Datasheet SAA5249GP-E, SAA5249P-E Datasheet (Philips)

Page 1
INTEGRATED CIRCUITS
DATA SH EET
SAA5249
Integrated VIP and Teletext with Background Memory Controller (IVT1.1BMCX)
Preliminary specification Supersedes data of December 1993 File under Integrated Circuits, IC02
1996 Nov 07
Page 2
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
FEATURES
• Complete teletext decoder featuring a background memory controller in a single 48-pin DIP package. Capable of storing of up to 512 teletext pages in an external DRAM, giving instant access to the teletext data
• Automatic processing of extension packet 26 for widest possible language decoding. All our standard language options can be available, and the language option is readable via I2C-bus.
• 100% hardware compatible with the SAA5247 plug-in replacement and with the possibility of extra market in those countries with packet 26 transmissions. Still pin-aligned to SAA5254 and SAA5244A.
• 100% software compatible with the SAA5247, and SAA5244A, except if the special OSD symbols were used. Also 100% software compatible to SAA5254. In all events there is a change to the ROM ID number.
• The device is pin-aligned with the other members of the new Philips teletext decoder family, i.e. SAA5281 and the SAA5254, making one hardware solution for the whole range
• Low software overhead for the microprocessor
• RGB interface to standard colour decoder ICs, push-pull
output drive.
GENERAL DESCRIPTION
The Integrated VIP and Teletext (IVT1.1BMCX) is a teletext decoder (contained within a single chip package) for decoding 625-line based World System Teletext transmissions. With its built-in background memory controller the device can store incoming teletext packets in the external 1M4 DRAM. With this large packet store which can be rapidly scanned, we can achieve near instantaneous access to all the pages transmitted by the broadcaster.
This version of the decoder also contains some extra hardware to process extension packet 26 automatically, extending the markets to which the TV chassis can be shipped and offering many more language options for the set maker.
SAA5249
QUICK REFERENCE DATA
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
V
DD
I
DD
V
syn
V
vid
f
XTAL
T
amb
supply voltage 4.5 5.0 5.5 V supply current − 90 120 mA sync amplitude 0.1 0.3 0.6 V video amplitude 0.7 1.0 1.4 V crystal frequency − 27 − MHz operating ambient temperature −20 − +70 °C
ORDERING INFORMATION
TYPE
NUMBER
NAME DESCRIPTION VERSION
PACKAGE
SAA5249P/E DIP48 plastic dual in-line package; 48 leads (600 mil) SOT240-1 SAA5249GP/E QFP64 plastic quad flat package; 64 leads (lead length 1.95 mm);
SOT319-1
body 14 × 20 × 2.7 mm; high stand-off height
1996 Nov 07 2
Page 3
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
BLOCK DIAGRAM
SAA5249
handbook, full pagewidth
DD1
DD2
SSn
SS1
46 45
3
12
16, 22 38
7
8
SEL1 SEL2
V
V
V
V
REF+
A0 to A9 D0 to D3
10
4
SAA5249
DATA SLICER
AND
CLOCK
REGENERATOR
DCVBS
ANALOG
TO
DIGITAL
CONVERTER
42
23
DRAM INTERFACE
RASR/W CAS1 ODD/EVEN
24 41
BACKGROUND
MUX
MEMORY
CONTROL
TIMING
CHAIN
29
TELETEXT
ACQUISITION
AND
DECODING
COR
21 27
DISPLAY
R/G/BY BLANK RGBREFCAS0
3
20 17 to 19 28
HAMMING CHECKER
AND
PACKET 26
PROCESSING
ENGINE
MEMORY
2
I C - BUS
INTERFACE
PAGE
31
SDA
30
SCL
OSCOUT
OSCIN
4
CRYSTAL
5
OSCILLATOR
6
GNDO
INPUT CLAMP
SYNC
SEPARATOR
911
BLACK IREF STTV/LFBPOL
Fig.1 Block diagram for SOT240-1 (DIP48) package.
1996 Nov 07 3
AND
DISPLAY 
CLOCK PHASE
LOCKED
LOOP
10 13 15 14
CVBS
VCR/FFB
MLB304
Page 4
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
PINNING
SAA5249
SYMBOL
SOT240-1 SOT319-1
(1)
DESCRIPTION
n.c. 1 1 not connected n.c. 2 2 not connected
PIN
V
DD1
3 25 +5 V supply OSCOUT 4 27 27 MHz crystal oscillator output OSCIN 5 28 27 MHz crystal oscillator input GNDO 6 29 0 V crystal oscillator ground V
SS1
7 12 0 V ground REF+ 8 32 positive reference voltage; this pin should be connected to ground via a
100 nF capacitor
BLACK 9 35 video black level storage pin; this pin should be connected to ground via a
100 nF capacitor
CVBS 10 36 composite video input pin; a positive-going 1 V (p-p) input is required,
connected via a 100 nF capacitor IREF 11 37 reference current input pin; connected to ground via a 27 kΩ resistor V
DD2
12 38 +5 V supply POL 13 39 STTV/LFB/FFB polarity selection pin STTV/LFB 14 40 sync to TV output pin/line flyback input pin; function controlled by an
internal register bit (scan sync mode)
VCR/FFB 15 42 PLL time constant switch/field input pin; function controlled by an internal
register bit (scan sync mode)
V
SS2
16 30 0 V ground REF−−31 negative reference voltage; this pin should be connected to REF+ via a
100 nF capacitor R 17 49 dot rate character output of the RED colour information G 18 50 dot rate character output of the GREEN colour information B 19 51 dot rate character output of the BLUE colour information RGBREF 20 52 input DC voltage to define the output high level on the RGB pins BLANK 21 53 dot rate fast blanking output V
SS3
22 54, 55 0 V ground; internally connected for SOT319 CAS0 23 56 column address select to external DRAM for BMCX function CAS1 24 57 column address select to external DRAM for BMCX function for second
DRAM where two 256 k × 4 devices are used A4 25 58 address output to external DRAM for BMCX function A3 26 59 address output to external DRAM for BMCX function COR 27 60 programmable output to provide contrast reduction of the TV picture for
mixed text and picture displays or when viewing newsflash/subtitle pages;
open drain output
EVEN 28 61 25 Hz output synchronized with the CVBS input field sync pulses to
ODD/
produce a non-interlaced display by adjustment of the vertical deflection
currents
1996 Nov 07 4
Page 5
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
SAA5249
SYMBOL
Y 29 62 dot rate character output of teletext foreground colour information; open
SCL 30 63 serial clock input for I2C-bus; it can still be driven HIGH during power-down
SDA 31 64 serial data port for the I
A5 32 4 address output to external DRAM for BMCX function A2 33 5 address output to external DRAM for BMCX function A6 34 6 address output to external DRAM for BMCX function A1 35 8 address output to external DRAM for BMCX function A7 36 9 address output to external DRAM for BMCX function A0 37 11 address output to external DRAM for BMCX function V
SS4
A8 39 13 address output to external DRAM for BMCX function A9 40 14 address output to external DRAM for BMCX function RAS 41 15 row address select to external DRAM
W 42 18 read/write for external DRAM
R/ D2 43 19 data input/output for external DRAM D0 44 20 data input/output for external DRAM SEL2 45 21 RAM select input to choose external DRAM size SEL1 46 22 RAM select input to choose external DRAM size D3 47 23 data input/output for external DRAM D1 48 24 data input/output for external DRAM
SOT240-1 SOT319-1
38 43 0 V ground
PIN
(1)
drain output
of the device
2
C-bus; open drain output. It can still be driven
HIGH during power-down of the device
DESCRIPTION
Note
1. The remaining pins for SOT319 are not connected.
1996 Nov 07 5
Page 6
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
V
DD1
OSCOUT
OSCIN
n.c. n.c.
48
1 2 3 4 5
D1
47
D3 SEL1
46 45
SEL2 D0
44
SAA5249
GNDO
V
SS1
REF
BLACK
CVBS
IREF
V
DD2 POL
STTV/LFB
VCR/FFB
V
SS2
RGBREF
BLANK
V
SS3 CAS0 CAS1
43 42 41
40 39 38
37 36 35 34 33 32 31
30 29 28
27 26 25
D2 R/W
RAS A9 A8
V
SS4 A0 A7
A1 A6 A2 A5
SDA
SCL Y ODD/EVEN
COR A3 A4
6 7 8
9 10 11 12
SAA5249P
13 14 15 16 17
R
18
G B
19 20
21 22
23 24
MLB305
Fig.2 Pin configuration; SOT240-1 (DIP48).
1996 Nov 07 6
Page 7
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
index corner
n.c. n.c. n.c.
A5
A2 A6 n.c. A1 A7
n.c.
A0
V
SS1
A8 A9
RAS
n.c. n.c.
R/W
D2
SDA
64 1 2 3 4 5 6 7 8 9
10 11 12
13 14 15 16 17 18 19
SCL 63
Y 62
ODD/EVEN 61
COR
A3
60
59
SAA5249GP
A4 58
CAS1 57
CAS0 56
SS3
V 55
SS3
V
54
BLAN 53
RGBREF
52
51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
B G
R
n.c.
V
SS4 VCR/FFB n.c.
STTV/LFB POL
V
DD2
IREF CVBS BLACK n.c. n.c.
SAA5249
20
21
D0
SEL2
22
SEL1
23 D3
24 D1
25
V
DD1
26
n.c.
Fig.3 Pin configuration; SOT319-1 (QFP64).
1996 Nov 07 7
27
28
OSCIN
OSCOUT
29
GNDO
30
SS2
V
31
REF
32
REF
MLB306
Page 8
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
LIMITING VALUES
In accordance with Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER MIN. MAX. UNIT
V
DD
V
I
V
O
I
O
I
IOK
T
amb
QUALITY AND RELIABILITY
supply voltage (all supplies) −0.3 +6.5 V input voltage (any input) −0.3 VDD+ 0.5 V output voltage (any output) −0.3 VDD+ 0.5 V output current (each output) −±10 mA DC input or output diode current −±20 mA operating ambient temperature −20 +70 °C
SAA5249
This device will meet Philips Semiconductors General Quality Specification for Business group
Circuits SNW-FQ-611-Part E”
. The principal requirements are shown in Tables 1 to 4.
“Consumer Integrated
1996 Nov 07 8
Page 9
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
Group A Table 1 Acceptance tests per lot
TEST REQUIREMENTS
Mechanical cumulative target: <100 ppm Electrical cumulative target: <100 ppm
Group B Table 2 Processability tests (by package family)
TEST REQUIREMENTS
Solderability <7% LTPD Mechanical <15% LTPD Solder heat resistance <15% LTPD
Group C
SAA5249
(1)
(1)
Table 3 Reliability tests (by process family)
TEST CONDITIONS REQUIREMENTS
(1)
Operational life 168 hours at Tj= 150 °C <1500 FPM; equivalent to <100 FITS
at Tj=70°C
Humidity life temperature, humidity, bias
<2000 FPM (1000 hours, 85 °C, 85% RH or equivalent test)
Temperature cycling performance T
stg(min)
to T
stg(max)
<2000 FPM
Table 4 Reliability tests (by device type)
TEST CONDITIONS REQUIREMENTS
ESD and latch-up ESD Human body model
<15% LTPD
(1)
2000 V, 100 pF, 1.5 kΩ ESD Machine model
<15% LTPD 200 V, 100 pF, 1.5 kΩ
latch-up 100 mA, 1.5 × V
DD
<15% LTPD (absolute maximum)
Note to Tables 1 to 4
1. ppm = fraction of defective devices, in parts per million. LTPD = Lot Tolerance Percent Defective. FPM = fraction of devices failing at test condition, in Failures Per Million. FITS = Failures In Time Standard.
1996 Nov 07 9
Page 10
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
CHARACTERISTICS
V
=5V±10%; T
DD
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies
V
DD
I
DD(tot)
supply voltage 4.5 5.0 5.5 V total supply current − 90 120 mA
Inputs
CVBS V
sync
t
d(sync)
sync amplitude 0.1 0.3 0.6 V delay from CVBS to TCS output
from STTV buffer (nominal video, average of leading/trailing edge)
∆t
d(sync)
change in sync delay between all black and all white video input at nominal levels
V
vid(p-p)
video input amplitude (peak-to-peak value)
display PLL catching range ±7 −−%
Z
source
C
i
source impedance −−250 Ω
input capacitance −−10 pF IREF R
gnd
resistor to ground − 27 − kΩ POL V
IL
V
IH
I
LI
C
i
LOW level input voltage −0.3 − +0.8 V
HIGH level input voltage 2.0 − VDD+ 0.5 V
input leakage current Vi= 0 to V
input capacitance −−10 pF LFB V
IL
V
IH
I
LI
I
i
t
d(LFB)
LOW level input voltage −0.3 − +0.8 V
HIGH level input voltage 2.0 − VDD+ 0.5 V
input leakage current Vi= 0 to V
input current note 1 −1 − +1 mA
delay between LFB front edge
and input video line sync VCR/FFB V
IL
V
IH
I
LI
I
i
LOW level input voltage −0.3 − +0.8 V
HIGH level input voltage 2.0 − VDD+ 0.5 V
input leakage current Vi= 0 to V
input current note 1 −1 − +1 mA
= −20 to +70 °C; unless otherwise specified.
amb
DD
DD
DD
−150 0 +150 ns
0 − 25 ns
0.7 1.0 1.4 V
−10 − +10 µA
−10 − +10 µA
− 250 − ns
−10 − +10 µA
SAA5249
1996 Nov 07 10
Page 11
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
RGBREF note 2 V
IL
I
LI
I
DC
SEL1 AND SEL2 V
IL
V
IH
I
LI
SCL V
IL
V
IH
I
LI
f
SCL
t
r
t
f
C
i
Inputs/outputs
LOW level input voltage −0.3 − VDD+ 0.5 V
input leakage current Vi= 0 to V
DD
−10 − +10 µA
DC current −−10 mA
LOW level input voltage −0.3 − +0.8 V
HIGH level input voltage 2.0 − VDD+ 0.5 V
input leakage current Vi= 0 to V
DD
−10 − +10 µA
LOW level input voltage −0.3 − +1.5 V
HIGH level input voltage 3.0 − VDD+ 0.5 V
input leakage current Vi= 0 to V
DD
−10 − +10 µA clock frequency 0 − 100 kHz input rise time 10% to 90% −−2µs input fall time 90% to 10% −−2µs input capacitance −−10 pF
SAA5249
C
RYSTAL OSCILLATOR (OSCIN; OSCOUT)
f
XTAL
G
v
G
m
C
i
C
FB
crystal frequency − 27 − MHz small signal voltage gain 3.5 −− mutual conductance fi= 100 kHz 1.5 −−mA/V input capacitance −−10 pF feedback capacitance −−5pF
BLACK C
blk
I
LI
storage capacitor to ground − 100 − nF input leakage current Vi= 0 to V
SDA V
IL
V
IH
I
LI
C
i
t
r
t
f
V
OL
t
f
C
L
LOW level input voltage −0.3 − +1.5 V HIGH level input voltage 3.0 − VDD+ 0.5 V input leakage current Vi= 0 to V input capacitance −−10 pF input rise time 10% to 90% −−2µs input fall time 90% to 10% −−2µs LOW level output voltage IOL= 3 mA 0 − 0.5 V output fall time 3 V to 1 V −−200 ns load capacitance −−400 pF
DD
DD
−10 − +10 µA
−10 − +10 µA
1996 Nov 07 11
Page 12
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
D0 TO D3 V
IL
V
IH
I
LI
C
i
V
OL
V
OH
t
r
t
f
C
L
Outputs
STTV G
stt
V
TCS
V
DCs
I
O
C
L
A0 TO A9 ADDRESS OUTPUT TO MEMORY A0 TO A9 V
OL
V
OH
C
L
t
r
t
f
R/W, CASO AND CAS1 V
OL
V
OH
C
L
t
r
t
f
LOW level input voltage −0.3 − +0.8 V HIGH level input voltage 2.0 − VDD+ 0.5 V input leakage current −10 − +10 µA input capacitance −−10 pF LOW level output voltage IOL= +1.6 mA 0 − 0.4 V HIGH level output voltage IOH= −0.2 mA 2.4 − V output rise time 0.6 to 2.2 V −−20 ns output fall time 2.2 to 0.6 V −−20 ns load capacitance −−50 pF
gain of STTV relative to video
0.9 1.0 1.1 input
TCS amplitude 0.2 0.3 0.45 V DC shift between TCS output and
−−0.15 V nominal video output
output drive current −−3.0 mA load capacitance −−100 pF
LOW level output voltage IOL= +1.6 mA 0 − 0.4 V HIGH level output voltage IOH= −0.2 mA 2.4 − V load capacitance −−50 pF output rise time 0.6 to 2.2 V −−20 ns output fall time 2.2 to 0.6 V −−20 ns
LOW level output voltage IOL= +1.6 mA 0 − 0.4 V HIGH level output voltage IOH= −0.2 mA 2.4 − V load capacitance −−50 pF output rise time 0.6 to 2.2 V −−20 ns output fall time 2.2 to 0.6 V −−20 ns
SAA5249
DD
DD
DD
V
V
V
1996 Nov 07 12
Page 13
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R, G AND B V
OL
V
OH
| output impedance −−200 Ω
|Z
o
C
L
I
DC
t
r
t
f
BLANK V
OL
V
OH
V
OH
V
OH
C
L
t
r
t
f
ODD/EVEN V
OL
V
OH
C
L
t
r
t
f
COR AND Y(OPEN-DRAIN) V
OH
V
OL
C
L
t
f
I
LO
t
skew
LOW level output voltage IOL= 2 mA 0 − 0.2 V HIGH level output voltage IOH= −1.6 mA;
RGBREF ≤ VDD− 2V
RGBREF
−0.25
RGBREF RGBREF
load capacitance −−50 pF DC current −−−3.3 mA output rise time 10% to 90% −−20 ns output fall time 90% to 10% −−20 ns
LOW level output voltage IOL= 1.6 mA 0 − 0.4 V HIGH level output voltage IOH= −0.2 mA;
1.1 −−V
VDD= 4.5 V
HIGH level output voltage IOH= 0 mA;
−−2.8 V
VDD= 5.5 V allowed voltage at pin with external pull-up −−VDDV load capacitance −−50 pF output rise time 10% to 90% −−20 ns output fall time 90% to 10% −−20 ns
LOW level output voltage IOL= +1.6 mA 0 − 0.4 V HIGH level output voltage IOH= −0.2 mA 2.4 − V load capacitance −−120 pF output rise time 0.6 to 2.2 V −−50 ns output fall time 2.2 to 0.6 V −−50 ns
pull-up voltage at pin −−VDDV output voltage LOW IOL= 5 mA 0 − 1.0 V load capacitance −−25 pF output fall time load resistor of 1.2 kΩ
−−50 ns to VDD; measured between VDD− 0.5 V and 1.5 V
output leakage current Vi= 0 to V skew delay between display
DD
−10 − +10 µA
−−20 ns
outputs R, G, B, COR, Y and BLANK
SAA5249
+0.25
DD
V
V
1996 Nov 07 13
Page 14
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Timing
DRAM INTERFACE t
RC
t
RP
t
RAS
t
CAS
t
ASR
t
RAH
t
ASC
t
CAH
t
RCD
t
RAD
t
RSH
t
CSH
t
CRP
t
DZO
, t
t
r
f
t
WCS
t
WCH
t
DS
t
DH
t
RAC
t
CAC
t
AA
t
RCS
t
RCH
t
RRH
t
RAL
t
OFF1
t
CDD
read or write cycle time 344 380 415 ns RAS precharge time 125 140 155 ns RAS pulse width 194 210 230 ns CAS pulse width 113 133 153 ns row address set-up time 30 60 80 ns row address hold time 50 60 92 ns column address set-up time 50 60 75 ns column address hold time 50 60 70 ns RAS to CAS delay time 130 148 160 ns RAS to column address delay
60 74 105 ns
time RAS hold time 15 60 70 ns CAS hold time 260 286 300 ns CAS to RAS precharge time 60 70 80 ns CAS set-up time from data input 200 225 280 ns rise and fall times 10 15 20 ns write set-up time 193 212 235 ns write command hold time 116 137 150 ns data input set-up time 193 212 235 ns data input hold time 42 62 80 ns access time from RAS 165 183 220 ns access time from CAS 0 3540ns access time from address 95 108 120 ns read command set-up time 193 212 235 ns read command hold time to CAS 0 1020ns read command hold time to RAS 55 65 100 ns column address to RAS lead time 90 133 150 ns output buffer turn-off time 20 30 40 ns CAS to data input delay time 25 35 45 ns
SAA5249
1996 Nov 07 14
Page 15
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I2C-BUS t
LOW
t
HIGH
t
SU;DAT
t
HD;DAT
t
SU;STO
t
BUF
t
HD;STA
t
SU;STA
Notes
1. This current is the maximum allowed into the inputs when line and field flyback signals are connected to these inputs. Series current limiting resistors must be used to limit the input currents to ±1 mA.
2. RGBREF is the positive supply pin for the RGB output pins and it must be able to source the IOH current from the R, G and B pins. The leakage specification on RGBREF only applies when there is no current load on the RGB pins.
clock LOW period 4 −−µs clock HIGH period 4 −−µs data set-up time 250 −−ns data hold time 170 −−ns set-up time from clock HIGH to
4 −−µs
STOP START set-up time following a
4 −−µs
STOP START hold time 4 −−µs START set-up time following
4 −−µs
clock LOW-to-HIGH transition
SAA5249
1996 Nov 07 15
Page 16
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
SAA5249
64 µs
64 µs
32 34.33
64 µs
59.33
27.33 32
MLA037 - 2
handbook, full pagewidth
1 2 3456 7
0 4.66
LSP
0 2.33
EP
(Line Sync Pulse)
0
BP
(Equalizing Pulse)
(Broad Pulse)
625
624
623
622
621
(312)
(311)
(310)
(309)
(308)
309 310 311 312 313 314 (1) 315 (2) 316 (3) 317 (4) 318 (5) 319 (6) 320 (7)
TCS interlaced
308 309 310 311 312 1 2 3 4 5 6 7
TCS interlaced
Fig.4 Composite sync waveforms.
TCS non-interlaced
1996 Nov 07 16
Page 17
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
SAA5249
handbook, full pagewidth
(1) Also BLANK in character and box blanking.
LSP
(TCS)
0 4.66
R, G, B, Y
(1)
0
R, G, B, Y
(1)
0
Fig.5 Display output timing (a) line rate (b) field rate.
40 µs
display period
16.67
lines 42 to 291 inclusive (and 355 to 604 inclusive interlaced)
display period
41
56.67 µs
64 µs
291
line numbers
MLA662 - 1
312
handbook, full pagewidth
SDA
t
LOW
t
SCL
SDA
MBC764
t
BUF
t
HD;STA
Fig.6 I2C-bus timing.
1996 Nov 07 17
t
r
SU;STA
t
HD;DAT
t
HIGH
t
f
t
SU;DAT
t
SU;STO
Page 18
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
RAS
t
RAS
t
RC
SAA5249
CAS
ADDRESS
WE
DATA OUTPUT
DATA INPUT
t
f
t
ASR
t
RAH
ROW COLUMN
t
RCD
t
RAD
t
RCS
high impedance
t
RAC
tt
DZO
t
ASC
t
RSH
t t
t
RAL
t
CAH
t
CAC
t
AA
high impedance
CAS CSH
t
DATA VALID
t
RP
t
RRH
OFF1
t
CRP
t
RCH
CDD
MBA732
Fig.7 DRAM interface timing; read cycle.
1996 Nov 07 18
Page 19
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
RAS
t
RAS
t
RC
SAA5249
CAS
ADDRESS
WE
DATA INPUT
DATA OUTPUT
t
t
ASR
t
RSH
t
WCH
t
DH
t
CAS
t
CSH
f
t
RAH
ROW
t
RCD
t
WCS
t
t
DS
ASC
COLUMN
t
CAH
DATA VALID
high impedance
t
RP
t
CRP
MBA731
Fig.8 DRAM interface timing; write cycle.
1996 Nov 07 19
Page 20
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
SAA5249
MBA073 - 4
1 2 3456 7
FIRST FIELD START (EVEN)
625
(312)
624
(311)
623
(310)
622
(309)
621
(308)
48 µs
31 µs
16 µs
SECOND FIELD START (ODD)
313 314 (1) 315 (2) 316 (3) 317 (4) 318 (5) 319 (6) 320 (7)
31 µs
Fig.9 ODD/EVEN timing.
2 µs
2 µs
309 310 311 312
TCS interlaced
ODD/EVEN output
(normal sync mode)
ODD/EVEN output
(normal sync mode
when VCS to SCS
mode active)
ODD/EVEN output
(slave sync mode)
1996 Nov 07 20
TCS interlaced
ODD/EVEN output
(normal sync mode)
ODD/EVEN output
(normal sync mode
when VCS to SCS
mode active)
ODD/EVEN output
(slave sync mode)
Page 21
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
APPLICATION INFORMATION
SAA5249
+5 V
C2
33 µF
C1
100 nF
12
IC1
SAA5249
15
IC2
D34D17D06A8
4748443943
3
D3
DD1
DD2
V
V
COR
ODD/EVENBGRBLANKYVCR
2819181721
27
C13
100 nF
5
1
CC
SS
V
V
D23A719A6
20
18
36
34373235332625
D1D0A8D2A7
29
1513101620
OE
A517A112A213A314A4
15
A6A0A5A1A2A3A4
CVBSVRGBREF
BLACK
STTV
9
14
C11
100 nF
C12
10 µF
A0
A910WE8RAS9CAS
2
11
40424123244645
A9
R/W
RAS
CAS0
POL
OSCOUT
OSCIN
45876
V
REF +
SS1
SS2
C14
100
nF
5
1
SS
CC
V D2D1D0A8A7A6A3A1A0WERAS
SEL2
SDA
OE
V
102019181716141312
SS3 SS4
C10 100 nF
V , V
22, 38
A4A2A5
+5 V
IC3
CAS1
IREF
GNDO
4
303111
15
D3
376
SEL1
SCL
C13 and C14
are optional
surface mounted
capacitors mounted
close to IC
892
R10
4.7 kΩ
R9
4.7 kΩ
LK4
LK3
CAS
LINK
LINK
IC2 and IC3 pin-outs are for 
Dual In-Line Package (DIP)
-
- 256K x 4
-
IC2 IC3
DRAM (120 nS)
LINK
34
1M x 4 -
256K x 4
256K x 4
MLB307
6
R G B BLANKING ODD/EVEN
KEY
1 2345
GND
X3
+5 V
R1
10 kΩ
1
X1
KEY
2
VCR
+5 V
C3
100 
nF
3
CVBS
C8 100 nF
R2
1 kΩ
LK1
LINK
4
STTV
C9 
100 nF L1
C5 8.2 pF
C4
100 nF
LK2
LINK
3.3 µH
C7 1 nF
R11
C7
R3
NOTE :
FOR +VE GOING
1
X2
1996 Nov 07 21
R9
27 kΩ
G1
27 MHz
3.3 kΩ
15 pF
1 kΩ
FOR - VE 
GOING
SYNC FIT LK2
SYNC FIT LK1
2
KEY
+5 V
+5 V
3
R6
R5
R7 220 Ω
4.7 kΩ
4.7 kΩ
R8 220 Ω
4
KEY
123
GND
X4
n.c.
5
SCL SDA
Fig.10 Application diagram; 1 or 4 Mbit DRAM.
D
Page 22
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
IVT1.1BMCX page memory organization
The organization of the page memory is illustrated by Fig.11. The IVT1.1BMCX provides an additional row as compared with first generation decoders; this brings the display format up to 40 characters by 25 rows. Rows 0 to 23 form the teletext page; Row 24 is the extra row available for software generated status messages and FLOF/FASTEXT prompt information.
fixed character
written by IVT hardware
7 characters
for status
71
alphanumerics white for normal alphanumerics green when looking for display page
24 characters from page header rolling when display page looked for
8 characters
always rolling
(time)
824
ROW
0 1 2 3 4
SAA5249
page information
PACKET X / 24 if R0D7 = 0
PACKET X / 27 / 0
PACKETS 8 / 30 / 0 to 15
MBA275 - 2
MAIN PAGE DISPLAY AREA
PACKET X / 22 PACKET X / 23
PACKET X / 24 STORED HERE IF R0D7 = 1
10 14
10 bytes for
received
14 bytes
free for use
by microcontroller
Fig.11 Basic page memory organization.
REMARK TO Fig.11
Row 0
Row 0 is for the page header. The first seven columns
ROW
0 1 2
(0 to 6) are free for status messages. The eighth is an alphanumeric white or green control character, written automatically by IVT1.1BMCX to give a green rolling header when a page is being looked for. The last eight characters are for rolling time.
Row 25
MBA274
5
to
20
21 22 23 24 25
Fig.12 Organization of the extension memory.
1996 Nov 07 22
The first 10 bytes of row 25 contain control data relating to the received page as shown in Table 5. The remaining 14-bytes are free for use by the microcomputer.
Page 23
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
Table 5 Row 25 received control data format
D0 PU0 PT0 MU0 MT0 HU0 HT0 C7 C11 MAG0 0 D1 PU1 PT1 MU1 MT1 HU1 HT1 C8 C12 MAG1 0 D2 PU2 PT2 MU2 MT2 HU2 C5 C9 C13 MAG2 0 D3 PU3 PT3 MU3 C4 HU3 C6 C10 C14 0 0 D4 HAM.ER HAM.ER HAM.ER HAM.ER HAM.ER HAM.ER HAM.ER HAM.ER D5 0 0 0 0 0 0 0 0 0 PBLF D60000000000 D70000000000
Column 0 1 2 3 4 5 6 7 8 9
Table 6 Page number and sub-code for Table 5
Page number
MAG magazine PU page units PT page tens PBLF page being looked for FOUND LOW for page has been found HAM.ER hamming error in corresponding byte
SAA5249
FOUND 0
Page sub-code
MU minutes units MT minutes tens HU hours units HT hours tens C4 to C14 transmitted control bits
1996 Nov 07 23
Page 24
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
Register maps
IVT1.1BMCX mode registers R0 to R11 are shown in Table 7. R0 to R10 are write only; R11 is read/write. Register map (R3), for page requests, is shown in detail in Table 9.
Table 7 Register map (notes 1 to 5)
REGISTER D7 D6 D5 D4 D3 D2 D1 D0
Adv. control 0 X24 POS FREE
RUN PLL
Mode 1 VCS TO
SCS
Page request address
Page request data
Display control (normal)
Display control (newsflash /subtitle)
Display mode
Cursor row 9 − CLEAR
Cursor column
Cursor data 11 D7 D6 D5 D4 D3 D2 D1 D0 Device
status
2 −− − − TB START
3 −− CLEAR
−−−−−−−−
5 BKGND
OUT
6 BKGND
OUT
7 STATUS
BTM TOP
−−−−−−−−
10 −− C5 C4 C3 C2 C1 C0
625/525
11B
SYNC
7 + P/ 8-BIT
BKGND IN COR OUT COR IN TEXT OUT TEXT IN PON OUT PON IN
BKGND IN COR OUT COR IN TEXT OUT TEXT IN PON OUT PON IN
CURSORONCONCEA
MEM.
ROM VERR4ROM
AUTO ODD/ EVEN
ACQ ON/OFF
B.M.
L REVEAL ON
A0 R4 R3 R2 R1 R0
VER R3
DISABLE HDR ROLL
DISABLE PKT 26
PRD4 PRD3 PRD2 PRD1 PRD0
TOP/BTM HALF
ROM VERR2ROM VERR1ROM
DISPLAY SRATUS ROW ONLY
DEW/ FULL FIELD
SINGLE DOUBLE HEIGHT
DISABLE ODD/ EVEN
TCS ON
COLUMN SC2
BOX ON24BOX ON
VER R0
SAA5249
− R11/R11B
SELECT
T1 T0
START COLUMN SC1
1-23
TEXT SIGNAL QUALITY
START COLUMN SC0
BOX ON 0
VCS SIGNAL QUALITY
1996 Nov 07 24
Page 25
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
Notes
1. The dash (−) indicates these bits are inactive and must be written to logic 0 for future compatibility.
2. All bits in registers R0 to R10 are cleared to logic 0 on power-up except bits D0 and D1 of Registers R1, R5 and R6 which are set to logic 1.
3. All memory is cleared to space (00100000) on power-up, except Row 0 Column 7 Chapter 0, which is alpha white (00000111) as the acquisition circuit is enabled but the page is on hold.
4. TB must be set to logic 0 for normal operation.
5. The I2C-bus slave address is 0010001.
Table 8 Register description
R0 ADVANCED CONTROL - auto increments to register 1
R11/R11B SELECT selects reading of R11 or R11B DISABLE ODD/ DISPLAY STATUS ROW when SET = 1 and R1D6 = 1 open (8-bit mode) then all the text display is blanked
DISABLE HDR ROLL disables green rolling header and time AUTO ODD/
FREE RUN PLL will force the PLL to free run in all conditions X24 POS automatic display of FASTEXT prompt row when logic 1
EVEN forces ODD/EVEN output LOW when logic 1
out apart from the status row, this allows the page memory to be used for non-textural data, such as in the German TOP system
EVEN when set forces ODD/EVEN LOW if any TV picture displayed, if DISABLE
ODD/EVEN = 0
SAA5249
R1 MODE - auto increments to register 2
T0, T1 interlace/non-interlace 312/313 line control (see Table 10) TCS ON text composite sync or direct sync select (see Table 10 for FFB mode selection) DEW/FULL FIELD field-flyback or full-channel mode DISABLE PKT 26 disable automatic processing of packet 26
ON/OFF acquisition circuits turned off when logic 1
ACQ 7 + P/8-BIT 7-bits with parity checking or 8-bit mode VCS TO SCS when logic 1 enables display of messages with 60Hz input signal
R2 PAGE REQUEST ADDRESS - auto increments to register 3
COL SCO - SC2 point to start column for page request data (see Table 9) TB must be logic 0 for normal operation
R3 PAGE REQUEST DATA - does not auto increment (see Table 9) CLEAR B.M. when set to logic 1. Useful when transmission channel changes
R5 NORMAL DISPLAY CONTROL - auto increments to register 6 R6 NEWSFLASH/SUBTITLE DISPLAY CONTROL - auto increments to register 7; (note 1)
PON picture on TEXT text on COR contrast reduction on BKGND background colour on
1996 Nov 07 25
Page 26
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with
C-bus
2
C-bus
SAA5249
Background Memory Controller
R7 DISPLAY MODE - does not auto increment
BOX ON 0 boxing function allowed on Row 0 BOX ON 1-23 boxing function allowed on Rows 1 to 23 BOX ON 24 boxing function allowed on Row 24 DOUBLE HEIGHT to display double height text BOTTOM HALF to select bottom half of page when DOUBLE HEIGHT = 1 REVEAL ON to reveal concealed text CURSOR ON to display cursor STATUS TOP row 25 displayed above or below the main text
R9 CURSOR ROW - auto increments to register 10
R0 to R4 active row for data written to or read from memory via the I A0 selects display memory page (when = 0) or extension packet memory (when = 1) CLEAR MEM. when set to 1, clears the display memory; this bit is automatically reset
R10 CURSOR COLUMN - auto increments to register 11 or 11B
C0 to C5 active column for data written to or read from memory via the I
2
R11 CURSOR DATA - does not auto increment
D0 to D7 data read from/written to memory via I2C-bus, at location pointed to by R9 and
R10. This location automatically increments each time R11 is accessed
R11B DEVICE STATUS - does not auto increment
VCS SIGNAL QUALITY indicates that the video signal quality is good and PLL is phase locked to input
video when = 1 TEXT SIGNAL QUALITY if a good teletext signal is being received when logic 1 ROM VER R0 to R4 indicated language/ROM variant. For Western European = 11000 625/525 SYNC if the input video is a 525 line signal when logic 1
Note
1. These functions have IN and OUT referring to inside and outside the boxing function respectively.
1996 Nov 07 26
Page 27
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
Table 9 Register map for page requests (R3); notes 1 to 5
START COLUMN PRD4 PRD3 PRD2 PRD1 PRD0
0 DO CARE
magazine
1 DO CARE
page tens PT3 PT2 PT1 PT0
2 DO CARE
page units PU3 PU2 PU1 PU0
3 DO CARE
hours tens X X HT1 HT0
4 DO CARE
hours units HU3 HU2 HU1 HU0
5 DO CARE
minutes tens X MT2 MT1 MT0
6 DO CARE
minutes units MU3 MU2 MU1 MU0
HOLD MAG2 MAG1 MAG0
SAA5249
Notes
1. Abbreviations are as for Table 5 except for DO CARE bits.
2. When the DO CARE bit is set to logic 1 this means the corresponding digit is to be taken into account for page requests. If the DO CARE bit is set to logic 0 the digit is ignored. This allows, for example, normal or timed page selection.
HOLD is set LOW, the page is held and not updated.
3. If
4. Columns auto-increment on successive I2C-bus transmission bytes.
5. X = don't care.
Table 10 Interlace/non-interlace 312/313 line control and ODD/EVEN field detection option; notes 1 and 2
TCS ON
FFB MODE
X 0 0 interlaced 312.5/312.5 lines X 0 1 non-interlaced 312/313 lines (note 1) X 1 0 non-interlaced 312/313 lines (note 1)
011
111
Notes
1. Reverts to interlaced mode if a newsflash or subtitle is being displayed.
2. X = Don't care.
T1 T0 RESULT
SCS (scan composite sync) mode: FFB leading edge in first broad pulse of field
SCS (scan composite sync) mode: FFB leading edge in second broad pulse of field
1996 Nov 07 27
Page 28
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
CLOCK SYSTEMS Crystal oscillator
The crystal is a conventional 2-pin design operating at 27 MHz. It is capable of oscillating with both fundamental and third overtone mode crystals. External components should be used to suppress the fundamental output of the third overtone as illustrated in Fig.13.
SAA5249
8.2 pF
1 nF
3.3 µH
3.3 kΩ
27 MHz 
3rd
overtone
V
DD1
OSCOUT
100 nF15 pF
OSCIN
GNDO
3 (25)
4 (27)
5 (28)
6 (29)
SAA5249
CRYSTAL
OSCILLATOR
MLB308
Fig.13 Crystal oscillator application diagram for SOT240-1; pins in parenthesis are for SOT319-1.
Table 11 Crystal characteristics (see Fig.13)
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
Crystal (27 MHz, 3rd overtone)
C1 series capacitance − 1.7 − pF C0 parallel capacitance − 5.2 − pF C
L
R
r
load capacitance − 20 − pF
resonance resistance −−50 Ω R1 series resistance − 20 −Ω X
a
X
j
X
d
ageing −−±510
adjustment tolerance −−±25 10
drift −−±25 10
−6
/year
−6
−6
1996 Nov 07 28
Page 29
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
CHARACTER SETS
The WST specification allows the selection of national character sets via the page header transmission bits, C12 to C14. The basic 96 character sets differ only in 13 national option characters as indicated in the Tables 16, 17 and 18 with reference to their table position in the basic character matrix illustrated in Table 15. The IVT1.1BMCX automatically decodes transmission bits C12 to C14. Tables 12, 13 and 14 illustrate the character matrixes.
Character bytes are listed as transmitted from b1 to b7.
MLA663
handbook, full pagewidth
SAA5249
alphanumerics and
graphics 'space'
character
0000010
contiguous
graphics character
0110111
alphanumerics
character
1011010
separated
graphics character
0110111
= =
Fig.14 Character format.
alphanumerics or
blast-through
alphanumerics
character
0001001
separated
graphics character
1111111
background
colour
alphanumerics
character
1111111
contiguous
graphics character
1111111
display
colour
1996 Nov 07 29
Page 30
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with
1
1
1
0
0
SAA5249
1
1
1
1
0
1
MBA429
1
1
0
1
Background Memory Controller
Table 12 SAA5249P/E character data input decoding, West European languages; notes 1 to 9 For character version number (11000) see Register 11B.
b
handbook, full pagewidth
B
8
I
b
T S
b4b3b2b
0 0 0 0
0 0 1 0
0 1 0 1
1 0 0 0
7
b
6
b
5
1
column
r o
w
0
10 0 0 1
2
30 0 1 1
40 1 0 0
5
60 1 1 0
70 1 1 1
8
91 0 0 1 steady
101 0 1 0 end box
111 0 1 1 start box ESC
121 1 0 0
131 1 0 1
141 1 1 0 SO
151 1 1 1 SI
0
0
0 or 1
0
0 or 1
0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
0 1 22a3 3a4 5 66a77a 8 912131415
alpha -
numerics
numerics
alpha -
numerics
numerics
numerics
numerics
magenta
numerics
numerics
normal
double
black
alpha -
red
green
alpha -
yellow
alpha -
blue
alpha -
alpha -
cyan
alpha -
white
flash
height
height
graphics
black
graphics
red
graphics
green
graphics
yellow
graphics
blue
graphics magenta
graphics
cyan
(2)
graphics
white
conceal
display
(2) (2)
contiguous
graphics
(2)
separated
graphics
(2) (2)
black
back -
ground
new
back -
ground
(1)
hold
graphics
(1) (2)
release
graphics
(1)
1
1
1
1
1
0
1
0
0
1
1
0
1
0
1
0
1
1
0
1
1
1
0
0
0
0
1
1
1996 Nov 07 30
Page 31
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
Table 13 SAA5249P/H character data input decoding, West European languages; notes 1 to 9 For character version number (11001) see Register 11B.
SAA5249
handbook, full pagewidth
b
B
8
I
b
T
7
S
b4b3b2b
0 0 0 0
0 0 1 0
0 1 0 1
1 0 0 0
b
0
0
6
b
5
1
column
r o
w
alpha -
numerics
0
black
alpha -
numerics
10 0 0 1
red
alpha -
numerics
2
green alpha -
numerics
30 0 1 1
yellow
alpha -
numerics
40 1 0 0
blue
alpha -
numerics
5
magenta
alpha -
numerics
60 1 1 0
cyan
alpha -
70 1 1 1
numerics
white
8
flash
91 0 0 1 steady
101 0 1 0 end box
111 0 1 1 start box ESC
normal
121 1 0 0
height
double
131 1 0 1
height
141 1 1 0 SO
151 1 1 1 SI
0
0 or 1
0
0 or 1
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
0 1 22a3 3a4 5 66a 77a8 912131415
graphics
black
graphics
red
graphics
green
graphics
yellow
graphics
blue
graphics
magenta
graphics
cyan
(2)
graphics
white
conceal
display
(2) (2)
contiguous
graphics
(2)
separated
graphics
(1)
(2) (2)
black
back -
ground
new
back -
ground
(1)
hold
graphics
(1) (2)
release
graphics
1
0
1
1
1
0
1
0
0
1
1
0
1
0
1
0
1
1
1
1
1
0
0
1
1
0
1
1
0
0
1
1
0
0
0
1
1
1
1
0
1
1
MLA961
1
1996 Nov 07 31
Page 32
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
Table 14 SAA5249P/T character data input decoding, West European and Turkish languages; notes 1 to 9 For character version number (11010) see Register 11B.
SAA5249
handbook, full pagewidth
b
B
8
I
b
T
7
S
b4b3b2b
0 0 0 0
0 0 1 0
0 1 0 1
1 0 0 0
b
6
0
0
b
5
1
0
column
0 1 22a3 3a4 5 66a77a 8 912131415
r o w
alpha -
numerics
0
black
alpha -
numerics
10 0 0 1
red
alpha -
numerics
2
green alpha -
numerics
30 0 1 1
yellow alpha -
numerics
40 1 0 0
blue
alpha -
numerics
5
magenta
alpha -
numerics
60 1 1 0
cyan
alpha -
70 1 1 1
numerics
white
8
flash
91 0 0 1 steady
101 0 1 0 end box
111 0 1 1 start box ESC
normal
121 1 0 0
height
double
131 1 0 1
height
141 1 1 0 SO
151 1 1 1 SI
0
0
0
0
graphics
black
graphics
red
graphics
green
graphics
yellow
graphics
blue
graphics magenta
graphics
cyan
(2)
graphics
white
conceal
display
(2) (2)
contiguous
graphics
(2)
separated
graphics
(2) (2)
black
back -
ground
new
back -
ground
(1)
hold
graphics
(1) (2)
release
graphics
0 or 1
0
0 or 1
0
0
0
0
0
0
0
0
1
1
1
0
(1)
1
1
1
1
1
0
1
0
1
1
0
1
0
1
0
1
1
1
1
1
0
0
1
1
0
1
1
0
0
1
0
1
0
0
1
1
1
1
0
MBA431
1
1
1
1996 Nov 07 32
Page 33
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with
1
1
1
0
0
SAA5249
1
1
1
0
1
1
1
1
0
1
Background Memory Controller
Table 15 SAA5249P/R character data input decoding, Baltic and Cyrillic languages; notes 1 to 9 For character version number (11101) see Register 11B.
B
b
8
I
b
T S
b4b3b2b
0 0 0 1
0 1 0 0
0 1 0 1
andbook, full pagewidth
0 1 1 1
7
b
6
b
5
1
0
column
r o w
alpha -
numerics
00 0 0 0
black
alpha -
numerics
1
alpha -
numerics
20 0 1 0
green alpha -
numerics
30 0 1 1
yellow
alpha -
numerics
4
blue
alpha -
numerics
5
magenta
alpha -
numerics
60 1 1 0
cyan
alpha -
7
numerics
white
81 0 0 0 flash
steady
91 0 0 1
101 0 1 0 end box
0
0 or 1
0
0 or 1
0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
0
1 22a3 3a4 5 66a 77a8 912131415
graphics
black
graphics
(2)
(2)
(2)
red
graphics
green
graphics
yellow
graphics
blue
graphics
magenta
graphics
cyan
graphics
white
conceal
display
contiguous
graphics
separated
graphics
(2)
red
1
1
1
1
1
0
1
0
0
1
1
0
1
0
1
0
1
1
1
0
1
0
1
1
0
0
0
1
111 0 1 1 start box TWIST
(2) (2)
height
height
(1)
(1)
black
back -
ground
new
back -
ground
hold
graphics
release
graphics
(2)
normal
121 1 0 0
double
131 1 0 1
141 1 1 0 SO
151 1 1 1 SI
1996 Nov 07 33
MBA648 - 1
Page 34
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
Notes to Tables 12, 13, 14 and 15
1. These control characters are reserved for compatibility with other data codes.
2. These control characters are presumed before each row begins.
3. Control characters shown in Columns 0 and 1 are normally displayed as spaces.
4. Characters may be referred to by column and row (for example 2/5 refers to %).
5. Black represents displayed colour. White represents background.
6. The SAA5249 national option characters are illustrated in Tables 16, 17,18 and 19.
7. Characters 8/6, 8/7, 9/5, 9/6 and 9/7 are special characters for combining with character 8/5 (E, H and T codes only).
8. National option characters will be displayed according to the setting of control bits C12 to C14. These will be mapped into the basic code table into positions shown in Tables 16, 17, 18 and 19.
9. Columns 2a, 3a, 6a and 7a are displayed in graphics mode.
SAA5249
1996 Nov 07 34
Page 35
Philips Semiconductors Preliminary specification
f
Integrated VIP and Teletext with Background Memory Controller
SAA5249
6/0
NC
7/11
5/11
NC
NC
7/12
5/12
NC
NC
7/13
5/13
NC
NC
7/14
5/14
NC
NC
MLA630
NC
5/15
ull pagewidth
NC
2/0 2/8 3/0 3/8 4/0 4/8 5/0 5/8 7/86/8 7/0
2/9 3/1 3/9 4/1 4/9 5/1 5/9 6/1 6/9 7/1 7/9
2/1
2/2 2/10 3/2 3/10 4/2 4/10 5/2 5/10 6/2 6/10 7/2 7/10
2/11 3/3 3/11 4/3 4/11 5/3 6/3 6/11 7/3
2/3
2/12 3/4 3/12 4/4 4/12 5/4 6/4 6/12 7/4
NC
2/4
Table 16 SAA5249 basic character matrix; note 1
1996 Nov 07 35
NC
2/5 2/13 3/5 3/13 4/5 4/13 5/5 6/5 6/13 7/5
2/6 2/14 3/6 3/14 4/6 4/14 5/6 6/6 7/6
2/7 2/15 3/7 3/15 4/7 4/15 5/7 6/7 6/15 7/7 7/15
Note
1. Where: NC = national option character position.
Page 36
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
Table 17 SAA5249P/E national option character set; note 1
SAA5249
andbook, full pagewidth
LANGUAGE
C12 C13 C14
ENGLISH
GERMAN
SWEDISH
ITALIAN
FRENCH
SPANISH
(1)
PHCB
000
001
010
011
100
101
2 / 3
2 / 4 4 / 0
CHARACTER POSITION (COLUMN / ROW)
5 / 11 5 / 12 5 / 13 5 / 14 5 / 15 6 / 0 7 / 11 7 / 12 7 / 13 7 / 14
Note
1. PHCB are the Page Header Control Bits. Other combinations default to English.
MLB458
1996 Nov 07 36
Page 37
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
Table 18 SAA5249P/H national option character set; note 1
SAA5249
handbook, full pagewidth
LANGUAGE
C12 C13 C14
POLISH
GERMAN
SWEDISH
SERBO-CROAT
CZECHOSLOVAKIA
RUMANIAN
(1)
PHCB
000
001
010
101
110
111
2 / 3
2 / 4 4 / 0
CHARACTER POSITION (COLUMN / ROW)
5 / 11 5 / 12 5 / 13 5 / 14 5 / 15 6 / 0 7 / 11 7 / 12 7 / 13 7 / 14
MLA966
Note
1. PHCB are the Page Header Control Bits. Other combinations default to German. Only the above characters change with the PHCB. All other characters in the basic set are shown in Table 15.
1996 Nov 07 37
Page 38
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
Table 19 SAA5249P/R national option character set; note 1
SAA5249
andbook, full pagewidth
LANGUAGE
ESTONIAN
LETTISH / LITHUANIAN
RUSSIAN
(1)
PHCB
C12 C13 C14
010
011
100
CHARACTER POSITION (COLUMN / ROW)
2 / 3
2 / 4 4 / 0
234567
0
1
2
3
4
5
6
5 / 11 5 / 12 5 / 13 5 / 14 5 / 15 6 / 0 7 / 11 7 / 12 7 / 13 7 / 14
7
8
9
10
11
12
13
14
15
MEA597
Note
1. PHCB are the Page Header Control Bits. Other combinations default to Estonian.
1996 Nov 07 38
Page 39
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
PACKAGE OUTLINES
SAA5249
DIP48: plastic dual in-line package; 48 leads (600 mil)
D
seating plane
L
Z
48
pin 1 index
e
b
SOT240-1
M
E
A
2
A
A
1
w M
b
1
25
E
c
(e )
1
M
H
1
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
max.
mm
OUTLINE VERSION
SOT240-1
1 2
min.
max.
1.4
1.14
0.055
0.045
IEC JEDEC EIAJ
b
b
1
0.53
0.38
0.021
0.015
0.014
0.009
REFERENCES
cD E e M
0.36
62.60
0.23
61.60
2.46
2.42
1996 Nov 07 39
14.22
13.56
0.56
0.53
24
(1)(1)
e
L
1
3.90
3.05
0.15
0.12
M
E
15.88
15.24
0.63
0.60
EUROPEAN
PROJECTION
18.46
15.24
0.73
0.60
H
w
0.2542.54 15.24
0.010.10 0.60
ISSUE DATE
92-11-17 95-01-25
max.
0.083 0.19 0.014 0.16
(1)
Z
2.14.9 0.36 4.06
Page 40
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
QFP64: plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.7 mm; high stand-off height
c
y
X
SAA5249
SOT319-1
51 33
52
pin 1 index
64
1
w M
b
0.25
p
D
H
D
cE
p
0.50
0.25
0.35
0.13
e
DIMENSIONS (mm are the original dimensions)
mm
A
max.
3.3
0.36
0.10
2.87
2.57
UNIT A1A2A3b
A
32
Z
E
e
H
E
E
w M
b
p
20
19
Z
D
B
0 5 10 mm
scale
(1)
(1) (1)(1)
D
20.1
19.9
eH
H
14.1
13.9
24.2
1
23.6
D
v M
A
v M
B
LLpQZywv θ
E
18.2
17.6
1.0
0.6
1.43
1.23
A
2
A
A
1
detail X
0.2 0.10.21.95
Q
(A )
3
θ
L
p
L
Z
E
D
1.2
0.8
o
7
o
0
1.2
0.8
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE VERSION
SOT319-1
IEC JEDEC EIAJ
REFERENCES
1996 Nov 07 40
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17 95-02-04
Page 41
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
SAA5249
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
DIP
OLDERING BY DIPPING OR BY WA VE
S The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
EPAIRING SOLDERED JOINTS
R Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
QFP
REFLOW SOLDERING Reflow soldering techniques are suitable for all QFP
packages. The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or vapour phase heating is used and the large packages are not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small amount of moisture in them can cause cracking of the plastic body. For more information, refer to the Drypack chapter in our
Reference Handbook”
(order code 9398 652 90011).
). If the
stg max
“Quality
(order code 9397 750 00192).
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary from 50 to 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheat for 45 minutes at 45 °C.
WAVE SOLDERING Wave soldering is not recommended for QFP packages.
This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices.
If wave soldering cannot be avoided, the following conditions must be observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering technique should be used.
• The footprint must be at an angle of 45° to the board
direction and must incorporate solder thieves downstream and at the side corners.
Even with these conditions, do not consider wave soldering the following packages: QFP52 (SOT379-1), QFP100 (SOT317-1), QFP100 (SOT317-2), QFP100 (SOT382-1) or QFP160 (SOT322-1).
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
1996 Nov 07 41
Page 42
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
SAA5249
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
PURCHASE OF PHILIPS I
2
C COMPONENTS
2
Purchase of Philips I components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
C components conveys a license under the Philips’ I2C patent to use the
1996 Nov 07 42
Page 43
Philips Semiconductors Preliminary specification
Integrated VIP and Teletext with Background Memory Controller
NOTES
SAA5249
1996 Nov 07 43
Page 44
Philips Semiconductors – a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381
China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580/xxx France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
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Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722
Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,
Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 247 9145, Fax. +7 095 247 9144 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 São Paulo, SÃO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849
Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1, P.O. Box 22978, TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381
Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1996 SCA52 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
Printed in The Netherlands 537021/50/02/pp44 Date of release: 1996 Nov07 Document order number: 9397 750 01014
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