Datasheet SAA6581T Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

SAA6581T

RDS/RBDS demodulator

Product specification
File under Integrated Circuits, IC01

2001 May 07

Philips Semiconductors Product specification

RDS/RBDS demodulator SAA6581T

FEATURES

• Integrated switched capacitor filter

• Demodulates European Radio Data System (RDS) or

the USA Radio Broadcast Data System (RBDS) signals

• Oscillator frequencies: 4.332 or 8.664 MHz

• Integrated ARI clamping

• CMOS device

• Single supply voltage: 5 V

• Extended temperature range: −40 to +85 °C

• Low number of external components.

GENERAL DESCRIPTION

The RDS/RBDS demodulator is a CMOS device with
integrated filtering and demodulating of RDS/RBDS
signals comingfrom a multiplexed input data stream. Data
signal RDDA and clock signal RDCL are provided as
outputs for further processing by a suitable
microcomputer, for example CCR921 and CCR922.

The SAA6581T replaces SAA6579 in function and
pin-compatibility.

APPLICATIONS

The RDS/RBDS system offers a large range of
applications from the many functions that can be
implemented. For car radios the most important are:

• Program Service (PS) name

• Traffic Program (TP) identification

• Traffic Announcement (TA) signal

• Alternative Frequency (AF) list

• Program Identification (PI)

• Enhanced Other Networks (EON) information.

QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

DDA

V

DDD

I

DD(tot)

V

i(MPX)

f

i(xtal)

analog supply voltage 4.0 5.0 5.5 V
digital supply voltage 4.0 5.0 5.5 V
total supply current − 6.0 − mA
RDS input sensitivity at pin MPX 1 −−mV
crystal input frequency − 4.332 − MHz

− 8.664 − MHz

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

SAA6581T SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

2001 May 07 2

Philips Semiconductors Product specification

RDS/RBDS demodulator SAA6581T

BLOCK DIAGRAM

handbook, full pagewidth

multiplex

input

+5 V

100 nF

330 pF

C2

C1

MPX

V

DDA

4

5

8th ORDER

BANDPASS FILTER

POWER
SUPPLY

AND RESET

6
V

SSAVref

57 kHz

560 pF

C6

87

SAA6581T

TEST

CONTROL

15

TCON

C3

2.2 µF

Fig.1 Block diagram.

CINSCOUT

CLOCKED

COMPARATOR

9

MODE

47 pF

OSCILLATOR

AND CLOCK

13 14

OSCIQ1OSCO

C4

+5 V

V

DDD

12

RDS/RBDS

DEMODULATOR

SIGNAL QUALITY

DETECTOR

C5
56 pF

113
V

SSD

C7
100 nF

10

SYNC

RDCL

16

2

RDDA

1

QUAL

MHB899

2001 May 07 3

Philips Semiconductors Product specification

RDS/RBDS demodulator SAA6581T

PINNING

SYMBOL PIN DESCRIPTION

QUAL 1 signal quality indication output
RDDA 2 RDS data output
V

ref

3 reference voltage output (1/2V
MPX 4 multiplex signal input
V
V

DDA
SSA

5 analog supply voltage (5 V)

6 analog ground (0 V)
CIN 7 comparator input
SCOUT 8 switched capacitor filter output
MODE 9 oscillator frequency select input
SYNC 10 ARI clamping control input
V
V

SSD
DDD

11 digital ground (0 V)

12 digital supply voltage (5 V)
OSCI 13 oscillator input
OSCO 14 oscillator output
TCON 15 test control input
RDCL 16 RDS clock output

DDA

)

handbook, halfpage

1

QUAL

2

RDDA

3

V

ref

4

MPX

V

DDA

V

SSA

CIN

SCOUT

SAA6581T

5
6
7
8

MHB900

Fig.2 Pin configuration.

16
15
14
13
12
11
10

9

RDCL
TCON
OSCO
OSCI
V

DDD

V

SSD

SYNC
MODE

FUNCTIONAL DESCRIPTION
RDS/RBDS signal demodulation

BANDPASS FILTER
The bandpass filter has a centre frequency of 57 kHz. It

selects the RDS/RBDSsub-band fromthe multiplex signal
MPX and suppresses the audio signal components. The
filter block contains an analog anti-aliasing filter at the
inputfollowedby an 8thorderswitched capacitor bandpass
filter and a reconstruction filter at the output.

CLOCKED COMPARATOR
Thecomparator digitizestheoutput signalfromthe 57 kHz

bandpass filter for further processing by the digital
RDS/RBDS demodulator. To attain high sensitivity and to
avoid phase distortion, the comparator input stage has
automatic offset compensation.

DEMODULATOR
The demodulator provides all functions of the SAA6579

and improves performance under weak signal conditions.

Demodulator functions include:

• 57 kHz carrier regeneration from the two sidebands
(Costas loop)

• Symbol integration over one RDS clock period

• Bi-phase symbol decoding

• Differential decoding

• Synchronization of RDS/RBDS output data.

The RDS/RBDS demodulator recovers and regenerates
the continuously transmitted RDS/RBDS data stream in
the MPX signal and provides clock RDCL for the output
signalsand dataoutput RDDA forfurther processingby an
RDS/RBDS decoder, for example CCR921 or CCR922.

ARI CLAMP
The demodulator checks the input signal for presence of

RDS only, or RDS plus ARI transmissions. After a fixed
test period, if the SYNC inputis setHIGH the demodulator
locksin the ‘verified’condition(seeTable 1). If SYNCisset
LOW, the ARI clamping is reset (disabled). After SYNC
returns to HIGH, the demodulator resumes checking the
input signal.

2001 May 07 4

Philips Semiconductors Product specification

RDS/RBDS demodulator SAA6581T

Table 1 Control pin SYNC

SYNC ARI CLAMPING

LOW internal ARI clamping disabled

HIGH ARI clamping allowed to be logged

SIGNAL QUALITY DETECTION
Output QUAL indicates thesafety ofthe regeneratedRDS

Table 2 Control pins TCON and MODE

TCON MODE OSCILLATOR FREQUENCY

HIGH LOW 4.332 MHz
HIGH HIGH 8.664 MHz

The clock generator generates the internal 4.332 MHz
system clock and timing signal derivatives.

data (HIGH = ‘good’ data; LOW = ‘unsafe’ data).

Power supply and internal reset

Oscillator and system clock generator

For good performance of the bandpass and demodulator
stages, the demodulator requires a crystal oscillator with a
frequency of 4.332 or 8.664 MHz. The demodulator can
operatewith eitherfrequency(see Table 2),so that aradio
set with a microcontroller can run, in this case, with one
crystal only. The demodulator oscillator can drive the

Thedemodulator hasseparate power supplyinputs forthe
digital and analog parts of the device. For the analog
functions an additional reference voltage (1⁄2V

DDA

) is
internally generated and available via the output pin V
The demodulator requires a defined reset condition. The
demodulator generates automatically a reset signal after
the power supplyV

is switched on,or ata voltage-drop.

DDA

microcontroller, or vice versa.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

DD

V

n

I

i

I

lu(prot)

supply voltage 0 6.5 V
voltage at pins 1 to 4, 7 to 10, and

13 to 16 with respect to pins 6 and 11
inputcurrent atpins 1 to 5, 7 to 11 and

13 to 16
latch-up protection current in pulsed

mode

pins 5 and 12 are
connected to V

DD

pins 6 and 11 are
connected to ground

T

= −40 to +85 °C with

amb

voltage limiting −2 to +10 V
T

=25°C with voltage

amb

−0.5 VDD+ 0.5 ≤ 6.5 V

−10 +10 mA

−100 +100 mA

−200 +200 mA

limiting −2 to +12 V

= −40 to +85 °C

T

amb

−10 +10 mA

without voltage limiting

T

amb

T

stg

V

es

ambient temperature −40 +85 °C
storage temperature −65 +150 °C
electrostatic handling voltage note 1 −4000 +4000 V

note 2 −500 +500 V

ref

.

Notes

1. Human body model (equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor).

2. Machine model (equivalent to discharging a 200 pF capacitor through a0 Ω series resistorand 0.75 µH inductance).

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient in free air 104 K/W

2001 May 07 5

Philips Semiconductors Product specification

RDS/RBDS demodulator SAA6581T

CHARACTERISTICS: DIGITAL PART

V

DDA=VDDD

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

DDD

I

DDD

P

tot

Inputs

V

IL

V

IH

I

i(pu)

Outputs

V

OL

V

OH

Crystal parameters

f

i(xtal)

∆f

osc

∆f

osc(T)

C

L

R

xtal

=5V; T

=25°C; unless otherwise specified.

amb

digital supply voltage 4.0 5.0 5.5 V
digital supply current − 1.5 − mA
total power dissipation − 30 − mW

LOW-level input voltage at
pins TCON, OSCI, SYNC and
MODE

HIGH-level input voltage at
pins TCON, OSCI, SYNC and
MODE

input pull-up current at
pins TCON and MODE

LOW-level output voltage at
pins QUAL, RDDA and RDCL

HIGH-level output voltage at
pins QUAL, RDDA and RDCL

crystal input frequency TCON = HIGH;

 adjustment tolerance of oscillator

frequency

 temperature drift of oscillator

frequency
load capacitance − 30 − pF
crystal resonance resistance −−120 Ω

−−0.3V

0.7V

−− V

DDD

DDD

V

VIH= 3.5 V −10 −20 −µA

IOL=2mA −−0.4 V

IOH= −0.02 mA 4.0 −− V

− 4.332 − MHz

MODE = LOW
TCON = HIGH;

− 8.664 − MHz

MODE = HIGH

−−30 × 10

T

= −40 to +85 °C −−30 × 10

amb

−6

−6

2001 May 07 6

Philips Semiconductors Product specification

RDS/RBDS demodulator SAA6581T

CHARACTERISTICS: ANALOG PART

V

DDA=VDDD

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

DDA

V

DDA

I

DD(tot)

V

ref

Z

o(Vref)

MPX input (signal before the capacitor on pin MPX)

V

i(MPX)(rms)

V

i(max)(p-p)

R

i(MPX)

57 kHz bandpass filter

f

c

B

−3dB

G

SCOUT-MPX

α

sb

R

o(SCOUT)

Comparator input (pin CIN)

V

i(min)(rms)

R

i

=5V; T

=25°C; measurements taken in Fig.1; unless otherwise specified.

amb

analog supply voltage 4.0 5.0 5.5 V

− V

 difference between analog and

DDD

digital supply voltages
total supply current − 6.0 − mA
reference voltage V
output impedance at pin V

RDS amplitude (RMS value) ∆f=±1.2 kHz RDS-signal;

maximum input signal capability
(peak-to-peak value)

input resistance f = 0 to 100 kHz 40 −−kΩ

centre frequency T

−3 dB bandwidth 2.5 3.0 3.5 kHz
signal gain f = 57 kHz 17 20 23 dB
stop band attenuation ∆f=±7 kHz 31 −−dB

output resistance at pin SCOUT f = 57 kHz − 30 60 Ω

minimum input level
(RMS value)

input resistance 70 110 150 kΩ

ref

− 0 0.5 V

= 5 V 2.25 2.5 2.75 V

DDA

− 25 − kΩ

1 −−mV

∆f=±3.2 kHz ARI-signal
f=57±2 kHz 200 −−mV
f < 50 kHz 1.4 −−V
f < 15 kHz 2.8 −−V
f > 70 kHz 3.5 −−V

= −40 to +85 °C 56.5 57.0 57.5 kHz

amb

f < 45 kHz 40 −−dB
f < 20 kHz 50 −−dB
f > 70 kHz 40 −−dB

f = 57 kHz − 110mV

2001 May 07 7

Philips Semiconductors Product specification

RDS/RBDS demodulator SAA6581T

TIMING DATA

handbook, full pagewidth

RDCL

RDDA

t

d(clk)

t

CLKH

Table 3 RDS timing (see Fig.3)

SYMBOL PARAMETER TYP. UNIT

t

d(clk)

T

CLK

t

CLKH

T

bit(slipped)

clock-data delay 4 µs
clock period 842 µs
clock HIGH time 421 µs
slipped data bit period 1263 µs

t

T

CLK

T

bit(slipped)

d(clk)

Fig.3 RDS timing diagram including a phase change.

MHB901

2001 May 07 8

Philips Semiconductors Product specification

RDS/RBDS demodulator SAA6581T

PACKAGE OUTLINE

SO16: plastic small outline package; 16 leads; body width 7.5 mm

D

c

y

Z

16

pin 1 index

1

e

9

A

2

A

8

w M

b

p

SOT162-1

E

H

E

Q

1

L

p

L

detail X

(A )

A

X

v M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT162-1

A

max.

2.65

0.10

A

0.30

0.10

0.012

0.004

A2A

1

2.45

2.25

0.096

0.089

IEC JEDEC EIAJ

075E03 MS-013

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

10.5

7.6

10.1

7.4

0.41

0.30

0.29

0.050

0.40

REFERENCES

2001 May 07 9

eHELLpQ

1.27

10.65

10.00

0.419

0.394

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

0.25

0.25 0.1

0.01

0.01

EUROPEAN

PROJECTION

ywv θ

Z

0.9

0.4

8

0.004

ISSUE DATE

0.035

0.016

97-05-22

99-12-27

0

o
o

Philips Semiconductors Product specification

RDS/RBDS demodulator SAA6581T

SOLDERING
Introduction to soldering surface mount packages

Thistext gives averybrief insight toa complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for
certainsurface mount ICs,butit is notsuitablefor fine pitch
SMDs. In these situations reflow soldering is
recommended.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuitboardby screenprinting,stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.

Wave soldering

Conventional single wave soldering is not recommended
forsurface mount devices(SMDs)or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a

turbulent wavewith high upwardpressure followed bya
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackages with leadsonfour sides, thefootprintmust

be placedat a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

2001 May 07 10

Philips Semiconductors Product specification

RDS/RBDS demodulator SAA6581T

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

WAVE REFLOW

(1)

BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable

SOLDERING METHOD

HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS not suitable

(3)

PLCC

, SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

(2)

(3)(4)
(5)

suitable

suitable
suitable

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is onlysuitable for SSOP and TSSOPpackages with a pitch (e) equal toor larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2001 May 07 11

Philips Semiconductors Product specification

RDS/RBDS demodulator SAA6581T

DATA SHEET STATUS

PRODUCT

DATA SHEET STATUS

Objective data Development This data sheet contains data from the objective specification for product

Preliminary data Qualification This data sheet contains data from the preliminary specification.

Product data Production This data sheet contains data from the product specification. Philips

(1)

STATUS

(2)

DEFINITIONS

development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

DEFINITIONS
Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition Limiting valuesgiven are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
atthese or atany other conditionsabovethose given inthe
Characteristics sectionsof the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentation or warrantythat suchapplicationswill be
suitable for the specified use without further testing or
modification.

DISCLAIMERS
Life support applications  These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expectedto resultin personalinjury. Philips
Semiconductorscustomers using orselling theseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuse of anyofthese products, conveysnolicence or title
under any patent, copyright, or mask work right to these
products,and makes norepresentations or warrantiesthat
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

2001 May 07 12

Philips Semiconductors Product specification

RDS/RBDS demodulator SAA6581T

NOTES

2001 May 07 13

Philips Semiconductors Product specification

RDS/RBDS demodulator SAA6581T

NOTES

2001 May 07 14

Philips Semiconductors Product specification

RDS/RBDS demodulator SAA6581T

NOTES

2001 May 07 15

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South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

2001

Internet: http://www.semiconductors.philips.com

72

Printed in The Netherlands 753503/01/pp16 Date of release: 2001 May 07 Document order number: 9397 750 08148