Datasheet SAA7152 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

SAA7152

Digital Video Comb Filter (DCF)

Product specification
File under Integrated Circuits, IC02

August 1996

Philips Semiconductors Product specification

Digital Video Comb Filter (DCF) SAA7152

FEATURES

• Comb filter circuit for luminance and chrominance
separation

• Applicable for standards
– PAL B/G, M and N
– PAL 4.43 (525 lines, 60 Hz)
– NTSC M and N
– NTSC 4.43 (50 and 60 Hz)

• Luminance and chrominance bypasses with short delay
in case of no filtering

• Line-locked system clock; CCIR-compatible

• I2C-bus controlled

GENERAL DESCRIPTION

The CMOS digital comb filter circuit is located between
video analog-to-digital converters and the video
multistandard decoder SAA7151B (not applicable for
SAA7191B). The two-dimensional filtering is only
appropriate for standard signals from a source with
constant phase relationship between subcarrier signal and
horizontal frequency. The comb-filter has to be switched
off for VTR-signals and for separate VBS and C signals. In
VCR and S-Video operation the luminance low-pass and
the chrominance bandpass parts can still be used for noise
reduction purposes. The processing delay is:

21 × LL27 clocks in active mode, or
3 × LL27 in short delay bypass mode (BYPS = 1)

QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

DD

I

P

V

i

V

o

supply voltage (pins 11, 34, 44) 4.5 5.0 5.5 V
total supply current − 85 180 mA
input levels TTL-compatible

output levels TTL-compatible
LL27 typical system clock frequency − 27 − MHz
T

amb

operating ambient temperature range 0 − 70 °C

ORDERING INFORMATION

EXTENDED

TYPE NUMBER

PINS PIN POSITION MATERIAL CODE

PACKAGE

SAA7152 44 PLCC plastic SOT187

Note

1. SOT187-2; 1997 January 06.

August 1996 2

(1)

Philips Semiconductors Product specification

Digital Video Comb Filter (DCF) SAA7152

BLOCK DIAGRAM

handbook, full pagewidth

CVBS(7 -0)

CIN(7 -0)

LL27

2

I C-bus

SDA

SCL

20 to 13

10 to 3

2

23

24

SAA7152

INPUT

INTERFACE

CSEL

CLOCK

BUFFER

control bits

2

I C-BUS

CONTROL

luminance bypass

clk

+5 V

V

DDD1

NLIN,
LLEN

LINE

DELAY 1

BANDPASS

FILTER 2

LOW-PASS

FILTER

chrominance bypass

11, 34, 44

CFRQ

TAPS,
CFRQ

to V

DDD3

CFRQ

BANDPASS

FILTER 1

LINE

DELAY 2

COMB FILTER

LOGIC

(MED)

ADDER

AND

LIMITER

NLIN,
LLEN

MULTIPLEXER

CCMB,
TAPS

YCMB

BYPS

OUTPUT

INTERFACE

REGISTER

25 to 32

35 to 42

YOUT(7-0)

COUT(7-0)

RESN

1

21
SP AP

22

12, 33, 43

V to V

SSD1

SSD3

MEH423-1

Fig.1 Block diagram.

August 1996 3

Philips Semiconductors Product specification

Digital Video Comb Filter (DCF) SAA7152

PINNING

SYMBOL PIN DESCRIPTION

RESN 1 reset input; active low
LL27 2 line-locked system clock input (27 MHz)
CIN0 3
CIN1 4
CIN2 5
CIN3 6
CIN4 7
CIN5 8
CIN6 9
CIN7 10
V
V

DD1
SS1

11 +5 V supply input

12 ground 1 (0 V)
CVBS0 13
CVBS1 14
CVBS2 15
CVBS3 16
CVBS4 17
CVBS5 18
CVBS6 19
CVBS7 20
SP 21 connected to ground (shift pin for testing)
AP 22 connected to ground (action pin for testing)
SDA 23 I
SCL 24 I
YOUT7 25
YOUT6 26
YOUT5 27
YOUT4 28
YOUT3 29
YOUT2 30
YOUT1 31
YOUT0 32
V
V

SS2
DD2

33 ground 2 (0 V)

34 +5 V supply input 2

chrominance input data bits CIN0 to CIN7

CVBS input data bits 0 to 7

2

C-bus data line

2

C-bus clock line

luminance (Y) output data bits 7 to 0

August 1996 4

Philips Semiconductors Product specification

Digital Video Comb Filter (DCF) SAA7152

SYMBOL PIN DESCRIPTION

COUT7 35
COUT6 36
COUT5 37
COUT4 38
COUT3 39
COUT2 40
COUT1 41
COUT0 42
V
V

SS3
DD3

43 ground 3 (0 V)

44 +5 V supply input 3

chrominance (C) output data bits 7 to 0

handbook, full pagewidth

COUT2
COUT1

COUT0

V

SS3

V

DD3

RESN

LL27

CIN0

CIN1

CIN2

CIN3

SS2

DD2

V

12

V

33 29303132

13 17161514

YOUT0

YOUT1

COUT3

39 3435363738

40
41

42
43
44

1

2
3

4
5

6

711109

COUT4

8

COUT5

COUT7

COUT6

SAA7152

YOUT2

YOUT3

28
27
26

25
24

23
22

21
20

19
18

YOUT4
YOUT5

YOUT6
YOUT7

SCL

SDA
AP
SP

CVBS7
CVBS6

CVBS5

CIN4

CIN5

CIN6

CIN7

V

DD1

V

SS1

Fig.2 Pin configuration.

August 1996 5

CVBS0

CVBS1

CVBS2

CVBS3

CVBS4

MEH422

Philips Semiconductors Product specification

Digital Video Comb Filter (DCF) SAA7152

handbook, full pagewidth

CVBS

Y

CHROMA

UV

ADC

TDA8708A

ADC

TDA8709A

CVBS(7-0) YOUT(7-0)

DCF

DIGITAL

VIDEO
COMB

FILTER

SAA7152

CIN(7-0)

clock

COUT(7-0)

LL27

Fig.3 System environment.

CVBS/Y

CUV

DMSD

SAA7151B

CREF

LL27

CGC

SAA7157

YUV

LFCO

MEH557-1

August 1996 6

Philips Semiconductors Product specification

Digital Video Comb Filter (DCF) SAA7152

I2C-BUS FORMAT

S SLAVE ADDRESS A SUBADDRESS A DATA0 A ........ DATAn A P

S = start condition
SLAVE ADDRESS = 1011 0010 (B2 h)
A = acknowledge, generated by the slave
SUBADDRESS
DATA = data byte (Table 1)
P = stop condition
X = read/write control bit

Note

1. If more than 1 byte DATA are transmitted, then auto-increment of the subaddress is performed.

(1)

= subaddress byte (Table 1)

X = 0, order to write (the circuit is slave receiver)
X = 1, order to read (the circuit is slave transmitter)

August 1996 7

Philips Semiconductors Product specification

Digital Video Comb Filter (DCF) SAA7152

Table 1 I2C-bus; subaddress and data bytes for writing (after X = 0 in address byte)

FUNCTION SUBADDRESS

Controls 00 BYPS CSEL CCMB YCMB TAPS CFRQ NLIN LLEN

Function of the bits of Table 1:

BYPS Select bypass with a short delay; all other

functions are disabled:

CSEL Input mode select: 0 = CVBS selected

CCMB Select comb filtering 0 = chrominance is bandpassed

YCMB Enable chrominance substruction from

CVBS signal:

TAPS Selects tap for switching Y and C to

adder:

CFRQ Select centre frequency and matching

factor of chrominance filter:

NLIN Select delay (number of lines): 0 = 4-line comb filter for standard PAL

LLEN Selects the number of clocks for each

line delay:

D7 D6 D5 D4 D3 D2 D1 D0

0 = no bypass
1 = comb filter bypassed (delay is 3 LLC)

1 = Y/C selected

1 = chrominance is comb-filtered
0 = disabled, CVBS/Y signal is only low-passed
1 = enabled (chrominance trap or comb filtering)
0 = for bandpass/low-pass combination
1 = for comb filter active
0 = 4.43 MHz
1 = 3.58 MHz

1 = 2-line filter for standard NTSC
0 = 1728 clocks (625 lines; 50 Hz)
1 = 1716 clocks (525 lines; 60 Hz)

DATA

August 1996 8

Philips Semiconductors Product specification

Digital Video Comb Filter (DCF) SAA7152

handbook, full pagewidth

0

-6

video
(dB)

-12

-18

-24

-30

-36

-42

-48
02

4

68

10

12

14 16

f (MHz)

Fig.4 Frequency response of bandpass filters 1 and 2 with CFRQ-bit = 1.

MEH424

ndbook, full pagewidth

0

-6

video
(dB)

-12

-18

-24

-30

-36

-42

-48
02

4

68

10

12

14 16

f (MHz)

Fig.5 Frequency response of bandpass filters 1 and 2 with CFRQ-bit = 0.

MEH425

August 1996 9

Philips Semiconductors Product specification

Digital Video Comb Filter (DCF) SAA7152

ok, full pagewidth

0

-6

video
(dB)

-12

-18

-24

-30

-36

-42

-48
02

Fig.6 Frequency response of low-pass filter with CFRQ-bit = 1.

4

68

MEH426

10

12

14 16

f (MHz)

handbook, full pagewidth

0

-6

video
(dB)

-12

-18

-24

-30

-36

-42

-48
02

MEH427

4

68

10

12

14 16

f (MHz)

Fig.7 Frequency response of low-pass filter with CFRQ-bit = 0.

August 1996 10

Philips Semiconductors Product specification

Digital Video Comb Filter (DCF) SAA7152

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

DD

V

I

V

O

P

tot

T

stg

T

amb

V

ESD

Note

1. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor; inputs and outputs are protected
against electrostatic discharge in normal handling. Normal precautions appropriate to handle MOS devices is
recommended (see

supply voltage (pins 11, 34, 44) −0.5 7.0 V
voltage on all inputs −0.5 VDD + 0.5 V
voltage on all outputs (I

= 20 mA) −0.5 VDD + 0.5 V

O max

total power dissipation − 1.0 W
storage temperature range −65 150 °C
operating ambient temperature range 0 70 °C
electrostatic handling

“Handling MOS Devices”

(1)

for all pins −±2000 V

).

CHARACTERISTICS

V

DD1

to V

DD3

= 5 V; T

= 0 to 70 °C and measurements taken in Fig.1 unless otherwise specified.

amb

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

DD

I

DD

supply voltage range (pins 11, 34, 44) 4.5 5.0 5.5 V
total supply current (pins 11, 34, 44) VDD = 5 V; inputs LOW;

− 85 180 mA

outputs not connected

2

C-bus, SDA and SCL (pins 23 and 24)

I

V

IL

V

IH

I

23, 24

I

ACK

V

OL

input voltage LOW −0.5 − 1.5 V
input voltage HIGH 3 − VDD+0.5 V
input current −−±10 µA
output current on pin 23 acknowledge 3 −− mA
output voltage at acknowledge I23 = 3 mA −−0.4 V

Data and clock inputs (pins 2 to 10 and pins 13 to 20)

V
V
V
V
I
C

IL
IH
IL
IH

leak

I

LL27 input voltage (pin 2) LOW −0.5 − 0.6 V

HIGH 2.4 − VDD+0.5 V

other input voltages LOW −0.5 − 0.8 V

HIGH 2.0 − VDD+0.5 V
input leakage current −−10 µA
input capacitance data inputs −−8pF

clock inputs −−10 pF

t

SU.DAT

t

HD.DAT

input data set-up time Fig.8 11 −− ns
input data hold time 3 −− ns

August 1996 11

Philips Semiconductors Product specification

Digital Video Comb Filter (DCF) SAA7152

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Data outputs (pins 25 to 32 and pins 35 to 42)

V

OL

V

OH

C

L

Timing of data outputs

t

OH

t

OD

Line locked clock input LL27 (pin 2)

t

LL27

t

p

t

r

t

f

Note

1. tSU, tHD, tOH and tOD include tr and tf.

output voltage LOW 0 − 0.6 V
output voltage HIGH 2.4 − V

DD

V

load capacitor 8 − 25 pF

Fig.8
output signal hold time from

CL = 8 pF 3 −− ns
positive edge of LL27

output delay from

CL = 25 pF −−32 ns
positive edge of LL27

Fig.8
cycle time note 1 35 − 39 ns

duty factor t

LL27H

/ t

LL27

40 50 60 %
rise time −−5ns
fall time −−6ns

handbook, full pagewidth

clock input LL27

input data

output data

t

t

LL27 H

t

SUtHD

not valid

t

OD

t

OH

not valid

Fig.8 Data input and output timing.

LL27

t

2.4 V

1.5 V

0.6 V

f

t

r

2.0 V

0.8 V

2.4V

0.6 V

MEH556-1

August 1996 12

Philips Semiconductors Product specification

Digital Video Comb Filter (DCF) SAA7152

PACKAGE OUTLINE

PLCC44: plastic leaded chip carrier; 44 leads

e

D

y

40

44

1

pin 1 index

6

β

k

717

e

D

H

D

X

2939

SOT187-2

e

E

A

Z

E

28

H

E

E

A

A

1

A

e

18

k

1

v M

Z

D

A

4

B

v M

B

w M

detail X

b

p

b

1

(A )

3

L

p

0 5 10 mm

scale

DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

UNIT A

mm

inches

A

1

min. max. max. max. max.

4.57

0.51

4.19

0.180

0.020

0.165

A

0.25

0.01

A

4

3

3.05

0.12

b

0.53

0.33

0.021

0.013

b

p

1

0.81

0.66

0.032

0.026

D

16.66

16.51

0.656

0.650

(1)

(1)

E

eH

16.66

1.27

16.51

0.656

0.05

0.650

e

D

16.00

14.99

0.630

0.590

e

E

16.00

14.99

0.630

0.590

17.65

17.40

0.695

0.685

Note

1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.

OUTLINE

VERSION

SOT187-2

IEC JEDEC EIAJ

112E10 MO-047AC

REFERENCES

August 1996 13

H

E

D

17.65

17.40

0.695

0.685

k

1.22

1.07

0.048

0.042

k

0.51

0.020

1

0.057

0.040

L

p

1.44

1.02

EUROPEAN

PROJECTION

(1) (1)

Z

Z

E

D

ywv β

0.18 0.100.18

0.007 0.0040.007

2.16

0.085

2.16

0.085

o

45

ISSUE DATE

92-11-17
95-02-25

Philips Semiconductors Product specification

Digital Video Comb Filter (DCF) SAA7152

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

Reflow soldering

Reflow soldering techniques are suitable for all PLCC and
QFP packages.

The choice of heating method may be influenced by larger
PLCC or QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our

Reference Handbook”

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

(order code 9398 652 90011).

“Quality

(order code 9397 750 00192).

• The package footprint must incorporate solder thieves at
the downstream corners.

QFP
Wave soldering is not recommended for QFP packages.

This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.

• The footprint must be at an angle of 45° to the board
direction and must incorporate solder thieves
downstream and at the side corners.

Even with these conditions, do not consider wave
soldering the following packages: QFP52 (SOT379-1),
QFP100 (SOT317-1), QFP100 (SOT317-2),
QFP100 (SOT382-1) or QFP160 (SOT322-1).

M

ETHOD (PLCC AND QFP)

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

Wave soldering

PLCC
Wave soldering techniques can be used for all PLCC

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

August 1996 14

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Philips Semiconductors Product specification

Digital Video Comb Filter (DCF) SAA7152

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

2

PURCHASE OF PHILIPS I

C COMPONENTS

2

Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

C components conveys a license under the Philips’ I2C patent to use the

August 1996 15