Datasheet SAB-C504-2R24M, SAB-C504-2R40M, SAB-C504-2RM, SAB-C504-L24M, SAB-C504-L40M Datasheet (Siemens)

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Page 1
Data Sheet 05.96
Microcomputer Components
C504
8-Bit CMOS Microcontroller
Page 2
C504 Revision History: Current Version: 05.96
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(in previous Version)
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Edition 05.96
This edition was realized using the software system FrameMaker
Published by Siemens AG, Bereich Halbleiter, Marketing­Kommunikation, Balanstraße 73, 81541 München
© Siemens AG 1996.
All Rights Reserved.
Attention please!
As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes and circuits implemented within components or assemblies.
The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. For questions on technology, delivery and prices please contact the Semiconductor Group Offices in Germany or the Siemens Companies
and Representatives worldwide (see address list). Due to technical requirements components may contain dangerous substances. For information on the types in question please contact
your nearest Siemens Office, Semiconductor Group. Siemens AG is an approved CECC manufacturer.
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Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components written approval of the Semiconductor Group of Siemens AG.
1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the
failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain hu-
man life. If they fail, it is reasonable to assume that the health of the user may be endangered.
1
of the Semiconductor Group of Siemens AG, may only be used in life-support devices or systems2 with the express
Page 3
8-Bit CMOS Microcontroller C504
Advance Information
• Fully compatible to standard 8051 microcontroller
• Up to 40 MHz operating frequency
• 16 K×8 ROM (C504-2R only, optional ROM protection)
• 256×8 RAM
• 256×8 XRAM
• Four 8-bit ports, (2 ports with mixed analog/digital I/O capability)
• Three 16-bit timers/counters (timer 2 with up/down counter feature)
• Capture/compare unit for PWM signal generation and signal capturing
- 3-channel, 16-bit capture/compare unit
- 1-channel, 10-bit compare unit
• Compare unit
• USART
• 10-bit A/D Converter with 8 multiplexed inputs
• Twelve interrupt sources with two priority levels
• On-chip emulation support logic (Enhanced Hooks Technology
TM
)
• Programmable 15-bit Watchdog Timer
• Oscillator Watchdog
• Fast Power On Reset
• Power Saving Modes
• M-QFP-44 package
• Temperature ranges: SAB-C504 T
SAF-C504 TA : – 40 to 85°C SAH-C504 TA : – 40 to 110°C (max. operating frequency.: TBD) SAK-C504 TA : – 40 to 125°C (max. operating frequency.: 12 MHz)
: 0 to 70°C
A
Semiconductor Group 3 05.96
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C504
The C504 with its capture compare unit (CCU) especially provides a functionality, which allows to use the microcontroller in motor control applications. Further, the C504 is functionally upward compatible with the SAB 80C52/C501 microcontroller and can replace it in existing applications. The C504-2R contains a non-volatile 16K×8 read-only program memory, a volatile on-chip 512×8 read/write data memory, four 8-bit wide ports, three 16-bit timers/counters, a 16-bit capture/ compare unit with compare timer, a 10-bit compare timer, a twelve source, two priority level interrupt structure, a serial port, versatile fail save mechanisms, on-chip emulation support logic, and a genuine 10-bit A/D converter. The C504-L is identical to the C504-2R, except that it lacks the program memory on chip. Therefore, the term C504 refers to all versions within this data sheet unless otherwise noted.
Ordering Information Type Ordering Code Package Description
(8-Bit CMOS microcontroller)
SAB-C504-LM Q67120-C1048 P-MQFP-44 for external memory (12 MHz) SAB-C504-L24M Q67120-C1049 P-MQFP-44 for external memory (24 MHz) SAB-C504-L40M Q67120-C1050 P-MQFP-44 for external memory (40 MHz) SAB-C504-2RM Q67120-DXXXX P-MQFP-44 with mask-programmable ROM (12 MHz) SAB-C504-2R24M Q67120-DXXXX P-MQFP-44 with mask-programmable ROM (24 MHz) SAB-C504-2R40M Q67120-DXXXX P-MQFP-44 with mask-programmable ROM (40 MHz)
Note: Versions for extended temperature ranges – 40 ˚C to 110 ˚C (SAH-C504) and – 40 ˚C to
125 ˚C (SAK-C504) are available on request. The ordering number of ROM types (DXXXX extensions) is defined after program release (verification) of the customer.
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C504
Figure 1 Logic Symbol
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C504
Figure 2 Pin Configuration (top view)
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Table 1 Pin Definitions and Functions
C504
Symbol Pin Number
(P-MQFP-44)
P1.0-P1.7 40-44,
1-3
40
41
42
43
44
1
2
3
I/O
Function
*)
I/O Port 1
is an 8-bit bidirectional port. Port pins can be used for digital input/output. P1.0 - P1.3 can also be used as analog inputs of the A/D-converter. As secondary digital functions, port 1 contains the timer 2 pins and the capture/compare inputs/outputs. Port 1 pins are assigned to be used as analog inputs via the register P1ANA. The functions are assigned to the pins of port 1 as follows: P1.0 / AN0 / T2 Analog input channel 0 /
P1.1 / AN1 / T2EX Analog input channel 1 /
P1.2 / AN2 / CC0 Analog input channel 2 /
P1.3 / AN3 / COUT0 Analog input channel 3 /
P1.4 / CC1 Input/output of capture/compare
P1.5 / COUT1 Output of capture/compare
P1.6 / CC2 Input/output of capture/compare
P1.7 / COUT2 Output of capture/compare
input to counter 2
capture/reload trigger of timer 2 / up-down count
input/output of capture/compare channel 0
output of capture/compare channel 0
channel 1
channel 1
channel 2
channel 2
RESET 4 I RESET
A high level on this pin for one machine cycle while the oscillator is running resets the device. An internal diffused resistor to VSS permits power-on reset using only an external capacitor to VCC.
*) I = Input
O = Output
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Table 1 Pin Definitions and Functions (cont’d)
C504
Symbol Pin Number
(P-MQFP-44)
P3.0-P3.7 5, 7-13
5
7
8
9
10
11
12
13
I/O
Function
*)
I/O Port 3
is an 8-bit bidirectional port. P3.0 (R×D) and P3.1 (T×D) operate as defined for the C501. P3.2 to P3.7 contain the external interrupt inputs, timer inputs, input and as an additional optinal function four of the analog inputs of the A/D-converter. Port 3 pins are assigned to be used as analog inputs via the bits of SFR P3ANA. P3.6/WR can be assigned as a third interrupt input. The functions are assigned to the pins of port 3 as follows: P3.0 / RxD Receiver data input (asynch.) or data
P3.1 / TxD Transmitter data output (asynch.) or
P3.2 / AN4 / INT0 Analog input channel 4 / external
P3.3 / AN5 / INT1 Analog input channel 5 / external
P3.4 / AN6 / T0 Analog input channel 6 / timer 0
P3.5 / AN7 / T1 Analog input channel 7 / timer 1
P3.6 / WR / INT2 WR control output; latches the data
P3.7 / RD RD control output; enables the
input/output (synch.) of serial interface
clock output (synch.) of serial interface
interrupt 0 input / timer 0 gate control input
interrupt 1 input / timer 1 gate control input
counter input
counter input
byte from port 0 into the external data memory / external interrupt 2 input
external data memory
CTRAP 6 I CCU Trap Input
With CTRAP = low the compare outputs of the CAPCOM unit are switched to the logic level as defined in the COINI register (if they are enabled by the bits in SFR TRCON). CTRAP is an input pin with an internal pullup resistor. For power saving reasons, the signal source which drives the CTRAP input should be at high or floating level during power-down mode.
*) I = Input
O = Output
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Table 1 Pin Definitions and Functions (cont’d)
C504
Symbol Pin Number
(P-MQFP-44)
I/O *)
Function
XTAL2 14 – XTAL2
Output of the inverting oscillator amplifier.
XTAL1 15 – XTAL1
Input to the inverting oscillator amplifier and input to the internal clock generator circuits. To drive the device from an external clock source, XTAL1 should be driven, while XTAL2 is left unconnected. There are no requirements on the duty cycle of the external clock signal, since the input to the internal clocking circuitry is divided down by a divide-by-two flip-flop. Minimum and maximum high and low times as well as rise/fall times specified in the AC characteristics must be observed.
P2.0-P2.7 18-25 I/O Port 2
is a bidirectional I/O port with internal pullup resistors. Port 2 pins that have 1s written to them are pulled high by the internal pullup resistors, and in that state can be used as inputs. As inputs, port 2 pins being externally pulled low will source current ( of the internal pullup resistors. Port 2 emits the high-order address byte during fetches from external program memory and during accesses to external data memory that use 16-bit addresses (MOVX @DPTR). In this application it uses strong internal pullup resistors when issuing 1s. During accesses to external data memory that use 8-bit addresses (MOVX @Ri), port 2 issues the contents of the P2 special function register.
I
, in the DC characteris-tics) because
IL
PSEN 26 O The Program Store Enable
output is a control signal that enables the external program memory to the bus during external fetch operations. It is activated every six oscillator periodes except during external data memory accesses. Remains high during internal program execution.
ALE 27 O The Address Latch Enable
output is used for latching the low-byte of the address into external memory during normal operation. It is activated every six oscillator periodes except during an external data memory access. When instructions are executed from internal ROM (
EA=1) the ALE generation can be disabled
by bit EALE in SFR SYSCON.
*) I = Input
O = Output
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Table 1 Pin Definitions and Functions (cont’d)
C504
Symbol Pin Number
(P-MQFP-44)
I/O *)
Function
COUT3 28 O 10-Bit compare channel output
This pin is used for the output signal of the 10-bit compare timer 2 unit. COUT3 can be disabled and set to a high or low state.
EA 29 I External Access Enable
When held at high level, instructions are fetched from the internal ROM (C504-2R only) when the PC is less than 4000H.When held at low level, the C504 fetches all instructions from external program memory. For the C504-L this pin must be tied low.
P0.0-P0.7 37-30 I/O Port 0
is an 8-bit open-drain bidirectional I/O port. Port 0 pins that have 1s written to them float, and in that state can be used as high-impendance inputs.Port 0 is also the multiplexed low-order address and data bus during accesses to external program or data memory. In this application it uses strong internal pullup resistors when issuing 1 s. Port 0 also outputs the code bytes during program verification in the C504-2R. External pullup resistors are required during program (ROM) verification.
V
AREF
V
AGND
V
SS
V
CC
*) I = Input
O = Output
38 – Reference voltage for the A/D converter. 39 – Reference ground for the A/D converter. 16 – Ground (0V) 17 – Power Supply (+5V)
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C504
Functional Description
The C504 basic architecture is fully compatible to the standard 8051 microcontroller family. While maintaining all architectural and operational characteristics of the SAB 80C52 / C501, the C504 incorporates some enhancements such as on-chip XRAM, A/D converter, fail save mechanisms, and a versatile capture/compare unit.
Figure 3 shows a block diagram of the C504.
Figure 3 Block Diagram of the C504
Semiconductor Group 11
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C504
CPU
The C504 is efficient both as a controller and as an arithmetic processor. It has extensive facilities for binary and BCD arithmetic and excels in its bit-handling capabilities. Efficient use of program memory results from an instruction set consisting of 44 % one-byte, 41 % two-byte, and 15 % three­byte instructions. With a 12 MHz crystal, 58 % of the instructions are executed in 1.0µs (24 MHz: 500 ns, 40 MHz : 300 ns).
Special Function Register PSW (Address D0H) Reset Value : 00
Bit No. MSB LSB
D7
H
Bit Function
CY Carry Flag
AC Auxiliary Carry Flag
F0 General Purpose Flag RS1
RS0
CY AC
D6
H
Used by arithmetic instruction.
Used by instructions which execute BCD operations.
Register Bank select control bits These bits are used to select one of the four register banks.
RS1 RS0 Function
H
D5
F0
H
D4
RS1 RS0 OV F1 PD0
H
D3
H
D2
H
D1
H
D0
H
PSW
H
0 0 Bank 0 selected, data address 00H-07 0 1 Bank 1 selected, data address 08H-0F 1 0 Bank 2 selected, data address 10H-17 1 1 Bank 3 selected, data address 18H-1F
OV Overflow Flag
Used by arithmetic instruction. F1 General Purpose Flag P Parity Flag
Set/cleared by hardware after each instruction to indicate an odd/even
number of "one" bits in the accumulator, i.e. even parity.
Semiconductor Group 12
H H H H
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Memory Organization
The C504 CPU manipulates operands in the following four address spaces:
– up to 64 Kbyte of external program memory – up to 64 Kbyte of external data memory – 256 bytes of internal data memory – 256 bytes of internal XRAM data memory – a 128 byte special function register area
Figure 4 illustrates the memory address spaces of the C504.
C504
Figure 4 C504 Memory Map
The XRAM in the C504 is a memory area that is logically located at the upper end of the external memory space, but is integrated on the chip. Because the XRAM is used in the same way as external data memory the same instruction types (MOVX instructions) must be used for accessing the XRAM. The XRAM can be enabled and disabled by the XMAP bit in the SYSCON register.
ROM Protection
The C504-2R ROM version allows to protect the content of the internal ROM against read out by non authorized people. The type of ROM protection (protected or unprotected) is fixed with the ROM mask. Therefore, the customer of a C504-2R ROM version has to define whether ROM protection has to be selected or not.
Semiconductor Group 13
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C504
Special Function Registers
All registers, except the program counter and the four general purpose register banks, reside in the special function register area. The 63 special function register (SFR) include pointers and registers that provide an interface between the CPU and the other on-chip peripherals. There are also 128 directly addressable bits within the SFR area. The SFRs of the C504 are listed in table 2 and table 3. In table 2 they are organized in groups which refer to the functional blocks of the C504. Table 3 illustrates the contents of the SFRs in numeric order of their addresses.
Semiconductor Group 14
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C504
Table 2 Special Function Registers - Functional Blocks
Block Symbol Name Address Contents after
Reset
CPU ACC
B DPH DPL PSW SP
SYSCON
Interrupt System
IEN0 IEN1 CCIE IP0 IP1 ITCON
Ports P0
P1 P1ANA P2 P3 P3ANA
A/D­Converter
ADCON0 ADCON1
ADDATH ADDATL P1ANA P3ANA
Serial Channels
PCON SBUF SCON
Timer 0/ Timer 1
TCON TH0 TH1 TL0 TL1 TMOD
1) Bit-addressable special function registers
2) This special function register is listed repeatedly since some bits of it also belong to other functional blocks.
3) X means that the value is undefined and the location is reserved
4) SFR is located in the mapped SFR area. For accessing this SFR, bit RMAP in SFR SYSCON must be set.
Accumulator B-Register Data Pointer, High Byte Data Pointer, Low Byte Program Status Word Register Stack Pointer System Control Register
Interrupt Enable Register 0 Interrupt Enable Register 1
2)
Capture/Compare Interrupt Enable Reg. Interrupt Priority Register 0 Interrupt Priority Register 1 Interrupt Trigger Condition Register
Port 0 Port 1
2)
Port 1 Analog Input Selection Register Port 2 Port 3
2)
Port 3 Analog Input Selection Register A/D Converter Control Register 0
A/D Converter Control Register 1 A/D Converter Data Register High Byte A/D Converter Data Register Low Byte
2)
Port 1 Analog Input Selection Register
2)
Port 3 Analog Input Selection Register
2)
Power Control Register Serial Channel Buffer Register Serial Channel Control Register
Timer 0/1 Control Register Timer 0, High Byte Timer 1, High Byte Timer 0, Low Byte Timer 1, Low Byte Timer Mode Register
E0 F0
83 82
D0
81 B1
A8
A9 D6
B8
B9 9A
80 90 90 A0 B0 B0
D8
DC D9 DA 90 B0
87 99
98 88
8C 8D 8A 8B 89
H H
H
H H H
H
H H
H H
H
H H
H
H
H
H H
H
H H
H H H
H
H
H
H H H H
H
H
1)
1)
1)
1)
1)
1)
1)
1) 4)
1)
1)
1) 4)
1
4)
4)
1)
1)
00
H
00
H
00
H
00
H
00
H
07
H
XX10XXX0 0X000000
XX000000 00
H
XX000000 XX000000 00101010
FF
H
FF
H
B
XXXX1111 FF
H
FF
H
XX1111XX XX000000
01XXX000 00
H
00XXXXXX XXXX1111 XX1111XX
000X0000
3)
XX
H
00
H
00
H
00
H
00
H
00
H
00
H
00
H
3)
B
3)
B
3)
B
3)
B
3)
B
3)
B
3)
B
3)
B
3)
B
3)
B
3)
B
3)
B
B
Semiconductor Group 15
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C504
Table 2 Special Function Registers - Functional Blocks (cont’d)
Block Symbol Name Address Contents after
Reset
Timer 2 T2CON
T2MOD RC2H RC2L TH2 TL2
Capture / Compare Unit
CT1CON CCPL CCPH CT1OFL CT1OFH CMSEL0 CMSEL1 COINI TRCON CCL0 CCH0 CCL1 CCH1 CCL2 CCH2 CCIR CCIE CT2CON CP2L CP2H CMP2L CMP2H BCON
Watchdog WDCON
WDTREL
Power Save Mode
1) Bit-addressable special function registers
2) This special function register is listed repeatedly since some bits of it also belong to other functional blocks.
3) X means that the value is undefined and the location is reserved
4) SFR is located in the mapped SFR area. For accessing this SFR, bit RMAP in SFR SYSCON must be set.
PCON PCON1
Timer 2 Control Register Timer 2 Mode Register Timer 2 Reload Capture Register, High Byte Timer 2 Reload Capture Register, Low Byte Timer 2 High Byte Timer 2 Low Byte
Compare timer 1 control register Compare timer 1 period register, low byte Compare timer 1 period register, high byte Compare timer 1 offset register, low byte Compare timer 1 offset register, high byte Capture/compare mode select register 0 Capture/compare mode select register 1 Compare output initialization register Trap enable control register Capture/compare register 0, low byte Capture/compare register 0, high byte Capture/compare register 1, low byte Capture/compare register 1, high byte Capture/compare register 2, low byte Capture/compare register 2, high byte Capture/compare interrupt request flag reg.
2)
Capture/compare interrupt enable register Compare timer 2 control register Compare timer 2 period register, low byte Compare timer 2 period register, high byte Compare timer 2 compare register, low byte Compare timer 2 compare register, high byte Block commutation control register
Watchdog Timer Control Register Watchdog Timer Reload Register
2)
Power Control Register Power Control Register 1
C8
C9 CB CA CD CC
E1 DE DF E6 E7 E3 E4 E2 CF C2 C3 C4 C5 C6 C7 E5 D6 C1 D2 D3 D4 D5 D7
C0
86 87
88
H H
H
H
H
H
H H H H H
H H H H H H H H H H H H H H
H
H
H
H H H H
H
1)
1)
4)
00
H
XXXXXXX0 00
H
00
H
00
H
00
H
00010000 00
H
00
H
00
H
00
H
00
H
00
H
FF
H
00
H
00
H
00
H
00
H
00
H
00
H
00
H
00
H
00
H
00010000 00
H
B
B
XXXXXX00 00
H
XXXXXX00 00
H
XXXX0000 00
H
000X0000 0XXXXXXX
3)
B
3)
B
3))
B
3)
B
3)
B
3)
B
Semiconductor Group 16
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Table 3 Contents of the SFRs, SFRs in Numeric Order of their Addresses
C504
Addr Register Content
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
after
H H H H
H
1)
.7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 WDT
.6 .5 .4 .3 .2 .1 .0
80 81 82 83 86
2)
P0 FF
H
SP 07
H
DPL 00
H
DPH 00
H
WDTREL 00
H
Reset
PSEL
87
88 88
89 8A 8B 8C 8D 90 90
98 99 9A
A0 A8
A9
B0
1) X means that the value is undefined and the location is reserved
2) Bit-addressable special function registers
3) SFR is located in the mapped SFR area. For accessing this SFR, bit RMAP in SFR SYSCON must be set.
PCON 000X-
H
2)
TCON 00
H
3)
PCON1 0XXX-
H
TMOD 00
H
TL0 00
H
TL1 00
H
TH0 00
H
TH1 00
H
2)
P1 FF
H
2)3)
P1ANA XXXX-
H
2)
SCON 00
H
SBUF XX
H
ITCON 0010-
H
2)
P2 FF
H
2)
IEN0 0X00-
H
IEN1 XX00-
H
2)
P3 FF
H
0000
H
XXXX
H H H H H
H
1111
H
H
1010
H
0000
0000
H
SMOD PDS IDLS – GF1 GF0 PDE IDLE
B
TF1 TR1 TF0 TR0 IE1 IT1 IE0 IT0 EWPD – – – – – – –
B
GATE C/
T M1 M0 GATE C/TM1 M0 .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 T2EX T2 – – – – EAN3 EAN2 EAN1 EAN0
B
SM0 SM1 SM2 REN TB8 RB8 TI RI .7 .6 .5 .4 .3 .2 .1 .0 IT2 IE2 I2ETF I2ETR I1ETF I1ETR I0ETF I0ETR
B
.7 .6 .5 .4 .3 .2 .1 .0 EA – ET2 ES ET1 EX1 ET0 EX0
B
– – ECT1 ECCM ECT2 ECEM EX2 EADC
B
RD WR T1 T0 INT1 INT0 TxD RxD
Semiconductor Group 17
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Table 3 Contents of the SFRs, SFRs in Numeric Order of their Addresses (cont’d)
C504
Addr Register Content
after
1)
B
B
B
B
B
B H H H H H H H
B0
B1
B8
B9
C0
C1
C2 C3 C4 C5 C6 C7 C8
2)3)
P3ANA XX11-
H
SYSCON XX10-
H
2)
IP0 XX00-
H
IP1 XX00-
H
2)
WDCON
H
CT2CON 0001-
H
CCL0 00
H
CCH0 00
H
CCL1 00
H
CCH1 00
H
CCL2 00
H
CCH2 00
H
2)
T2CON 00
H
Reset
11XX
XXX0
0000
0000 XXXX-
0000
0000
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
– – EAN7 EAN6 EAN5 EAN4 – –
– – EALE RMAP – – – XMAP
– – PT2 PS PT1 PX1 PT0 PX0
– – PCT1 PCCM PCT2 PCEM PX2 PADC
– – – – OWDS WDTS WDT SWDT
CT2P ECT2O STE2 CT2
CT2R CLK2 CLK1 CLK0
RES .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 TF2 EXF2 RCLK TCLK EXEN2 TR2 C/T2 CP/
RL2
C9
CA CB CC CD CF D0 D2
1) X means that the value is undefined and the location is reserved
2) Bit-addressable special function registers
3) SFR is located in the mapped SFR area. For accessing this SFR, bit RMAP in SFR SYSCON must be set.
T2MOD XXXX-
H
RC2L 00
H
RC2H 00
H
TL2 00
H
TH2 00
H
TRCON 00
H
2)
PSW 00
H
CP2L 00
H
XXX0
H H H H H H H
– – – – – – – DCEN
B
.7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 TRPEN TRF TREN5 TREN4 TREN3 TREN2 TREN1 TREN0 CY AC F0 RS1 RS0 OV F1 P .7 .6 .5 .4 .3 .2 .1 .0
Semiconductor Group 18
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Table 3 Contents of the SFRs, SFRs in Numeric Order of their Addresses (cont’d)
C504
Addr Register Content
after
1)
B
H
B
H
H
B
H
B
B H H H
B
H
D3
D4 D5
D6
D7
D8
D9 DA
DC
DE DF E0 E1
E2
CP2H XXXX.
H
CMP2L 00
H
CMP2H XXXX.
H
CCIE 00
H
BCON 00
H
2)
ADCON0 XX00-
H
ADDATH 00
H
ADDATL 00XX-
H
ADCON1 01XX-
H
CCPL 00
H
CCPH 00
H
2)
ACC 00
H
CT1CON 0001-
H
COINI FF
H
Reset
XX00
XX00
0000
XXXX
X000
0000
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
––––––.1.0
.7 .6 .5 .4 .3 .2 .1 .0 ––––––.1.0
ECTP ECTC CC2
FEN
BCMP
PWM1 PWM0 EBCE
CC2 REN
CC1 FEN
BCERR
CC1 REN
CC0 FEN
CC0 REN
BCEN BCM1 BCM0
BCEM – – IADC BSY ADM MX2 MX1 MX0
.9 .8 .7 .6 .5 .4 .3 .2 .1.0––––––
ADCL1 ADCL0 – – – MX2 MX1 MX0
.7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 CTM ETRP STE1 CT1
CT1R CLK2 CLK1 CLK0
RES
COUT3ICOUTXICOUT2ICC2I COUT1ICC1I COUT0ICC0I
E3
E4
E5 E6 E7 F0
1) X means that the value is undefined and the location is reserved
2) Bit-addressable special function registers
CMSEL0 00
H
CMSEL1 00
H
CCIR 00
H
CT1OFL 00
H
CT1OFH 00
H
2)
B 00
H
H
H
H H H H
CMSEL13CMSEL12CMSEL11CMSEL10CMSEL03CMSEL02CMSEL01CMSEL
0000
CT1FP CT1FC CC2F CC2R CC1F CC1R CC0F CC0R .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0
Semiconductor Group 19
00
CMSEL23CMSEL22CMSEL21CMSEL
20
Page 20
Timer / Counter 0 and 1 Timer/Counter 0 and 1 can be used in four operating modes as listed in table 4. Table 4
Timer/Counter 0 and 1 Operating Modes Mode Description TMOD Input Clock
C504
T M1 M0 internal external (max)
f
OSC/12 × 32
f
OSC/24 × 32
0 8-bit timer/counter with a
Gate C/
XX00
divide-by-32 prescaler 1 16-bit timer/counter X X 1 1 f 2 8-bit timer/counter with
XX00f
OSC/12
OSC/12
f
OSC/24
f
OSC/24
8-bit autoreload 3 Timer/counter 0 used as one
XX11f
OSC/12
f
OSC/24
8-bit timer/counter and one
8-bit timer
Timer 1 stops In the “timer” function (C/T = ‘0’) the register is incremented every machine cycle. Therefore the
count rate is f
OSC
/12. In the “counter” function the register is incremented in response to a 1-to-0 transition at its corresponding external input pin (P3.4/T0, P3.5/T1). Since it takes two machine cycles to detect a falling edge the max. count rate is f
/24. External inputs INT0 and INT1 (P3.2, P3.3) can be
OSC
programmed to function as a gate to facilitate pulse width measurements. Figure 5 illustrates the input clock logic.
Figure 5 Timer/Counter 0 and 1 Input Clock Logic
Semiconductor Group 20
Page 21
C504
Timer 2
Timer 2 is a 16-bit Timer/Counter with an up/down count feature. It can operate either as timer or as an event counter which is selected by bit C/T2 (T2CON.1). It has three operating modes as shown in table 5.
Table 5 Timer/Counter 2 Operating Modes
Mode
16-bit Auto­reload
16-bit Cap­ture
Baud Rate Gene­rator
R×CLK
or
T×CLK
0
0
0 0
0
0
1
1
T2CON T2MOD
CP/
RL2
TR2 internal
DCEN
0
0
0 0
1
1
X
X
1
1
1 1
1
1
1
1
0
0
1 1
X
X
X
X
T2CON
EXEN
0
1
X X
0
1
0
1
P1.1/
T2EX
X
Remarks
reload upon overflow
↓
reload trigger (falling edge)
0
Down counting
1
Up counting
X↓16 bit Timer/
Counter (only up-counting) capture TH2, TL2 → RC2H, RC2L
X↓no overflow
interrupt request (TF2) extra external interrupt (“Timer 2”)
Input Clock
f
/12
OSC
f
/12
OSC
f
/2
OSC
external
(P1.0/T2)
max
f
/24
OSC
max
f
/24
OSC
max
f
/24
OSC
off X X 0 X X X Timer 2 stops – –
Note: ↓ = falling edge
Semiconductor Group 21
Page 22
C504
Capture/Compare Unit
The Capture / Compare Unit (CCU) of the C504 is built up by a 16-bit 3-channel capture/compare unit (CAPCOM) and a 10-bit 1-channel compare unit (COMP). In compare mode, the CAPCOM unit provides two output signals per channel, which can have inverted signal polarity and non­overlapping pulse transitions. The COMP unit can generate a single PWM output signal and is further used to modulate the CAPCOM output signals. In capture mode, the value of the compare timer 1 is stored in the capture registers if a signal transition occurs at the pins CCx. Figure 6 shows the block diagram of the CCU.
Figure 6 Block Diagram of the CCU
Semiconductor Group 22
Page 23
C504
The compare timer 1 and 2 are free running, processor clock coupled 16-bit / 10-bit timers which have each a count rate with a maximum of its possible compare output signal waveforms are shown in figure 7.
f
OSC
/2 up to
f
/256. The compare timer operations with
OSC
Figure 7 Basic Operating Modes of the CAPCOM Unit
Compare timer 1 runs only in operating mode 1 with one output signal of selectable signal polarity at the pin COUT3.
Semiconductor Group 23
Page 24
C504
Serial Interface (USART)
The serial port is full duplex and can operate in four modes (one synchronous mode, three asynchronous modes) as illustrated in table 6. The possible baudrates can be calculated using the formulas given in table 6.
Table 6 USART Operating Modes
Mode
SCON Baudrate Description
SM0 SM1
000
f
/12 Serial data enters and exits through R×D.
OSC
T×D outputs the shift clock. 8-bit are transmitted/received (LSB first)
1 0 1 Timer 1/2 overflow rate 8-bit UART
10 bits are transmitted (through T×D) or received (R×D)
210
OSC
/32 or f
/64 9-bit UART
OSC
f
11 bits are transmitted (T×D) or received (R×D)
3 1 1 Timer 1/2 overflow rate 9-bit UART
Like mode 2 except the variable baud rate
Figure 8 Block Diagram of Baud Rate Generation for the Serial Interface
Semiconductor Group 24
Page 25
The possible baudrates can be calculated using the formulas given in table 7.
Table 7 Formulas for Calculating Baudrates
C504
Baud Rate
derived from
Oscillator 0
Timer 1 (16-bit timer)
(8-bit timer with
8-bit autoreload)
Timer 2 1,3
Interface Mode Baudrate
f
/12
OSC
SMOD
2
1,3 1,3
(2
SMOD
× timer 1 overflow rate) /32
× f
OSC
/ (32 × (65536-(RC2H, RC2L))
(2
(2
SMOD
f
OSC
× f
OSC
) / (32 × 12 × (256-TH1))
) / 64
Semiconductor Group 25
Page 26
C504
10-Bit A/D Converter
The C504 has a high performance 10-bit A/D converter (figure 9) with 8 inputs included which uses successive approximation technique for the conversion of analog input voltages.
Figure 9 A/D Converter Block Diagram
Semiconductor Group 26
Page 27
C504
The A/D converter uses two clock signals for operation : the conversion clock f the input clock fIN (= 1/ tIN). Both clock signals are derived from the C504 system clock f is applied at the XTAL pins. The duration of an A/D conversion is a multiple of the period of the f
ADC
(= 1/ t
ADC
OSC
) and
which
IN
clock signal. The table in figure 10 shows the prescaler ratios and the resulting A/D conversion times which must be selected for typical system clock rates.
MCU System Clock Rate (f
OSC
)
3.5 MHz 1.75 ÷ 4 0 0 .438 48 x t 12 MHz 6 ÷ 4 0 0 1.5 48 x t 16 MHz 8 ÷ 4 0 0 2 48 x t 24 MHz 12 ÷ 8 0 1 1.5 96 x t 32 MHz 16 ÷ 8 0 1 2 96 x t 40 MHz 20 ÷ 16 1 0 1.25 192 x t
f
IN
[MHz]
Prescaler f
Ratio ADCL1 ADCL0
ADC
[MHz]
A/D Conversion
Time [µs]
= 27.4
IN
= 8
IN
= 6
IN
= 8
IN
= 6
IN
= 9.6
IN
Figure 10 A/D Converter Clock Selection
The analog inputs are located at port 1 and port 3 (4 lines on each port). The corresponding port 1 and port 3 pins have a port structure, which allows to use it either as digital I/Os or analog inputs. The analog input function of these mixed digital/analog port lines is selected via the registers P1ANA and P3ANA.
Semiconductor Group 27
Page 28
C504
Interrupt System
The C504 provides 12 interrupt sources with two priority levels. Figure 11 and 12 give a general overview of the interrupt sources and illustrate the interrupt request and control flags.
Figure 11 Interrupt Request Sources (Part 1)
Semiconductor Group 28
Page 29
C504
Figure 12 Interrupt Request Sources (Part 2)
Semiconductor Group 29
Page 30
Table 8 Interrupt Vector Addresses
Request Flags Interrupt Source Vector Address
C504
IE0 TF0 IE1 TF1 RI + TI TF2 + EXF2 IADC IE2 TRF, BCERR CT2P CC0F-CC2F, CC0R-CC2R CT1FP, CT1FC –
A low-priority interrupt can itself be interrupted by a high-priority interrupt, but not by another low­priority interrupt. A high-priority interrupt cannot be interrupted by any other interrupt source. If two requests of different priority level are received simultaneously, the request of higher priority is serviced. If requests of the same priority are received simultaneously, an internal polling sequence determines which request is serviced. Thus within each priority level there is a second priority structure determined by the polling sequence as shown in table 9.
External interrupt 0 Timer 0 interrupt External interrupt 1 Timer 1 interrupt Serial port interrupt Timer 2 interrupt A/D converter interrupt External interrupt 2 CAPCOM emergency interrupt Compare timer 2 interrupt Capture / compare match interrupt Compare timer 1 interrupt Power-down interrupt
0003 000B 0013 001B 0023 002B 0043 004B 0053 005B 0063 006B 007B
H
H
H
H
H
H
H
H
H
H
H
H H
Table 9 Interrupt Source Structure
Interrupt Source Priority
High Priority
External Interrupt 0 Timer 0 Interrupt External Interrupt 1 Timer 1 Interrupt Serial Channel Timer 2 Interrupt
A/D Converter External Interrupt 2 CCU Emergency Interrupt Compare Timer 2 Interrupt Capture / Compare Match Interrupt Compare Timer 1 Interrupt
Low Priority
High h
Low
Semiconductor Group 30
Page 31
C504
Fail Save Mechanisms
The C504 offers enhanced fail safe mechanisms, which allow an automatic recovery from software upset or hardware failure.
– 15-bit reloadable watchdog timer – Oscillator Watchdog
Watchdog Timer
The watchdog timer in the C504 is a 15-bit timer, which is incremented by a count rate of either f 12 or f
/32. From the 15-bit watchdog timer count value only the upper 7 bits can be
CYCLE
programmed. Figure 5 shows the block diagram of the programmable watchdog timer.
SOC
/
Figure 13 Block Diagram of the Programmable Watchdog Timer
The watchdog timer can be started by software (bit SWDT in SFR WDCON), but it cannot be stopped during active mode of the device. If the software fails to refresh the running watchdog timer an internal reset will be initiated. The reset cause (external reset or reset caused by the watchdog) can be examined by software (status flag WDTS in WDCON is set). A refresh of the watchdog timer is done by setting bits WDT (SFR WDCON) and SWDT consecutively. This double instruction sequence has been implemented to increase system security. It must be noted, however, that the watchdog timer is halted during the idle mode and power down mode of the processor. Therefore, it is possible to use the idle mode in combination with the watchdog timer function.
Semiconductor Group 31
Page 32
Oscillator Watchdog
The oscillator watchdog of the C504 serves for three functions :
– Monitoring of the on-chip oscillator's function
The watchdog supervises the on-chip oscillator's frequency; if it is lower than the frequency of an auxiliary RC oscillator, the internal clock is supplied by this RC oscillator and the C504 is put into reset state; if the failure condition again disappears, the part executes a final reset phase of typ. 1 ms in order to allow the oscillator to stabilize; then the oscillator watchdog reset is released and the part starts program execution again.
– Fast internal reset after power-on
The oscillator watchdog unit provides a clock supply for the reset before the on-chip oscillator has started. The oscillator watchdog unit also works identically to the monitoring function.
– Control of external wake-up from software power-down mode
When the power-down mode is left by a low level at the INT0 pin, the oscillator watchdog unit assures that the microcontroller resumes operation (execution of the power-down wake-up interrupt) with the nominal clock rate. In the power-down mode the RC oscillator and the on­chip oscillator are stopped. Both oscillators are started again when power-down mode is released. When the on-chip oscillator has a higher frequency than the RC oscillator, the microcontroller starts operation after a final delay of typ. 1 ms in order to allow the on-chip oscillator to stabilize.
C504
Figure 14 Block Diagram of the Programmable Watchdog Timer
Semiconductor Group 32
Page 33
Power Saving Modes
Two power down modes are available, the idle mode and power down mode.
– In the idle mode the oscillator of the C504 continues to run, but the CPU is gated off from the
clock signal. However, the interrupt system, the serial port, the A/D converter, and all timers with the exception of the watchdog timer are further provided with the clock. The CPU status is preserved in its entirety: the stack pointer, program counter, program status word, accumulator, and all other registers maintain their data during idle mode.
– In the power down mode, the RC oscillator and the on-chip oscillator which operates with the
XTAL pins is stopped. Therefore all functions of the microcontroller are stopped and only the contents of the on-chip RAM, XRAM and the SFR's are maintained. The port pins, which are controlled by their port latches, output the values that are held by their SFR's.
Table 10 gives a general overview of the power saving modes. Table 10
Power Saving Modes Overview
C504
Mode Entering
Leaving by Remarks 2-Instruction Example
Idle mode ORL PCON, #01H
ORL PCON, #20H
Ocurrence of an
interrupt from a
peripheral unit
Hardware Reset
CPU clock is stopped; CPU maintains their data; peripheral units are active (if enabled) and provided with clock
Power-Down Mode
ORL PCON, #02H ORL PCON, #40H
Hardware Reset Oscillator is stopped;
Wake-up from power
down
contents of on-chip RAM and SFR’s are maintained;
In the power down mode of operation, VCC can be reduced to minimize power consumption. It must be ensured, however, that VCC is not reduced before the power down mode is invoked, and that V
CC
is restored to its normal operating level, before the power down mode is terminated. The idle mode can be terminated by activating any enabled peripheral interrupt or by resetting the C504. The power down mode can be terminated using an interrupt by a short low pulse at the pin P3.2/AN4/INT0 or by resetting the C504. If a power saving mode is left through an interrupt, the microcontroller state (CPU, ports, peripherals) remains preserved. If a power saving mode is left by a reset operation, the microcontroller state is disturbed and replaced by the reset state of the C504.
Semiconductor Group 33
Page 34
C504
Absolute Maximum Ratings
Ambient temperature under bias (TA) .............................................................. 0˚C to + 70 ˚C
Storage temperature (TST)................................................................................– 65 ˚C to + 150 ˚C
Voltage on VCC pins with respect to ground (VSS) ............................................– 0.5 V to 6.5 V
Voltage on any pin with respect to ground (VSS)..............................................– 0.5 V to VCC + 0.5 V
Input current on any pin during overload condition..........................................– 10 mA to + 10 mA
Absolute sum of all input currents during overload condition ..........................| 100 mA |
Power dissipation.............................................................................................TBD
Note:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage of the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for longer periods may affect device reliability. During overload conditions ( Voltage on
V
pins with respect to ground (
CC
V
) must not exceed the values defined by the
SS
absolute maximum ratings.
V
>
V
or
V
<
V
IN
CC
IN
) the
SS
Semiconductor Group 34
Page 35
C504
DC Characteristics
V
= 5 V + 10%, – 15%; VSS=0V TA= 0 to 70 °C for the SAB-C504
CC
T
= – 40 to 85 °C for the SAF-C504
A
T
= – 40 to 110 °C for the SAH-C504
A
T
= – 40 to 125 °C for the SAK-C504
A
Parameter Symbol Limit Values Unit Test Condition
min. max.
Input low voltage (except
EA,
RESET, CTRAP) Input low voltage (
EA) V
Input low voltage (RESET, CTRAP)
Input high voltage (except XTAL1, RESET and
CTRAP) Input high voltage to XTAL1 Input high voltage to RESET and
CTRAP Output low voltage (ports 1, 2, 3,
COUT3) Output low voltage (port 0, ALE,
PSEN) Output high voltage (ports 1, 2, 3) V
Output high voltage (ports 1,3 pins in push-pull mode and COUT3)
V
IL
– 0.5 0.2 VCC –
V–
0.1
IL1
– 0.5 0.2 VCC –
V–
0.3
V
IL2
– 0.5 0.2 VCC +
V–
0.1
V
IH
0.2 VCC+
V
+ 0.5 V –
CC
0.9
V
IH1
V
IH2
V
OL
V
OL1
OH
V
OH1
0.7 V
0.6 V
CC
CC
V
+ 0.5 V –
CC
V
+ 0.5 V –
CC
– 0.45 V IOL= 1.6 mA
– 0.45 V IOL= 3.2 mA
2.4
0.9 V
0.9 V
CC
CC
– –
–VI
V IOH=–80µA,
I
=–10µA
OH
= – 800 µA
OH
1)
1)
Output high voltage (port 0 in external bus mode, ALE,
PSEN) Logic 0 input current (ports 1, 2, 3) I Logical 1-to-0 transition current
V
OH2
IL
I
TL
2.4
0.9 V –10 –50 µA VIN= 0.45 V – 65 – 650 µA VIN=2V
(ports 1, 2, 3) Input leakage current (port 0, Pin capacitance C
Overload current
EA) I
LI
IO
I
OV
– ± 1 µA 0.45 < VIN< V –10pFf
– ± 5mA
Semiconductor Group 35
CC
– –
V IOH= – 800 µA2),
I
=–80µA
OH
= 1 MHz,
c
T
=25°C
A
7) 8)
2)
CC
Page 36
C504
Parameter Symbol Limit Values Unit Test Condition
9)
typ.
Power supply current:
4)
Active mode, 12 MHz Idle mode, 12 MHz
5)
Active mode, 24 MHz Idle mode, 24 MHz
5)
Active mode, 40 MHz Idle mode, 40 MHz
5)
Power-down mode
I
CC
I
4)
4)
CC
I
CC
I
CC
I
CC
I
CC
I
PD
1) Capacitive loading on ports 0 and 2 may cause spurious noise pulses to be superimposed on the VOL of ALE
and port 3. The noise is due to external bus capacitance discharging into the port 0 and port 2 pins when these pins make 1-to-0 transitions during bus operation. In the worst case (capacitive loading > 100 pF), the noise pulse on ALE line may exceed 0.8 V. In such cases it may be desirable to qualify ALE with a schmitt-trigger, or use an address latch with a schmitt-trigger strobe input.
16 8 25 13 38 17 1
max.
TBD TBD TBD TBD TBD TBD 50
mA mA mA mA mA mA µA
V
=5V,
CC
V
=5V,
CC
V
=5V,
CC
V
=5V,
CC
V
=5V,
CC
V
=5V,
CC
V
=2…5.5 V
CC
4)
5)
4)
5)
4)
5)
3)
V
2) Capacitive loading on ports 0 and 2 may cause the
V
0.9
specification when the address lines are stabilizing.
CC
on ALE and PSEN to momentarily fall below the
OH
3) IPD (power-down mode) is measured under following conditions:
EA = Port0 =
; RESET = VSS; XTAL2 = N.C.; XTAL1 = VSS;V
CC
= VSS; all other pins are disconnected.
AGND
V
4) ICC (active mode) is measured with:
t
, t
XTAL1 driven with
CLCH
EA = Port0 = Port1 = RESET =
= 5 ns , VIL= VSS+ 0.5 V, VIH= VCC– 0.5 V; XTAL2 = N.C.;
CHCL
V
; all other pins are disconnected. ICC would be slightly higher if a crystal
CC
oscillator is used (appr. 1 mA).
I
(idle mode) is measured with all output pins disconnected and with all peripherals disabled;
5)
CC
XTAL1 driven with RESET = EA =
6) I
at other frequencies is given by:
CC max
t
, t
CLCH
V
; Port0 = VCC; all other pins are disconnected.
SS
= 5 ns, VIL= VSS+ 0.5 V, VIH= VCC– 0.5 V; XTAL2 = N.C.;
CHCL
active mode: TBD idle mode: TBD
f
where
is the oscillator frequency in MHz. ICC values are given in mA and measured at VCC=5V.
osc
7) Overload conditions occur if the standard operating conditions are exceeded, i.e. the voltage on any pin
exceeds the specified range (i.e.
> VCC+ 0.5 V or VOV< V
OV
– 0.5 V). The supply voltage V
SS
and V
CC
SS
V
must remain within the specified limits. The absolute sum of input currents on all port pins may not exceed 50 mA.
8) Not 100 % tested, guaranteed by design characterization.
I
9) The typical
values are periodically measured at TA= +25 ˚C but not 100% tested.
CC
Semiconductor Group 36
Page 37
A/D Converter Characteristics
V
= 5 V + 10%, – 15%; VSS=0V TA= 0 to 70 °C for the SAB-C504
CC
4V ≤ V
V
– 0.1 V ≤ V
SS
AREF
≤ V
+ 0.1 V; TA= – 40 to 85 °C for the SAF-C504
CC
≤ V
AGND
+ 0.2 V; TA= – 40 to 110 °C for the SAH-C504
SS
T
= – 40 to 125 °C for the SAK-C504
A
Parameter Symbol Limit Values Unit Test Condition
min. max.
Analog input voltage Sample time t
Conversion cycle time t
Total unadjusted error T
V
AIN
S
ADCC
UE
V
AGND
– 64 x t
– 384 x t
V
AREF
32 x t 16 x t 8 x t
IN
192 x t 96 x t 48 x t
V ns Prescaler ÷ 32
IN IN IN
ns Prescaler ÷ 32
IN
IN IN IN
– ± 2 LSB VSS+ 0.5V ≤ VIN≤ VCC– 0.5V
1)
Prescaler ÷ 16 Prescaler ÷ 8 Prescaler ÷ 4
Prescaler ÷ 16 Prescaler ÷ 8 Prescaler ÷ 4
– ± 4 LSB VSS < VIN < VSS+ 0.5V
VCC– 0.5V < VIN < V
Internal resistance of reference voltage source
Internal resistance of analog source
ADC input capacitance C
R
R
AREF
ASRC
AIN
– t
ADC
/ 250
kΩ
t
ADC
– 0.25
t
– tS / 500
kΩ
in [ns]
S
– 0.25
–50pF
6)
in [ns]
5) 6)
2) 6)
C504
2)
3)
4)
CC
4)
Notes see next page.
Clock calculation table : Clock Prescaler
ADCL1, 0 t
ADC
t
S
Ratio
÷ 32 1 1 32 x t ÷ 16 1 0 16 x t ÷ 8 0 1 8 x t ÷ 4 0 0 4 x t
Further timing conditions : t
min = 500 ns
ADC
tIN = 2 / f
IN IN
OSC
IN IN
64 x t 32 x t 16 x t 8 x t
= 2 t
IN
CLCL
Semiconductor Group 37
IN IN IN
t
ADCC
384 x t 192 x t 96 x t 48 x t
IN
IN IN IN
Page 38
Notes:
1) V
may exceed V
AIN
these cases will be X000
2) During the sample time the input capacitance C
or V
AGND
AREF
or X3FFH, respectively.
H
up to the absolute maximum ratings. However, the conversion result in
can be charged/discharged by the external source. The
AIN
internal resistance of the analog source must allow the capacitance to reach their final voltage level within t After the end of the sample time t
, changes of the analog input voltage have no effect on the conversion
S
result.
C504
S
.
3) This parameter includes the sample time t calibration. Values for the conversion clock t
, the time for determining the digital result and the time for the
S
depend on programming and can be taken from the table on
ADC
the previous page.
4) T
is tested at V
UE
AREF
= 5.0 V, V
= 0 V, VCC = 4.9 V. It is guaranteed by design characterization for all
AGND
other voltages within the defined voltage range. If an overload condition occurs on maximum 2 not selected analog input pins and the absolute sum of input overload currents on all analog input pins does not exceed 10 mA, an additional conversion error of 1/2 LSB is permissible.
5) During the conversion the ADC’s capacitance must be repeatedly charged or discharged. The internal resistance of the reference source must allow the capacitance to reach their final voltage level within the indicated time. The maximum internal resistance results from the programmed conversion timing.
6) Not 100 % tested, but guaranteed by design characterization.
Semiconductor Group 38
Page 39
C504
AC Characteristics for C504-L / C504-2R
V
= 5 V + 10%, – 15%; VSS=0V TA= 0 to 70 °C for the SAB-C504
CC
T
= – 40 to 85 °C for the SAF-C504
A
T
= – 40 to 110 °C for the SAH-C504
A
T
= – 40 to 125 °C for the SAK-C504
A
(CL for port 0, ALE and PSEN outputs = 100 pF; CL for all other outputs = 80 pF)
Program Memory Characteristics Parameter Symbol Limit Values Unit
12-MHz clock Variable Clock
t
1/
min. max. min. max.
= 3.5 MHz to
CLCL
12 MHz
ALE pulse width Address setup to ALE Address hold after ALE ALE low to valid instr in ALE to
PSEN t PSEN pulse width t PSEN to valid instr in t Input instruction hold after Input instruction float after Address valid after
PSEN t
PSEN t PSEN t
Address to valid instr in Address float to
*)
Interfacing the C504 to devices with float times up to 75 ns is permissible. This limited bus contention will not cause any damage to port 0 drivers.
PSEN t
t
LHLL
t
AVLL
t
LLAX
t
LLIV
LLPL
PLPH
PLIV
PXIX
PXIZ
PXAV
t
AVIV
AZPL
127 – 2t 43 – t 30 – t – 233 – 4t 58 – t 215 – 3t – 150 – 3t
–40 – ns
CLCL
–40 – ns
CLCL
–23 – ns
CLCL
– 100 ns
CLCL
–25 – ns
CLCL
–35 – ns
CLCL
– 100 ns
CLCL
0–0–ns
*)
–63– t
*)
75 – t
–8 – ns
CLCL
– 302 – 5t
–20 ns
CLCL
– 115 ns
CLCL
0–0–ns
Semiconductor Group 39
Page 40
C504
AC Characteristics for C504-L / C504-2R (cont’d) External Data Memory Characteristics
Parameter Symbol Limit Values Unit
12-MHz clock Variable Clock
1/
t
= 3.5 MHz to
CLCL
12 MHz
min. max. min. max.
RD pulse width WR pulse width Address hold after ALE RD to valid data in Data hold after Data float after
RD
RD ALE to valid data in Address to valid data in ALE to Address valid to
WR or RD
WR or RD WR or RD high to ALE high Data valid to Data setup before Data hold after Address float after
WR transition
WR
WR
RD
t
RLRH
t
WLWH
t
LLAX2
t
RLDV
t
RHDX
t
RHDZ
t
LLDV
t
AVDV
t
LLWL
t
AVWL
t
WHLH
t
QVWX
t
QVWH
t
WHQX
t
RLAZ
400 – 6t 400 – 6t 114 – 2t – 252 – 5t
– 100 – ns
CLCL
– 100 – ns
CLCL
–53 – ns
CLCL
– 165 ns
CLCL
0–0–ns –97– 2t – 517 – 8t – 585 – 9t 200 300 3t 203 – 4t 43 123 t 33 – t 433 – 7t 33 – t
–50 3t
CLCL
– 130 – ns
CLCL
–40 t
CLCL
–50 – ns
CLCL
– 150 – ns
CLCL
–50 – ns
CLCL
–70 ns
CLCL
– 150 ns
CLCL
– 165 ns
CLCL
+50 ns
CLCL
+40 ns
CLCL
–0–0ns
External Clock Drive Parameter Symbol Limit Values Unit
Variable Clock
Freq. = 3.5 MHz to 12 MHz
min. max.
Oscillator period High time Low time Rise time Fall time
t
CLCL
t
CHCX
t
CLCX
t
CLCH
t
CHCL
83.3 294 ns 20 t 20 t
CLCL
CLCL
– t – t
CLCX
CHCX
ns
ns –20ns –20ns
Semiconductor Group 40
Page 41
C504
AC Characteristics for C504-L24 / C504-2R24
V
= 5 V + 10 %, – 15 %; VSS=0V TA= 0 to 70 °C for the SAB-C504
CC
T
= – 40 to 85 °C for the SAF-C504
A
(CL for port 0, ALE and PSEN outputs = 100 pF; CL for all other outputs = 80 pF)
Program Memory Characteristics Parameter Symbol Limit Values Unit
24-MHz clock Variable Clock
1/
t
= 3.5 MHz to
CLCL
24 MHz
min. max. min. max.
ALE pulse width Address setup to ALE Address hold after ALE ALE low to valid instr in ALE to
PSEN t PSEN pulse width t PSEN to valid instr in t Input instruction hold after Input instruction float after Address valid after
PSEN t
PSEN t PSEN t
Address to valid instr in Address float to
*)
Interfacing the C504 to devices with float times up to 37 ns is permissible. This limited bus contention will not cause any damage to port 0 drivers.
PSEN t
t
LHLL
t
AVLL
t
LLAX
t
LLIV
LLPL
PLPH
PLIV
PXIX
PXIZ
PXAV
t
AVIV
AZPL
43 – 2t 17 – t 17 – t –80– 4t 22 – t 95 – 3t –60– 3t
–40 – ns
CLCL
–25 – ns
CLCL
–25 – ns
CLCL
–87 ns
CLCL
–20 – ns
CLCL
–30 – ns
CLCL
–65 ns
CLCL
0–0–ns
*)
–32– t
*)
37 – t
–5 – ns
CLCL
– 148 – 5t
–10 ns
CLCL
–60 ns
CLCL
0–0–ns
Semiconductor Group 41
Page 42
C504
AC Characteristics for C504-L24 / C504-2R24 (cont’d) External Data Memory Characteristics
Parameter Symbol Limit Values Unit
24-MHz clock Variable Clock
1/
t
= 3.5 MHz to
CLCL
24 MHz
min. max. min. max.
RD pulse width WR pulse width Address hold after ALE RD to valid data in Data hold after Data float after
RD
RD ALE to valid data in Address to valid data in ALE to Address valid to
WR or RD
WR WR or RD high to ALE high Data valid to Data setup before Data hold after Address float after
WR transition
WR
WR
RD
t
RLRH
t
WLWH
t
LLAX2
t
RLDV
t
RHDX
t
RHDZ
t
LLDV
t
AVDV
t
LLWL
t
AVWL
t
WHLH
t
QVWX
t
QVWH
t
WHQX
t
RLAZ
180 – 6t 180 – 6t 56 – 2t – 118 – 5t
–70 – ns
CLCL
–70 – ns
CLCL
–27 – ns
CLCL
–90 ns
CLCL
0 0–ns –63– 2t – 200 – 8t – 220 – 9t 75 175 3t 67 – 4t 17 67 t 5–t 170 – 7t 15 – t
–50 3t
CLCL
–97 – ns
CLCL
–25 t
CLCL
–37 – ns
CLCL
– 122 – ns
CLCL
–27 – ns
CLCL
–20 ns
CLCL
– 133 ns
CLCL
– 155 ns
CLCL
+50 ns
CLCL
+25 ns
CLCL
–0–0ns
External Clock Drive Parameter Symbol Limit Values Unit
Variable Clock
Freq. = 3.5 MHz to 24 MHz
min. max.
Oscillator period High time Low time Rise time Fall time
t
CLCL
t
CHCX
t
CLCX
t
CLCH
t
CHCL
41.7 294 ns 12 t 12 t
CLCL
CLCL
– t – t
CLCX
CHCX
ns
ns –12ns –12ns
Semiconductor Group 42
Page 43
C504
AC Characteristics for C504-L40 / C504-2R40
V
= 5 V + 10 %, – 15 %; VSS=0V TA= 0 to 70 °C for the SAB-C504
CC
T
= – 40 to 85 °C for the SAF-C504
A
(CL for port 0, ALE and PSEN outputs = 100 pF; CL for all other outputs = 80 pF)
Program Memory Characteristics Parameter Symbol Limit Values Unit
40-MHz clock Variable Clock
1/
t
= 3.5 MHz to
CLCL
40 MHz
min. max. min. max.
ALE pulse width t Address setup to ALE Address hold after ALE ALE low to valid instr in ALE to
PSEN t PSEN pulse width t PSEN to valid instr in t Input instruction hold after Input instruction float after Address valid after
PSEN t
PSEN t PSEN t
Address to valid instr in Address float to
*)
Interfacing the C504 to devices with float times up to 25 ns is permissible. This limited bus contention will not cause any damage to port 0 drivers.
PSEN t
LHLL
t
AVLL
t
LLAX
t
LLIV
LLPL
PLPH
PLIV
PXIX
PXIZ
PXAV
t
AVIV
AZPL
35 – 2t 10 – t 10 – t –55– 4t 10 – t 60 – 3t –25– 3t
–15 – ns
CLCL
–15 – ns
CLCL
–15 – ns
CLCL
–45 ns
CLCL
–15 – ns
CLCL
–15 – ns
CLCL
–50 ns
CLCL
0–0–ns
*)
–20– t
*)
20 – t
–5 – ns
CLCL
–65– 5t
–5 ns
CLCL
–60 ns
CLCL
– 5 – – 5 – ns
Semiconductor Group 43
Page 44
C504
AC Characteristics for C504-L40 / C504-2R40 (cont’d) External Data Memory Characteristics
Parameter Symbol Limit Values Unit
40-MHz clock Variable Clock
1/
t
= 3.5 MHz to
CLCL
40 MHz
min. max. min. max.
RD pulse width WR pulse width Address hold after ALE RD to valid data in Data hold after Data float after
RD
RD ALE to valid data in Address to valid data in ALE to Address valid to
WR or RD
WR WR or RD high to ALE high Data valid to Data setup before Data hold after Address float after
WR transition
WR
WR
RD
t
RLRH
t
WLWH
t
LLAX2
t
RLDV
t
RHDX
t
RHDZ
t
LLDV
t
AVDV
t
LLWL
t
AVWL
t
WHLH
t
QVWX
t
QVWH
t
WHQX
t
RLAZ
120 – 6t 120 – 6t 35 – 2t –75– 5t
–30 – ns
CLCL
–30 – ns
CLCL
–15 – ns
CLCL
–50 ns
CLCL
0 0–ns –38– 2t – 150 – 8t – 150 – 9t 60 90 3t 70 – 4t 10 40 t 5–t 125 – 7t 5–t
–15 3t
CLCL
–30 – ns
CLCL
–15 t
CLCL
–20 – ns
CLCL
–50 – ns
CLCL
–20 – ns
CLCL
–12 ns
CLCL
–50 ns
CLCL
–75 ns
CLCL
+15 ns
CLCL
+15 ns
CLCL
–0–0ns
External Clock Drive Parameter Symbol Limit Values Unit
Variable Clock
Freq. = 3.5 MHz to 40 MHz
min. max.
Oscillator period High time Low time Rise time Fall time
t
CLCL
t
CHCX
t
CLCX
t
CLCH
t
CHCL
25 294 ns 10 t 10 t
CLCL
CLCL
– t – t
CLCX
CHCX
ns
ns –10ns –10ns
Semiconductor Group 44
Page 45
C504
Figure 15 Program Memory Read Cycle
Figure 16 Data Memory Read Cycle
Semiconductor Group 45
Page 46
C504
Figure 17 Data Memory Write Cycle
Figure 18 External Clock Cycle
Semiconductor Group 46
Page 47
C504
ROM Verification Characteristics for C504-2R ROM Verification Mode 1
Parameter Symbol Limit Values Unit
min. max.
Address to valid data ENABLE to valid data Data float after ENABLE Oscillator frequency
t
AVQV
t
ELQV
t
EHQZ
1/
t
CLCL
–48t –48t 048t
CLCL
CLCL
CLCL
ns ns ns
4 6 MHz
Figure 19 ROM Verification Mode 1
Semiconductor Group 47
Page 48
C504
ROM Verification Mode 2 Parameter Symbol Limit Values Unit
min. typ max.
ALE pulse width ALE period Data valid after ALE Data stable after ALE P3.5 setup to ALE low Oscillator frequency
t
AWD
t
ACY
t
DVA
t
DSA
t
AS
1/
t
CLCL
–2t –12t
CLCL
CLCL
––4t 8 t
CLCL
– t
––ns
CLCL
–ns –ns
CLCL
ns
–ns
4–6MHz
Figure 20 ROM Verification Mode 2
Semiconductor Group 48
Page 49
AC Inputs during testing are driven at VCC– 0.5 V for a logic ’1’ and 0.45 V for a logic ’0’. Timing measurements are made at V
for a logic ’1’ and V
IHmin
for a logic ’0’.
ILmax
Figure 21 AC Testing: Input, Output Waveforms
C504
For timing purposes a port pin is no longer floating when a 100 mV change from load voltage occurs and begins to float when a 100 mV change from the loaded VOH/VOL level occurs.
I
OL/IOH
≥±20 mA
Figure 22 AC Testing : Float Waveforms
Figure 23 Recommended Oscillator Circuits for Crystal Oscillator
Semiconductor Group 49
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