Datasheet SAA6579T-V1 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of January 1994
File under Integrated Circuits, IC01

1997 Feb 24

INTEGRATED CIRCUITS

SAA6579

Radio Data System (RDS)
demodulator

1997 Feb 24 2

Philips Semiconductors Product specification

Radio Data System (RDS) demodulator SAA6579

FEATURES

• Anti-aliasing filter (2nd order)

• Integrated 57 kHz band-pass filter (8th order)

• Reconstruction filter (2nd order)

• Clocked comparator with automatic offset compensation

• 57 kHz carrier regeneration

• Synchronous demodulator for 57 kHz modulated RDS

signals

• Selectable 4.332/8.664 MHz crystal oscillator with
variable dividers

• Clock regeneration with lock on biphase data rate

• Biphase symbol decoder with integrate and dump

functions

• Differential decoder

• Signal quality detector

• Subcarrier output.

GENERAL DESCRIPTION

The integrated CMOS circuit SAA6579 is an RDS
demodulator. It recovers the additional inaudible RDS
information which is transmitted by FM radio broadcasting.

The data signal RDDA and the clock signal RDCL are
provided as outputs for further processing by a suitable
decoder (microcomputer).

The operational functions of the device are in accordance
with the

“CENELEC EN 50067”

.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

DDA

analog supply voltage (pin 5) 3.6 5.0 5.5 V

V

DDD

digital supply voltage (pin 12) 3.6 5.0 5.5 V

I

tot

total supply current − 6 − mA

V

i(rms)

RDS input amplitude (RMS value; pin 4) 1 −−mV

V

OH

HIGH level output voltage for signals RDDA, RDCL, QUAL and T57 4.4 −−V

V

OL

LOW level output voltage for signals RDDA, RDCL, QUAL and T57 −−0.4 V

T

amb

operating ambient temperature −40 − +85 °C

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

SAA6579 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1

SAA6579T SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

1997 Feb 24 3

Philips Semiconductors Product specification

Radio Data System (RDS) demodulator SAA6579

BLOCK DIAGRAM

Fig.1 Block diagram and application circuit.

Via pin MODE two different crystal frequencies can be used.

MODE CRYSTAL CLOCK

LOW 4.332 MHz
HIGH 8.664 MHz

handbook, full pagewidth

SAA6579

0.1 µF

ANTI-

ALIASING

FILTER

57 kHz

BANDPASS

(8th ORDER)

RECONSTRUCTION

FILTER

OSCILLATOR

AND

DIVIDER

CLOCKED

COMPARATOR

COSTAS LOOP
VARIABLE AND
FIXED DIVIDER

CLOCK

REGENERATION

AND SYNC

BIPHASE
SYMBOL

DECODER

DIFFERENTIAL

DECODER

TEST LOGIC AND OUTPUT

SELECTOR SWITCH

REFERENCE

VOLTAGE

2.2 µF

4

7

8

5

3

6

V

DDA

V

ref

V

P1

13

14

QUAL

RDDA

RDCL

T57

QUALITY BIT

GENERATOR

1

2

15

16

11

12

2.2 k

Ω

82 pF

47 pF

4.332/8.664 MHz

MPX

signal

330 pF



9

10

MODE TEST

560 pF

MEH162

V

SSD

V

DDD

+5 V

+5 V

OSCOOSCI

MUX

SCOUT

CIN

0.1 µF

V

SSA

1997 Feb 24 4

Philips Semiconductors Product specification

Radio Data System (RDS) demodulator SAA6579

PINNING

SYMBOL PIN DESCRIPTION

QUAL 1 quality indication output
RDDA 2 RDS data output
V

ref

3 reference voltage output (0.5V

DDA

)
MUX 4 multiplex signal input
V

DDA

5 +5 V supply voltage for analog part

V

SSA

6 ground for analog part (0 V)
CIN 7 subcarrier input to comparator
SCOUT 8 subcarrier output of reconstruction filter
MODE 9 oscillator mode/test control input
TEST 10 test enable input
V

SSD

11 ground for digital part (0 V)

V

DDD

12 +5 V supply voltage for digital part
OSCI 13 oscillator input
OSCO 14 oscillator output
T57 15 57 kHz clock signal output
RDCL 16 RDS clock output

handbook, halfpage

SAA6579

MGD684

1
2
3
4
5
6
7
8

QUAL

RDDA

V

ref

MUX

V

DDA

V

SSA

CIN

SCOUT

RDCL
T57
OSCO
OSCI
V

DDD

V

SSD

TEST
MODE

16
15
14
13
12
11
10

9

Fig.2 Pin configuration. Fig.3 Pin configuration.

handbook, halfpage

MGD685

1
2
3
4
5
6
7
8

16
15
14
13
12
11
10

9

QUAL

RDDA

V

ref

MUX

V

DDA

V

SSA

CIN

SCOUT

RDCL
T57
OSCO
OSCI
V

DDD

V

SSD

TEST
MODE

SAA6579T

1997 Feb 24 5

Philips Semiconductors Product specification

Radio Data System (RDS) demodulator SAA6579

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); ground pins 6 and 11 connected together.

Notes

1. Equivalent to discharging a 200 pF capacitor via a 0 Ω series resistor.

2. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

DDA

analog supply voltage (pin 5) 0 6 V

V

DDD

digital supply voltage (pin 12) 0 6 V

V

n

voltage on all pins; grounds excluded −0.5 V

DDX

+ 0.5 V

T

stg

storage temperature −40 +150 °C

T

amb

operating ambient temperature −40 +85 °C

V

es

electrostatic handling for all pins except
pins 9 and 10

note 1 ±300 − V
note 2 +1500 −3000 V

FUNCTIONAL DESCRIPTION

The SAA6579 is a demodulator circuit for RDS
applications. It contains a 57 kHz bandpass filter and a
digital demodulator to regenerate the RDS data stream out
of the multiplex signal (MPX).

Filter part

The MUX signal is band-limited by a second-order
anti-aliasing-filter and fed through a 57 kHz band-pass
filter (8th order band-pass filter with 3 kHz bandwidth) to
separate the RDS signals. This filter uses switched
capacitor technique and is clocked by a clock frequency of

541.5 kHz derived from the 4.332/8.664 MHz crystal
oscillator. Then the signal is fed to the reconstruction filter
to smooth the sampled and filtered RDS signal before it is
output on pin 8. The signal is AC-coupled to the
comparator (pin 7). The comparator is clocked with a
frequency of 228 kHz (synchronized by the 57 kHz of the
demodulator).

Digital part

The synchronous demodulator (Costas loop circuit) with
carrier regeneration demodulates the internal coupled,
digitized signal. The suppressed carrier is recovered from
the two sidebands (Costas loop). The demodulated signal
is low-pass-filtered in such a way that the overall pulse
shape (transmitter and receiver) approaches a
cosinusoidal form in conjunction with the following
Integrate and dump circuit.

The data-spectrum shaping is split into two equal parts and
handled in the transmitter and in the receiver. Ideally, the
data filtering should be equal in both of these parts.

The overall data-channel-spectrum shaping of the
transmitter and the receiver is approximately 100% roll-off.

The Integrate and dump circuit performs an integration
over a clock period. This results in a demodulated and
valid RDS signal in form of biphase symbols being output
from the integrate and dump circuit. The final stages of
RDS data processing are the biphase symbol decoding
and the differential decoding. After synchronization by
data clock RDCL (pin 16) data appears on the RDDA
output (pin 2). The output of the biphase symbol decoder
is evaluated by a special circuit to provide an indication of
good data (QUAL = HIGH) or corrupt data (QUAL = LOW).

Timing

Fixed and variable dividers are applied to the

4.332/8.664 MHz crystal oscillator to generate the

1.1875 kHz RDS clock RDCL, which is synchronized by
the incoming data. Which ever clock edge is considered
(positive or negative going edge) the data will remain valid
for 399 µs after the clock transition. The timing of data
change is 4 µs before a clock change. Which clock
transition (positive or negative going clock) the data
change occurs in, depends on the lock conditions and is
arbitrary (bit slip).

During poor reception it is possible that faults in phase
occur, then the clock signal stays uninterrupted, and data
is constant for 1.5 clock periods. Normally, faults in phase
do not occur on a cyclic basis. If however, faults in phase
occur in this way, the minimum spacing between two
possible faults in phase depends on the data being
transmitted. The minimum spacing cannot be less than
16 clock periods. The quality bit changes only at the time
of a data change.

1997 Feb 24 6

Philips Semiconductors Product specification

Radio Data System (RDS) demodulator SAA6579

CHARACTERISTICS

V

DDA=VDDD

=5V; T

amb

=25°C and measurements taken in Fig.1; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

DDA

analog supply voltage (pin 5) 3.6 5.0 5.5 V

V

DDD

digital supply voltage (pin 12) 3.6 5.0 5.5 V

I

tot

total supply current I5+I

12

− 6 − mA

V

ref

reference voltage (pin 3) V

DDA

=5V − 2.5 − V

MPX input (signal before the capacitor on pin 4)

V

i MPX(rms)

RDS amplitude (RMS value) ∆f=±1.2 kHz RDS;

∆f=±3.5 kHz ARI; see Fig.5

1 −−mV

V

i MPX(p-p)

maximum input signal capability
(peak-to-peak value)

f=57±2 kHz 200 −−mV
f < 50 kHz 1.4 −−V
f < 15 kHz 2.8 −−V
f > 70 kHz 3.5 −−V

R

4-6

input resistance f = 0 to 100 kHz 40 −−kΩ

G

8-4

signal gain f = 57 kHz 17 20 23 dB

57 kHz band-pass filter

f

c

centre frequency T

amb

= −40 to +85 °C 56.5 57.0 57.5 kHz
B −3 dB bandwidth 2.5 3.0 3.5 kHz
G stop band gain ∆f=±7 kHz 31 −−dB

f < 45 kHz 40 −−dB
f < 20 kHz 50 −−dB
f > 70 kHz 40 −−dB

R

o(8)

output resistance (pin 8) f = 57 kHz − 26 −Ω

Comparator input (pin 7)

V

i(rms)

minimum input level (RMS value) f = 57 kHz − 110mV

R

i

input resistance 70 110 150 kΩ

Oscillator input (pin 13)

V

IH

HIGH level input voltage V

DDD

= 5.0 V 4.0 −−V

V

IL

LOW level input voltage V

DDD

= 5.0 V −−1.0 V

I

I

input current V

DDD

= 5.5 V −−±1µA

1997 Feb 24 7

Philips Semiconductors Product specification

Radio Data System (RDS) demodulator SAA6579

Note

1. The signal T57 has a phase lead of 123° (±180°) relative to the ARI carrier at output SCOUT.

Digital demodulator and outputs QUAL, RDDA, T57, OSCO and RDCL (pins 1, 2, 14, 15 and 16)

V

OH

HIGH level output voltage IQ= −20 µA; V

DDD

= 4.5 V 4.4 −−V

V

OL

LOW level output voltage IQ= 3.2 mA; V

DDD

= 5.5 V −− 0.4 V

f

RDCL

nominal clock frequency RDCL − 1187.5 − Hz

∆t

RDCL

jitter of RDCL −− 18 µs

f

T57

nominal subcarrier frequency T57 note 1 − 57.0 − kHz

I

O

output current OSCO (pin 14) V

DDD

= 4.5 V; V14= 0.4 V 1.5 −−mA

V

DDD

= 4.5 V; V14= 4.1 V −1.6 −−mA

output current QUAL, RDDA, T57,
RDCL (pins 1, 2, 15 and 16)

V

DDD

= 4.5 V; V14= 0.4 V 5.9 −−mA

V

DDD

= 4.5 V; V14= 4.1 V −5.3 −−mA

4.332 MHz crystal parameters

f

0

XTAL frequency − 4.332 − MHz

∆f

max

maximum permitted tolerance −±50 − 10

−6

∆f

o

adjustment tolerance of f

0

T

amb

=25°C −−±20 10

−6

T

amb

= −40 to +85 °C −− ±25 10

−6

C

L

load capacitance − 30 − pF

R

xtal

resonance resistance −− 60 Ω

8.664 MHz crystal parameters

f

0

XTAL frequency − 8.664 − MHz

∆f

max

maximum permitted tolerance −±50 − 10

−6

∆f

o

adjustment tolerance of f

0

T

amb

=25°C −−±30 10

−6

T

amb

= −40 to +85 °C −− ±30 10

−6

C

L

load capacitance − 30 − pF

R

xtal

resonance resistance −− 60 Ω

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1997 Feb 24 8

Philips Semiconductors Product specification

Radio Data System (RDS) demodulator SAA6579

Fig.4 RDS timing diagram including a phase jump.

handbook, full pagewidth

4 µs 4 µs

842 µs 421 µs

MEH163

RDDA,
QUAL

RDCL

handbook, full pagewidth

0

100

correct

blocks

(%)

75

25

(1) (2)

50

MGD683

10

−1

1

10

Vi (RDS signal, RMS value)

(mV)

(1) RDS + ARI (BK).
(2) RDS only.

Fig.5 Typical RDS sensitivity.

1997 Feb 24 9

Philips Semiconductors Product specification

Radio Data System (RDS) demodulator SAA6579

PACKAGE OUTLINES

UNIT

A

max.

1 2

b

1

cEe M

H

L

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT38-1

92-10-02
95-01-19

A

min.

A

max.

b

max.

w

M

E

e

1

1.40

1.14

0.055

0.045

0.53

0.38

0.32

0.23

21.8

21.4

0.86

0.84

6.48

6.20

0.26

0.24

3.9

3.4

0.15

0.13

0.2542.54 7.62

0.30

8.25

7.80

0.32

0.31

9.5

8.3

0.37

0.33

2.2

0.087

4.7 0.51 3.7

0.15

0.021

0.015

0.013

0.009

0.010.100.0200.19

050G09 MO-001AE

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w M

b

1

e

D

A

2

Z

16

1

9

8

b

E

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

(1) (1)

D

(1)

Z

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

SOT38-1

1997 Feb 24 10

Philips Semiconductors Product specification

Radio Data System (RDS) demodulator SAA6579

UNIT

A

max.

A

1

A2A

3

b

p

cD

(1)E(1) (1)

eHELLpQ

Z

ywv θ

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

2.65

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

10.5

10.1

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8
0

o
o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT162-1

8

16

w

M

b

p

D

detail X

Z

e

9

1

y

0.25

075E03 MS-013AA

pin 1 index

0.10

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.41

0.40

0.30

0.29

0.050

1.4

0.055

0.42

0.39

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

X

θ

A

A

1

A

2

H

E

L

p

Q

E

c

L

v

M

A

(A )

3

A

0 5 10 mm

scale

92-11-17

95-01-24

SO16: plastic small outline package; 16 leads; body width 7.5 mm

SOT162-1

1997 Feb 24 11

Philips Semiconductors Product specification

Radio Data System (RDS) demodulator SAA6579

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

DIP

S

OLDERING BY DIPPING OR BY WA VE

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

W

AVE SOLDERING

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1997 Feb 24 12

Philips Semiconductors Product specification

Radio Data System (RDS) demodulator SAA6579

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

1997 Feb 24 13

Philips Semiconductors Product specification

Radio Data System (RDS) demodulator SAA6579

NOTES

1997 Feb 24 14

Philips Semiconductors Product specification

Radio Data System (RDS) demodulator SAA6579

NOTES

1997 Feb 24 15

Philips Semiconductors Product specification

Radio Data System (RDS) demodulator SAA6579

NOTES

Internet: http://www.semiconductors.philips.com

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© Philips Electronics N.V. 1997 SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

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51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]/xxx
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: seeAustria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]
Middle East: see Italy

Printed in The Netherlands 547027/1200/02/pp16 Date of release: 1997 Feb 24 Document order number: 9397 750 00913