Datasheet SAA7214 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

SAA7214

Transport MPEG2 source decoder

Preliminary specification
Supersedes data of 1999 Mar 16
File under Integrated Circuits, IC02

2001 Mar 28

Philips Semiconductors Preliminary specification

Transport MPEG2 source decoder SAA7214

FEATURES
General features

• Conditional access descrambling DVB-compliant

• Stream demultiplexing (TS, PES, program and

proprietary streams)

• Internal PR3001 32-bit RISC processor running at

40.5 MHz

• Low-power sleep modes supported across the chip

• Comprehensive driver software and development tool

support

• Package: SQFP208.
The following sections specify the featuresin more detail,

in the form of a feature matrix.

External interfaces

The SAA7214 supports the following external interfaces:

• Versatile compressed stream input at 108 Mbits/s

• A 16-bit microcontroller extension bus supporting

DRAM, Flash, (E)PROM and external memory mapped

• I/O devices. It also supports a synchronous interface to
communicate with the integrated MPEG AVGD decoder
SAA7215 at 40.5 Mbytes.

• an IEEE 1284 interface (Centronics) supporting master
and slave modes. Usable as a general purpose port

• A dedicated interface to IEEE 1394 devices (such as
Philips’ PDI 1394 chip set)

• Two UART (RS232) data ports with DMA capabilities
(≤187.5 kbits/s) including hardware flow control RxD,
TxD, RTS and CTS for modem support

• An elementary UART with DMA capabilities,(e.g.
dedicated to front panel devices for instance)

• Two dedicated smart-card reader interfaces (ISO 7816
compatible) with DMA capabilities

• Two I2C-bus master/slave transceivers supporting the
standard (100 kbit/s) and fast (400 kbits/s) I2C-bus
modes

• 32 general purpose, bidirectional I/O interface pins, the
first 8 bits may also be used as interrupt inputs

• One PWM output (8-bit resolution)

• A GP/HS interface supporting stream recording through

IEEE 1394 IC

• A JTAG interface for board test support.

CPU related features

The SAA7214 contains an embedded RISC CPU, which
incorporates the following features:

• A 32-bit PR3001 core

• 1 kbyte data, and 4 kbytes Instruction caches

(write-through style)

• A programmable low-power mode, including wake-up
on interrupt

• A memory management unit

• Two fully independent 24-bit timers and one 24-bit timer

including watchdog facilities

• A real-time clock unit (active in sleep mode)

• Built-in software debug support

• Anon-chip4 kbytes SRAM for storing code which needs

fast execution.

MPEG2 systems features

MPEG2 systems features of the SAA7214 include the
following

• Parsing of TS, PS (HW) and proprietary (SW) data
streams. Maximum input rate is 108 Mbits/s

• A real-time, DVB compliant descrambler core,
incorporating storage for up to 6 control word pairs

• HW section filtering based on 32 different PIDs with a
flexible number of filter conditions (8 or 4 byte condition
+ 8 or 4 byte mask) per PID and a total filter capacity of
40(8 byte condition checks) orupto80(4 bytecondition
checks) filter conditions.

• 4 TS/PES filters for retrieval for data at TS or PES level
for applications such as subtitling, TXT or retrieval of
private

• Data

• Flexible DMA based storage of the 32 section sub

streams and 4 TS/PES data substreams in the external
memory

2001 Mar 28 2

Philips Semiconductors Preliminary specification

Transport MPEG2 source decoder SAA7214

• System time base management with a double counter
mechanism for clock control and discontinuity handling

• 2 PTS/DTS timers

• A GP/HS filter which can serve as alternate input from

for example EEE1394 devices. It can also output either
scrambled or descrambled TS to IEEE 1394 devices.

APPLICATIONS

• Digital television decoder environment.

GENERAL DESCRIPTION
SAA7214 system overview

The device is part of a comprehensive source decoding kit
which contains all the hardware and software required to
receive and decode MPEG2 transport streams, including
descrambling, demultiplexing. In addition, it includes a
MIPS PR3001 RISC CPU core and several peripheral
interfaces such as UARTs, I2C-bus units, and an
IEEE 1284 (Centronics) interface. The SAA7214 is
therefore capable of performing all controller tasks in
digital television applications such as set-top boxes.
The SAA7214 is compliant to DVB specification.

The SAA7214 receives transport streams through a
versatile stream input interface capable of handling both
byte-parallel and bit-serial streams, in various formats,
supportingdatastreamsuptoand including 13.5 Mbytes/s
(108 Mbits/s).Thestreamdataisfirst applied to an on-chip
descrambler incorporating DVB descrambling algorithm,
onthe basis of 6 control word pairs stored in on-chip RAM.
Demultiplexing is subsequently applied to the stream, to
separate up to 32 individual data streams.

The demultiplexer section includes clock recovery and
timebase management. Program Specific Information
(PSI), Service Information (SI), Conditional Access (CA)
messages and private data are selected and stored in
external memory, for subsequent off-line processing by
the internal PR3001 CPU core.

To support advanced board testing facilities, the SAA7214
includes boundary scan test hardware, in accordance with
the JTAG standard. The device features a low-power
sleep mode, which is capable of sustaining set-top box
standby functionality, thus eliminating the need for a
separate front-panel controller. The SAA7214 requires a
supplyvoltage of 3.3 V and some devices input and output
interfaces are 5 V tolerant. The device is mounted in a
SQFP208 package.

2001 Mar 28 3

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2001 Mar 28 4

handbook, full pagewidth

BLOCK DIAGRAM

Philips Semiconductors Preliminary specification

Transport MPEG2 source decoder SAA7214

CPU section

MIPS

PR3001

CORE

DATA CACHE

INST. CACHE

TIMER 1

TIMER 2

TIMER-WD 3

PI-bus

SS MM

PI-BUS

CTRL

JTAG

EXTENSION BUS

CONTROLLER

CARDREADER UART

INPUT

INTERFACE

GP/HS

INTERFACE

1394 GATEWAY

MPEG SYSTEM

GATEWAY

01 0 10

12

PWM Demultiplexer Descrambler section

PID

FILTER

PCR

PROCESSING

PIO

INTERFACE

DESCRAMBLER

MPEG system-bus

TS/PES

LTERS

SSM

I2C

SECTION

LTERS

LTER DMA

CONTROLLER

M

1284

RTC

32KHz

AV

LTER

Peripheral section

AUDIO AND

VIDEO

INTERFACE

MPEG SYSTEM

INT.HANDLER

SS S

INTERRUPT

CONTROLLER

Reset

Clock

4 KBYTE

S-RAM

Fig.1 Block diagram.

FCE105

Philips Semiconductors Preliminary specification

Transport MPEG2 source decoder SAA7214

APPLICATION INFORMATION

handbook, full pagewidth

Telco i/f

Smart

cards

FRONT
PANEL

CONTROL

VXX

MODEM

TDA8004

16 MBIT
SDRAM

16 MBIT

SDRAM

(OPTIONAL)

2

C

I

TDA8060
TDA5056

TUNER

SAA8044

(SDD)

SAA7214

AV PES

SAA7215

(AVGD)

MPEG TS

BUFFERS

1394

L+PHY

IEE1384
RS232

IEEE1394

FLASH

DRAM

(OPTIONAL)

FCE106

AUDIO DAC

SWITCHING

SCART1 SCART2 SCART3

Fig.2 Set-top box example.

2001 Mar 28 5

Philips Semiconductors Preliminary specification

Transport MPEG2 source decoder SAA7214

PACKAGE OUTLINE

SQFP208: plastic shrink quad flat package;
208 leads (lead length 1.3 mm); body 28 x 28 x 3.4 mm; high stand-off height

c

y

X

A

SOT316-1

157

208

156

105

104

Z

E

e

H

E

E

w M

b

p

A

2

A

A

1

(A )

3

θ

L

p

L

pin 1 index

1

w M

b

e

p

Z

D

H

D

53

52

v M

D

A

B

v M

B

detail X

0 5 10 mm

scale

DIMENSIONS (mm are the original dimensions)

mm

A

max.

4.10

0.50

0.25

3.6

3.2

0.25

UNIT A1A2A3b

cE

p

0.27

0.20

0.17

0.09

(1)

(1) (1)(1)

D

28.1

27.9

eH

28.1

0.5

27.9

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

IEC JEDEC EIAJ

REFERENCES

SOT316-1 MS-029

2001 Mar 28 6

H

30.9

30.3

D

E

30.9

30.3

LL

p

0.75

0.45

0.080.21.3 0.08

EUROPEAN

PROJECTION

Z

1.39

1.11

D

Zywv θ

E

1.39

1.11

o

8

o

0

ISSUE DATE

99-12-27
00-01-25

Philips Semiconductors Preliminary specification

Transport MPEG2 source decoder SAA7214

SOLDERING
Introduction to soldering surface mount packages

Thistextgivesaverybriefinsightto a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
totheprinted-circuitboardbyscreenprinting,stencillingor
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswithleadsonfour sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

2001 Mar 28 7

Philips Semiconductors Preliminary specification

Transport MPEG2 source decoder SAA7214

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

WAVE REFLOW

(1)

BGA, SQFP not suitable suitable

SOLDERING METHOD

HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable

(3)

PLCC

, SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

(2)

(3)(4)
(5)

suitable

suitable
suitable

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2001 Mar 28 8

Philips Semiconductors Preliminary specification

Transport MPEG2 source decoder SAA7214

DATA SHEET STATUS

PRODUCT

DATA SHEET STATUS

Objective data Development This data sheet contains data from the objective specification for product

Preliminary data Qualification This data sheet contains data from the preliminary specification.

Product data Production This data sheet contains data from the product specification. Philips

(1)

STATUS

(2)

DEFINITIONS

development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

DEFINITIONS
Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseoratanyotherconditionsabovethosegivenin the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythat such applications will be
suitable for the specified use without further testing or
modification.

DISCLAIMERS
Life support applications  These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomersusingorselling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseofanyofthese products, conveys no licence or title
under any patent, copyright, or mask work right to these
products,andmakesnorepresentationsorwarrantiesthat
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

ICs with MPEG-2 functionality  Use of this product in
any manner that complies with the MPEG-2 Standard is
expressly prohibited without a license under applicable
patents in the MPEG-2 patent portfolio, which license is
available from MPEG LA, L.L.C., 250 Steele Street, Suite
300, Denver, Colorado 80206.

2001 Mar 28 9

Philips Semiconductors Preliminary specification

Transport MPEG2 source decoder SAA7214

PURCHASE OF PHILIPS I2C COMPONENTS

Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

2

C components conveys a license under the Philips’ I2C patent to use the

2001 Mar 28 10

Philips Semiconductors Preliminary specification

Transport MPEG2 source decoder SAA7214

NOTES

2001 Mar 28 11

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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable andmaybe changed
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under patent- or other industrial or intellectual property rights.

2001

Internet: http://www.semiconductors.philips.com

72

Printed in The Netherlands 753504/03/pp12 Date of release: 2001 Mar 28 Document order number: 9397 750 08174