Datasheet S-AV37A Specification

S-AV37A

TOSHIBA RF POWER AMPLIFIER MODULE

S-AV37A

FM RF POWER AMPLIFIER MODULE FOR 32-W COMMERCIAL VHF RADIO APPLICATIONS

･Power Gain: 35 dB (Min.)
･Total Efficiency: 50% (Min.)

ABSOLUTE MAXIMUM RATINGS

CHARACTERISTICS SYMBOL TEST CONDITION RATING UNIT

Maximum Current IT 8 A

Power Supply Voltage VDD V

Control Voltage VGG 10.5 ≤ VDD ≤ 16.5 V, Pi = 10 mW 5.5 V

Instantaneous Output Power Pomax

Input Power Pi 10.5 ≤ VDD ≤ 16.5 V, VGG ≤ 5.5 V 20 mW

Operating Case Temperature T

Storage Temperature T

(Tc = 25°C, IT < 8 A,

= 0 V (GND), RF: none 16.5 V

GG

V

≤ 5.5 V, Pi = 10 mW, 10.5 ≤ V

GG

16.5V, within 2 seconds

c (opr)

mW (Note 2)

-40 to 110 °C

stg

10.5 ≤ V

≤ 16.5 V, VGG ≤ 5.5 V, Pi = 10

DD

ZG = ZL = 50

Note 1: The maximum ratings are the limits that must not be exceeded even for an instant, under worst possible

conditions. Exceeding the ratings may cause device damage, ignition, or deterioration. Therefore, when
designing the circuitry, derating factors should be applied so that the absolute maximum ratings are not
exceeded.

Note 2: The output power rating satisfies the range shown in Figures 1 and 2 according to the operating case

temperature. Ensure that the device should be operated within the specified operating range. The figures below
indicate the output power obtained 2 seconds after Po is generated.

Poma x-Tc

35

30

25

20

15

Pomax (W)

10

5

0

-30 -20 -10 0 10 20 30 40 50 60 70 80 90 100

*When the device is used at Tc =100°C, the output power rating is 24 W as shown in Figure 1. When the power
dissipation at Tc = 100°C exceeds the rating shown in Figure 2, the output derating is required to limit the dissipation
within the specified range.

Figure 1 Pomax-Tc

Tc (℃)

100

90

80

70

60

50

40

PDmax(W)

Power dissipation (PD)

30

PD = (VDD × IDD) – Po + Pi

20

10

0

-30 -20 -10 0 10 20 30 40 50 60 70 80 90 100

Note 3: The case temperature is monitored using the screw terminal blocks on the input side that are used for the

module implementation.

Note 4: To protect a device from being permanently damaged, the power-on sequence must be as follows (, while the

reversed order should be applied when turning off): 1. VDD, 2. Pi, 3. VGG

Ω

)

≤

DD

PDmax-Tc

Tc(℃)

45 W

-30 to 100 °C

Figure 2 PDmax-Tc

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PACKAGE OUTLINE

Unit: mm

① RF Input ② V
④ RF Outout ⑤ GROUND(FRANGE)

JEDEC —

JEITA —

TOSHIBA 5-32G

Weight: 35g

ELECTRICAL CHARACTERISTICS

③ VDD

GG

(Tc = 25℃,

S-AV37A

ZG = 50Ω)

CHARACTERISTICS SYMBOL TEST CONDITION MIN TYP. MAX UNIT

Frequency Range f

Output Power1 Po1 32 — — W

Power Gain1 Gp1 35 — — dB

Total Efficiency ηT 50 — — %

Input VSWR VSWRin — — 3.0 —

Second Harmonic 2nd HRM

Third Harmonic 3rd HRM — — -40 dB

Output Power2 Po2 20 — — W

Power Gain2 Gp2

Ruggedness —

Stability —

— 154 — 162 MHz

range

V

= 12.5 V

DD

= 5 V

V

GG

Pi = 10 mW

= 50 Ω

Z

L

— — -40 dB

= 10.5V、VGG = 5V

V

DD

Pi = 10mW、Z

10.5 V ≤ V

(VGG = V

Pi = 10 mW
P

= 32 W (Adjusted via VGG @ ZL = 50Ω)

o

VSWR LOAD 20: 1 ALL PHASE (@ 2 s)

10.5 V ≤ V

(VGG = V

Pi = 10 mW

≤ 32 W (Adjusted via VGG @ ZL = 50Ω)

P

o

VSWR LOAD 3: 1 ALL PHASE

= 50Ω

L

≤ 16.5 V, 0 V ≤ VGG ≤ V

DD

@ Po = 32 W)

GGajs

≤ 16.5 V, 0 V ≤ VGG ≤ V

DD

@ Po = 32W)

GGajs

33 — — dB

GGajs

No Damage —

GGajs

No spurious output

of -60 dB or greater

—

Note 5:The output power is intended to follow the rating provided in Figure 1 in Note 2.
Note 6: Stability

Measurements are performed under the conditions where VSWR is at 3:1 through all phases over the whole frequency
range, and they are guaranteed only under those conditions. Even though it is guaranteed to be stable where VSWR is
at 3:1, the VSWR load over the operating frequency should be designed to be 50 Ω .At the same time, ensure that the

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S-AV37A

VSWR load does not deviate much from 50Ω even for a moment, nor deviate even a little from 50Ω continually. The
S-AU82AL is not intended for such operations, and proper operation under such conditions is not guaranteed due to the
possibilities of heat generation in the module and its applications.

HANDLING PRECAUTIONS

･ Since this product has a protective cap, care should be taken to avoid applying an excessive impact and allowing

foreign objects to get inside when handling this product. Also, please do not remove a cap. If the cap is removed,
the foreign object inside the module or the applied impact may lead IC failure, causing smoke or ignition.

･ Since this product is structurally susceptible to static electricity, protections against the static electricity should be

applied to objects that may come in direct contact with devices, such as worktables, equipment, operators and
solder irons.

・This product is not designed nor intended to perform a continuous transmission for applications like a base station.

Please do not use this product for such applications, for the reliability cannot be guaranteed.

・This product is intended to be used for a single operation (single-device operation). A proper operation is not

guaranteed for a parallel operation. A parallel operation should be performed in accordance with your own good
judgment.

・Mounting method

・The flatness of a heat sink must not exceed 50 μm. If the flatness exceeds 50 μm, the device may experience

an unexpected stress that may lead to module breakdown due to damage or ignition in the substrate inside a
module and other module parts.

・Please apply thermal compound between a module and a heat sink to improve the adhesive property.
・Use a 4-mm diameter screw with the clamping screw torque of 1.2 to 1.5 Nm.
・Please solder the module leads after the screw is clamped.

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EQUIVALENT CIRCUIT

① Pi

Z

= 50 Ω

G

S-AV37A

Z

L

④ Po

= 50 Ω

TEST FIXTURE

② V

GG

C1

C2

L L

V

GG

V

DD

C1

C2

DD

③ V

C1: 10000 pF
C2: 10 μF
L: ϕ0.5-mm enamel wire, 4T, 3ID

⑤GROUND

（Flange）

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Ｓ－Ａ

３７

MARKING

S-AV37A

Product Number (without A)
This dot indicates that the actual product name is “S-AV37A.”
Alphanumeric characters: Date of manufacture

TOSHIBA

Ｖ

ＪＡＰＡＮ

Dot: Indicates that this product is manufactured by “TOSHIBA

COMPONENTS.”

Explanation of Lot No.

Month of manufacture: January to December are denoted by letters A to L respectively.
Year of manufacture: Last decimal digit of the year of manufacture

RESTRICTIONS ON PRODUCT USE

• The information contained herein is subject to change without notice.

20070701-EN

• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.

• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.

• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.

• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.

• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.

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