Datasheet SC1186 Datasheet (SEMTECH)

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E
查询SC1186供应商
PROGRAMMABLE SYNCHRONOUS DC/DC CONVERTER, DUAL LOW DROPOUT REGULATOR CONTROLLER
PRELIMINA RY - Dec ember 2, 1999
TEL:805-498-2111 FAX:805-498-3804 WEB:ht tp://www.semtech.com
The SC1186 com bines a synchronous vol tage mode controller with two low-dropout linear regulators providing m ost of the circuitr y necessary to implement t hr ee DC/DC conv er ters for powering advanced micropr ocessors such as Pentium
The SC1186 switching sect ion feat ur es an i ntegrated 5 bit D/A c onvert er , latched dr ive output for enhanced noise immunit y, pulse by pulse curr ent limiti ng and logic compatible shutdown. The SC1186 switching secti on oper ates at a fi xed fr equenc y of 140kHz, providi ng an optimum compr omise between size, effic iency and cost i n the intended application areas. The int egr ated D/A converter provi des programmability of output voltage from 2.0V to 3.5V in 100mV increments and 1.30V to 2.05V in 50mV increments with no ext er nal component s.
The SC1186 linear sections are low dropout r egula­tors with short ci r c uit protection, supplying 1.5V for GTL bus and 2.5V for non-GTL I/O. The Reference voltage is made avai lable for exter nal linear regulators.
®
II & III.
SC1186
FEATURES
Synchronous design, enabl es no heatsi nk sol ution
95% efficienc y ( swit c hing section)
5 bit DAC for output programmability
Designed for I ntel Pentium® ll & III requirements
1.5V, 2.5V short circuit protect ed linear cont r ollers
1.265V ± 1.5% Reference available
APPLICATIONS
Pentium® ll & III microprocessor supplies
Flex ible m otherboards
1.3V to 3.5V microprocessor supplies
Programmable tr iple power supplies
ORDERING INFORMATION
Part Number
(1)
Package
Linear
Voltage
SC1186CSW SO-24 1.5V/2.5V 0° to 125°C
Note: (1) Add suffix ‘TR’ for t ape and r eel.
Temp.
Range (T
J
)
PIN CONFIGURATION
Top View
AGND
GATE1 LDOS1 LDOS2
VCC
REF
LDOEN
CS-
CS+
PGNDH
DH
PGNDL
1 2 3 4
5 6 7 8
9 10 11 12
(24 Pin SOIC)
24 23 22 21 20 19 18 17 16 15 14 13
GATE2 LDOV VID0 VID1 VID2 VID3 VID4 VOSENS EN BSTH BSTL DL
BLOCK DIAGRAM
REF
VID4 VID3 VID2 VID1 VID0
VOSENSE
AGND
LDOEN
LDOS1 GATE1
D/A
2.5V FET CONTROLLER
VCC CS-
+
-
ERROR AMP
OSCILLATOR
1.265V REF
LDOV REF
70mV
-
+
1.5V FET CONTROLLER
ENCS+
CURRENT LIMIT
+
-
R
Q
S
LDOS2
GATE2
LEVEL SHIFT AND HIGH SIDE DRIVE
SHOOT-THRU CONTROL
SYNCHRONOUS MOSFET DRIVE
BSTH
DH
PGNDH
BSTL
DL
PGNDL
1
© 1999 SEMTECH CORP.
Pentium is a registered trademark of Intel Corporation
652 MITCHELL ROA D NE WBURY P A RK CA 91320
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PROGRAMMABLE SYNCHRONOUS DC/DC
SC1186
CONVERTER, DUAL LOW DROPOUT REGULATOR CONTROLLER
PRELIMINA RY - Dec ember 2, 1999
ABSOLU TE MAXIMUM RATINGS
Parameter Symbol Maximum Units
VCC to GND V
IN
-0.3 to +7 V PGND to GND ± 1 V BST to GND -0.3 to +15 V
Operating Temperat ur e Range T Junction Temperatur e Range T Storage Temperature Range T Lead Temperature (Soldering) 10 seconds T Thermal Impedance Junction to A mbient
Thermal Impedance Junction to Case
θ θ
A
J
STG
L
JA
JC
0 to +70 °C
0 to +125 °C
-65 to +150 °C 300 °C
80 °C/W 25 °C/W
ELECTRICAL CHARACTERISTICS
Unless specified: VCC = 4.75V to 5.25V; GND = P
PARAMETER CONDITIONS MIN TYP MAX UNITS Switching Section
Output Voltage I Supply Vol tage VCC 4.5 7 V Supply Current VCC = 5.0V 8 15 mA Load Regulation I Line Regulation ±0.15 % Current Limit Voltage 60 70 85 mV Oscillator Frequency 120 140 160 kHz Oscillator Max Duty Cycle 90 95 % Peak DH Sink/ S our c e Cur rent BSTH-DH = 4.5V,DH- P GNDH = 3.3V
Peak DL Sink/ S ource Current BSTL-DL = 4.5V, DL-PGNDL = 3. 3V
Gain (A
) VOSENSE to V
OL
VID Source Current VID Leakage VIDx = 5V 10 µA Power Good Threshold Voltage 88 112 % Dead Tim e 40 100 ns
Linear Sect ions
Quiescent Curr ent LDOV = 12V 5 mA Output Voltage LDO1 2.493 2.525 2.556 V Output Voltage LDO2 1.496 1.515 1.534 V Reference Voltage Gain (A
) LDOS (1,2) to GATE (1,2) 90 dB
OL
Load Regulation I Line Regulation 0.3 % Output Impedance V
= 0V; V
GND
VIDx ≤ 2.4V
Iref ≤ 100µA
= VO; 0mV < (CS+-CS-) < 60mV; LDOV = 11.4V to 12.6V; TA = 0 to 70°C
OSENSE
= 2A in Application Circuit See Output Voltage Tabl e
O
= 0.8A to 15A 1 %
O
DH-PGNDH = 1. 5V1100
DL-PGNDL = 1. 5V1100
O
35 dB
110 µA
1.246 1.265 1.284 V
= 0 to 8A 0.3 %
O
= 6.5V 1 1.5
GATE
A
mA
A
mA
k
© 1999 SEMTECH CORP.
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PROGRAMMABLE SYNCHRONOUS DC/DC CONVERTER, DUAL LOW DROPOUT REGULATOR CONTROLLER
PRELIMINA RY - Dec ember 2, 1999
ELECTRICAL CHARACTERISTICS (Cont.)
SC1186
Unless specified: VCC = 4.75V to 5.25V; GND = P
GND
= 0V; V
= VO; 0mV < (CS+-CS-) < 60mV; LDOV = 11.4V to 12.6V; TA = 0 to 70°C
OSENSE
PARAMETER CONDITIONS MIN TYP MAX UNITS
LDOV Undervoltage Lock out 6.5 8.0 10 V LDOEN Threshold 1.3 1.9 V LDOEN Sink Cur r ent LDOEN = 3.3V
LDOEN = 0V
0.01
-200
1.0
-300
µA µA
Ov er c urrent Trip Voltage % of Vo set poi nt 20 40 60 % Power-up Output Shor t Circui t Immunity 1 5 60 ms Output Short Circuit Glitch Immunity 0.5 4 6 ms Gate Pulldown Impedance GATE(1,2)-AGND;VCC=BST=0V 80 300 750 VOSENSE Impedance 10
k
k
PIN DESCRIPTION
Pin Pin Name Pin Function
1 AGND Small Signal A nalog and Digital Ground 2 GATE1 Gate Drive Output LDO1 3 LDOS1 Sense Input for LDO1 4 LDOS2 Sense Input for LDO2 5 VCC Input Voltage 6 REF Buffered Reference Voltage output
7 LDOEN LDO Supply Monitor. 8 CS- Current Sense Input ( negative)
9 CS+ Current Sense Input (positive) 10 PGNDH P ower Ground for Hi gh S ide Switch 11 DH High Side Driver Output 12 PGNDL Power Ground for Low Side Switch 13 DL Low Side Dri ver O utput 14 BSTL Supply for Low Side Driver 15 BSTH Supply for High Si de Dr iv er 16 EN
(1)
Logic low shuts down the converter; High or open f or normal operation.
17 VOSENSE Top end of int er nal feedback c hain
VID4 VID3 VID2 VID1 VID0
(1) (1) (1) (1) (1)
Programming Input (MSB) Programming Input Programming Input Programming Input Programming Input (LSB)
18 19 20 21 22 23 LDOV +12V for LDO secti on 24 GATE2 Gat e Drive Output LDO 2
AGND
GATE1 LDOS1 LDOS2
VCC
REF
LDOEN
CS-
CS+
PGNDH
DH
PGNDL
Note: (1) All logic level inputs and output s are open collector TTL compatible.
Top View
1 2 3 4 5 6 7 8
9 10 11 12
24 23 22 21 20 19 18 17 16 15 14 13
(24 Pin SOIC)
GATE2 LDOV VID0 VID1 VID2 VID3 VID4 VOSENSE EN BSTH BSTL DL
© 1999 SEMTECH CORP.
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PROGRAMMABLE SYNCHRONOUS DC/DC CONVERTER, DUAL LOW DROPOUT REGULATOR CONTROLLER
PRELIMINA RY - Dec ember 2, 1999
OUTPUT VOLTAGE
Unless specified: 4.75V < VCC < 5.25V; GND = PGND = 0V; VOSENSE = VO; 0mV < (CS+-CS-) < 60mV; = 0°C < T
PARAMETER VID
Output Voltage 01111 1. 277 1.300 1.323 V
< 85°C
j
Standard
MIN TYP MAX UNITS
43210
01110 1.326 1.350 1.374 01101 1.375 1.400 1.425 01100 1.424 1.450 1.476 01011 1.478 1.500 1.523 01010 1.527 1.550 1.573 01001 1.576 1.600 1.624 01000 1.625 1.650 1.675 00111 1.675 1.700 1.726 00110 1.724 1.750 1.776 00101 1.782 1.800 1.818 00100 1.832 1.850 1.869 00011 1.881 1.900 1.919 00010 1.931 1.950 1.970 00001 1.980 2.000 2.020 00000 2.030 2.050 2.071 11111 1.970 2.000 2.030 11110 2.069 2.100 2.132 11101 2.167 2.200 2.233 11100 2.266 2.300 2.335 11011 2.364 2.400 2.436 11010 2.463 2.500 2.538 11001 2.561 2.600 2.639 11000 2.660 2.700 2.741 10111 2.758 2.800 2.842 10110 2.842 2.900 2.958 10101 2.940 3.000 3.060 10100 3.038 3.100 3.162 10011 3.136 3.200 3.264 10010 3.234 3.300 3.366 10001 3.332 3.400 3.468 10000 3.430 3.500 3.570
SC1186
© 1999 SEMTECH CORP.
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PRELIMINA RY - Dec ember 2, 1999
APPLICATION CIRCUIT
PROGRAMMABLE SYNCHRONOUS DC/DC CONVERTER, DUAL LOW DROPOUT REGULATOR CONTROLLER
SC1186
GND
C18
IRL34025
15
BSTH
0.1uF
+
+
+
10DH11
PGNDH
C16
C14
13
14
DL
BSTL
+
VCC_CORE
C17
1500uF
C15
Q1
8
CS-
IRL34025
17
VOSENSE
1500uF
R4
5mOhm
4uH
L1
Q2
7
18
VID4
LDOEN
R5
2.32k
R6
1.00k
C13
0.1uF
9
CS+
1500uF
1500uF
23
LDOV
3
LDOS1
2.5V
+
Q3
330uF
C11
IRLML2803
1.5V
C9
1000uF
+
Q4
3.3V
IRFZ14S
C21
+
330uF
VCC5REF
U1
6
R1
10
+
+
12V
5V
C1
0.1uF
22
C3
1500uF
C2
1500uF
AGND
EN
VID319VID220VID121VID0
PGNDL
GATE224GATE1
LDOS2
1
16
12
C5
0.1uF
EN
REF
VID0
VID1
SC1186CSW
2
4
VID2
VID3
VID4
5
© 1999 SEMTECH CORP.
652 MITCHELL ROA D NE WBURY P A RK CA 91320
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PROGRAMMABLE SYNCHRONOUS DC/DC
SC1186
CONVERTER, DUAL LOW DROPOUT REGULATOR CONTROLLER
PRELIMINA RY - Dec ember 2, 1999
MATERIALS LIST
Qty. Reference Part/Description Vendor Notes
4 C1,C5,C13,C18 0.1µF Ceram ic Various 6 C2,C3,C14-C17 1500µF/6.3V SANYO MV-GX or equiv. Low ESR 1 C9 1000µF 2 C11,C21 330µF/6.3V Various 1 L1 4µH 8 Turns 16AWG on MICROM E TALS T50-52D core 2 Q1,Q2 See notes See notes FET selection r equires trade-off between effi c iency and
cost. Absolute maximum R
1 Q3 IRLML2803 IR 1 Q4 IRFZ14S IR Or equival ent
.25Ω 30V SOT23 (or equivalent)
= 22 mΩ for Q1,Q2
DS(ON)
1R4 1R5 1R6 1R1 1 U1 SC1186CSW SEMTECH
5m
2.32kΩ, 1%, 1/8W 1kΩ, 1%, 1/8W 10Ω, 5%, 1/8W
IRC OAR-1 Series Various Various Various
© 1999 SEMTECH CORP.
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Page 7
PRELIMINA RY - Dec ember 2, 1999
96%
92%
88%
84%
Efficiency (%)
PROGRAMMABLE SYNCHRONOUS DC/DC CONVERTER, DUAL LOW DROPOUT REGULATOR CONTROLLER
SC1186
80%
76%
0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0
Vo=2.8V Vo=2.0V Vo=2.5V
Io (Amps)
Typical Efficiency (Switching section)
Typical Ripple, V o=2.0V, I o=10A
Output Voltage
Output Current 5A/div
Transient Response Vo=2.4V , Io=300mA to 15A
© 1999 SEMTECH CORP.
2.5V Linear Short circ uit output r esponse
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PRELIMINA RY - Dec ember 2, 1999
PROGRAMMABLE SYNCHRONOUS DC/DC CONVERTER, DUAL LOW DROPOUT REGULATOR CONTROLLER
SC1186
LAYOUT GUIDELINES
Careful attention to layout requirement s are nec essary for successful im plementation of the SC1186 PWM controller. High cur rents switching at 140kHz ar e pr e­sent in the appl ication and their ef fect on ground plane voltage differentials m ust be under stood and mini ­mized.
1). The hi gh power part s of the cir c uit should be laid out first. A ground plane should be used, the number and position of ground plane i nterrupti ons should be such as to not unnecessarily compromise ground plane integri ty. Isolated or semi-isolated areas of the ground plane may be deliberately intr oduced to constrain ground currents to particular ar eas, for ex ample the input capacitor and bottom FET ground.
2). The l oop formed by the Input Capacitor(s) (Ci n) , the Top FET ( Q1) and the Bott om FET ( Q2) must be kept
10
1
AGND
2
GATE1
3
LDOS1
4 Q1
0.1uF
0.1uF
LDOS2
5
VCC
6
REF
7
LDOEN
8
CS-
9
CS+
10
PGNDH
11
DH
12
PGNDL
GATE2
LDOV
VID0 VID1
VID2 VID3
VID4
VOSENSE
EN BSTH
BSTL
DL
SC1186
as small as possible. This loop contains all the high current, fast transition switching. Connections should be as wide and as short as possible to minimiz e loop inductance. Minimizi ng this loop area will a) reduce EMI, b) lower ground injection current s, r esul ting in electrically “cleaner” gr ounds for the rest of the system and c) minimize source ringing, resulting in mor e r eli­able gate switching signals.
3). The connection between the junc tion of Q1, Q2 and the output i nductor should be a wide trac e or c opper region. It should be as short as practical. Sinc e this connection has fast voltage transi tions, keeping this connection short will minimize EMI. The connection between the output i nduc tor and the sense resistor should be a wide trace or copper ar ea, there are no fast voltage or c urrent transitions in this connection and length is not so i mportant, however addi ng unnec ­essary impedance will reduce efficiency.
12V IN
24 23 22 21 20 19 18 17 16 15 14 13
5V
Cin
+
1.00k
Q2
4uH
2.32k
5mOhm
Cout
Vout
+
3.3V Vo Lin1
+
Cin Lin
Layout diagram for the SC1186
© 1999 SEMTECH CORP.
Heavy lines indicate
Q3
Q4
+
Cout Lin1
Vo Lin2
+
Cout Lin2
high current paths.
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PRELIMINA RY - Dec ember 2, 1999
PROGRAMMABLE SYNCHRONOUS DC/DC CONVERTER, DUAL LOW DROPOUT REGULATOR CONTROLLER
SC1186
4) The Output Capacitor( s) (Cout) should be locat ed as close to the load as possible, fast tr ansi ent load currents are suppli ed by Cout only, and connec tions between Cout and the load must be short, wide cop­per areas to minimize induct anc e and r esi stanc e.
5) The SC1186 is best pl ac ed over a quiet ground plane area, avoid pulse currents in the Cin, Q1, Q2 loop flowing in this area. PGNDH and PGNDL shoul d be returned to t he gr ound plane close to the pac k age. The AGND pin should be connected to t he gr ound side of (one of) the output capacitor(s). If this is not possible, the AGND pin may be c onnected to the ground path between the Out put Capacitor( s) and t he Cin, Q1, Q2 loop. Under no circumstanc es should AGND be returned to a ground inside the Cin, Q1, Q 2 loop.
6) Vcc for the SC1186 should be supplied from the
5V
5V supply through a 10Ω resistor, the V c c pin should be decoupled direc tly to AGND by a 0.1µF ceramic capacitor , trace lengths should be as short as possi-
ble.
7) The Current S ense resistor and the divider across it should form as small a loop as possible, the traces running back to CS + and CS- on the SC1186 should run parall el and close to each ot her . The 0.1µF ca­pacitor shoul d be mounted as close to t he CS + and CS- pins as possible.
8) Ideall y, the grounds f or the two LDO sections should be returned to the ground side of ( one of) the output capacitor(s).
+
Currents in various part s of the power section
Vout
+
9
© 1999 SEMTECH CORP.
652 MITCHELL ROA D NE WBURY P A RK CA 91320
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PRELIMINA RY - Dec ember 2, 1999
PROGRAMMABLE SYNCHRONOUS DC/DC CONVERTER, DUAL LOW DROPOUT REGULATOR CONTROLLER
SC1186
COMPONENT SELECTION
SWITCHING SECTION OUTPUT CAPACIT O RS - Selection begins with the most critical component. Because of fast transient load current requirements i n modern microprocessor core supplies, the out put capacitor s must supply all transient load current r equirement s until the cur r ent in the output inductor r amps up to the new level. Output capacitor ESR is therefore one of the most important c r iteria. The maximum ESR can be sim ply calculated f r om:
V
R
ESR
t
I
t
Where
=
t
=
t
step current Transient I
For example, t o meet a 100m V transient l imit with a 10A load step, t he output capacitor ESR must be less than 10mΩ. To meet this ki nd of ESR level , there are three available capacitor technologies.
Each Capacitor Total
Technology C
(µF)
Low ESR Tantalum 330 60 6 2000 10 OS-CON 330 25 3 990 8.3 Low ESR Aluminum 1500 44 5 7500 8.8
ESR
(mΩ)
The choice of which to use is simply a cost/ per for­mance issue, wit h Low ESR Alumi num being the cheapest, but tak ing up the most space.
INDUCTOR - Having dec ided on a suitable type and value of output capacitor , the maxim um all owable value of i nduc tor can be calculated. Too large an in­ductor will produce a slow current ramp rat e and will cause the output capacitor to supply more of the tran­sient load cur r ent for longer - leadi ng to an output volt­age sag below the ESR excur si on c alculated above. The maximum induct or val ue may be calc ulated f r om:
CR
ESR
L
()
I
t
VV
OIN
The calculated maxim um induct or val ue assumes 100% duty cycle, so some allowance must be made. Choosing an inductor value of 50 to 75% of the calc ulated maxi­mum will guarantee that the induct or c ur r ent will ramp
excursion voltage transient MaximumV
Qty.
Rqd.C(µF)
ESR
(mΩ)
fast enough to r educ e the voltage dropped across the ESR at a f ast er r ate than the capacitor sags, hence en­suring a good recovery from tr ansi ent with no additional excursions. We must also be concerned with ripple c ur r ent in the output inductor and a general rule of thumb has been to allow 10% of maximum output current as ripple current. Note that most of the output voltage ripple is produced by the inductor rippl e c ur r ent fl owing in the output c a­pacitor E S R. Ripple cur r ent can be calculated fr om:
V
I
L
RIPPLE
IN
=
fL4
OSC
Ripple current allowance will define the minimum per­mit ted inductor val ue.
POWER FETS - The FETs are chosen based on sev­eral criteria wit h pr obably the m ost import ant being power dissipation and power handling capability. TOP FE T - The power dissipati on in the top FE T is a combination of c onduc tion losses, switching losses and bottom FET body diode recover y losses. a) Conduction losses are simply calculated as:
2
RIP
OCOND
δ=
)on(DS
where
V
O
cycleduty =
δ
V
IN
b) Switchi ng losses can be estimated by assuming a switching time, if we assume 100ns then:
2
10VIP
=
INOSW
or more generally,
f)tt(VI
+
P
=
SW
4
c) Body diode r ec overy losses are more diffi c ult to esti ­mate, but to a first approximation, it is reasonable to as­sume that t he stor ed c har ge on the bottom FET body diode will be moved through the top FET as it starts to turn on. The r esul ting power dissipati on in the top FE T will be:
fVQP
=
OSCINRRRR
To a first order approximation, it is convenient to only consider conduction losses to determine FET suitability. For a 5V in; 2.8V out at 14.2A requirement, ty pical FE T losses would be:
OSCfrINO
© 1999 SEMTECH CORP.
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PRELIMINA RY - Dec ember 2, 1999
PROGRAMMABLE SYNCHRONOUS DC/DC CONVERTER, DUAL LOW DROPOUT REGULATOR CONTROLLER
SC1186
Using 1.5X Room temp R
to allow for temperature
DS(ON)
rise.
FET type
R
DS(on)
(mΩ) IRL34025 15 1.69 D IRL2203 10.5 1.19 D
(W) Package
P
D
2
PAK
2
PAK
Si4410 20 2.26 SO-8
BOTTOM FET - Bottom FET losses are almost entirely due to conduction. The body diode is forced into con­duction at the beginning and end of the bott om switch conduction per iod, so when the FET tur ns on and off, there is very little vol tage across it, resul ting in low switching losses. Conduction losses for the FE T can be determined by:
2 OCOND
)1(RIP
δ=
)on(DS
For the example above:
FET type
R
DS(on)
(mΩ) IRL34025 15 1.33 D
IRL2203 10.5 0.93 D
(W) Package
P
D
2
PAK
2
PAK
Si4410 20 1.77 SO-8
Each of t he pac kage types has a characteri stic thermal impedance, for t he TO-220 package, thermal impedance is mostly determi ned by the heatsink used. For the surface mount pac k ages on doubl e si ded FR4, 2 oz printed c ircuit boar d materi al, thermal impedances of
o
C/W for t he D2PAK and 80oC/W for t he S O-8 are
40 readily achievable. The c or responding temper ature rise is detailed below:
INPUT CAPACITORS - since the RMS ripple current in the input capacitor s may be as high as 50% of t he output current, suitabl e c apac itors must be chosen ac­cordingly. Also, during fast load transients, t her e may be restrict ions on input di/dt. These restrictions requi r e useable energy storage within the converter circuitr y , either as ex tra output capacitance or, more usually , additional input capac itors. Choosing low ESR input capacitor s will help maximize ripple rating for a given size.
SHORT CIRCUIT PROTECTION - LINEARS
The Short circuit feature on t he linear cont r ollers is implemented by usi ng the Rds(on) of t he FETs. As output current increases, the regulation l oop maintains the output volt age by turning the F E T on more and more. Eventually, as the Rds(on) lim it is reached, the FET will be unably to turn on mor e fully, and output voltage will start to fall. When the output voltage falls to approximately 50% of nominal, the LDO contr oller is latched off, setting output voltage to 0. P ower must be cycled to reset the latch.
To prevent false latchi ng due to capacitor inrush cur­rents or low supply rai ls, the current lim it lat c h is ini­tially disabled. It is enabled at a preset time (nominally 2mS) after both t he LDOV and LDOEN rai ls rise above t heir lockout points.
To be most effective, the l inear FET Rds(on) should not be selected artificial ly low, the FET should be cho­sen so that, at m aximum requi r ed c ur r ent, it is almost fully turned on
If, for ex ample, a linear supply of 1.5V at 4A is re­quired f rom a 3.3V ± 5% r ail, max al lowable Rds(on) would be.
Rds(on)max = (0.95*3.3-1. 5) /4 ≈ 400m
Temperature rise (oC) FET type Top FET Bottom FET IRL34025 67.6 53.2
IRL2203 47.6 37.2 Si4410 180.8 141.6
It is apparent that single SO-8 Si4410 are not adequate for this applicat ion, but by usi ng par allel pairs in each po­sition, power dissipation will be approximat ely halved and temperature rise reduced by a factor of 4.
© 1999 SEMTECH CORP.
To allow for temperature effects 200mΩ would be a suitable room temperature maxim um, allowing a peak short circuit current of approx imately 15A f or a short tim e before shutdown.
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PRELIMINA RY - Dec ember 2, 1999
OUTLINE DRAWING
PROGRAMMABLE SYNCHRONOUS DC/DC CONVERTER, DUAL LOW DROPOUT REGULATOR CONTROLLER
JEDEC MS-013AD
B17104B
SC1186
ECN99-600 9-22-99 ECN99-719 12-2-99
© 1999 SEMTECH CORP.
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652 MITCHELL ROA D NE WBURY P A RK CA 91320
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