Datasheet SAA5700GP-M4C, SAA5700GP-M4B Datasheet (Philips)

DATA SH EET

Preliminary specification
File under Integrated Circuits, IC02

1997 May 16

INTEGRATED CIRCUITS

SAA5700

Chinese Character System Teletext
(CCST) decoder

1997 May 16 2

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

FEATURES

• Acquisition and display of the 625-line PAL CCST
Chinese standard for teletext, with Chinese and Latin
character sets

• Supports multiple DRAM sizes: 256K × 4 bits,
1M × 4 bits, 4M × 4 bits and 2 × 1M × 4 bits with an
additional decoder/demultiplexer IC

• Acquires and stores in background up to (typically)
400 pages with 1M × 4 bits external DRAM

• CCST Fastext, with capability of displaying Chinese
characters on Fastext prompt row

• Meshing for reduced contrast video background in
subtitles and boxes

• Full line and screen colour to all edges of screen

• Supports 625-line 50/100 Hz display modes

• Scan-locked and stand-alone sync modes; supports

video-locked sync modes with external PLL

• Easy control via high level I

2

C-bus SAFARI commands

• Sync mode switching and picture centring via I2C-bus
SAFARI commands

• Supports external decryption unit for encrypted data.

GENERAL DESCRIPTION

The SAA5700 is a Chinese teletext decoder suitable for TV
and multimedia applications. It incorporates all the data
slicing, acquisition and display circuitry on-chip, as well as
the logic for memory management. An external DRAM is
used to store the currently displayed page and also the
precaptured teletext pages.

An external ROM is used to store the ideographic Chinese
character set. There is a high level software interface with
easy commands for the control of the decoder. Control is
achieved via the I2C-bus.

The device is available in a QFP64 package.

ORDERING INFORMATION

TYPE NUMBER

PACKAGE

NAME DESCRIPTION VERSION

SAA5700GP QFP64 plastic quad flat package; 64 leads (lead length 1.95 mm);

body 14 × 20 × 2.8 mm

SOT319-2

1997 May 16 3

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MGG539

SYNC

SEPARATOR

DATA

ACQUISITION

PACKET
BUFFER

MEMORY

INTERFACE

OSCILLATOR

AND CLOCK

GENERATOR

ACQUISITION

TIMING

PROCESSOR

BLOCK

DISPLAY

INTERFACE

DISPLAY

TIMING

FRONT END

DISPLAY SECTION

SAA5700

BUS

35

4

5

10
6

7

27
42
53
44

54, 41, 40,
38 to 36,
32 to 28

55 to 58,
52, 51,
47, 46

25

18

17

24

23

22

21

62

61

60

63

59

64

1

33 48 49 2 19 20 9 8 14,16,

26

12 MHz

RD7 to RD0

RA10 to RA0

WE

CAS

RAS

ROMCS

I

REF

REF+

STN

CVBS

BLACK

V

DDD1VSS1VDDD2VSS2VSS3VDDXVSSOVDDAVSSAVSS

OSCOUT
OSCIN

RESET

DCL
DDA
SCL
SDA

R
G
B
BLAN

LFB
FFB/STTV
ODD/EVEN

24 MHz

6 MHz

1997 May 16 4

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

PINNING

SYMBOL PIN I/O DESCRIPTION

OSCOUT 1 O oscillator output to crystal
V

SS3

2 ground ground for I/O pad buffers connect to VSS; internally connected to V

SS1

and V

SS2

n.c. 3 − not connected
BLACK 4 I/O black level sample and hold capacitor; 100 nF to V

SSA

CVBS 5 I video signal input; 100 nF series capacitor, 250Ω source impedance maximum,

reference to V

SSA

STN 6 I/O ADC current reference decoupling; 100 nF to V

SSA

I

REF

7 I current reference input; 10 kΩ to V

SSA

V

SSA

8 ground 0 V power supply; analog

V

DDA

9 supply +5 V power supply; analog

REF+ 10 I ADC voltage reference decoupling; 100 nF to V

SSA

i.c. 11 − internally connected; do not use
i.c. 12 − internally connected; do not use
i.c. 13 − internally connected; do not use
V

SS

14 ground connect to VSS for normal use
n.c. 15 − not connected
V

SS

16 ground connect to VSS for normal use
LFB 17 I scan line flyback input (HSYNC)
FFB/STTV 18 I/O scan field flyback input (VSYNC)/sync to TV output
V

DDX

19 supply +5 V power supply; connect to VDD for normal use
V

SSO

20 ground output stage current return and 0 V
R 21 O analog Red output
G 22 O analog Green output
B 23 O analog Blue output
BLAN 24 O fast blanking (VDS)
ODD/EVEN 25 O frame rate signal for hardware de-interlace (FRAME)
V

SS

26 ground connect to VSS for normal use
ROMCS 27 O chip select (address decode) for ROM
RA0 28 O bit 0 of address to DRAM, ROM and IC
RA1 29 O bit 1 of address to DRAM, ROM and IC
RA2 30 O bit 2 of address to DRAM, ROM and IC
RA3 31 O bit 3 of address to DRAM, ROM and IC

1997 May 16 5

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

RA4 32 O bit 4 of address to DRAM, ROM and IC
V

SS1

33 ground 0 V power supply digital; connected internally to V

SS2

and V

SS3

n.c. 34 − not connected
V

DDD1

35 supply +5 V power supply digital; connected internally to V

DD2

RA5 36 O bit 5 of address to DRAM, ROM and IC
RA6 37 O bit 6 of address to DRAM, ROM and IC
RA7 38 O bit 7 of address to DRAM, ROM and IC
n.c. 39 − not connected
RA8 40 O bit 8 of address to DRAM, ROM and IC
RA9 41 O bit 9 of address to DRAM, ROM and IC
RAS 42 O row address strobe to DRAM; active LOW
n.c. 43 − not connected
WE 44 O write enable to DRAM and IC; active LOW
i.c. 45 − internally connected; do not use
RD0 46 I/O bit 0 of data bus to/from DRAM, ROM and IC
RD1 47 I/O bit 1 of data bus to/from DRAM, ROM and IC
V

DDD2

48 supply +5 V power supply digital; connected internally to V

DD1

V

SS2

49 ground 0 V power supply digital; connected internally to V

SS1

and V

SS3

n.c. 50 − not connected
RD2 51 I/O bit 2 of data bus to/from DRAM, ROM and IC
RD3 52 I/O bit 3 of data bus to/from DRAM, ROM and IC
CAS 53 O column address strobe to DRAM; active LOW
RA10 54 O bit 10 of address to DRAM, ROM and IC
RD7 55 I/O bit 7 of data bus to/from DRAM, ROM and IC
RD6 56 I/O bit 6 of data bus to/from DRAM, ROM and IC
RD5 57 I/O bit 5 of data bus to/from DRAM, ROM and IC
RD4 58 I/O bit 4 of data bus to/from DRAM, ROM and IC
RESET 59 I chip/processor reset input (active HIGH)
DDA 60 I/O bidirectional serial data to/from optional Decryptor
SCL 61 I primary I

2

C-bus serial clock input

SDA 62 I/O primary I

2

C-bus serial data
DCL 63 O serial clock to optional Decryptor
OSCIN 64 I oscillator input from crystal/external clock input

SYMBOL PIN I/O DESCRIPTION

1997 May 16 6

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

Fig.2 Pin configuration.

handbook, full pagewidth

SAA5700

MGG538

1
2
3
4
5
6
7
8

9
10
11
12
13
14
15
16
17
18
19

OSCOUT

V

SS3

n.c.

BLACK

CVBS

STN

I

REF

V

SSA

V

DDA

REF+

i.c.
i.c.
i.c.

V

SS

n.c.

V

SS

LFB

FFB/STTV

V

DDX

RD2
n.c.
V

SS2

V

DDD2

RD1
RD0
i.c.
WE
n.c.
RAS
RA9
RA8
n.c.
RA7
RA6
RA5
V

DDD1
n.c.
V

SS1

51

50
49
48
47
46
45
44
43
42

41
40
39
38
37
36
35
34
33

20

21

22

23

24

25

26

27

28

29

30

31

32

64

63

62

61

60

59

58

57

56

55

54

53

52

OSCIN

DCL

SDA

SCL

DDA

RESET

RD4

RD5

RD6

RD7

RA10

CAS

RD3

V

SSO

R

G

B

BLAN

ODD/EVEN

V

SS

ROMCS

RA0

RA1

RA2

RA3

RA4

1997 May 16 7

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

HIGH LEVEL I2C-BUS COMMAND INTERFACE

This device communicates via the I2C-bus using the SAFARI protocol. The following section indicates the protocol which
is supported by this decoder.

User commands

Table 1 lists the CCST user command codes in TV mode; Table 2 lists the CCST user command codes in Text mode.

Table 1 TV mode user command codes

FUNCTION ID

(HEX)

FUNCTION

00 −
01 −
02 −
03 PICTURE
04 STATUS
05 −
06 −
07 TIME
08 −
09 −
0A −

0B −
0C −
0D −
0E −
0F −

10 TV PROGRAMME 0

11 TV PROGRAMME 1

12 TV PROGRAMME 2

13 TV PROGRAMME 3

14 TV PROGRAMME 4

15 TV PROGRAMME 5

16 TV PROGRAMME 6

17 TV PROGRAMME 7

18 TV PROGRAMME 8

19 TV PROGRAMME 9
1A TV PROGRAMME10
1B TV PROGRAMME11
1C TV PROGRAMME 12
1D TV PROGRAMME 13
1E TV PROGRAMME14
1F TV PROGRAMME 15

Table 2 Text mode user command codes

FUNCTION ID

(HEX)

FUNCTION

20 RED
21 GREEN
22 YELLOW
23 SUBTITLE
24 STATUS
25 HOLD TOGGLE
26 REVEAL
27 CANCEL TOGGLE
28 INDEX

29 −
2A BROWSE
2B REVEAL SET TOGGLE
2C −
2D PREVIOUS
2E DISPLAY CHINESE PROMPT
2F SUBCODE TOGGLE

30 1

31 2

32 3

33 4

34 5

35 6

36 7

27 8

28 9

29 0
3A SIZE
3B UP
3C DOWN
3D CYAN
3E MIX
3F TEXT

1997 May 16 8

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

Extended commands

The extended commands for the decoder are listed in Table 3.

Table 3 Extended commands

OBJECT FUNCTION

PARAMETER LENGTH

(BYTES)

PARAMETERS

NAME

ID

(HEX)

NAME

ID

(HEX)

INPUT OUTPUT INPUT OUTPUT

Display 48 set sync mode 04 1 − sync mode none

set display
position

08 4 −

row start, line start none

Processor 52 restart software 06 3 − FFFFFCH none
Memory and OSD 53 read packet 03 1

[+1]

40 packet number,

[Designation
code]

packet data

write packet 06 1

+40

− packet number,
packet data

none

OSD mode on 08 0 − none none
OSD mode off 0A 0 − none none
OSD display 0E 0 − none none
clear display page 10 0 − none none

1997 May 16 9

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

CHARACTERISTICS

T

amb

= −20 to +70 °C and V

DDn

= 4.5 to 5.5 V; unless otherwise indicated.

SYMBOL PARAMETER MIN. MAX. UNITS

V

DDD1

digital supply voltage 1 −0.3 +6.5 V

V

DDD2

digital supply voltage 2 −0.3 +6.5 V

V

DDA

analog supply voltage −0.3 +6.5 V

V

DDX

supply voltage X −0.3 +6.5 V

V

I(max)

maximum input voltage (any input) −0.3 VDD+ 0.5 V

V

O(max)

maximum output voltage (any output) −0.3 VDD+ 0.5 V

∆V

DDX-DDn

supply voltage difference

between V

DDX

, V

DDD1

, V

DDD2

and V

DDA

− 0.25 V

I

I(d)

diode input current (DC) − 20 mA

I

O(d)

diode output current (DC) − 20 mA

I

O(max)

maximum output current (any output) − 10 mA

T

stg

storage temperature −55 +125 °C

T

amb

operating ambient temperature −20 +70 °C

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Power supplies

V

DDD1

digital supply voltage 1 4.5 5.0 5.5 V

I

DDD1

digital supply current 1 − 95 140 mA

V

DDD2

digital supply voltage 2 4.5 5.0 5.5 V

I

DDD2

digital supply current 2 − 2.4 6.5 mA

V

DDA

analog supply voltage 4.5 5.0 5.5 V

I

DDA

analog supply current − 40 53 mA

V

DDX

supply voltage X 4.5 5.0 5.5 V

I

DDX

supply current X − 32 40 mA

I

DD(tot)

total supply current − 170 240 mA

Inputs

CVBS
V

sync

sync amplitude 0.1 0.3 0.6 V

V

bur(p-p)

colour burst amplitude
(peak-to-peak value)

0 0.3 4 V

V

I(video)(p-p)

video input amplitude (peak-to-peak
value)

0.7 1.0 1.4 V

V

I(data)

teletext data amplitude 0.29 0.46 0.71 V

Z

source

source impedance −−250 Ω

V

SW(I)

input switching level of sync
separator

1.6 1.9 2.2 V

C

i

input capacitance −−10 pF

1997 May 16 10

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

I

REF

R

IREF

resistor to V

SSA

− 10 − kΩ

V

IREF

voltage on I

REF

pin VDD=5V − 2.3 − V
RESET
V

IL

LOW-level input voltage −0.3 − +0.8 V

V

IH

HIGH-level input voltage 2.0 − VDD+ 0.5 V

I

LI

input leakage current VI= 0 to V

DD

−10 − +10 µA
LFB (HSYNC)
V

IL

LOW-level input voltage −0.3 − +0.6 V

V

IH

HIGH-level input voltage 2.4 − VDD+ 0.5 V

V

hys

input hysteresis voltage − 0.7 − V

I

LI

input leakage current VI= 0 to V

DD

−10 − +10 mA
I

I(max)

maximum input current note 1 −1 − +1 µA

t

W(LFB)

LFB input pulse width 200 −−ns

t

i(r)

input rise time −−100 ns

t

i(f)

input fall time −−100 ns
FFB (VSYNC)
V

IL

LOW-level input voltage −0.3 0.3V

DD

− V

V

IH

HIGH-level input voltage 0.7V

DD

VDD+ 0.5 − V

I

LI

input leakage current VI= 0 to V

DD

−10 +10 −µA

I

I(max)

maximum input current −1+1− mA
t

W(FFB)

FFB input pulse width 1 −−display

lines

t

i(r)

input rise time −−500 ns
t

i(f)

input fall time −−500 ns

Input/outputs

REF+
C

REF+

decoupling capacitor to V

SSA

− 100 − nF

V

REF+

DC voltage on REF+ 2.3 2.5 2.7 V
OSCIN AND OSCOUT
V

osc(p-p)

oscillation amplitude

(peak-to-peak value)

− V

DD

− V

C

i

input capacitance −−10 pF
f

osc

oscillator frequency − 6.0 − MHz
∆f

osc

oscillator frequency tolerance − 500 − ppm
BLACK
C

BLACK

storage capacitor to V

SSA

− 100 − nF

V

BLACK

black level for nominal sync

amplitude

1.75 2.0 2.25 V

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1997 May 16 11

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

I

LI

input leakage current VI= 0 to V

DD

−10 − +10 µA
STN
C

STN

decoupling capacitor to V

SSA

− 100 − nF
V

STN

DC voltage on STN 0.95 1.1 1.25 V
SCL (OPEN-DRAIN)
f

SCL

SCL clock frequency 0 − 400 kHz
V

IL

LOW-level input voltage −0.5 − +1.5 V
V

IH

HIGH-level input voltage 3.0 − VDD+ 0.5 V
V

OL

LOW-level output voltage IOL= 3 mA 0 − 0.4 V

I

OL

= 6 mA 0 − 0.6 V

I

LI

input leakage current VI= 0 to V

DD

−10 − +10 µA

C

i

input capacitance −−10 pF
C

L

load capacitance −−400 pF
t

i(r)

input rise time f

SCL

= 100 kHz;

note 2

50 − 1000 ns

f

SCL

= 400 kHz;

note 2

50 − 300 ns

t

i(f)

input fall time f

SCL

= 100 kHz;

note 3

50 − 300 ns

f

SCL

= 400 kHz;

note 3

50 − 300 ns

t

o(f)

output fall time 3 to 1.5 V;

IOL=3mA

50 − 250 ns

SDA (OPEN-DRAIN)
V

IL

LOW-level input voltage −0.5 − +1.5 V
V

IH

HIGH-level input voltage 3.0 − VDD+ 0.5 V
V

OL

LOW-level output voltage IOL= 3 mA 0 − 0.4 V

I

OL

= 6 mA 0 − 0.6 V

I

LI

input leakage current VI= 0 to V

DD

−10 − +10 µA

C

i

input capacitance −−10 pF
C

L

load capacitance −−400 pF
t

i(r)

input rise time f

SCL

= 100 kHz;

note 2

50 − 1000 ns

f

SCL

= 400 kHz;

note 2

50 − 300 ns

t

i(f)

input fall time f

SCL

= 100 kHz;

note 3

50 − 300 ns

f

SCL

= 400 kHz;

note 3

50 − 300 ns

t

o(f)

output fall time 3 to 1.5 V;

IOL=3mA

50 − 250 ns

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1997 May 16 12

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

DCL AND DDA (INTERNAL PULL-DOWN RESISTOR)
V

IL

LOW-level input voltage −0.3 − +0.8 V
V

IH

HIGH-level input voltage 2.0 − VDD+ 0.5 V
V

OL

LOW-level output voltage IOL= 1.6 mA 0 − 0.4 V
I

LI

input leakage current VI= 0 to V

DD

−10 − +10 µA

C

i

input capacitance −−10 pF
C

L

load capacitance −−50 pF
t

o(f)

output fall time 2.2 to 0.6 V;

IOL= 1.6 mA

−−10 ns

RD7 TO RD0
V

IL

LOW-level input voltage −0.3 − +0.8 V
V

IH

HIGH-level input voltage 2.0 − VDD+ 0.5 V
V

OL

LOW-level output voltage IOL= 1.6 mA 0 − 0.4 V
V

OH

HIGH-level output voltage IOH= −0.2 mA 2.4 − V

DD

V

I

LI

input leakage current VI= 0 to V

DD

−10 − +10 µA

C

i

input capacitance −−10 pF
C

L

load capacitance −−30 pF
t

o(r)

output rise time into C

L

0.6 to 2.2 V −−10 ns

t

o(f)

output fall time into C

L

2.2 to 0.6 V −−10 ns

Outputs

CAS
V

OL

LOW-level output voltage IOL= 1.6 mA 0 − 0.4 V
V

OH

HIGH-level output voltage IOH= −0.2 mA 2.4 − V

DD

V

C

L

load capacitance −−50 pF
t

o(r)

output rise time into C

L

0.6 to 2.2 V −−5ns

t

o(f)

output fall time into C

L

2.2 to 0.6 V −−5ns
RAS, WE, ROMCS, RA10 TO RA0
V

OL

LOW-level output voltage IOL= 1.6 mA 0 − 0.4 V

V

OH

HIGH-level output voltage IOH= −0.2 mA 2.4 − V

DD

V

C

L

load capacitance −−50 pF

t

o(r)

output rise time into C

L

0.6 to 2.2 V −−10 ns
t

o(f)

output fall time into C

L

2.2 to 0.6 V −−10 ns
ODD/EVEN (FRAME)
V

OL

LOW-level output voltage IOL= 1.6 mA 0 − 0.4 V

V

OH

HIGH-level output voltage IOH= −0.2 mA 2.4 − V

DD

V

C

L

load capacitance −−200 pF

t

o(r)

output rise time into C

L

0.6 to 2.2 V −−200 ns
t

o(f)

output fall time into C

L

2.2 to 0.6 V −−200 ns

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1997 May 16 13

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

Notes

1. This current is the maximum allowed into the inputs when line and field flyback signals are connected to these inputs.
An external series resistor must be used to limit the input currents to 1 mA.

2. Measured from V

IL(max)

to V

IH(min)

.

3. Measured from V

IH(min)

to V

IL(max)

.

STTV
V

STTV

VCS, TCS amplitude 0.2 0.3 0.4 V

V

STTV(DC)

nominal DC voltage 1.85 2.0 2.15 V

I

O(drive)

output drive −−3mA
R, G AND B
I

OL

LOW-level output current (black

level)

−10 − +10 µA

I

OH

HIGH-level output current

(full intensity)

V

DDX

= 5 V 5.1 6.0 6.9 mA

R

L

load resistance to V

SSO

for nominal

1V

(p-p)

output

− 160 −Ω

C

L

load capacitance −−20 pF
t

o(r)

output rise time 10% to 90% −−15 ns
t

o(f)

output fall time 90% to 10% −−15 ns
BLAN (VDS)
V

OH

HIGH-level output voltage IOH= −2mA VDD− 0.25 − V

DD

V

V

OL

LOW-level output voltage IOL= 2 mA 0 − 0.2 V
C

L

load capacitance −−50 pF
t

o(r)

output rise time 10% to 90% −−15 ns
t

o(f)

output fall time 90% to 10% −−15 ns
t

SK

skew delay between outputs R,G,B

and BLAN

−−15 ns

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1997 May 16 14

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

Table 4 I2C-bus Timing (see note 1 and Fig.3)

Note

1. The I

2

C-bus interface pins SDA and SCL may pull the data and clock lines below 3 V while the power supply VDD is

in the range 0.4 to 0.8 V. Outside this range, the SDA and SCL pins behave correctly.

SYMBOL PARAMETER

100 kHz 400 kHz

UNIT

MIN. MAX. MIN. MAX.

f

SCL

SCL clock frequency 0 100 0 400 kHz
t

LOW

LOW period of the SCL clock 4.7 − 1.3 −µs
t

HIGH

HIGH period of the SCL clock 4.0 − 0.6 −µs
t

SU;DAT

data set-up time 250 − 100 −µs
t

HD;DAT

date hold time 0 − 0 −µs
t

SU;STO

set-up time clock HIGH to STOP 4.7 − 0.6 −µs
t

BUF

set-up time STOP to START 4.7 − 1.3 −µs
t

HD;STA

START hold time 4.0 − 0.6 −µs
t

SU;STA

set-up time clock rising edge to START 4.7 − 0.6 −µs
t

r

rise time of both SDA and SCL signals − 1000 − 300 ns
t

f

fall time of both SDA and SCL signals − 300 − 300 ns

Fig.3 Primary I2C-bus timing.

handbook, full pagewidth

MGG541

t

HIGH

t

LOW

t

r

t

f

t

SU;STA

t

HD;STA

t

SU;DAT

t

HD;DAT

t

SU;STO

t

BUF

SCL

SDA

1997 May 16 15

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

DRAM Interface timing (see note 1 and Fig.4)

Note

1. Based on a display clock frequency of 24 MHz, maximum 24 MHz + 500 ppm.

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

T

cy(RAS)

RAS cycle time − 375 − ns

t

pch(RAS)

RAS precharge time 60 −−ns

t

h(CAS)

CAS hold time 80 −−ns

t

d(RAS-CAS)

RAS to CAS delay time 20 −−ns

t

WL(CAS)

CAS pulse width LOW 20 −−ns

T

cy(CAS)

CAS page mode cycle time 50 −−ns

t

pch(CAS)

CAS precharge time 10 −−ns

t

h(CAS-RAS)

RAS hold time after CAS 20 −−ns

t

pch(CAS-RAS)

CAS to RAS precharge time 10 −−ns

t

su(RA)

row address set-up time 0 −−ns

t

h(RA)

row address hold time 10 −−ns

t

su(CA)

column address set-up time 0 −−ns

t

h(CA)

column address hold time 15 −−ns

t

su(R)

read command set-up time 0 −−ns

t

h(R)(CAS)

read command hold time from (CAS) 0 −−ns

t

h(R)(RAS)

read command hold time from (RAS) 10 −−ns

t

su(W)

write command set-up time 0 −−ns

t

h(W)

write command hold time 15 −−ns

t

su(i)(D)

data input set-up time 0 −−ns

t

h(i)(D)

data input hold time 15 −−ns

t

ACC(R)(CAS)

read access time from (CAS) −−20 ns

t

ACC(R)(RAS)

read access time from (RAS) −−80 ns

1997 May 16 16

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

Fig.4 DRAM interface timing.

handbook, full pagewidth

MGG542

t

RP

t

RSH

t

CSH

t

PC

t

CAS

t

CAH

t

CP

t

RRH

t

RCH

t

RCS

READ
CYCLE

WRITE
CYCLE

RD IN

RD OUT

RAS

CAS

ADDRESS

WE

t

CYC

t

RCD

t

ASR

t

RAH

t

ASC

t

CAC

t

RAC

t

WCS

t

WCH

t

DS

t

DH

WE

1997 May 16 17

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

APPLICATION INFORMATION

Fig.5 Application Diagram.

D7 to D4

D3 to D0

handbook, full pagewidth

MGG540

OSCIN

OSCOUT

10 kΩ

100 kΩ

75 Ω

100 nF

100 nF

100 nF

100 nF

100 nF

100 nF

100 nF

100 nF

22 pF

22 pF

6 MHz

V

SS3

V

SSA

I

REF

CVBS

STN

REF+

BLACK

V

DDA

9

4

10

6

7

8

5

2

1

64

CVBS

front

end

LFB

HSYNC
VSYNC

RGB ground

FFB

R/G/B/BLAN

R/G/B/BLAN

V

SSO

ODD/EVEN

ODD/EVEN

25

20

21 to 24

18

17

TV

display

SDA

SCL

61

62

I

2

C-bus to

microcontroller

RESET

RESET

V

SS

V

SS

V

SS

1459 16 26

27

35 33 19

V

DDD1VSS1VDDX

+5 V +5 V

0 V

+5 V

DCL
DDA

63
60

V

DDD2

V

SS2

WE
CAS

RAS

RD3 to RD0

RA0 to RA10

V

DD

V

SS

WE

CAS
RAS

D3 to D0

A10 to A0

48
49

44
53
42

52, 51, 47, 46

28 to 32,
36 to 38,
40,41,54

DRAM

OE

0 V

74LS573

DI

RD7

to

RD4

55 to 58

OE

OE

CE

EN

V

DD

V

SS

+5 V

+5 V

+5 V

ROM

0 V

0 V

0 V

0 V

SAA5700

crystal

oscillator

ROMCS

DO

A18 to A0

1997 May 16 18

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

PACKAGE OUTLINE

UNIT A1A2A3b

p

cE

(1)

eH

E

LLpQZywv θ

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

0.25

0.05

2.90

2.65

0.25

0.50

0.35

0.25

0.14

14.1

13.9

1

18.2

17.6

1.4

1.2

1.2

0.8

7
0

o
o

0.2 0.10.21.95

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

1.0

0.6

SOT319-2

92-11-17
95-02-04

D

(1) (1)(1)

20.1

19.9

H

D

24.2

23.6

E

Z

1.2

0.8

D

e

θ

E

A

1

A

L

p

Q

detail X

L

(A )

3

B

19

y

c

E

H

A

2

D

Z

D

A

Z

E

e

v M

A

1

64

52

51 33

32

20

X

pin 1 index

b

p

D

H

b

p

v M

B

w M

w M

0 5 10 mm

scale

QFP64: plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm

SOT319-2

A

max.

3.20

1997 May 16 19

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

Reflow soldering

Reflow soldering techniques are suitable for all QFP
packages.

The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our

“Quality

Reference Handbook”

(order code 9397 750 00192).

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

Wave soldering

Wave soldering is not recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The footprint must be at an angle of 45° to the board

direction and must incorporate solder thieves
downstream and at the side corners.

Even with these conditions, do not consider wave
soldering the following packages: QFP52 (SOT379-1),
QFP100 (SOT317-1), QFP100 (SOT317-2),
QFP100 (SOT382-1) or QFP160 (SOT322-1).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1997 May 16 20

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

2

C COMPONENTS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Purchase of Philips I

2

C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

1997 May 16 21

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

NOTES

1997 May 16 22

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

NOTES

1997 May 16 23

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

NOTES

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1997 SCA54
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

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Metro MANILA, Tel. [phone], Fax. [phone]

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Uruguay: see South America
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Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

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220050 MINSK, Tel. [phone], Fax. [phone]

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Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

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Tel. [phone], Fax. [phone]
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India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. [phone], Fax. [phone]
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20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
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Tel. [phone]
Middle East: see Italy

Printed in The Netherlands 547047/50/01/pp24 Date of release: 1997 May 16 Document order number: 9397 750 01008