The SC1154 is a synchronous-buck switch-mode controller designed for use in single ended power supply
applications where efficiency is the primary concern.
The controller is a hysteretic type, with a user selectable hysteresis. The SC1154 is ideal for implementing DC/DC converters needed to power advanced
microprocessors such as Pentium
and multiple processor configurations. Inhibit, undervoltage lockout and soft-start functions are included for
controlled power-up.
SC1154 features include an integrated 5 bit D/A converter, temperature compensated voltage reference,
current limit comparator, over-current protection, and
an adaptive deadtime circuit to prevent shoot-through
of the power MOSFET during switching transitions.
Power good signaling, logic compatible shutdown, and
over-voltage protection are also provided. The integrated D/A converter provides programmability of output voltage from 2.0V to 3.5V in 100mV increments
and 1.3V to 2.05V in 50mV increments with no external
components.
The SC1154 high side driver can be configured as either a grounded reference or as a floating bootstrap
driver. High and low side drivers have a peak current
rating of 2 amps.
®
ll, in both single
FEATURES
•
Programmable hysteresis
•
5 bit DAC programmable output (1.3V-3.5V)
•
On-chip power good and OVP functions
•
Designed to meet latest Intel specifications
•
Up to 95% efficiency
•
+ 1% tolerance over temperature
APPLICATIONS
•
Server Systems and Workstations
•
Pentium® II Core Supply
•
Multiple Microprocessor Supplies
•
Voltage Regulator Modules
ORDERING INFORMATION
DEVICE
SC1154CSWSO-280 - 125°C
Note:
(1) Add suffix ‘TR’ for tape and reel.
(1)
PACKAGETEMP. RANGE (TJ)
PIN CONFIGURATION
Top View
(28-Pin SOIC)
SIMPLIFIED BLOCK DIAGRAM
Pentium is a registered trademark of Intel Corporation
14V
BOOT to DRVGND25V
BOOT to BOOTLO15V
Digital Inputs-0.3 to +7.3V
AGND to DRVGND+
0.5VV
LOHIB to AGND14V
LOSENSE to AGND14V
IOUTLO to AGND14V
HISENSE to AGND14V
VSENSE to AGND5V
Continuous Power Dissipation, T
Continuous Power Dissipation, T
Operating Junction TemperatureT
Lead Temperature (Soldering) 10 secondsT
Storage TemperatureT
1IOUTCurrent Out. The output voltage on this pin is proportional to the load current as measured
across the high side MOSFET, and is approximately equal to 2 x R
2DROOPDroop Voltage. This pin is used to set the amount of output voltage set-point droop as a
function of load current. The voltage is set by a resistor divider between IOUT and AGND.
3OCPOver Current Protection. This pin is used to set the trip point for over current protection by a
resistor divider between IOUT and AGND.
4VHYSTHysteresis Set Pin. This pin is used to set the amount of hysteresis required by a resistor
divider between VREFB and AGND.
5VREFBBuffered Reference Voltage (from VID circuitry).
6VSENSE Output Voltage Sense.
7AGNDSmall Signal Analog and Digital Ground.
8SOFTSTSoft Start. Connecting a capacitor from this pin to AGND sets the time delay.
DS(ON)
x I
LOAD
.
9NCNot connected
10LODRVLow Drive Control. Connecting this pin to +5V enables normal operation. When LOHIB is
grounded, this pin can be used to control LOWDR.
11LOHIBLow Side Inhibit. This pin is used to eliminate shoot-thru current.
12DRVGND Power Ground.
13LOWDRLow Side Driver Output.
14DRVDrive Regulator for the MOSFET Drivers.
15VIN12V12V Supply.
16BOOTBootstrap. This pin is used to generate a floating drive for the high side FET driver.
17HIGHDR High Side Driver Output.
18BOOTLO Bootstrap Low. In desktop applications, this pin connects to DRVGND.
19HISENSE High Current Sense. Connected to the drain of the high side FET, or the input side of a current
sense resistor between the input and the high side FET.
20LOSENSE Low Current Sense. Connected to the source of the high side FET, or the FET side of a current
sense resistor between the input and the high side FET.
21IOUTLOThis is the sampling capacitors bottom leg. Voltage on this pin is voltage on the LOSENSE pin
when the high side FET is on.
22INHIBITInhibit. If this pin is grounded, the MOSFET drivers are disabled. Usually connected to +5V
through a pull-up resistor.
(1)
23VID4
24VID3
25VID2
26VID1
27VID0
28PWRGD
Programming Input (MSB).
(1)
Programming Input.
(1)
Programming Input.
(1)
Programming Input.
(1)
Programming Input (LSB).
(1)
Power Good. This open collector logic output is high if the output voltage is within 5% of the set
PROGRAMMABLE SYNCHRONOUS
DC/DC HYSTERETIC CONTROLLER
FOR ADVANCED PROCESSORS
SC1154
(V)
NOTE:
(1) If the VID bits are set to 11111, then the high-side and the low-side driver outputs will be set low, and the controller will be set to a low-Iq state.
PROGRAMMABLE SYNCHRONOUS
DC/DC HYSTERETIC CONTROLLER
FOR ADVANCED PROCESSORS
SC1154
FUNCTIONAL DESCRIPTION
Reference/Voltage Identification
The reference/voltage identification (VID) section consists of a temperature compensated bandgap reference and a 5-bit voltage selection network. The 5 VID
pins are TTL compatable inputs to the VID selection
network. They are internally pulled up to +5V generated from the +12V supply by a resistor divider, and
provide programmability of output voltage from 2.0V to
3.5V in 100mV increments and 1.3V to 2.05V in 50mV
increments.
Refer to the Output Voltage Table for the VID code
settings. The output voltage of the VID network, VREF
is within 1% of the nominal setting over the full input
and output voltage range and junction temperature
range. The output of the reference/VID network is indirectly brought out through a buffer to the REFB pin.
The voltage on this pin will be within 3mV of VREF. It
is not recommended to drive loads with REFB other
than setting the hysteresis of the hysteretic comparator, because the current drawn from REFB sets the
charging current for the soft start capacitor. Refer to
the soft start section for additional information.
Hysteretic Comparator
The hysteretic comparator regulates the output voltage
of the synchronous-buck converter. The hysteresis is
set by connecting the center point of a resistor divider
from REFB to AGND to the HYST pin. The hysteresis
of the comparator will be equal to twice the voltage difference between REFB and HYST, and has a maximum value of 60mV. The maximum propagation delay
from the comparator inputs to the driver outputs is
250ns.
Low Side Driver
The low side driver is designed to drive a low R
channel MOSFET, and is rated for 2 amps source and
sink. The bias for the low side driver is provided internally from VDRV.
High Side Driver
The high side driver is designed to drive a low R
N-channel MOSFET, and is rated for 2 amps source
and sink. It can be configured either as a ground referenced driver or as a floating bootstrap driver. When
configured as a floating driver, the bias voltage to the
driver is developed from the DRV regulator. The inter-
DS(ON)
DS(ON)
N-
nal bootstrap diode, connected between the DRV and
BOOT pins, is a Schottky for improved drive efficiency.
The maximum voltage that can be applied between the
BOOT pin and ground is 25V. The driver can be referenced to ground by connecting BOOTLO to PGND,
and connecting +12V to the BOOT pin.
Deadtime Control
Deadtime control prevents shoot-through current from
flowing through the main power FETs during switching
transitions by actively controlling the turn-on times of
the FET drivers. The high side driver is not allowed to
turn on until the gate drive voltage to the low-side FET
is below 2 volts, and the low side driver is not allowed
to turn on until the voltage at the junction of the 2 FETs
(VPHASE) is below 2 volts. An internal low-pass filter
with an 11MHz pole is located between the output of
the low-side driver (DL) and the input of the deadtime
circuit that controls the high-side driver, to filter out
noise that could appear on DL when the high-side
driver turns on.
Current Sensing
Current sensing is achieved by sampling and holding
the voltage across the high side FET while it is turned
on. The sampling network consists of an internal 50
switch and an external 0.1µF hold capacitor. Internal
logic controls the turn-on and turn-off of the sample/
hold switch such that the switch does not turn on until
VPHASE transitions high and turns off when the input
to the high side driver goes low. Thus sampling will
occur only when the high side FET is conducting current. The voltage at the IO pin equals 2 times the
sensed voltage. In applications where a higher accuracy in current sensing is required, a sense resistor
can be placed in series with the high side FET and the
voltage across the sense resistor can be sampled by
the current sensing circuit.
Droop Compensation
The droop compensation network reduces the load
transient overshoot/undershoot at VOUT, relative to
VREF. VOUT is programmed to a voltage greater than
VREF (equal to VREF x (1+R5/R6)) by an external resistor divider from VOUT to the VSENSE pin to reduce
the undershoot on VOUT during a low to high load
current transient. The overshoot during a high to low
load current transient is reduced by subtracting the
voltage that is on the DROOP pin from VREF. The
voltage on the IO pin is divided down with an external
PROGRAMMABLE SYNCHRONOUS
DC/DC HYSTERETIC CONTROLLER
FOR ADVANCED PROCESSORS
SC1154
FUNCTIONAL DESCRIPTION (cont.)
resistor divider, and connected to the DROOP pin.
Thus, under loaded conditions, VOUT is regulated to
Vout = Vref • (1+R7/R8) - IOUT • R2/(R1+R2).
Inhibit
The inhibit pin is a TTL compatible digital pin that is
used to enable the controller. When INH is low, the
output drivers are low, the soft start capacitor is discharged, the soft start current source is disabled, and
the controller is in a low I
the short across the soft start capacitor is removed, the
soft start current source is enabled, and normal converter operation begins. When the system logic supply
is connected to INH, it controls power sequencing by
locking out controller operation until the system logic
supply exceeds the input threshold voltage of the INH
circuit; thus the +12V supply and the system logic supply (either +5V or 3.3V) must be above UVLO thresholds before the controller is allowed to start up.
VIN
The VIN undervoltage lockout circuit disables the controller while the +12V supply is below the 10V start
threshold during power-up. While the controller is disabled, the output drivers will be low, the soft start capacitor will be shorted and the soft start current is disabled and the controller will be in a low I
VIN exceeds the start threshold, the short across the
soft start capacitor is removed, the soft start current
source is enabled and normal converter operation begins. There is a 2V hysteresis in the undervoltage
lockout circuit for noise immunity.
state. When INH goes high,
Q
state. When
Q
Thus these resistor values will determine the soft start
charging current. The maximum current that can be
sourced by REFB is 500µA.
Power Good
The power good circuit monitors for an undervoltage
condition on VOUT. If VSENSE is 7% (nominal) below
VREF, then the power good pin is pulled low. The
PWRGD pin is an open drain output.
Overvoltage Protection
The overvoltage protection circuit monitors VOUT for
an overvoltage condition. If VSENSE is 15% above
VREF, than a fault latch is set and both output drivers
are turned off. The latch will remain set until VIN goes
below the undervoltage lockout value. A 1ms deglitch
timer is included for noise immunity.
Overcurrent Protection
The overcurrent protection circuit monitors the current
through the high side FET. The overcurrent threshold
is adjustable with an external resistor divider between
IO and AGND, with the divider voltage connected to
the OCP pin. If the voltage on the OCP pin exceeds
100mV, then a fault latch is set and the output drivers
are turned off. The latch will remain set until VIN goes
below the undervoltage lockout value. A 1ms deglitch
timer is included for noise immunity. The OCP circuit
is also designed to protect the high side FET against a
short-to-ground fault on the terminal common to both
power FETs (VPHASE).
Drive Regulator
Soft Start
The drive regulator provides drive voltage to the low
side driver, and to the high side driver when the high
The soft start circuit controls the rate at which VOUT
powers up. A capacitor is connected between SS and
AGND and is charged by an internal current source.
side driver is configured as a floating driver. The minimum drive voltage is 7V. The minimum short circuit
current is 100mA.
The value of the current source is proportional to the
reference voltage so the charging rate of C
is also
SS
proportional to the reference voltage. By making the
charging current proportional to VREF, the power-up
time for VOUT will be independent of VREF. Thus, C
SS
can remain the same value for all VID settings. The
soft start charging current is determined by the following equation: I
SS
/5. Where I
REFB
is the current
REFB
= I
flowing out of the REFB pin. It is recommended that
no additional loads be connected to REFB, other than
the resistor divider for setting the hysteresis voltage.
3. Components connected to IOUT, DROOP, OCP, VHYST, VREFB, VSENSE, and SOFTST should be referenced to AGND.
4. The bypass capacitors C10 and C15 should be placed close to the IC and referenced to DRVGND.
5. Locate bootstrap capacitor C13 close to the IC.
6. Place bypass capacitor C14 close to Drain of the top FET and Source of the bottom FET to be effective.
7. Route HISENSE and LOSENSE close to each other to minimize induced differential mode noise.
8. Bypass a high frequency disturbance with ceramic capacitor at the point where HISENSE is connected to Vin.
9. Input bulk capacitors should placed as close as possible to the power FETs because of the very high ripple current flow in this pass.
10. If Schottky diode used in parallel with a synchronous (bottom) FET, to achieve a greater efficiency at lower
Vout settings, it needs to be placed next to the aforementioned FET in very close proximity.
11. Since the feedback path relies on the accurate sampling of the output ripple voltage, the best results can be
achieved by connecting the AGND to the ground side of the bulk output capacitors.
12. DRVGND pin should be tight to the main ground plane utilizing very low impedance connection, e.g., multiple
vias.
13. In order to prevent substrate glitching, a small (0.5A) Schottky diode should be placed in close proximity to the
chip with the cathode connected to BOOTLO and anode connected to DRVGND.