SC1154
PROGRAMMABLE SYNCHRONOUS
DC/DC HYSTERETIC CONTROLLER
FOR ADVANCED PROCESSORS
© 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320
PRELIMINARY - March 1, 2000
14
MATERIALS LIST
Quantity Reference Part/Description Vendor Notes
1 C5 0.001µF
6 C1-C4, C8, C11 0.01µF
3 C17-C19 150µF, 16V (TPS) AVX
7 C6,C7,C9,C12,C16,C20, C27 0.1µF
2 C13,C14 0.33µF
6 C21-C26 470µF, 6.3V (TPS) AVX
2 C10,C15 2.2µF, 16V
1 D1 MBRD1035 MOT
1 L1 1µH, DO5022P-102 Coilcraft
1 L2 1.5µH, DO5022P-152HC Coilcraft
1 Q1 IRL3103NS, D2PAK Int. Rect .
1 Q2 IRL2203NS, D2PAK Int. Rect .
2RA,RB
0
Ω
1R1 2K
2 R2,R4 1K
1R3 2.7K
1 R5 100
1 R6 20K
1 R7 150
3 R8,R9,R10 10K
1 R11 2.2
1 R12 3.9
1 U1 SC1154, SO-28 SEMTECH
Layout guidelines
1. Locate R8 and C5 close to pins 6 and 7.
2. Locate C6 close to pins 5 and 7.
3. Components connected to IOUT, DROOP, OCP, VHYST, VREFB, VSENSE, and SOFTST should be referenced to AGND.
4. The bypass capacitors C10 and C15 should be placed close to the IC and referenced to DRVGND.
5. Locate bootstrap capacitor C13 close to the IC.
6. Place bypass capacitor C14 close to Drain of the top FET and Source of the bottom FET to be effective.
7. Route HISENSE and LOSENSE close to each other to minimize induced differential mode noise.
8. Bypass a high frequency disturbance with ceramic capacitor at the point where HISENSE is connected to Vin.
9. Input bulk capacitors should placed as close as possible to the power FETs because of the very high ripple current flow in this pass.
10. If Schottky diode used in parallel with a synchronous (bottom) FET, to achieve a greater efficiency at lower
Vout settings, it needs to be placed next to the aforementioned FET in very close proximity.
11. Since the feedback path relies on the accurate sampling of the output ripple voltage, the best results can be
achieved by connecting the AGND to the ground side of the bulk output capacitors.
12. DRVGND pin should be tight to the main ground plane utilizing very low impedance connection, e.g., multiple
vias.
13. In order to prevent substrate glitching, a small (0.5A) Schottky diode should be placed in close proximity to the
chip with the cathode connected to BOOTLO and anode connected to DRVGND.