Preliminary specification1997 Sept 16
IC17 Data Handbook
Page 2
Philips SemiconductorsPreliminary specification
SA900I/Q transmit modulator
DO NOT DISTRIBUTE WITHOUT ECN DATED AFTER Sept 16, 1997
DESCRIPTION
The SA900 is a monolithic high performance, multi-function transmit
modulator for use in cellular radio applications, fabricated in QUBiC
BiCMOS technology. The SA900 features both analog (AMPS)
mode and complex, I/Q digital (NADC IS–136) mode quadrature
modulation functions, a PLL synthesizer with VCO, crystal oscillator,
programmable prescalers and Gilbert cell multiplier phase detector
with programmable charge pump output. The DUALTX output can
be used in DUAL mode cellular phone applications with the AMPS
and NADC modulation being applied to the I/Q baseband inputs.
The DUALTX output also provides 6-bit power control with 40dB of
gain control in 0.63dB steps. In addition, buffered crystal oscillator
programmable prescaler outputs are provided to support system
clock reference needs. Programming of the SA900 functions are
realized by a high speed 3-wire serial interface. The SA900 can be
programmed into a sleep mode (low current mode providing crystal
oscillator and Master Clock functions), a standby mode (providing
crystal oscillator, Master Clock, System Clock 1 and Transmit LO
buffer functions), and the AMPS mode and the DUAL mode
configurations.
FEA TURES
•V
= 4.0V
CC
•Tx output frequency = 900MHz
•Direct modulation of RF
•DUAL mode, on-chip PA control
•I/Q modulator
•Single sideband quadrature LO generation with no external
adjustments required
•On-chip crystal oscillator with 3 buffered outputs
•AMPS/TACS compatible
•On-chip VCO
PIN CONFIGURATION
BE Package
I
Vcc
CLK2
GND
I
QQGND
424344
20 21 22 23 24
DATA
MCLK
CLKSET
3940413738
CLOCK
GND
TXLO_2
TXLO_1
GND
Vcc
TANK_1
TANK_2
Vcc
PHSOUT
I
PEAK
GND
XTAL_1
Vcc
LO_2
LO_1
1
2
3
4
5
6
7
8
9
10
11
12
13 14 15 16 17 18 19
Vcc
CLK1
XTAL_2
GND
45464748
GND
Figure 1. Pin Configuration
•Selective power-down
– Low power AMPS/TACS mode
– Low power dual mode NADC
1. Maximum dissipation is determined by the operating ambient temperature and the thermal resistance, θ
RECOMMENDED OPERATING CONDITIONS
SYMBOLPARAMETERRATINGUNITS
V
CC
T
A
T
J
Supply voltage-0.3 to +6V
Voltage applied to any other pin-0.3 to (VCC + 0.3)V
Power dissipation, TA = 25°C (still air)600mW
Maximum operating junction temperature150°C
Maximum power input/output+10dBm
Storage temperature range–65 to +150°C
.
48-pin LQFP:θ
= 67°C/W
JA
JA
Supply voltage3.9 to 5.1V
Operating ambient temperature range-40 to +85°C
Operating junction temperature-40 to +105°C
Output level–1.5+2dBm
869 to 894MHz-104dBm
824 to 849MHz-47dBc
AMPSTX
Spurious output2 to 824MHz-41dBc
849 to 869MHz-41dBc
894MHz to 8.49GHz-41dBc
TXLO and harmonics-21dBc
Adjacent channel noise power@30kHz-95dBc/Hz
Alternate channel noise power@60kHz-101dBc/Hz
Broadband noise power869 to 894MHz-136dBm/Hz
DUAL output, SE=1, AD=1, TXEN=1 (with
external matching Figure 9)
Frequency range820920
VSWR2:1
Output level (avg) (I and Q
quad, 0dB VGA)
0+2dBm
Gain flatness1dB
1997 Sept 16
8
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Philips SemiconductorsPreliminary specification
SYMBOL
PARAMETER
TEST CONDITIONS
UNITS
Broadband noise (0dB VGA)
_
Output impedance
Out ut level
SA900I/Q transmit modulator
AC ELECTRICAL CHARACTERISTICS (continued)
LIMITS
MINTYPMAX
DUALTX3rd order-35-42dBc
(cont.)Linearity (0dB VGA, I and Q inphase)5th order-55dBc
7th order-65dBc
Carrier suppression (I and Q quadrature)VGA = 0dB-35-45dBc
Carrier suppression (I and Q quadrature)VGA = –40dB-28-33dBc
Sideband suppressionI and Q quadrature-35-45dBc
2. Needs a different matching component. Max test frequency is 850MHz with test circuit shown in Figure 11.
0.81.0
0.81.0
1
1
MHz
V
P-P
kΩ
1
1
MHz
V
P-P
P-P
P-P
FUNCTIONAL DESCRIPTION
Dual Mode Operation
The SA900 transmit modulator provides direct single sideband
quadrature modulation of the difference of the TXLO and VCO
frequencies, while providing quadrature LO signals for the I/Q
modulator. The quadrature LO signals are modulated with high
linearity by the baseband inphase (I) and quadrature (Q) signals.
The summed modulator output produces the lower sideband, while
rejecting the upper sideband. The I and Q inputs also provide DC
biasing for the modulator inputs. The summed output of the
modulator goes to a variable gain amplifier (VGA) to control the
output level, it has 40.0dB of attenuation control range, with 0.63dB
steps. The power control function is programmed by means of a
6-bit word (see Table 3). The VGA output drives the power amp
output stage to provide +2dBm average minimum power level (at
0dB power control) into 50Ω, in conjunction with external matching
components on DUAL TX. The AD (AMPS/DUAL) and the SE
(synthesizer enable) bit control the power up/down of the DUAL
1997 Sept 16
mode function. The transition of the TXEN, from low to high turns
on the modulator. The falling edge of the TXEN signal disables the
synthesizer and modulator . The TXLO is a system supplied LO
signal. The SA900 buffers the TXLO signal (LO_1/2) for use with
the system synthesizer (such as the SA7025) to form the system LO
synthesizer loop. The DUAL mode can also be used for AMPS
operation. The AMPS and DUAL mode modulation is generated by
the system DSP IC to provide the required I/Q baseband modulation
for the SA900. The DUAL output provides low broadband noise
output power (so that the receiver sensitivity is not degraded) and
high linearity to meet cellular phone system needs. Table 1 provides
the VGA power control limits.
The SA900 DUALTX output is externally matched with either a shunt
inductor to V
and a series capacitor or a shunt inductor to V
CC
and a series inductor. This matches the DUALTX output to 50Ω.
Values of the matching components are dependent on PCB layout,
typical values are shown in Figure 9.
The SA900 can be configured to operate in the AMPS mode, where
FM modulation is applied to the SA900’s VCO. For the AMPS
mode, the VCO is configured with the proper synthesizer bandwidth
to allow the application of the AMPS modulation to the VCO varactor
tuned tank circuit. The modulated VCO signal is input into an image
reject mixer along with the TXLO signal, where the upper sideband
is rejected. This single sideband modulated signal then drives the
AMPS output power amplifier. The PA provides +2dBm power level
into 50Ω, with no external matching components required. The AD
(AMPS/DUAL) and the SE (synthesizer enable) bit control the power
up/down of the AMPS mode function. The transition of the TXEN
signal from low to high turns on the modulator. The falling edge of
TXEN signal disables the synthesizer and the modulator.
Synthesizer Operation
The SA900 synthesizer is comprised of the differential VCO circuit,
with external tank components, the Gilbert cell multiplier phase
detector with programmable charge pump current, crystal oscillator
and programmable prescalers. The charge pump output drives an
external second order loop filter. The output of the loop filter is used
to provide the control voltage to the VCO tuning varactor to
complete the PLL synthesizer. The synthesized VCO output
frequency is mixed with the TXLO signal to generate the transmit LO
from the lower sideband (the difference of the VCO and TXLO
frequencies). The output of VCO is fed to a programmable /N
prescaler with user selectable divides of 6, 7, 8 and 9 (all divides
configured to provide 50% duty cycle). The output of the /N divider
drives the A8/1 prescaler. The A8/1 divide is selected by the AD
control bit (AD=1 for /1, and AD=0 for /8). The output of the divide
A8/1 is fed into one input of the phase detector. The reference input
for the phase comparator is generated from the crystal oscillator
(XO) output from the B8/1 prescaler. The B8/1 divide is selected by
the AD control bit (AD=0 for /8, and AD=1 for /1). The phase
detector compares the prescaled XO reference phase to the VCO
prescaled phase, to generate a charge pump output current
proportional to the phase error. The phase detector , a Gilbert cell
multiplier type, having a linear output from 0 to π (π/2 ±π/2). The
charge pump peak output current is programmable from 100µA for
the AMPS mode (AD=0) to a maximum of 6.4mA for the DUAL
mode (AD=1) by way of an external current setting resistor placed
from I
in Figure 5. The charge pump current output is programmed by
where R
The PLL frequency is determined by
where N=6, 7, 8, 9 and A8/1 and B8/1 are controlled by the AD bit
(AD=1 A8/1 and B8/1 are divide by 1, AD=0 A8/1 and B8/1 are
divide 8).
to circuit ground. The typical loop filter network is shown
PEAK
1.25V
AD 0I
AD 1I
is placed between I
SET
VCO XO N
OUT
OUT
(
(
A8
1
B8
1
6
24
)
)
PEAK
R
SET
1.25V
R
SET
and GROUND.
Table 2.Data Word Format
MnemonicsBitsFunction
A01 (MSB)Address bit 0 (1)
A12Address bit 1 (0)
A23Address bit 2 (1)
A34Address bit 4 (1)
PC05Power control bit 0
PC16Power control bit 1
PC27Power control bit 2
PC38Power control bit 3
PC49Power control bit 4
PC510Power control bit 5
N011Divide N bit 0
N112Divide N bit 1
AD13AMPS/DUAL mode select bit
SE14Synthesizer enable bit
NA15NA
SM116Sleep mode 1 control bit
SM217Sleep mode 2 control bit
X18Divide 3/1 control bit
Y19Divide 2/1 control bit
NA20NA
NA21NA
NA22NA
NA23NA
NA24 (LSB)NA
VCO Operation
The VCO is designed to operate from 90MHz to 140MHz. The VCO
tank is configured using a parallel inductor and a dual common
cathode tuning varactor diodes. DC blocking capacitors are used to
isolate the varactor
1997 Sept 16
10
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Philips SemiconductorsPreliminary specification
SA900I/Q transmit modulator
control voltage from the VCO tank DC bias voltages. The VCO
tuning voltage is generated from the output of the PLL loop filter.
The VCO tank configuration is shown in Figure 6.
Crystal Oscillator (XO) Operation
For cellular radio applications, the SA900 will most likely utilize an
external reference TCXO in order to provide the frequency stability
necessary to operate to system requirements. The output of the
system TCXO can be AC coupled to the XTAL_1 input. However,
for applications that do not require such accuracy the XO circuit can
be configured as a Colpitts type oscillator with the addition of two
external capacitors along with the reference crystal and a trim
capacitor as shown in Figure 7.
Programmable Clock Outputs
The SA900 generates three buffered XO outputs used for external
reference signals. The XO feeds three sets of programmable
prescalers, the prescaler outputs are buffered to provide the CLK1,
CLK2 and MCLK signals. The CLK1 signal is a selectable divide 3/1
(X=1 divide 3, X=0 divide 1), 50% duty cycle, of the XO reference
signal. The CLK2 signal is a selectable divide 2/1 (Y=1 divide 2,
Y=0 divide 1), 50% duty cycle, of the XO reference signal. The
MCLK signal is a selectable divide 4/5/1 (CLKSET = V
CLKSET = V
cycle, of the XO reference signal. MCLK is externally set by means
of the tri-level CLKSET input to provide a default master system
clock prior to programming the SA900.
/2 divide 5, and CLKSET = 0V divide 1), 50% duty
CC
divide 4,
CC
Programming Operation
The SA900 is configured by means of a 3-wire input (CLOCK,
STROBE, DATA) to program the AMPS and DUAL modes, in
addition there are two power saving modes of operation, SLEEP and
STANDBY. The control logic section of the SA900 is designed using
low power CMOS logic. During SLEEP mode only the circuitry
required to provide a master clock (MCLK) to the digital portion of
the system is enabled. During the STANDBY mode of operation
MCLK, CLK1 and the TXLO and buffered LO outputs are powered
on, which may be the case when the system is in the receive only
mode. In the AMPS or DUAL operational modes all functions of the
SA900 are powered on to support receive, transmit and system
clock functions. The programming of the SA900 is identical to the
programming format of the SA7025 low-voltage 1GHz fractional-N
synthesizer, that can be used in conjunction with the SA900 to
provide the cellular radio channel selection.
The programming data is structured as a 24 bit long serial data
word; the word includes 4 address bits (dedicated 1 0 1 1) for chip
select. Data bits are shifted in on the leading edge of the clock, with
the least significant bit (LSB) first and the most significant bit (MSB)
last. Table 2 shows data word format, the 15th and last 5 bits are
not used. Figure 8 shows the chip timing diagram.
AMPS/DUAL Mode
The A/D mode select enables or disables that portion of the circuitry
used for either the AMPS or DUAL mode of operation.
AD
0AMPS
1DUAL
Mode
Synthesizer Enable
The SE bit turns on and off the synthesizer circuitry.
SE
0Disabled
1Enabled
Operation
Sleep Mode 1
The SM1 bit is used to power down the TXLO buffer , the divide 3/1
prescaler and the CLK1 output buffer.
SM1
0Power down
1Power up (STANDBY)
Operation
Sleep Mode 2
The SM2 bit is used to power down the divide 2/1 prescaler and the
CLK2.
DUALTX VGA Attenuation Profile vs. VCC (T = 27°C, F = 836MHz)
Figure 14. Performance Characteristics
18
SR00649
Page 19
Philips SemiconductorsPreliminary specification
SA900I/Q transmit modulator
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mmSOT313-2
1997 Sept 16
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Page 20
Philips SemiconductorsPreliminary specification
SA900I/Q transmit modulator
DEFINITIONS
Data Sheet IdentificationProduct StatusDefinition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation
register eligible circuits under the Semiconductor Chip Protection Act.
Copyright Philips Electronics North America Corporation 1996
All rights reserved. Printed in U.S.A.
1997 Sept 16
20
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