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Page 3
8-Bit CMOS Microcontroller C504
Advance Information
• Fully compatible to standard 8051 microcontroller
• Up to 40 MHz operating frequency
• 16 K×8 ROM (C504-2R only, optional ROM protection)
• 256×8 RAM
• 256×8 XRAM
• Four 8-bit ports, (2 ports with mixed analog/digital I/O capability)
• Three 16-bit timers/counters (timer 2 with up/down counter feature)
• Capture/compare unit for PWM signal generation and signal capturing
- 3-channel, 16-bit capture/compare unit
- 1-channel, 10-bit compare unit
• Compare unit
• USART
• 10-bit A/D Converter with 8 multiplexed inputs
• Twelve interrupt sources with two priority levels
• On-chip emulation support logic (Enhanced Hooks Technology
TM
)
• Programmable 15-bit Watchdog Timer
• Oscillator Watchdog
• Fast Power On Reset
• Power Saving Modes
• M-QFP-44 package
• Temperature ranges: SAB-C504T
SAF-C504TA : – 40 to 85°C
SAH-C504TA : – 40 to 110°C (max. operating frequency.: TBD)
SAK-C504TA : – 40 to 125°C (max. operating frequency.: 12 MHz)
: 0 to 70°C
A
Semiconductor Group305.96
Page 4
C504
The C504 with its capture compare unit (CCU) especially provides a functionality, which allows to
use the microcontroller in motor control applications. Further, the C504 is functionally upward
compatible with the SAB 80C52/C501 microcontroller and can replace it in existing applications.
The C504-2R contains a non-volatile 16K×8 read-only program memory, a volatile on-chip 512×8
read/write data memory, four 8-bit wide ports, three 16-bit timers/counters, a 16-bit capture/
compare unit with compare timer, a 10-bit compare timer, a twelve source, two priority level interrupt
structure, a serial port, versatile fail save mechanisms, on-chip emulation support logic, and a
genuine 10-bit A/D converter. The C504-L is identical to the C504-2R, except that it lacks the
program memory on chip. Therefore, the term C504 refers to all versions within this data sheet
unless otherwise noted.
Ordering Information
TypeOrdering CodePackageDescription
(8-Bit CMOS microcontroller)
SAB-C504-LMQ67120-C1048P-MQFP-44 for external memory (12 MHz)
SAB-C504-L24MQ67120-C1049P-MQFP-44 for external memory (24 MHz)
SAB-C504-L40MQ67120-C1050P-MQFP-44 for external memory (40 MHz)
SAB-C504-2RMQ67120-DXXXXP-MQFP-44 with mask-programmable ROM (12 MHz)
SAB-C504-2R24MQ67120-DXXXXP-MQFP-44 with mask-programmable ROM (24 MHz)
SAB-C504-2R40MQ67120-DXXXXP-MQFP-44 with mask-programmable ROM (40 MHz)
Note: Versions for extended temperature ranges – 40 ˚C to 110 ˚C (SAH-C504) and – 40 ˚C to
125 ˚C (SAK-C504) are available on request.
The ordering number of ROM types (DXXXX extensions) is defined after program release
(verification) of the customer.
Semiconductor Group4
Page 5
C504
Figure 1
Logic Symbol
Semiconductor Group5
Page 6
C504
Figure 2
Pin Configuration (top view)
Semiconductor Group6
Page 7
Table 1
Pin Definitions and Functions
C504
SymbolPin Number
(P-MQFP-44)
P1.0-P1.740-44,
1-3
40
41
42
43
44
1
2
3
I/O
Function
*)
I/OPort 1
is an 8-bit bidirectional port. Port pins can be used for
digital input/output. P1.0 - P1.3 can also be used as analog
inputs of the A/D-converter. As secondary digital functions,
port 1 contains the timer 2 pins and the capture/compare
inputs/outputs. Port 1 pins are assigned to be used as
analog inputs via the register P1ANA.
The functions are assigned to the pins of port 1 as follows:
P1.0 / AN0 / T2Analog input channel 0 /
P1.1 / AN1 / T2EXAnalog input channel 1 /
P1.2 / AN2 / CC0Analog input channel 2 /
P1.3 / AN3 / COUT0Analog input channel 3 /
P1.4 / CC1Input/output of capture/compare
P1.5 / COUT1Output of capture/compare
P1.6 / CC2Input/output of capture/compare
P1.7 / COUT2Output of capture/compare
input to counter 2
capture/reload trigger of timer 2 /
up-down count
input/output of capture/compare
channel 0
output of capture/compare
channel 0
channel 1
channel 1
channel 2
channel 2
RESET4IRESET
A high level on this pin for one machine cycle while the
oscillator is running resets the device. An internal diffused
resistor to VSS permits power-on reset using only an
external capacitor to VCC.
*)I = Input
O = Output
Semiconductor Group7
Page 8
Table 1
Pin Definitions and Functions (cont’d)
C504
SymbolPin Number
(P-MQFP-44)
P3.0-P3.75, 7-13
5
7
8
9
10
11
12
13
I/O
Function
*)
I/OPort 3
is an 8-bit bidirectional port. P3.0 (R×D) and P3.1 (T×D)
operate as defined for the C501. P3.2 to P3.7 contain the
external interrupt inputs, timer inputs, input and as an
additional optinal function four of the analog inputs of the
A/D-converter. Port 3 pins are assigned to be used as
analog inputs via the bits of SFR P3ANA.
P3.6/WR can be assigned as a third interrupt input. The
functions are assigned to the pins of port 3 as follows:
P3.0 / RxDReceiver data input (asynch.) or data
P3.6 / WR / INT2WR control output; latches the data
P3.7 / RDRD control output; enables the
input/output (synch.) of serial
interface
clock output (synch.) of serial
interface
interrupt 0 input / timer 0 gate control
input
interrupt 1 input / timer 1 gate control
input
counter input
counter input
byte from port 0 into the external data
memory /
external interrupt 2 input
external data memory
CTRAP6ICCU Trap Input
With CTRAP = low the compare outputs of the CAPCOM
unit are switched to the logic level as defined in the COINI
register (if they are enabled by the bits in SFR TRCON).
CTRAP is an input pin with an internal pullup resistor. For
power saving reasons, the signal source which drives the
CTRAP input should be at high or floating level during
power-down mode.
*)I = Input
O = Output
Semiconductor Group8
Page 9
Table 1
Pin Definitions and Functions (cont’d)
C504
SymbolPin Number
(P-MQFP-44)
I/O
*)
Function
XTAL214–XTAL2
Output of the inverting oscillator amplifier.
XTAL115–XTAL1
Input to the inverting oscillator amplifier and input to the
internal clock generator circuits.
To drive the device from an external clock source, XTAL1
should be driven, while XTAL2 is left unconnected. There
are no requirements on the duty cycle of the external clock
signal, since the input to the internal clocking circuitry is
divided down by a divide-by-two flip-flop. Minimum and
maximum high and low times as well as rise/fall times
specified in the AC characteristics must be observed.
P2.0-P2.718-25I/OPort 2
is a bidirectional I/O port with internal pullup resistors. Port
2 pins that have 1s written to them are pulled high by the
internal pullup resistors, and in that state can be used as
inputs. As inputs, port 2 pins being externally pulled low
will source current (
of the internal pullup resistors. Port 2 emits the high-order
address byte during fetches from external program
memory and during accesses to external data memory that
use 16-bit addresses (MOVX @DPTR). In this application
it uses strong internal pullup resistors when issuing 1s.
During accesses to external data memory that use 8-bit
addresses (MOVX @Ri), port 2 issues the contents of the
P2 special function register.
I
, in the DC characteris-tics) because
IL
PSEN26OThe Program Store Enable
output is a control signal that enables the external program
memory to the bus during external fetch operations. It is
activated every six oscillator periodes except during
external data memory accesses. Remains high during
internal program execution.
ALE27OThe Address Latch Enable
output is used for latching the low-byte of the address into
external memory during normal operation. It is activated
every six oscillator periodes except during an external data
memory access. When instructions are executed from
internal ROM (
EA=1) the ALE generation can be disabled
by bit EALE in SFR SYSCON.
*)I = Input
O = Output
Semiconductor Group9
Page 10
Table 1
Pin Definitions and Functions (cont’d)
C504
SymbolPin Number
(P-MQFP-44)
I/O
*)
Function
COUT328O10-Bit compare channel output
This pin is used for the output signal of the 10-bit compare
timer 2 unit. COUT3 can be disabled and set to a high or
low state.
EA29IExternal Access Enable
When held at high level, instructions are fetched from the
internal ROM (C504-2R only) when the PC is less than
4000H.When held at low level, the C504 fetches all
instructions from external program memory.
For the C504-L this pin must be tied low.
P0.0-P0.737-30I/OPort 0
is an 8-bit open-drain bidirectional I/O port. Port 0 pins that
have 1s written to them float, and in that state can be used
as high-impendance inputs.Port 0 is also the multiplexed
low-order address and data bus during accesses to
external program or data memory. In this application it
uses strong internal pullup resistors when issuing 1 s.
Port 0 also outputs the code bytes during program
verification in the C504-2R. External pullup resistors are
required during program (ROM) verification.
V
AREF
V
AGND
V
SS
V
CC
*)I = Input
O = Output
38–Reference voltage for the A/D converter.
39–Reference ground for the A/D converter.
16–Ground (0V)
17–Power Supply (+5V)
Semiconductor Group10
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C504
Functional Description
The C504 basic architecture is fully compatible to the standard 8051 microcontroller family. While
maintaining all architectural and operational characteristics of the SAB 80C52 / C501, the C504
incorporates some enhancements such as on-chip XRAM, A/D converter, fail save mechanisms,
and a versatile capture/compare unit.
Figure 3 shows a block diagram of the C504.
Figure 3
Block Diagram of the C504
Semiconductor Group11
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C504
CPU
The C504 is efficient both as a controller and as an arithmetic processor. It has extensive facilities
for binary and BCD arithmetic and excels in its bit-handling capabilities. Efficient use of program
memory results from an instruction set consisting of 44 % one-byte, 41 % two-byte, and 15 % threebyte instructions. With a 12 MHz crystal, 58 % of the instructions are executed in 1.0µs (24 MHz:
500 ns, 40 MHz : 300 ns).
Special Function Register PSW (Address D0H)Reset Value : 00
Bit No.MSBLSB
D7
H
BitFunction
CYCarry Flag
ACAuxiliary Carry Flag
F0General Purpose Flag
RS1
RS0
CYAC
D6
H
Used by arithmetic instruction.
Used by instructions which execute BCD operations.
Register Bank select control bits
These bits are used to select one of the four register banks.
RS1RS0Function
H
D5
F0
H
D4
RS1RS0OVF1PD0
H
D3
H
D2
H
D1
H
D0
H
PSW
H
00Bank 0 selected, data address 00H-07
01Bank 1 selected, data address 08H-0F
10Bank 2 selected, data address 10H-17
11Bank 3 selected, data address 18H-1F
OVOverflow Flag
Used by arithmetic instruction.
F1General Purpose Flag
PParity Flag
Set/cleared by hardware after each instruction to indicate an odd/even
number of "one" bits in the accumulator, i.e. even parity.
Semiconductor Group12
H
H
H
H
Page 13
Memory Organization
The C504 CPU manipulates operands in the following four address spaces:
– up to 64 Kbyte of external program memory
– up to 64 Kbyte of external data memory
– 256 bytes of internal data memory
– 256 bytes of internal XRAM data memory
– a 128 byte special function register area
Figure 4 illustrates the memory address spaces of the C504.
C504
Figure 4
C504 Memory Map
The XRAM in the C504 is a memory area that is logically located at the upper end of the external
memory space, but is integrated on the chip. Because the XRAM is used in the same way as
external data memory the same instruction types (MOVX instructions) must be used for accessing
the XRAM. The XRAM can be enabled and disabled by the XMAP bit in the SYSCON register.
ROM Protection
The C504-2R ROM version allows to protect the content of the internal ROM against read out by
non authorized people. The type of ROM protection (protected or unprotected) is fixed with the
ROM mask. Therefore, the customer of a C504-2R ROM version has to define whether ROM
protection has to be selected or not.
Semiconductor Group13
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C504
Special Function Registers
All registers, except the program counter and the four general purpose register banks, reside in the
special function register area.
The 63 special function register (SFR) include pointers and registers that provide an interface
between the CPU and the other on-chip peripherals. There are also 128 directly addressable bits
within the SFR area.
The SFRs of the C504 are listed in table 2 and table 3. In table 2 they are organized in groups
which refer to the functional blocks of the C504. Table 3 illustrates the contents of the SFRs in
numeric order of their addresses.
Semiconductor Group14
Page 15
C504
Table 2
Special Function Registers - Functional Blocks
BlockSymbolNameAddressContents after
Reset
CPUACC
B
DPH
DPL
PSW
SP
SYSCON
Interrupt
System
IEN0
IEN1
CCIE
IP0
IP1
ITCON
PortsP0
P1
P1ANA
P2
P3
P3ANA
A/DConverter
ADCON0
ADCON1
ADDATH
ADDATL
P1ANA
P3ANA
Serial
Channels
PCON
SBUF
SCON
Timer 0/
Timer 1
TCON
TH0
TH1
TL0
TL1
TMOD
1) Bit-addressable special function registers
2) This special function register is listed repeatedly since some bits of it also belong to other functional blocks.
3) X means that the value is undefined and the location is reserved
4) SFR is located in the mapped SFR area. For accessing this SFR, bit RMAP in SFR SYSCON must be set.
Accumulator
B-Register
Data Pointer, High Byte
Data Pointer, Low Byte
Program Status Word Register
Stack Pointer
System Control Register
Timer / Counter 0 and 1
Timer/Counter 0 and 1 can be used in four operating modes as listed in table 4.
Table 4
Timer/Counter 0 and 1 Operating Modes
ModeDescriptionTMODInput Clock
C504
TM1M0internalexternal (max)
f
OSC/12 × 32
f
OSC/24 × 32
08-bit timer/counter with a
GateC/
XX00
divide-by-32 prescaler
116-bit timer/counterXX11f
28-bit timer/counter with
XX00f
OSC/12
OSC/12
f
OSC/24
f
OSC/24
8-bit autoreload
3Timer/counter 0 used as one
XX11f
OSC/12
f
OSC/24
8-bit timer/counter and one
8-bit timer
Timer 1 stops
In the “timer” function (C/T = ‘0’) the register is incremented every machine cycle. Therefore the
count rate is f
OSC
/12.
In the “counter” function the register is incremented in response to a 1-to-0 transition at its
corresponding external input pin (P3.4/T0, P3.5/T1). Since it takes two machine cycles to detect a
falling edge the max. count rate is f
/24. External inputs INT0 and INT1 (P3.2, P3.3) can be
OSC
programmed to function as a gate to facilitate pulse width measurements. Figure 5 illustrates the
input clock logic.
Figure 5
Timer/Counter 0 and 1 Input Clock Logic
Semiconductor Group20
Page 21
C504
Timer 2
Timer 2 is a 16-bit Timer/Counter with an up/down count feature. It can operate either as timer or as
an event counter which is selected by bit C/T2 (T2CON.1). It has three operating modes as shown
in table 5.
interrupt
request (TF2)
extra external
interrupt
(“Timer 2”)
Input Clock
f
/12
OSC
f
/12
OSC
f
/2
OSC
external
(P1.0/T2)
max
f
/24
OSC
max
f
/24
OSC
max
f
/24
OSC
offXX0XXXTimer 2 stops––
Note: ↓ = falling edge
Semiconductor Group21
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C504
Capture/Compare Unit
The Capture / Compare Unit (CCU) of the C504 is built up by a 16-bit 3-channel capture/compare
unit (CAPCOM) and a 10-bit 1-channel compare unit (COMP). In compare mode, the CAPCOM unit
provides two output signals per channel, which can have inverted signal polarity and nonoverlapping pulse transitions. The COMP unit can generate a single PWM output signal and is
further used to modulate the CAPCOM output signals. In capture mode, the value of the compare
timer 1 is stored in the capture registers if a signal transition occurs at the pins CCx. Figure 6 shows
the block diagram of the CCU.
Figure 6
Block Diagram of the CCU
Semiconductor Group22
Page 23
C504
The compare timer 1 and 2 are free running, processor clock coupled 16-bit / 10-bit timers which
have each a count rate with a maximum of
its possible compare output signal waveforms are shown in figure 7.
f
OSC
/2 up to
f
/256. The compare timer operations with
OSC
Figure 7
Basic Operating Modes of the CAPCOM Unit
Compare timer 1 runs only in operating mode 1 with one output signal of selectable signal polarity
at the pin COUT3.
Semiconductor Group23
Page 24
C504
Serial Interface (USART)
The serial port is full duplex and can operate in four modes (one synchronous mode, three
asynchronous modes) as illustrated in table 6. The possible baudrates can be calculated using the
formulas given in table 6.
Table 6
USART Operating Modes
Mode
SCONBaudrateDescription
SM0SM1
000
f
/12Serial data enters and exits through R×D.
OSC
T×D outputs the shift clock. 8-bit are
transmitted/received (LSB first)
101Timer 1/2 overflow rate8-bit UART
10 bits are transmitted (through T×D) or
received (R×D)
210
OSC
/32 or f
/649-bit UART
OSC
f
11 bits are transmitted (T×D) or
received (R×D)
311Timer 1/2 overflow rate9-bit UART
Like mode 2 except the variable baud rate
Figure 8
Block Diagram of Baud Rate Generation for the Serial Interface
Semiconductor Group24
Page 25
The possible baudrates can be calculated using the formulas given in table 7.
Table 7
Formulas for Calculating Baudrates
C504
Baud Rate
derived from
Oscillator0
Timer 1 (16-bit timer)
(8-bit timer with
8-bit autoreload)
Timer 21,3
Interface ModeBaudrate
f
/12
OSC
SMOD
2
1,3
1,3
(2
SMOD
× timer 1 overflow rate) /32
× f
OSC
/ (32 × (65536-(RC2H, RC2L))
(2
(2
SMOD
f
OSC
× f
OSC
) / (32 × 12 × (256-TH1))
) / 64
Semiconductor Group25
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C504
10-Bit A/D Converter
The C504 has a high performance 10-bit A/D converter (figure 9) with 8 inputs included which uses
successive approximation technique for the conversion of analog input voltages.
Figure 9
A/D Converter Block Diagram
Semiconductor Group26
Page 27
C504
The A/D converter uses two clock signals for operation : the conversion clock f
the input clock fIN (= 1/ tIN). Both clock signals are derived from the C504 system clock f
is applied at the XTAL pins. The duration of an A/D conversion is a multiple of the period of the f
ADC
(= 1/ t
ADC
OSC
) and
which
IN
clock signal. The table in figure 10 shows the prescaler ratios and the resulting A/D conversion
times which must be selected for typical system clock rates.
MCU System Clock
Rate (f
OSC
)
3.5 MHz1.75÷ 400.43848 x t
12 MHz6÷ 4001.548 x t
16 MHz8÷ 400248 x t
24 MHz12÷ 8011.596 x t
32 MHz16÷ 801296 x t
40 MHz20÷ 16101.25192 x t
f
IN
[MHz]
Prescalerf
RatioADCL1ADCL0
ADC
[MHz]
A/D Conversion
Time [µs]
= 27.4
IN
= 8
IN
= 6
IN
= 8
IN
= 6
IN
= 9.6
IN
Figure 10
A/D Converter Clock Selection
The analog inputs are located at port 1 and port 3 (4 lines on each port). The corresponding port 1
and port 3 pins have a port structure, which allows to use it either as digital I/Os or analog inputs.
The analog input function of these mixed digital/analog port lines is selected via the registers
P1ANA and P3ANA.
Semiconductor Group27
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C504
Interrupt System
The C504 provides 12 interrupt sources with two priority levels. Figure 11 and 12 give a general
overview of the interrupt sources and illustrate the interrupt request and control flags.
Figure 11
Interrupt Request Sources (Part 1)
Semiconductor Group28
Page 29
C504
Figure 12
Interrupt Request Sources (Part 2)
Semiconductor Group29
Page 30
Table 8
Interrupt Vector Addresses
Request FlagsInterrupt SourceVector Address
C504
IE0
TF0
IE1
TF1
RI + TI
TF2 + EXF2
IADC
IE2
TRF, BCERR
CT2P
CC0F-CC2F, CC0R-CC2R
CT1FP, CT1FC
–
A low-priority interrupt can itself be interrupted by a high-priority interrupt, but not by another lowpriority interrupt. A high-priority interrupt cannot be interrupted by any other interrupt source.
If two requests of different priority level are received simultaneously, the request of higher priority is
serviced. If requests of the same priority are received simultaneously, an internal polling sequence
determines which request is serviced. Thus within each priority level there is a second priority
structure determined by the polling sequence as shown in table 9.
The watchdog timer in the C504 is a 15-bit timer, which is incremented by a count rate of either f
12 or f
/32. From the 15-bit watchdog timer count value only the upper 7 bits can be
CYCLE
programmed. Figure 5 shows the block diagram of the programmable watchdog timer.
SOC
/
Figure 13
Block Diagram of the Programmable Watchdog Timer
The watchdog timer can be started by software (bit SWDT in SFR WDCON), but it cannot be
stopped during active mode of the device. If the software fails to refresh the running watchdog timer
an internal reset will be initiated. The reset cause (external reset or reset caused by the watchdog)
can be examined by software (status flag WDTS in WDCON is set). A refresh of the watchdog timer
is done by setting bits WDT (SFR WDCON) and SWDT consecutively. This double instruction
sequence has been implemented to increase system security.
It must be noted, however, that the watchdog timer is halted during the idle mode and power down
mode of the processor. Therefore, it is possible to use the idle mode in combination with the
watchdog timer function.
Semiconductor Group31
Page 32
Oscillator Watchdog
The oscillator watchdog of the C504 serves for three functions :
– Monitoring of the on-chip oscillator's function
The watchdog supervises the on-chip oscillator's frequency; if it is lower than the frequency
of an auxiliary RC oscillator, the internal clock is supplied by this RC oscillator and the C504
is put into reset state; if the failure condition again disappears, the part executes a final reset
phase of typ. 1 ms in order to allow the oscillator to stabilize; then the oscillator watchdog reset
is released and the part starts program execution again.
– Fast internal reset after power-on
The oscillator watchdog unit provides a clock supply for the reset before the on-chip oscillator
has started. The oscillator watchdog unit also works identically to the monitoring function.
– Control of external wake-up from software power-down mode
When the power-down mode is left by a low level at the INT0 pin, the oscillator watchdog unit
assures that the microcontroller resumes operation (execution of the power-down wake-up
interrupt) with the nominal clock rate. In the power-down mode the RC oscillator and the onchip oscillator are stopped. Both oscillators are started again when power-down mode is
released. When the on-chip oscillator has a higher frequency than the RC oscillator, the
microcontroller starts operation after a final delay of typ. 1 ms in order to allow the on-chip
oscillator to stabilize.
C504
Figure 14
Block Diagram of the Programmable Watchdog Timer
Semiconductor Group32
Page 33
Power Saving Modes
Two power down modes are available, the idle mode and power down mode.
– In the idle mode the oscillator of the C504 continues to run, but the CPU is gated off from the
clock signal. However, the interrupt system, the serial port, the A/D converter, and all timers
with the exception of the watchdog timer are further provided with the clock. The CPU status
is preserved in its entirety: the stack pointer, program counter, program status word,
accumulator, and all other registers maintain their data during idle mode.
– In the power down mode, the RC oscillator and the on-chip oscillator which operates with the
XTAL pins is stopped. Therefore all functions of the microcontroller are stopped and only the
contents of the on-chip RAM, XRAM and the SFR's are maintained. The port pins, which are
controlled by their port latches, output the values that are held by their SFR's.
Table 10 gives a general overview of the power saving modes.
Table 10
Power Saving Modes Overview
C504
ModeEntering
Leaving byRemarks
2-Instruction
Example
Idle modeORL PCON, #01H
ORL PCON, #20H
Ocurrence of an
interrupt from a
peripheral unit
Hardware Reset
CPU clock is stopped;
CPU maintains their data;
peripheral units are active (if
enabled) and provided with
clock
Power-Down
Mode
ORL PCON, #02H
ORL PCON, #40H
Hardware ResetOscillator is stopped;
Wake-up from power
down
contents of on-chip RAM and
SFR’s are maintained;
In the power down mode of operation, VCC can be reduced to minimize power consumption. It must
be ensured, however, that VCC is not reduced before the power down mode is invoked, and that V
CC
is restored to its normal operating level, before the power down mode is terminated.
The idle mode can be terminated by activating any enabled peripheral interrupt or by resetting the
C504. The power down mode can be terminated using an interrupt by a short low pulse at the pin
P3.2/AN4/INT0 or by resetting the C504. If a power saving mode is left through an interrupt, the
microcontroller state (CPU, ports, peripherals) remains preserved. If a power saving mode is left by
a reset operation, the microcontroller state is disturbed and replaced by the reset state of the C504.
Semiconductor Group33
Page 34
C504
Absolute Maximum Ratings
Ambient temperature under bias (TA) .............................................................. 0˚C to + 70 ˚C
Storage temperature (TST)................................................................................– 65 ˚C to + 150 ˚C
Voltage on VCC pins with respect to ground (VSS) ............................................– 0.5 V to 6.5 V
Voltage on any pin with respect to ground (VSS)..............................................– 0.5 V to VCC + 0.5 V
Input current on any pin during overload condition..........................................– 10 mA to + 10 mA
Absolute sum of all input currents during overload condition ..........................| 100 mA |
Power dissipation.............................................................................................TBD
Note:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent
damage of the device. This is a stress rating only and functional operation of the device at
these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for longer
periods may affect device reliability. During overload conditions (
Voltage on
V
pins with respect to ground (
CC
V
) must not exceed the values defined by the
SS
absolute maximum ratings.
V
>
V
or
V
<
V
IN
CC
IN
) the
SS
Semiconductor Group34
Page 35
C504
DC Characteristics
V
= 5 V + 10%, – 15%; VSS=0VTA= 0 to 70 °Cfor the SAB-C504
CC
T
= – 40 to 85 °Cfor the SAF-C504
A
T
= – 40 to 110 °Cfor the SAH-C504
A
T
= – 40 to 125 °Cfor the SAK-C504
A
ParameterSymbolLimit ValuesUnitTest Condition
min.max.
Input low voltage (except
EA,
RESET, CTRAP)
Input low voltage (
EA)V
Input low voltage (RESET,
CTRAP)
Input high voltage (except XTAL1,
RESET and
CTRAP)
Input high voltage to XTAL1
Input high voltage to RESET and
CTRAP
Output low voltage (ports 1, 2, 3,
COUT3)
Output low voltage (port 0, ALE,
PSEN)
Output high voltage (ports 1, 2, 3)V
Output high voltage (ports 1,3 pins
in push-pull mode and COUT3)
V
IL
– 0.50.2 VCC –
V–
0.1
IL1
– 0.50.2 VCC –
V–
0.3
V
IL2
– 0.50.2 VCC +
V–
0.1
V
IH
0.2 VCC+
V
+ 0.5V–
CC
0.9
V
IH1
V
IH2
V
OL
V
OL1
OH
V
OH1
0.7 V
0.6 V
CC
CC
V
+ 0.5V–
CC
V
+ 0.5V–
CC
–0.45VIOL= 1.6 mA
–0.45VIOL= 3.2 mA
2.4
0.9 V
0.9 V
CC
CC
–
–
–VI
VIOH=–80µA,
I
=–10µA
OH
= – 800 µA
OH
1)
1)
Output high voltage (port 0 in
external bus mode, ALE,
PSEN)
Logic 0 input current (ports 1, 2, 3) I
Logical 1-to-0 transition current
1) Capacitive loading on ports 0 and 2 may cause spurious noise pulses to be superimposed on the VOL of ALE
and port 3. The noise is due to external bus capacitance discharging into the port 0 and port 2 pins when these
pins make 1-to-0 transitions during bus operation. In the worst case (capacitive loading > 100 pF), the noise
pulse on ALE line may exceed 0.8 V. In such cases it may be desirable to qualify ALE with a schmitt-trigger,
or use an address latch with a schmitt-trigger strobe input.
16
8
25
13
38
17
1
max.
TBD
TBD
TBD
TBD
TBD
TBD
50
mA
mA
mA
mA
mA
mA
µA
V
=5V,
CC
V
=5V,
CC
V
=5V,
CC
V
=5V,
CC
V
=5V,
CC
V
=5V,
CC
V
=2…5.5 V
CC
4)
5)
4)
5)
4)
5)
3)
V
2) Capacitive loading on ports 0 and 2 may cause the
V
0.9
specification when the address lines are stabilizing.
CC
on ALE and PSEN to momentarily fall below the
OH
3) IPD (power-down mode) is measured under following conditions:
is the oscillator frequency in MHz. ICC values are given in mA and measured at VCC=5V.
osc
7) Overload conditions occur if the standard operating conditions are exceeded, i.e. the voltage on any pin
exceeds the specified range (i.e.
> VCC+ 0.5 V or VOV< V
OV
– 0.5 V). The supply voltage V
SS
and V
CC
SS
V
must remain within the specified limits. The absolute sum of input currents on all port pins may not exceed 50
mA.
8) Not 100 % tested, guaranteed by design characterization.
I
9) The typical
values are periodically measured at TA= +25 ˚C but not 100% tested.
CC
Semiconductor Group36
Page 37
A/D Converter Characteristics
V
= 5 V + 10%, – 15%; VSS=0VTA= 0 to 70 °Cfor the SAB-C504
CC
4V ≤ V
V
– 0.1 V ≤ V
SS
AREF
≤ V
+ 0.1 V;TA= – 40 to 85 °Cfor the SAF-C504
CC
≤ V
AGND
+ 0.2 V;TA= – 40 to 110 °Cfor the SAH-C504
SS
T
= – 40 to 125 °Cfor the SAK-C504
A
ParameterSymbolLimit ValuesUnitTest Condition
min.max.
Analog input voltage
Sample timet
Conversion cycle timet
Total unadjusted errorT
V
AIN
S
ADCC
UE
V
AGND
–64 x t
–384 x t
V
AREF
32 x t
16 x t
8 x t
IN
192 x t
96 x t
48 x t
V
nsPrescaler ÷ 32
IN
IN
IN
nsPrescaler ÷ 32
IN
IN
IN
IN
–± 2LSBVSS+ 0.5V ≤ VIN≤ VCC– 0.5V
1)
Prescaler ÷ 16
Prescaler ÷ 8
Prescaler ÷ 4
Prescaler ÷ 16
Prescaler ÷ 8
Prescaler ÷ 4
–± 4LSBVSS < VIN < VSS+ 0.5V
VCC– 0.5V < VIN < V
Internal resistance of
reference voltage source
Internal resistance of
analog source
ADC input capacitanceC
R
R
AREF
ASRC
AIN
–t
ADC
/ 250
kΩ
t
ADC
– 0.25
t
–tS / 500
kΩ
in [ns]
S
– 0.25
–50pF
6)
in [ns]
5) 6)
2) 6)
C504
2)
3)
4)
CC
4)
Notes see next page.
Clock calculation table :
Clock Prescaler
ADCL1, 0t
ADC
t
S
Ratio
÷ 32 1 132 x t
÷ 16 1 016 x t
÷ 8 0 18 x t
÷ 4 0 04 x t
Further timing conditions : t
min = 500 ns
ADC
tIN = 2 / f
IN
IN
OSC
IN
IN
64 x t
32 x t
16 x t
8 x t
= 2 t
IN
CLCL
Semiconductor Group37
IN
IN
IN
t
ADCC
384 x t
192 x t
96 x t
48 x t
IN
IN
IN
IN
Page 38
Notes:
1) V
may exceed V
AIN
these cases will be X000
2) During the sample time the input capacitance C
or V
AGND
AREF
or X3FFH, respectively.
H
up to the absolute maximum ratings. However, the conversion result in
can be charged/discharged by the external source. The
AIN
internal resistance of the analog source must allow the capacitance to reach their final voltage level within t
After the end of the sample time t
, changes of the analog input voltage have no effect on the conversion
S
result.
C504
S
.
3) This parameter includes the sample time t
calibration. Values for the conversion clock t
, the time for determining the digital result and the time for the
S
depend on programming and can be taken from the table on
ADC
the previous page.
4) T
is tested at V
UE
AREF
= 5.0 V, V
= 0 V, VCC = 4.9 V. It is guaranteed by design characterization for all
AGND
other voltages within the defined voltage range.
If an overload condition occurs on maximum 2 not selected analog input pins and the absolute sum of input
overload currents on all analog input pins does not exceed 10 mA, an additional conversion error of 1/2 LSB
is permissible.
5) During the conversion the ADC’s capacitance must be repeatedly charged or discharged. The internal
resistance of the reference source must allow the capacitance to reach their final voltage level within the
indicated time. The maximum internal resistance results from the programmed conversion timing.
6) Not 100 % tested, but guaranteed by design characterization.
Semiconductor Group38
Page 39
C504
AC Characteristics for C504-L / C504-2R
V
= 5 V + 10%, – 15%; VSS=0VTA= 0 to 70 °Cfor the SAB-C504
CC
T
= – 40 to 85 °Cfor the SAF-C504
A
T
= – 40 to 110 °Cfor the SAH-C504
A
T
= – 40 to 125 °Cfor the SAK-C504
A
(CL for port 0, ALE and PSEN outputs = 100 pF; CL for all other outputs = 80 pF)
Program Memory Characteristics
ParameterSymbolLimit ValuesUnit
12-MHz clockVariable Clock
t
1/
min.max.min.max.
= 3.5 MHz to
CLCL
12 MHz
ALE pulse width
Address setup to ALE
Address hold after ALE
ALE low to valid instr in
ALE to
PSENt
PSEN pulse widtht
PSEN to valid instr int
Input instruction hold after
Input instruction float after
Address valid after
PSENt
PSENt
PSENt
Address to valid instr in
Address float to
*)
Interfacing the C504 to devices with float times up to 75 ns is permissible. This limited bus contention will not
cause any damage to port 0 drivers.
PSENt
t
LHLL
t
AVLL
t
LLAX
t
LLIV
LLPL
PLPH
PLIV
PXIX
PXIZ
PXAV
t
AVIV
AZPL
127–2t
43–t
30–t
–233–4t
58–t
215–3t
–150–3t
–40–ns
CLCL
–40–ns
CLCL
–23–ns
CLCL
– 100 ns
CLCL
–25–ns
CLCL
–35–ns
CLCL
– 100 ns
CLCL
0–0–ns
*)
–63–t
*)
75–t
–8–ns
CLCL
–302–5t
–20ns
CLCL
– 115 ns
CLCL
0–0–ns
Semiconductor Group39
Page 40
C504
AC Characteristics for C504-L / C504-2R (cont’d)
External Data Memory Characteristics
ParameterSymbolLimit ValuesUnit
12-MHz clockVariable Clock
1/
t
= 3.5 MHz to
CLCL
12 MHz
min.max.min.max.
RD pulse width
WR pulse width
Address hold after ALE
RD to valid data in
Data hold after
Data float after
RD
RD
ALE to valid data in
Address to valid data in
ALE to
Address valid to
WR or RD
WR or RD
WR or RD high to ALE high
Data valid to
Data setup before
Data hold after
Address float after
Oscillator period
High time
Low time
Rise time
Fall time
t
CLCL
t
CHCX
t
CLCX
t
CLCH
t
CHCL
25294ns
10t
10t
CLCL
CLCL
– t
– t
CLCX
CHCX
ns
ns
–10ns
–10ns
Semiconductor Group44
Page 45
C504
Figure 15
Program Memory Read Cycle
Figure 16
Data Memory Read Cycle
Semiconductor Group45
Page 46
C504
Figure 17
Data Memory Write Cycle
Figure 18
External Clock Cycle
Semiconductor Group46
Page 47
C504
ROM Verification Characteristics for C504-2R
ROM Verification Mode 1
ParameterSymbolLimit ValuesUnit
min.max.
Address to valid data
ENABLE to valid data
Data float after ENABLE
Oscillator frequency
t
AVQV
t
ELQV
t
EHQZ
1/
t
CLCL
–48t
–48t
048t
CLCL
CLCL
CLCL
ns
ns
ns
46MHz
Figure 19
ROM Verification Mode 1
Semiconductor Group47
Page 48
C504
ROM Verification Mode 2
ParameterSymbolLimit ValuesUnit
min.typmax.
ALE pulse width
ALE period
Data valid after ALE
Data stable after ALE
P3.5 setup to ALE low
Oscillator frequency
t
AWD
t
ACY
t
DVA
t
DSA
t
AS
1/
t
CLCL
–2t
–12t
CLCL
CLCL
––4t
8 t
CLCL
–t
––ns
CLCL
–ns
–ns
CLCL
ns
–ns
4–6MHz
Figure 20
ROM Verification Mode 2
Semiconductor Group48
Page 49
AC Inputs during testing are driven at VCC– 0.5 V for a logic ’1’ and 0.45 V for a logic ’0’.
Timing measurements are made at V
for a logic ’1’ and V
IHmin
for a logic ’0’.
ILmax
Figure 21
AC Testing: Input, Output Waveforms
C504
For timing purposes a port pin is no longer floating when a 100 mV change from load voltage
occurs and begins to float when a 100 mV change from the loaded VOH/VOL level occurs.
I
OL/IOH
≥±20 mA
Figure 22
AC Testing : Float Waveforms
Figure 23
Recommended Oscillator Circuits for Crystal Oscillator
Semiconductor Group49
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