
=8V, V
G S
= 0V
C
OS S
C
R S S
c
t
D(ON)
t
r
t
D(OFF )
t
f
Q
g
Q
gs
Q
gd
f =1.0MH
Z
VDD = 10V,
ID = 1A,
V
G E N
= 4.5V,
RL = 10
R
GE N
= 6
ohm
ohm
VDS=10V,ID =6A,V
VDS=10V,ID =6A,V
VDS =10V, ID = 6A,
V
G S
=10V
2
G S
G S
=10V
=4.5V
705
280
65
10
15 30
35
20 40
25
9.3 11.5
2
2
P
P
P
20 ns
ns
ns
60
ns
30
nC
nC
nC
nC
F
F
F
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S DU/D3055L 2
E L E C TR IC AL C HA R A C TE R IS T IC S (TA=25 C unles s otherwis e
P a rameter
S ymbol
C o ndition
Min
Typ
C
Max
Unit
5
DR AIN-S OUR CE DIODE CHAR AC T E R IS TIC S
Diode F orward Voltage
V
S D
b
V
G S
= 0V, Is =1.7A
0.72
1.2
V
Notes
a.S urface Mounted on FR 4 B oard, t <= 10sec.
b.Pulse Test:P ulse W idth <=300us , Duty Cycle<= 2%.
c.G uaranteed by des ign, not s ubject to production testing.
25
VGS = 3, 4,10 V
20
15
10
5
ID, Drain C urrent(A)
0
0 1 2 3 4 5 6
VDS , Drain-to-S ource Voltage (V )
F igure 1. Output Characteristics
VGS = 2V
25
20
15
10
T j=125 C
5
ID, Dra in C urrent (A)
0
0. 0 0. 5 1 1.5 2 2.5 3
VGS , G ate-to-S ource Voltage (V )
25 C
F igure 2. T ransfer C haracteristics
-55 C
300 0
250 0
200 0
150 0
100 0
C , C apa citanc e (pF)
500
0
0 2 4 6 8 10 12
VDS , Drain-to S ource Voltage (V )
F igure 3. Capacitance
C iss
C oss
C rss
1. 8
VGS =4.5 V
ID=6A
1. 6
1. 4
1. 2
1. 0
On-R esistance(O hms)
(Normalized)
0. 8
R DS (O N),
0. 6
-50 0 50 100 15 0
Tj, J unction T emperature ( C )
F igure 4. On-R esistance Variation with
Temperature
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S DU/D3055L 2
1.09
VDS=V
1.06
1.03
1.00
0.97
Vth, Normalized
0.94
0.91
G ate-S ource T hreshold Voltage
-50 -25 0 25 50 7 5 100 1 25 150
Tj, J unction T emperature ( C )
GS
ID=250uA
F igure 5. Gate T hr eshold V ariation
with Temperatur e
36
30
24
18
12
6
gFS , T rans conductance ( S )
0
0 3 6 9 12 15
VDS=10V
1.15
1.10
1.05
1.00
0.95
0.90
B VD SS , Normalized
0.85
Dra in-S ource Breakdown Voltage
ID=250uA
5
-50 -25 0 25 50 75 100 125 1 50
Tj, J unction T emperature ( C )
F igure 6. Breakdown V oltage V ariation
with Temperatur e
20
10
1
Is , S ource-drain current ( A)
0
0.4 0. 6 0.8 1.0 1 .2 1. 4
TJ=25 C
IDS , Dra in-S ource C urrent (A)
F igure 7. T r ansconductance V ariation
with Drain Current
10
VDS=10V
8
ID=6A
6
4
2
VGS , Gate to S ource V oltage (V)
0
0 4 8 12 16 20 24 28
Qg, T otal Gate C harge (nC )
32
F igure 9. Gate Char ge
VSD , Body Diode Forward Voltage (V )
F igure 8. Body Diode F orward V oltage
V ar iation with Sour ce C urrent
50
10
(O N) L imit
S
D
R
1
1
V
G S
0.1
ID, Dra in C urrent (A )
0.03
=4.5V
S ingle Pulse
Tc=25 C
0.1 1 10 20 50
VDS , Drain-S ource V oltage (V )
10ms
100 ms
1s
DC
F igure 10. Maximum Safe
Operating Area
4
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S DU/D3055L 2
DD
V
5
V
G S
R
G EN
IN
V
D
G
S
on
t
d(off)
t
r
d(on)
R
L
OU T
V
t
OU T
V
IN
V
10%
t
90%
10% 10%
INVE R TE D
50% 50%
90%
t
off
f
t
90%
P ULS E W IDT H
F igure 11. Switching T est C ircuit
2
1
Duty C yc le=0.5
0. 2
0. 1
0. 1
0. 05
0. 01
0. 02
S ingle P ulse
-4
10
-3
10
r(t), Normalized E ffective
T rans ient Thermal Impeda nce
F igure 13. Normalized T hermal T r ansient I mpedance Curve
F igure 12. Switching W aveforms
-2
10
S quare Wave P ulse D uration (sec)
-1
10
DM
P
1
t
2
t
1. R thJA ( t)=r ( t) * R thJA
2. R thJA=S ee Datas heet
3. TJ M-T A = PDM* R thJA (t)
4. Duty C ycle , D=t1/t2
1 10 100
5