Datasheet SC1154CSW.TR Datasheet (Semtech Corporation)

Page 1
SC1154
PROGRAMMABLE SYNCHRONOUS DC/DC HYSTERETIC CONTROLLER FOR ADVANCED PROCESSORS
© 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320
PRELIMINARY - March 1, 2000
1
Pentium is a registered trademark of Intel Corporation
DEVICE
(1)
PACKAGE TEMP. RANGE (TJ)
SC1154CSW SO-28 0 - 125°C
ORDERING INFORMATION
Note: (1) Add suffix ‘TR’ for tape and reel.
DESCRIPTION
The SC1154 is a synchronous-buck switch-mode con­troller designed for use in single ended power supply applications where efficiency is the primary concern. The controller is a hysteretic type, with a user se­lectable hysteresis. The SC1154 is ideal for imple­menting DC/DC converters needed to power advanced microprocessors such as Pentium
®
ll, in both single and multiple processor configurations. Inhibit, under­voltage lockout and soft-start functions are included for controlled power-up.
SC1154 features include an integrated 5 bit D/A con­verter, temperature compensated voltage reference, current limit comparator, over-current protection, and an adaptive deadtime circuit to prevent shoot-through of the power MOSFET during switching transitions. Power good signaling, logic compatible shutdown, and over-voltage protection are also provided. The inte­grated D/A converter provides programmability of out­put voltage from 2.0V to 3.5V in 100mV increments and 1.3V to 2.05V in 50mV increments with no external components.
The SC1154 high side driver can be configured as ei­ther a grounded reference or as a floating bootstrap driver. High and low side drivers have a peak current rating of 2 amps.
FEATURES
Programmable hysteresis
5 bit DAC programmable output (1.3V-3.5V)
On-chip power good and OVP functions
Designed to meet latest Intel specifications
Up to 95% efficiency
+ 1% tolerance over temperature
APPLICATIONS
Server Systems and Workstations
Pentium® II Core Supply
Multiple Microprocessor Supplies
Voltage Regulator Modules
PIN CONFIGURATION
Top View
(28-Pin SOIC)
SIMPLIFIED BLOCK DIAGRAM
Page 2
SC1154
PROGRAMMABLE SYNCHRONOUS DC/DC HYSTERETIC CONTROLLER FOR ADVANCED PROCESSORS
© 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320
PRELIMINARY - March 1, 2000
2
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Maximum Units
VIN12V VIN
MAX
14 V BOOT to DRVGND 25 V BOOT to BOOTLO 15 V Digital Inputs -0.3 to +7.3 V AGND to DRVGND +
0.5V V LOHIB to AGND 14 V LOSENSE to AGND 14 V IOUTLO to AGND 14 V HISENSE to AGND 14 V VSENSE to AGND 5V Continuous Power Dissipation, T
A
= 25°C P
D
1.2 W
Continuous Power Dissipation, T
C
= 25°C P
D
6.25 W Operating Junction Temperature T
J
0 to +125 °C
Lead Temperature (Soldering) 10 seconds T
L
300 °C
Storage Temperature T
STG
-65 to 150 °C
Page 3
SC1154
PROGRAMMABLE SYNCHRONOUS DC/DC HYSTERETIC CONTROLLER FOR ADVANCED PROCESSORS
© 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320
PRELIMINARY - March 1, 2000
3
PIN DESCRIPTION
Pin Pin Name Pin Function
1 IOUT Current Out. The output voltage on this pin is proportional to the load current as measured
across the high side MOSFET, and is approximately equal to 2 x R
DS(ON)
x I
LOAD
.
2 DROOP Droop Voltage. This pin is used to set the amount of output voltage set-point droop as a
function of load current. The voltage is set by a resistor divider between IOUT and AGND.
3 OCP Over Current Protection. This pin is used to set the trip point for over current protection by a
resistor divider between IOUT and AGND.
4 VHYST Hysteresis Set Pin. This pin is used to set the amount of hysteresis required by a resistor
divider between VREFB and AGND. 5 VREFB Buffered Reference Voltage (from VID circuitry). 6 VSENSE Output Voltage Sense. 7 AGND Small Signal Analog and Digital Ground. 8 SOFTST Soft Start. Connecting a capacitor from this pin to AGND sets the time delay. 9 NC Not connected
10 LODRV Low Drive Control. Connecting this pin to +5V enables normal operation. When LOHIB is
grounded, this pin can be used to control LOWDR.
11 LOHIB Low Side Inhibit. This pin is used to eliminate shoot-thru current. 12 DRVGND Power Ground. 13 LOWDR Low Side Driver Output. 14 DRV Drive Regulator for the MOSFET Drivers. 15 VIN12V 12V Supply. 16 BOOT Bootstrap. This pin is used to generate a floating drive for the high side FET driver. 17 HIGHDR High Side Driver Output. 18 BOOTLO Bootstrap Low. In desktop applications, this pin connects to DRVGND. 19 HISENSE High Current Sense. Connected to the drain of the high side FET, or the input side of a current
sense resistor between the input and the high side FET.
20 LOSENSE Low Current Sense. Connected to the source of the high side FET, or the FET side of a current
sense resistor between the input and the high side FET.
21 IOUTLO This is the sampling capacitors bottom leg. Voltage on this pin is voltage on the LOSENSE pin
when the high side FET is on.
22 INHIBIT Inhibit. If this pin is grounded, the MOSFET drivers are disabled. Usually connected to +5V
through a pull-up resistor.
23 VID4
(1)
Programming Input (MSB).
24 VID3
(1)
Programming Input.
25 VID2
(1)
Programming Input.
26 VID1
(1)
Programming Input.
27 VID0
(1)
Programming Input (LSB).
28 PWRGD
(1)
Power Good. This open collector logic output is high if the output voltage is within 5% of the set
point.
Page 4
SC1154
PROGRAMMABLE SYNCHRONOUS DC/DC HYSTERETIC CONTROLLER FOR ADVANCED PROCESSORS
© 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320
PRELIMINARY - March 1, 2000
4
ELECTRICAL CHARACTERISTICS
Unless specified: 0 < TJ < 125°C, VIN = 12V
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage Range VIN12V 11.4 12 13 V Supply Current (Quiescent) I
IN
q
INH = 5V, VID not 11111, VIN above UVLO threshold during start-up, f
SW
= 200kHz, BOOTLO = 0V,
C
DH
= CDL = 50pF
15 mA
High Side Driver Supply Current (Quiescent)
I
BOOT
q
INH = 0V or VID = 11111 or VIN below UVLO threshold during start-up, BOOT = 13V, BOOTLO = 0V
10 µA
INH = 5V, VID not 11111, VIN above UVLO threshold during start-up, f
SW
= 200kHz, BOOT = 13V, BOOTLO = 0V,
C
DH
= 50pF
5mA
REFERENCE/VOLTAGE IDENTIFICATION
Reference Voltage Accuracy V
REF
11.4V < VIN12V < 12.6V, over full VID range (see Output Voltage Table)
-1 1 %
VID0 - VID4 High Threshold Voltage
V
TH(H)
2.25 V
VID0 - VID4 Low Threshold Voltage
V
TH(L)
1V
POWER GOOD
Undervoltage Threshold V
TH(PWRGD)
90 95 % V
REF
Output Saturation Voltage V
SAT
IO = 5mA 0.5 V
Hysteresis V
HYS(PWRGD)
10 mV
OVER VOLTAGE PROTECTION
OVP Trip Point V
OVP
12 15 20 %V
REF
Hysteresis
(1)
V
HYS(OVP)
10 mV
Page 5
SC1154
PROGRAMMABLE SYNCHRONOUS DC/DC HYSTERETIC CONTROLLER FOR ADVANCED PROCESSORS
© 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320
PRELIMINARY - March 1, 2000
5
ELECTRICAL CHARACTERISTICS (cont.)
Unless specified: 0 < TJ < 125°C, VIN = 12V
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS SOFT START
Charge Current I
CHG
VSS = 0.5V, resistance from VREFB pin to AGND = 20kΩ, V
REFB
= 1.3V
Note: I
CHG
= (I
VREFB
/ 5)
10.4 13 15.6 µA
Discharge Current Idischg V
(S/S)
= 1V 1 mA
INHIBIT COMPARATOR
Start Threshold Vstart
INH
12.02.4 V
VIN12V UVLO
Start Threshold Vstart
UVLO
9.25 10 10.75 V
Hysteresis Vhys
UVLO
1.8 2 2.2 V
HYSTERETIC COMPARATOR
Input Offset Voltage Vos
HYSCMPVDROOP
pin grounded 5 mV
Input Bias Current Ibias
HYSCMP
A
Hysteresis Accuracy V
HYS_ACC
7mV
Hysteresis Setting V
HYS_SET
60 mV
DROOP COMPENSATION
Initial Accuracy V
DROOP_ACCVDROOP
= 50mV 5 mV
OVERCURRENT PROTECTION
OCP Trip Point V
OCP
0.09 0.1 0.11 V
Input Bias Current Ibias
OCP
100 nA
HIGH-SIDE VDS SENSING
Gain 2V/V Initial Accuracy V
IOUT_ACCVHISENSE
= 12V, V
IOUTLO
= 11.9V 6 mV
IOUT Source Isource
IOUTVIOUT
= 0.5V, V
HISENSE
= 12V,
V
IOUTLO
= 11.5V
500 µA
IOUT Sink Current Isink
IOUT
V
IOUT
= 0.05V, V
HISENSE
= 12V,
V
IOUTLO
= 12V
40 50 µA
Output Voltage Swing V
HISENSE
= 11V,
R
IOUT
= 10k0hm
03.75V
Page 6
SC1154
PROGRAMMABLE SYNCHRONOUS DC/DC HYSTERETIC CONTROLLER FOR ADVANCED PROCESSORS
© 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320
PRELIMINARY - March 1, 2000
6
ELECTRICAL CHARACTERISTICS (cont.)
Unless specified: 0 < TJ < 125°C, VIN12V = 12V
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS HIGH-SIDE VDS SENSING (cont.)
V
HISENSE
= 4.5V,
R
IOUT
= 10kOhm
02.0V
V
HISENSE
= 3V, R
IOUT
= 10kOhm 0 1.0 V
LOSENSE High Level Input Voltage
Vih
LOSENSEVHISENSE
= 4.5V (Note 1) 2.85 V
LOSENSE Low Level Input Voltage
Vil
LOSENSEVHISENSE
= 4.5V (Note 1) 1.8 V
Sample/Hold Resistance R
S/H
4.5V < = 13V 50 65 80
BUFFERED REFERENCE
VREFB Load Regulation Vldreg
REFB
10µA < I
REFB
< 500µA 2 mV
DEADTIME CIRCUIT
LOHIB High Level Voltage Vih
LOHIB
2V
LOHIB Low Level Input Voltage
Vil
LOHIB
1.0 V
LOWDR High Level Input Voltage
Vih
LOWDR
(Note 1) 2 V
LOWDR Low Level Input Voltage
Vil
LOWDR
(Note 1) 1.0 V
DRIVE REGULATOR
Output Voltage V
DRV
11.4 < VIN12V < 12.6V, I
DRV
= 50mA
79V
Load Regulation Vldreg
DRV
1mA < I
DRV
< 50mA 100 mV
Short Circuit Current Ishort
DRV
100 mA
HIGH-SIDE OUTPUT DRIVER
Peak Output Current Isrc
HIGHDR’
Isink
HIGHDR
duty cycle < 2%, tpw < 100us, T
J
= 125°C
V
BOOT
- V
BOOTLO
= 6.5V, V
HIGHDR
= 1.5V (src), or V
HIGHDR
= 5V
(sink) (Note 1)
2
A
Page 7
SC1154
PROGRAMMABLE SYNCHRONOUS DC/DC HYSTERETIC CONTROLLER FOR ADVANCED PROCESSORS
© 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320
PRELIMINARY - March 1, 2000
7
ELECTRICAL CHARACTERISTICS (cont.)
Unless specified: 0 < T
J <
125°C, VIN12V = 12V
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS HIGH-SIDE OUTPUT DRIVER (cont.)
Output Resistance Rsrc
HIGHDR’
TJ = 125°C V
BOOT
- V
BOOTLO
= 6.5V,
V
HIGHDR
= 6V
45
Rsink
HIGHDR
TJ = 125°C V
BOOT
- V
BOOTLO
= 6.5V,
V
HIGHDR
= 0.5V
5
LOW-SIDE OUTPUT DRIVER
Peak Outout Current Isrc
LOWDR’
Isink
LOWDR
duty cycle < 2%, tpw < 100us, T
J
= 125°C
V
DRV
= 6.5V, V
LOWDR
= 1.5V
(src), or V
LOWDR
= 5V (sink)
(Note 1)
2
A
Output Resistance Rsrc
LOWDR’
TJ = 125°C V
DRV
= 6.5V, V
LOWDR
= 6V
45
Rsink
LOWDR
TJ = 125°C V
DRV
= 6.5V, V
LOWDR
= 0.5V
5
HYSTERETIC COMPARATORS
(1)
Propagation Delay Time from VSENSE to HIGHDR or LOWDR (excluding deadtime)
t
HCPROP
10mV overdrive,
1.3V <
Vref < 3.5V
150 250 ns
OUTPUT DRIVERS
HIGHDR rise/fall time tr
HIGHDR
,tfHIGHDR
Cl = 9nF, V
BOOT
= 6.5v,
V
BOOTLO
= grounded,
T
J
= 125 °C
60 ns
LOWDR rise/fall time tr
LOWDR ,
tf
LOWDR
Cl = 9nF, V
DRV
= 6.5v,
T
J
= 125 °C
60 ns
OVERCURRENT PROTECTION
(1)
Comparator Propagation Delay Time
t
OCPROP
s
Deglitch Time t
OCDGL
13µs
OVERVOLTAGE PROTECTION
Comparator Propagation Delay Time
t
OVPROP
s
Deglitch Time t
OVDGL
13µs
Page 8
SC1154
PROGRAMMABLE SYNCHRONOUS DC/DC HYSTERETIC CONTROLLER FOR ADVANCED PROCESSORS
© 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320
PRELIMINARY - March 1, 2000
8
ELECTRICAL CHARACTERISTICS (cont.)
Unless specified: 0 < TJ < 125° C, VIN12V = 12V
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS HIGH-SIDE Vds SENSING
(1)
Response Time t
VDSRESP
V
HISENSE
= 12v, V
IOUTLO
pulsed from 12v to 11.9v, 100ns rise and fall times
s
V
HISENSE
= 4.5v, V
IOUTLO
pulsed from 4.5v to 4.4v, 100ns rise and fall times
s
V
HISENSE
= 3v, V
IOUTLO
pulsed from 3.0v to 2.9v, 100ns rise and fall times
s
Short Circuit Protection Rising Edge Delay
t
VDSRED
LOSENSE grounded 300 500 ns
Sample/Hold Switch turn­on/turn-off Delay
t
SWXDLY
3v < V
HISENSE
< 11v
V
LOSENSE
= V
HISENSE
30 100 ns
POWER GOOD
Comparator Propagation Delay
t
PWRGD
s
SOFTSTART
Comparator Propagation Delay
t
SLST
overdrive = 10mv 560 900 ns
DEADTIME
Driver Nonoverlap Time t
NUL
30 100 ns
Note 1: Guaranteed, but not tested
Page 9
SC1154
PROGRAMMABLE SYNCHRONOUS DC/DC HYSTERETIC CONTROLLER FOR ADVANCED PROCESSORS
© 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320
PRELIMINARY - March 1, 2000
9
BLOCK DIAGRAM
REGULATOR
SHUTDOWN
FILTER
FILTER
VREF
VREF
VID0
VID1
VID2
VID3
VID4
ANALOG BIAS
I(VREFB) / 5
FILTER
LOWDR
RISING EDGE
DELAY
HIGHDR
BANDGAP
2V
Vcc
10V
Vcc
DEGLITCH
VSENSE
1.15VREF
0.93VREF
DECODE
11111
UVLO
FAULT
INH
1.15VREF 0.93VREF
+
-
DEGLITCH
SOFTST
INHIBIT
+
-
DROOP
R
S
Q
DRV
BOOT
HIGHDR
BOOTLO
LODRV
LOWDR
DRVGND
+
-
DRIVE
100mV
+
-
OCP
PWRGD
+
-
+
-
G=2
IOUTLOHISENSEIOUT
50uA
LOSENSE
AGND
PREREG
VSENSE LOHIB
+
--+
+
-
VREFB
VID
DAC
VIN12V
+
-
VHYST
+
--+
+
-
+-
+
-
Page 10
SC1154
PROGRAMMABLE SYNCHRONOUS DC/DC HYSTERETIC CONTROLLER FOR ADVANCED PROCESSORS
© 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320
PRELIMINARY - March 1, 2000
10
NOTE:
(1) If the VID bits are set to 11111, then the high-side and the low-side driver outputs will be set low, and the con­troller will be set to a low-Iq state.
OUTPUT VOLTAGE TABLE
0 = GND; 1 = Floating or +5V pull-up
VID4 VID3 VID2 VID1 VID0 VDC
(V)
0 1 1 1 1 1.30 0 1 1 1 0 1.35 0 1 1 0 1 1.40 0 1 1 0 0 1.45 0 1 0 1 1 1.50 0 1 0 1 0 1.55 0 1 0 0 1 1.60 0 1 0 0 0 1.65 0 0 1 1 1 1.70 0 0 1 1 0 1.75 0 0 1 0 1 1.80 0 0 1 0 0 1.85 0 0 0 1 1 1.90 0 0 0 1 0 1.95 0 0 0 0 1 2.00 0 0 0 0 0 2.05 1 1 1 1 1 NO CPU 1 1 1 1 0 2.10 1 1 1 0 1 2.20 1 1 1 0 0 2.30 1 1 0 1 1 2.40 1 1 0 1 0 2.50 1 1 0 0 1 2.60 1 1 0 0 0 2.70 1 0 1 1 1 2.80 1 0 1 1 0 2.90 1 0 1 0 1 3.00 1 0 1 0 0 3.10 1 0 0 1 1 3.20 1 0 0 1 0 3.30 1 0 0 0 1 3.40 1 0 0 0 0 3.50
Page 11
SC1154
PROGRAMMABLE SYNCHRONOUS DC/DC HYSTERETIC CONTROLLER FOR ADVANCED PROCESSORS
© 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320
PRELIMINARY - March 1, 2000
11
Reference/Voltage Identification
The reference/voltage identification (VID) section con­sists of a temperature compensated bandgap refer­ence and a 5-bit voltage selection network. The 5 VID pins are TTL compatable inputs to the VID selection network. They are internally pulled up to +5V gener­ated from the +12V supply by a resistor divider, and provide programmability of output voltage from 2.0V to
3.5V in 100mV increments and 1.3V to 2.05V in 50mV increments. Refer to the Output Voltage Table for the VID code settings. The output voltage of the VID network, VREF is within 1% of the nominal setting over the full input and output voltage range and junction temperature range. The output of the reference/VID network is indi­rectly brought out through a buffer to the REFB pin. The voltage on this pin will be within 3mV of VREF. It is not recommended to drive loads with REFB other than setting the hysteresis of the hysteretic compara­tor, because the current drawn from REFB sets the charging current for the soft start capacitor. Refer to the soft start section for additional information.
Hysteretic Comparator
The hysteretic comparator regulates the output voltage of the synchronous-buck converter. The hysteresis is set by connecting the center point of a resistor divider from REFB to AGND to the HYST pin. The hysteresis of the comparator will be equal to twice the voltage dif­ference between REFB and HYST, and has a maxi­mum value of 60mV. The maximum propagation delay from the comparator inputs to the driver outputs is 250ns.
Low Side Driver
The low side driver is designed to drive a low R
DS(ON)
N­channel MOSFET, and is rated for 2 amps source and sink. The bias for the low side driver is provided inter­nally from VDRV.
High Side Driver
The high side driver is designed to drive a low R
DS(ON)
N-channel MOSFET, and is rated for 2 amps source and sink. It can be configured either as a ground refer­enced driver or as a floating bootstrap driver. When configured as a floating driver, the bias voltage to the driver is developed from the DRV regulator. The inter-
nal bootstrap diode, connected between the DRV and BOOT pins, is a Schottky for improved drive efficiency. The maximum voltage that can be applied between the BOOT pin and ground is 25V. The driver can be refer­enced to ground by connecting BOOTLO to PGND, and connecting +12V to the BOOT pin.
Deadtime Control
Deadtime control prevents shoot-through current from flowing through the main power FETs during switching transitions by actively controlling the turn-on times of the FET drivers. The high side driver is not allowed to turn on until the gate drive voltage to the low-side FET is below 2 volts, and the low side driver is not allowed to turn on until the voltage at the junction of the 2 FETs (VPHASE) is below 2 volts. An internal low-pass filter with an 11MHz pole is located between the output of the low-side driver (DL) and the input of the deadtime circuit that controls the high-side driver, to filter out noise that could appear on DL when the high-side driver turns on.
Current Sensing
Current sensing is achieved by sampling and holding the voltage across the high side FET while it is turned on. The sampling network consists of an internal 50
switch and an external 0.1µF hold capacitor. Internal logic controls the turn-on and turn-off of the sample/ hold switch such that the switch does not turn on until VPHASE transitions high and turns off when the input to the high side driver goes low. Thus sampling will occur only when the high side FET is conducting cur­rent. The voltage at the IO pin equals 2 times the sensed voltage. In applications where a higher accu­racy in current sensing is required, a sense resistor can be placed in series with the high side FET and the voltage across the sense resistor can be sampled by the current sensing circuit.
Droop Compensation
The droop compensation network reduces the load transient overshoot/undershoot at VOUT, relative to VREF. VOUT is programmed to a voltage greater than VREF (equal to VREF x (1+R5/R6)) by an external re­sistor divider from VOUT to the VSENSE pin to reduce the undershoot on VOUT during a low to high load current transient. The overshoot during a high to low load current transient is reduced by subtracting the voltage that is on the DROOP pin from VREF. The voltage on the IO pin is divided down with an external
FUNCTIONAL DESCRIPTION
Page 12
SC1154
PROGRAMMABLE SYNCHRONOUS DC/DC HYSTERETIC CONTROLLER FOR ADVANCED PROCESSORS
© 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320
PRELIMINARY - March 1, 2000
12
FUNCTIONAL DESCRIPTION (cont.)
resistor divider, and connected to the DROOP pin. Thus, under loaded conditions, VOUT is regulated to Vout = Vref • (1+R7/R8) - IOUT • R2/(R1+R2).
Inhibit
The inhibit pin is a TTL compatible digital pin that is used to enable the controller. When INH is low, the output drivers are low, the soft start capacitor is dis­charged, the soft start current source is disabled, and the controller is in a low I
Q
state. When INH goes high, the short across the soft start capacitor is removed, the soft start current source is enabled, and normal con­verter operation begins. When the system logic supply is connected to INH, it controls power sequencing by locking out controller operation until the system logic supply exceeds the input threshold voltage of the INH circuit; thus the +12V supply and the system logic sup­ply (either +5V or 3.3V) must be above UVLO thresh­olds before the controller is allowed to start up.
VIN
The VIN undervoltage lockout circuit disables the con­troller while the +12V supply is below the 10V start threshold during power-up. While the controller is dis­abled, the output drivers will be low, the soft start ca­pacitor will be shorted and the soft start current is dis­abled and the controller will be in a low I
Q
state. When VIN exceeds the start threshold, the short across the soft start capacitor is removed, the soft start current source is enabled and normal converter operation be­gins. There is a 2V hysteresis in the undervoltage lockout circuit for noise immunity.
Soft Start
The soft start circuit controls the rate at which VOUT powers up. A capacitor is connected between SS and AGND and is charged by an internal current source. The value of the current source is proportional to the reference voltage so the charging rate of C
SS
is also proportional to the reference voltage. By making the charging current proportional to VREF, the power-up time for VOUT will be independent of VREF. Thus, C
SS
can remain the same value for all VID settings. The soft start charging current is determined by the follow­ing equation: I
SS
= I
REFB
/5. Where I
REFB
is the current flowing out of the REFB pin. It is recommended that no additional loads be connected to REFB, other than the resistor divider for setting the hysteresis voltage.
Thus these resistor values will determine the soft start charging current. The maximum current that can be sourced by REFB is 500µA.
Power Good
The power good circuit monitors for an undervoltage condition on VOUT. If VSENSE is 7% (nominal) below VREF, then the power good pin is pulled low. The PWRGD pin is an open drain output.
Overvoltage Protection
The overvoltage protection circuit monitors VOUT for an overvoltage condition. If VSENSE is 15% above VREF, than a fault latch is set and both output drivers are turned off. The latch will remain set until VIN goes below the undervoltage lockout value. A 1ms deglitch timer is included for noise immunity.
Overcurrent Protection
The overcurrent protection circuit monitors the current through the high side FET. The overcurrent threshold is adjustable with an external resistor divider between IO and AGND, with the divider voltage connected to the OCP pin. If the voltage on the OCP pin exceeds 100mV, then a fault latch is set and the output drivers are turned off. The latch will remain set until VIN goes below the undervoltage lockout value. A 1ms deglitch timer is included for noise immunity. The OCP circuit is also designed to protect the high side FET against a short-to-ground fault on the terminal common to both power FETs (VPHASE).
Drive Regulator
The drive regulator provides drive voltage to the low side driver, and to the high side driver when the high side driver is configured as a floating driver. The mini­mum drive voltage is 7V. The minimum short circuit current is 100mA.
Page 13
SC1154
PROGRAMMABLE SYNCHRONOUS DC/DC HYSTERETIC CONTROLLER FOR ADVANCED PROCESSORS
© 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320
PRELIMINARY - March 1, 2000
13
Iout1Droop2OCP3Vhyst4Vrefb5Vsense6AnaGnd7Slowst8Bias9Lodrv10Lohib11DrvGnd12LowDr13DRV
14
Vin12
15
Boot
16
HiDr
17
BootLo
18
Hisense
19
Losense
20
Ioutlo
21
Inhibit
22
VID4
23
VID3
24
VID2
25
VID1
26
VID0
27
PwrGd
28
U1
SC1154
R11
2.2
R12
3.9
L2
1.5uH
C7
0.1
R3
2.7k
R1
2k
R4
1k
R2
1k
R5
100
R6
20k
C5
0.001
R7
150
R8
10k
+5V
C8
2.2uF 16V
C9
2.2uF 16V
+12V
C12
0.1
C14
0.33
R10
10k
12345
109876
S1
R9
10k
C11
0.01
C4
0.01
C6
0.1
12345
6
J2
123
4
J1
C17
150uF 16V
C18
150uF 16V
C23
470uF 6.3V
C24
470uF 6.3V
L1
1uH
C16
0.1
C20
0.1
C27
0.1
PWRGD
INHIB
+
_
Vin +5 to +12V
Vout
+
_
C19
150uF 16V
C25
470uF 6.3V
+12V
+12V
+12V
C2
0.01
C3
0.01
C13
0.33
Q1
IRL3103S
Q2
IRL2203S
D1
MBRD1035
C26
460uF 6.3V
Ra*
0
+5V
C9
0.1
C8
0.01
+5V
+5V
+5V
Rb*
0
+5V
Vout
GND
* Only one resistor/jumper to be installed, either Ra or Rb.
Dopt.
MBR0530
pin18
C22
470uF 6.3V
C21
470uF 6.3V
APPLICATION CIRCUIT
Page 14
SC1154
PROGRAMMABLE SYNCHRONOUS DC/DC HYSTERETIC CONTROLLER FOR ADVANCED PROCESSORS
© 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320
PRELIMINARY - March 1, 2000
14
MATERIALS LIST
Quantity Reference Part/Description Vendor Notes
1 C5 0.001µF 6 C1-C4, C8, C11 0.01µF 3 C17-C19 150µF, 16V (TPS) AVX 7 C6,C7,C9,C12,C16,C20, C27 0.1µF 2 C13,C14 0.33µF 6 C21-C26 470µF, 6.3V (TPS) AVX 2 C10,C15 2.2µF, 16V 1 D1 MBRD1035 MOT 1 L1 1µH, DO5022P-102 Coilcraft 1 L2 1.5µH, DO5022P-152HC Coilcraft 1 Q1 IRL3103NS, D2PAK Int. Rect . 1 Q2 IRL2203NS, D2PAK Int. Rect . 2RA,RB
0
1R1 2K 2 R2,R4 1K 1R3 2.7K 1 R5 100 1 R6 20K 1 R7 150 3 R8,R9,R10 10K 1 R11 2.2 1 R12 3.9 1 U1 SC1154, SO-28 SEMTECH
Layout guidelines
1. Locate R8 and C5 close to pins 6 and 7.
2. Locate C6 close to pins 5 and 7.
3. Components connected to IOUT, DROOP, OCP, VHYST, VREFB, VSENSE, and SOFTST should be refer­enced to AGND.
4. The bypass capacitors C10 and C15 should be placed close to the IC and referenced to DRVGND.
5. Locate bootstrap capacitor C13 close to the IC.
6. Place bypass capacitor C14 close to Drain of the top FET and Source of the bottom FET to be effective.
7. Route HISENSE and LOSENSE close to each other to minimize induced differential mode noise.
8. Bypass a high frequency disturbance with ceramic capacitor at the point where HISENSE is connected to Vin.
9. Input bulk capacitors should placed as close as possible to the power FETs because of the very high ripple cur­rent flow in this pass.
10. If Schottky diode used in parallel with a synchronous (bottom) FET, to achieve a greater efficiency at lower Vout settings, it needs to be placed next to the aforementioned FET in very close proximity.
11. Since the feedback path relies on the accurate sampling of the output ripple voltage, the best results can be achieved by connecting the AGND to the ground side of the bulk output capacitors.
12. DRVGND pin should be tight to the main ground plane utilizing very low impedance connection, e.g., multiple vias.
13. In order to prevent substrate glitching, a small (0.5A) Schottky diode should be placed in close proximity to the chip with the cathode connected to BOOTLO and anode connected to DRVGND.
Page 15
SC1154
PROGRAMMABLE SYNCHRONOUS DC/DC HYSTERETIC CONTROLLER FOR ADVANCED PROCESSORS
© 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320
PRELIMINARY - March 1, 2000
15
EVALUATION BOARD ARTWORK
TOP LAYER
BOTTOM LAYER
Page 16
SC1154
PROGRAMMABLE SYNCHRONOUS DC/DC HYSTERETIC CONTROLLER FOR ADVANCED PROCESSORS
© 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320
PRELIMINARY - March 1, 2000
16
EVALUATION BOARD LAYOUT
TOP VIEW
BOTTOM VIEW
Page 17
SC1154
PROGRAMMABLE SYNCHRONOUS DC/DC HYSTERETIC CONTROLLER FOR ADVANCED PROCESSORS
© 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320
PRELIMINARY - March 1, 2000
17
SC1154 Voltage Regulation
-5.00
-4.00
-3.00
-2.00
-1.00
0.00
1.00
2.00
3.00
4.00
5.00
02468101214
Output Current, A
%
3.5
2.8 2
1.5
SC1154 Efficiency
60.0
65.0
70.0
75.0
80.0
85.0
90.0
95.0
100.0
0 5 10 15 20
Output Current, A
%
3.5
2.8
2.0
1.5
Vin =
TEST DATA
Page 18
SC1154
PROGRAMMABLE SYNCHRONOUS DC/DC HYSTERETIC CONTROLLER FOR ADVANCED PROCESSORS
© 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320
PRELIMINARY - March 1, 2000
18
OUTLINE - SO-28
ECN00-904
Loading...