Datasheet SDC15 Datasheet (Semtech) [ru]

PROTECTION PRODUCTS

PROTECTION PRODUCTS

SDC15

TVS Diode Array for ESD Protection

of 12V Data and Power Lines

Description

The SDC15 transient voltage suppressor (TVS) is
designed to protect components which are connected
to data and transmission lines from voltage surges
caused by electrostatic discharge
transients

TVS diodes are characterized by their high surge
capability, low operating and clamping voltages, and
fast response time. This makes them ideal for use as
board level protection of sensitive semiconductor
components. The dual-junction common-cathode
design allows the user to protect one data or power
line operating at ±12 volts. The low profile SOT23
package allows flexibility in the design of “crowded”
circuit boards.

The SDC15 TVS will meet the surge requirements of
IEC 61000-4-2 (Formerly IEC 801-2), Level 4, “Human
Body Model” for air and contact discharge.

(EFT)(EFT)

(EFT) , and

(EFT)(EFT)

lightninglightning

lightning.

lightninglightning

(ESD)(ESD)

(ESD), electrical fast

(ESD)(ESD)

Features

 300 watts peak pulse power (t
 40 watts peak pulse power (t
 Transient protection for data and power lines to

IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 12A (1.2/50µs)

 Protects one bidirectional line
 Low clamping voltage
 Low leakage current
 High surge capability
 Solid-state silicon avalanche technology

= 8/20µs)

p

= 10/1000µs)

p

Mechanical Characteristics

 JEDEC SOT23 package
 Molding compound flammability rating: UL 94V-0
 Marking : DC15
 Packaging : Tape and Reel per EIA 481

Applications

 RS-232 Data Lines
 Portable Electronics
 Industrial Controls
 Set-Top Box
 Servers, Notebook, and Desktop PC
 12V DC Supply Protection

Circuit Diagram Schematic & PIN Configuration

Revision 12/15/04

SOT23 (Top View)

1

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PROTECTION PRODUCTS

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Absolute Maximum Rating

SDC15

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Electrical Characteristics

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2 2004 Semtech Corp.

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PROTECTION PRODUCTS

Typical Characteristics

SDC15

Non-Repetitive Peak Pulse Power vs. Pulse Time

10

(kW)

pk

1

0.1

Peak Pulse Power - P

0.01

0.1 1 10 100 1000

Pulse Duration - t

(µs)

p

Pulse Waveform Clamping Voltage vs. Peak Pulse Current

110

100

90

80

70

PP

60

50

Percen t of I

40

30

20

10

0

0 5 10 15 20 25 30

-t

e

Time (µs)

td = IPP/2

Waveform

Parameters:

tr = 8µs

td = 20µs

Power Derating Curve

110

100

90

PP

80

70

60

50

40

30

% of Rated Power or I

20

10

0

0 25 50 75 100 125 150

Ambient Temperature - T

25

(V)

C

20

15

Clamping Voltage - V

10

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Peak Pulse Current - I

(oC)

A

Waveform

Parameters:

tr = 8µs

td = 20µ s

(A)

PP

Forward Voltage vs. Forward Current

3

2.5

(V)

F

2

1.5

1

Forw ard Vo ltage - V

0.5

0

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Forw ard Curren t - I

F

(A)

Waveform

Parameters:

tr = 8µs

td = 20µ s

3 2004 Semtech Corp.

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PROTECTION PRODUCTS

PROTECTION PRODUCTS

Applications Information

Device Connection for Protection of One Data Line

The SDC15 is designed to protect one data or I/O line
operating at ±12 volts. Connection options are as
follows:

z Common mode protection: Pin 1 is connected to

the data line and pin 2 is connected to ground. For
best results, this pin should be connected directly
to a ground plane on the board. The path length
should be kept as short as possible to minimize
parasitic inductance. Pin 3 is not connected.

z Differential protection: Pin 1 is connected to one

line and pin 2 is connected to the second line. Pin
3 is not connected.

SDC15

Device Schematic and Pin Configuration

Circuit Board Layout Recommendations for Suppres­sion of ESD.

Good circuit board layout is critical for the suppression
of fast rise-time transients such as ESD. The following
guidelines are recommended:

z Place the SDC15 near the input terminals or

connectors to restrict transient coupling.

z Minimize the path length between the SDC15 and

the protected line.

z Minimize all conductive loops including power and

ground loops.

z The ESD transient return path to ground should be

kept as short as possible.

z Never run critical signals near board edges.
z Use ground planes whenever possible.

Matte Tin Lead Finish

Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com­pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.

RS-232 Transceiver Protection Example

4 2004 Semtech Corp.

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PROTECTION PRODUCTS

Outline Drawing - SOT23

SDC15

D

e1

3

12

e

A

NOTES:

CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).

1.

2.

DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS

3.
OR GATE BURRS.

-A- -B-

DATUMS AND TO BE DETERMINED AT DATUM PLANE

A

B

E1

bxN

bbb C A B

A1

E

A2

3X

C

SEATING

aaa C

SEATING PLANE

-H-

PLANE

C

GAUGE
PLANE

0.25

H

DETAIL A

SIDE VIEW

DIMENSIONS

INCHES

DIM

MIN

A

.035
.000

A1
A2 .035 .037 0.950.88.040 1.02

b

c

0

L

L1

SEE DETAIL A

.012

c

.003

.114

D
E

.082

.093

E1 .051 1.30

e

.075

e1 .037 0.95 BSC

L .015 .020 0.500.40.024 0.60

.022

L1

N3 3
0

aaa

.004 0.10

bbb .008 0.20

-

-

-

-

-

MAXNOM

.044
.004

.020
.007

.104
.055.047

MILLIMETERS
MIN

NOM

MAX

-

0.89

0.01

0.30

0.08

2.10

-

-

-

2.90

2.37

1.90 BSC

(0.55)

-

1.12

0.10

0.51

0.18

3.042.80.110 .120

2.64

1.401.20

8°0°8°0°

Land Pattern - SOT23

X

Y

DIM

C

Z

G

Y

E .037 0.95

C

E1 .075 1.90

G
X
Y
Z

E

NOTES:

THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY

1.

E1

CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.

REFERENCE IPC-SM-782A.

Note 1 : Grid placement courtyard is 8 x 8 elements (4mm x 4mm) in accordance with the international grid detailed in IEC

2.

Publication 97.

DIMENSIONS

(.087)

.031
.039
.055
.141

MILLIMETERSINCHES

(2.20)

0.80

1.00

1.40

3.60

5 2004 Semtech Corp.

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PROTECTION PRODUCTS

PROTECTION PRODUCTS

Ordering Information

SDC15

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Contact Information

Semtech Corporation

Protection Products Division

200 Flynn Road, Camarillo, CA 93012

Phone: [phone] FAX [phone]

6 2004 Semtech Corp.

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