The SC1186 com bines a synchronous vol tage mode
controller with two low-dropout linear regulators
providing m ost of the circuitr y necessary to
implement t hr ee DC/DC conv er ters for powering
advanced micropr ocessors such as Pentium
The SC1186 switching sect ion feat ur es an i ntegrated
5 bit D/A c onvert er , latched dr ive output for
enhanced noise immunit y, pulse by pulse curr ent
limiti ng and logic compatible shutdown. The SC1186
switching secti on oper ates at a fi xed fr equenc y of
140kHz, providi ng an optimum compr omise between
size, effic iency and cost i n the intended application
areas. The int egr ated D/A converter provi des
programmability of output voltage from 2.0V to 3.5V
in 100mV increments and 1.30V to 2.05V in 50mV
increments with no ext er nal component s.
The SC1186 linear sections are low dropout r egulators with short ci r c uit protection, supplying 1.5V for
GTL bus and 2.5V for non-GTL I/O. The Reference
voltage is made avai lable for exter nal linear
regulators.
®
II & III.
SC1186
FEATURES
•
Synchronous design, enabl es no heatsi nk sol ution
•
95% efficienc y ( swit c hing section)
•
5 bit DAC for output programmability
•
Designed for I ntel Pentium® ll & III requirements
•
1.5V, 2.5V short circuit protect ed linear cont r ollers
Pentium is a registered trademark of Intel Corporation
652 MITCHELL ROA D NE WBURY P A RK CA 91320
Page 2
PROGRAMMABLE SYNCHRONOUS DC/DC
SC1186
CONVERTER, DUAL LOW DROPOUT
REGULATOR CONTROLLER
PRELIMINA RY - Dec ember 2, 1999
ABSOLU TE MAXIMUM RATINGS
ParameterSymbolMaximumUnits
VCC to GNDV
IN
-0.3 to +7V
PGND to GND± 1V
BST to GND-0.3 to +15V
Operating Temperat ur e RangeT
Junction Temperatur e RangeT
Storage Temperature RangeT
Lead Temperature (Soldering) 10 secondsT
Thermal Impedance Junction to A mbient
Output VoltageI
Supply Vol tageVCC4.57V
Supply CurrentVCC = 5.0V815mA
Load RegulationI
Line Regulation±0.15%
Current Limit Voltage607085mV
Oscillator Frequency120140160kHz
Oscillator Max Duty Cycle9095%
Peak DH Sink/ S our c e Cur rentBSTH-DH = 4.5V,DH- P GNDH = 3.3V
= VO; 0mV < (CS+-CS-) < 60mV; LDOV = 11.4V to 12.6V; TA = 0 to 70°C
OSENSE
PARAMETERCONDITIONSMINTYPMAX UNITS
LDOV Undervoltage Lock out6.58.010V
LDOEN Threshold1.31.9V
LDOEN Sink Cur r entLDOEN = 3.3V
LDOEN = 0V
0.01
-200
1.0
-300
µA
µA
Ov er c urrent Trip Voltage% of Vo set poi nt204060%
Power-up Output Shor t Circui t Immunity1560ms
Output Short Circuit Glitch Immunity0.546ms
Gate Pulldown ImpedanceGATE(1,2)-AGND;VCC=BST=0V80300750
VOSENSE Impedance10
k
Ω
k
Ω
PIN DESCRIPTION
PinPin NamePin Function
1AGNDSmall Signal A nalog and Digital Ground
2GATE1Gate Drive Output LDO1
3LDOS1Sense Input for LDO1
4LDOS2Sense Input for LDO2
5VCCInput Voltage
6REFBuffered Reference Voltage output
7LDOENLDO Supply Monitor.
8CS-Current Sense Input ( negative)
9CS+Current Sense Input (positive)
10PGNDHP ower Ground for Hi gh S ide Switch
11DHHigh Side Driver Output
12PGNDLPower Ground for Low Side Switch
13DLLow Side Dri ver O utput
14BSTLSupply for Low Side Driver
15BSTHSupply for High Si de Dr iv er
16EN
(1)
Logic low shuts down the converter;
High or open f or normal operation.
4C1,C5,C13,C18 0.1µF Ceram icVarious
6C2,C3,C14-C17 1500µF/6.3VSANYOMV-GX or equiv. Low ESR
1C91000µF
2C11,C21330µF/6.3VVarious
1L14µH8 Turns 16AWG on MICROM E TALS T50-52D core
2Q1,Q2See notesSee notesFET selection r equires trade-off between effi c iency and
Careful attention to layout requirement s are nec essary
for successful im plementation of the SC1186 PWM
controller. High cur rents switching at 140kHz ar e pr esent in the appl ication and their ef fect on ground plane
voltage differentials m ust be under stood and mini mized.
1). The hi gh power part s of the cir c uit should be laid
out first. A ground plane should be used, the number
and position of ground plane i nterrupti ons should be
such as to not unnecessarily compromise ground plane
integri ty. Isolated or semi-isolated areas of the ground
plane may be deliberately intr oduced to constrain
ground currents to particular ar eas, for ex ample the
input capacitor and bottom FET ground.
2). The l oop formed by the Input Capacitor(s) (Ci n) , the
Top FET ( Q1) and the Bott om FET ( Q2) must be kept
10
1
AGND
2
GATE1
3
LDOS1
4Q1
0.1uF
0.1uF
LDOS2
5
VCC
6
REF
7
LDOEN
8
CS-
9
CS+
10
PGNDH
11
DH
12
PGNDL
GATE2
LDOV
VID0
VID1
VID2
VID3
VID4
VOSENSE
EN
BSTH
BSTL
DL
SC1186
as small as possible. This loop contains all the high
current, fast transition switching. Connections should
be as wide and as short as possible to minimiz e loop
inductance. Minimizi ng this loop area will a) reduce
EMI, b) lower ground injection current s, r esul ting in
electrically “cleaner” gr ounds for the rest of the system
and c) minimize source ringing, resulting in mor e r eliable gate switching signals.
3). The connection between the junc tion of Q1, Q2 and
the output i nductor should be a wide trac e or c opper
region. It should be as short as practical. Sinc e this
connection has fast voltage transi tions, keeping this
connection short will minimize EMI. The connection
between the output i nduc tor and the sense resistor
should be a wide trace or copper ar ea, there are no
fast voltage or c urrent transitions in this connection
and length is not so i mportant, however addi ng unnec essary impedance will reduce efficiency.
4) The Output Capacitor( s) (Cout) should be locat ed
as close to the load as possible, fast tr ansi ent load
currents are suppli ed by Cout only, and connec tions
between Cout and the load must be short, wide copper areas to minimize induct anc e and r esi stanc e.
5) The SC1186 is best pl ac ed over a quiet ground
plane area, avoid pulse currents in the Cin, Q1, Q2
loop flowing in this area. PGNDH and PGNDL shoul d
be returned to t he gr ound plane close to the pac k age.
The AGND pin should be connected to t he gr ound
side of (one of) the output capacitor(s). If this is not
possible, the AGND pin may be c onnected to the
ground path between the Out put Capacitor( s) and t he
Cin, Q1, Q2 loop. Under no circumstanc es should
AGND be returned to a ground inside the Cin, Q1, Q 2
loop.
6) Vcc for the SC1186 should be supplied from the
5V
5V supply through a 10Ω resistor, the V c c pin should
be decoupled direc tly to AGND by a 0.1µF ceramic
capacitor , trace lengths should be as short as possi-
ble.
7) The Current S ense resistor and the divider across
it should form as small a loop as possible, the traces
running back to CS + and CS- on the SC1186 should
run parall el and close to each ot her . The 0.1µF capacitor shoul d be mounted as close to t he CS + and
CS- pins as possible.
8) Ideall y, the grounds f or the two LDO sections
should be returned to the ground side of ( one of) the
output capacitor(s).
SWITCHING SECTION
OUTPUT CAPACIT O RS - Selection begins with the
most critical component. Because of fast transient load
current requirements i n modern microprocessor core
supplies, the out put capacitor s must supply all transient
load current r equirement s until the cur r ent in the output
inductor r amps up to the new level. Output capacitor
ESR is therefore one of the most important c r iteria. The
maximum ESR can be sim ply calculated f r om:
V
R
ESR
t
≤
I
t
Where
=
t
=
t
step current Transient I
For example, t o meet a 100m V transient l imit with a
10A load step, t he output capacitor ESR must be less
than 10mΩ. To meet this ki nd of ESR level , there are
three available capacitor technologies.
The choice of which to use is simply a cost/ per formance issue, wit h Low ESR Alumi num being the
cheapest, but tak ing up the most space.
INDUCTOR - Having dec ided on a suitable type and
value of output capacitor , the maxim um all owable
value of i nduc tor can be calculated. Too large an inductor will produce a slow current ramp rat e and will
cause the output capacitor to supply more of the transient load cur r ent for longer - leadi ng to an output voltage sag below the ESR excur si on c alculated above.
The maximum induct or val ue may be calc ulated f r om:
CR
ESR
L
()
I
t
VV
−≤
OIN
The calculated maxim um induct or val ue assumes 100%
duty cycle, so some allowance must be made. Choosing
an inductor value of 50 to 75% of the calc ulated maximum will guarantee that the induct or c ur r ent will ramp
excursion voltage transient MaximumV
Qty.
Rqd.C(µF)
ESR
(mΩ)
fast enough to r educ e the voltage dropped across the
ESR at a f ast er r ate than the capacitor sags, hence ensuring a good recovery from tr ansi ent with no additional
excursions.
We must also be concerned with ripple c ur r ent in the
output inductor and a general rule of thumb has been to
allow 10% of maximum output current as ripple current.
Note that most of the output voltage ripple is produced
by the inductor rippl e c ur r ent fl owing in the output c apacitor E S R. Ripple cur r ent can be calculated fr om:
V
I
L
RIPPLE
IN
=
fL4
⋅⋅
OSC
Ripple current allowance will define the minimum permit ted inductor val ue.
POWER FETS - The FETs are chosen based on several criteria wit h pr obably the m ost import ant being
power dissipation and power handling capability.
TOP FE T - The power dissipati on in the top FE T is a
combination of c onduc tion losses, switching losses and
bottom FET body diode recover y losses.
a) Conduction losses are simply calculated as:
2
RIP
OCOND
δ⋅⋅=
)on(DS
where
V
O
cycleduty =
≈δ
V
IN
b) Switchi ng losses can be estimated by assuming a
switching time, if we assume 100ns then:
2
−
10VIP
⋅⋅=
INOSW
or more generally,
f)tt(VI
⋅+⋅⋅
P
=
SW
4
c) Body diode r ec overy losses are more diffi c ult to esti mate, but to a first approximation, it is reasonable to assume that t he stor ed c har ge on the bottom FET body
diode will be moved through the top FET as it starts to
turn on. The r esul ting power dissipati on in the top FE T
will be:
fVQP
⋅⋅=
OSCINRRRR
To a first order approximation, it is convenient to only
consider conduction losses to determine FET suitability.
For a 5V in; 2.8V out at 14.2A requirement, ty pical FE T
losses would be:
BOTTOM FET - Bottom FET losses are almost entirely
due to conduction. The body diode is forced into conduction at the beginning and end of the bott om switch
conduction per iod, so when the FET tur ns on and off,
there is very little vol tage across it, resul ting in low
switching losses. Conduction losses for the FE T can be
determined by:
2
OCOND
)1(RIP
δ−⋅⋅=
)on(DS
For the example above:
FET type
R
DS(on)
(mΩ)
IRL34025151.33D
IRL220310.50.93D
(W)Package
P
D
2
PAK
2
PAK
Si4410201.77SO-8
Each of t he pac kage types has a characteri stic thermal
impedance, for t he TO-220 package, thermal
impedance is mostly determi ned by the heatsink used.
For the surface mount pac k ages on doubl e si ded FR4, 2
oz printed c ircuit boar d materi al, thermal impedances of
o
C/W for t he D2PAK and 80oC/W for t he S O-8 are
40
readily achievable. The c or responding temper ature rise
is detailed below:
INPUT CAPACITORS - since the RMS ripple current
in the input capacitor s may be as high as 50% of t he
output current, suitabl e c apac itors must be chosen accordingly. Also, during fast load transients, t her e may
be restrict ions on input di/dt. These restrictions requi r e
useable energy storage within the converter circuitr y ,
either as ex tra output capacitance or, more usually ,
additional input capac itors. Choosing low ESR input
capacitor s will help maximize ripple rating for a given
size.
SHORT CIRCUIT PROTECTION - LINEARS
The Short circuit feature on t he linear cont r ollers is
implemented by usi ng the Rds(on) of t he FETs. As
output current increases, the regulation l oop maintains
the output volt age by turning the F E T on more and
more. Eventually, as the Rds(on) lim it is reached, the
FET will be unably to turn on mor e fully, and output
voltage will start to fall. When the output voltage falls
to approximately 50% of nominal, the LDO contr oller
is latched off, setting output voltage to 0. P ower must
be cycled to reset the latch.
To prevent false latchi ng due to capacitor inrush currents or low supply rai ls, the current lim it lat c h is initially disabled. It is enabled at a preset time (nominally
2mS) after both t he LDOV and LDOEN rai ls rise
above t heir lockout points.
To be most effective, the l inear FET Rds(on) should
not be selected artificial ly low, the FET should be chosen so that, at m aximum requi r ed c ur r ent, it is almost
fully turned on
If, for ex ample, a linear supply of 1.5V at 4A is required f rom a 3.3V ± 5% r ail, max al lowable Rds(on)
would be.
Rds(on)max = (0.95*3.3-1. 5) /4 ≈ 400m
Ω
Temperature rise (oC)
FET typeTop FETBottom FET
IRL3402567.653.2
IRL220347.637.2
Si4410180.8141.6
It is apparent that single SO-8 Si4410 are not adequate
for this applicat ion, but by usi ng par allel pairs in each position, power dissipation will be approximat ely halved and
temperature rise reduced by a factor of 4.
To allow for temperature effects 200mΩ would be a
suitable room temperature maxim um, allowing a peak
short circuit current of approx imately 15A f or a short
tim e before shutdown.