Page 1
HF/VHF/UHF N-CHANNEL MOSFETs
■ GOLDMETALLIZATION
■ COMMONSOURCE CONFIGURATION
■ 2 - 500 MHz
■ 5 WATTS
■ 28 VOLTS
■ 13.5 dB MIN. AT400 MHz
■ CLASSA OR AB OPERATION
■ EXCELLENTTHERMALSTABILITY
DESCRIPTION
The SD2900is a gold metallizedN-ChannelMOS
field-effect RF power transistor. It is intended for
use in 28 V DC large signal applications up to
500 MHz
SD2900
RF POWER TRANSISTORS
M113
epoxy sealed
ORDER CODE BRANDING
SD2900 SD2900
PIN CONNECTION
1. Drain 3.Gate
2. Source 4. Source
ABSOLUTE MAXIMUM RATINGS (T
Symb o l Parameter Val u e Uni t
V
(BR)DSS
V
V
P
T
Drain Source Voltage 65 V
Drain-G at e Voltage (RGS=1MΩ)
DGR
Gat e- Source Voltag e ± 20 V
GS
Drain Cur re nt 900 mA
I
D
Power Diss ipation 21.9 W
DISS
Max. Oper ating Juncti on Temperatu re 200
T
j
Storage Temperature -65 to 1 50
STG
case
=25oC)
65 V
THERMAL DATA
R
th(j-c)
R
th(c-s)
* Determined using a flat aluminum or copperheatsink with thermal compound applied (Dow Corning 340 or equivalent).
November 1999
Junct ion- Ca se Therm al Resist anc e
Case-Heat s i nk Therm al R esis tance ∗
8.0
0.30
o
o
o
C/W
o
C/W
C
C
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Page 2
SD2900
ELECTRICAL SPECIFICATION (T
case
=25oC)
STATIC
Symb o l Para met er Mi n . Typ . Max. Unit
V
(BR)DSSVGS
I
DSS
I
GSS
V
GS(Q)
V
DS(ON)VGS
g
FS
C
ISS
C
OSS
C
RSS
=0V IDS=5mA 65 V
VGS=0V VDS=28V 0.5 mA
VGS= 20V VDS=0V 1.0 µA
VDS= 10V ID=10mA 1.0 6.0 V
= 10V ID=0.5A 1.6 V
VDS= 10V ID=0.5A 0.2 mho
VGS=0V VDS=28V f=1MHz 8.5 pF
VGS=0V VDS=28V f=1MHz 7.8 pF
VGS=0V VDS=28V f=1MHz 1.4 pF
REF. 1021307I
DYNAMIC
Symb o l Para met er Mi n . Typ . Max. Unit
P
OUT
G
η
Load
Mismatch
f = 400 M H z VDD=28V IDQ=50mA 5 W
f = 400 M H z VDD=28V P
PS
f = 400 M H z VDD=28V P
D
f = 400 M H z V
DD
=28V P
=5W IDQ= 5 0 mA 13.5 16 dB
out
=5W IDQ=50mA 45 50 %
out
=5W IDQ=50mA
out
30:1 VSWR
All Angles
IMPEDANCEDATA
2/8
FREQ. ZIN(Ω )Z
DL
(Ω )
400 MHz 8.6 - j 2 4.6 22.6 + j 27.0
Page 3
TYPICALPERFORMANCE
SD2900
Capacitancevs Drain-SourceVoltage
100
f = 1 MHz
10
C, CAPACITANCES (pF)
1
01 02 03 0
VDS.DRAIN-SOURCE VOLTAGE(VOLTS)
GC83130
Ciss
Coss
Crss
Drain Current vs Gate Voltage
1000
800
VDS= 10V
0
567891 0
VGS, GATE-SOURCE VOLTAGE (VOLTS)
ID, DRAINCURRENT (mA)
600
400
200
T= 25°C
GC8315 0
T= -20° C
T= 80°C
MaximumThermalResistancevs Case
Temperature
10
9.5
9
8.5
RTH(j-c)(ºC/W)
8
7.5
25 45 65 85
Tc, CASETEMPERATURE (ºC)
GC8314 0
Gate-SourceVoltages vs CaseTemperature
1.04
1.02
1
0.98
0.96
VDD=10V
VGS,GATE-SOURCE VOLTAGE(NORMALIZED)
0.94
-25 0 25 50 75 100
Tc, CASE TEMPERATURE (ºC)
ID= 100m A
GC83160
ID = 7 50 mA
ID = 5 00 mA
ID= 200m A
ID = 5 0 mA
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Page 4
SD2900
TYPICALPERFORMANCE
OutputPowervs Input Power
8
6
Tc=25° C
f =40 0 MHz
IDQ = 50 mA
4
2
Pout, OUTPUT POWER (W)
0
10 50 90 130 17 0 210 250
Pin, INPUT POWER (mW)
GC831 80
Vdd = 28 V
Vdd =13 .5V
OutputPower vs Input Power
10
IDQ = 50 mA
VDD = 28 V
8
f = 400 MHz
6
4
2
Pout, OUTPUT POWER (W)
0
0.01 0.06 0.10 0.15 0.19 0.24
T = 25º C
Pin, INPUT POWER (W)
OutputPowervs Voltage Supply OutputPower vs Gate Voltage
Pin =0 .24 W
Pin =0.12 W
GC831 90
6
4
VDD = 28 V
IDQ = 50 mA
f = 400 MHz
Pin =Co nstant
T=25°C
8
6
IDQ = 50 mA
f = 40 0 MHz
4
GC831 70
T =-20ºC
T = 80ºC
GC83200
T =-20° C
T=80°C
2
Pout, OUTPUT POWER (WATTS)
0
13 18 23 28
VDD, SUPPLYVOLTAGE (VOLTS)
PowerGainvs Output Power
18
17
16
Tc= 25° C
f=400 MHz
IDQ= 50m A
15
PG, POWER GAIN(dB)
14
012345678
Pout, OUTPUT POWER(W)
Pin =0 .06 W
GC83210
2
Pout, OUTPUT POWER (W)
0
1.5 3 4.5 6
VGS, GATE-SOURCE VOLTAGE (VOLTS)
Efficiencyvs OutputPower
70
60
50
40
Tc= 25° C
30
EFFICIENCY(%)
20
10
02468
f = 400 MHz
IDQ = 5 0 mA
Pout,OUTPUT POWER(W)
GC832 20
4/8
Page 5
400 MHz Test Circuit Schematic
SD2900
400 MHz Test Circuit Component Part List
5/8
Page 6
SD2900
400 MHz Test Circuit Photomaster
ProductionTest Fixture
REF. 1021498C
6/8
Page 7
M113 (.380 DIA 4/L N/HERM W/FLG) MECHANICAL DATA
SD2900
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 5.59 5.84 0.220 0.230
B 19.81 20.83 0.780 0.820
C 18.29 18.54 0.720 0.730
D 24.64 24.89 0.970 0.980
E 9.40 9.78 0.370 0.385
F 0.10 0.15 0.004 0.006
G 2.16 2.67 0.085 0.105
H 4.06 4.57 0.160 0.180
I 7.14 0.281
J 6.22 6.48 0.245 0.255
K 3.05 3.30 0.120 0.130
mm inch
ControllingDimension:Inches
1010936D
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Page 8
SD2900
Information furnished is believed to beaccurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise underany patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a trademark of STMicroelectronics
1999 STMicroelectronics – Printed in Italy – All Rights Reserved
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