Datasheet S9408P, S9408S Datasheet (SUMMIT)

Page 1
SUMMIT
MICROELECTRONICS, Inc.
Serial Input, Quad 8-Bit Nonvolatile DACPOT™
S9408
FEATURES
• Four 8-Bit DACS – Differential Non-linearity - ±0.5LSB max
– Integral Non-Linearity - ±1LSB max
• Each DAC has Independent Reference Inputs – Output Buffer Amplifiers Swing Rail-to-Rail
– Ground to VDD Reference Input Range
• Each DAC’s Digital Input Data Maintained in Nonvolatile EEPROM
• Power-On Reset Reloads Registers with Nonvolatile Data
• Simple Serial Interface for Reading and Writing DAC values, SPI™ and QSPI™ compatible.
• Fully operational from 2.7V to 5.5V
• Low Power: <1mW @ 2.7V
FUNCTIONAL BLOCK DIAGRAM
Memory Control
8-Bit E2PROM
OVERVIEW
The S9408 DACPOT™ is a serial input, voltage output, quad 8-bit digital to analog converter. The S9408 oper-
ates from a single +2.7V to +5.5V supply. Internal preci­sion buffers swing rail-to-rail and the reference input range includes both ground and the positive supply.
The S9408 integrates four 8-bit DACs and their associ­ated circuits which include an enhanced unity-gain opera-
tional amplifier output, an 8-bit data latch, an 8-bit non­volatile register, and an industry-standard serial interface for reading and writing data to the DACs’ data latches and registers. The DACs are independently programmable and each has its own electrically isolated Vreference inputs.
DAC SECTION 0
2
V
REFH0
V
DD
RDY/BSY#
CS#
CLK
00/REG#
GND 10
Serial
3
Programming
4
6 7
DI
5
9
Memory
Controller
Control
Logic
Data In
Serial Data Out
8-Bit Data Register
8-Bit DAC
DAC SECTION 1
DAC SECTION 2
DAC SECTION 3
AMP
2015 T BD 2.0
V
18
OUT0
11
V
REFL0
1
V
REFH1
V
17
OUT1
12
V
REFL1
20
V
REFH2
V
16
OUT2
13
V
REFL2
19
V
REFH3
V
15
OUT3
14
V
REFL3
8
DO
© SUMMIT MICROELECTRONICS, Inc. 2000 • 300 Orchard City Drive, Suite 131 • Campbell, CA 95008 • Phone 408-378-6461 • Fax 408-378-6586 • www.summitmicro.com
Characteristics subject to change without notice
2015 2.2 8/2/00
1
Page 2
PINOUT and SIGNAL DEFINITION
S9408
Pin Name Function
V
REFH1
V
REFH0
V
DD
RDY/BSY#
CLK
CS#
DI
DO
00/REG#
GND
20-Pin PDIP
or 20-Pin SOIC
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
V
REFH2
V
REFH3
V
OUT0
V
OUT1
V
OUT2
V
OUT3
V
REFL3
V
REFL2
V
REFL1
V
REFL0
2015 T PCon 2.0
1, 2 V
REFH
20, 19 V
3V
DD
Vreference High:
REFL
< V
REFH
- V
DD
Power Supply Voltage
4 RDY/BSY# Ready/Busy: open drain output
indicating status of nonvolatile write operations
5 CLK Clock Input Pin: used for serial
data communication
6 CS# Chip Select: When high deselects
the device and places it in a low
power mode 7 DI Data Input: serial data input pin 8 DO Data Output: serial data output pin
9 00/REG# Power On Recall Option Input
10 GND Power Supply Ground
11, 12 V
REFL
13, 14 V 15, 16 V
OUT
Vreference Low:
REFH
> V
REFL
GND
DAC Output: buffered D to A
17, 18 converter output
The analog outputs of the S9408 can be programmed to any one of 256 individual voltage steps. Each step value is 1/256th of the voltage differential between V V
of the respective DAC. Once programmed these
REFL
REFH
and
settings can be retained in nonvolatile memory during all power conditions and will be automatically recalled upon a power-up sequence. Each DAC can be independently read without affecting the output voltage during the read
cycle. In addition, each output can be adjusted an unlim­ited number of times without altering the value stored in
the nonvolatile memory.
DEVICE OPERATION
Analog Section
The S9804 is an 8-bit, voltage output digital-to-analog converter (DAC). The DAC consists of a resistor network that converts 8-bit digital inputs into equivalent analog output voltages in proportion to the applied reference voltage.
Reference inputs
The voltage differential between the V
REFL
and V
REFH
inputs sets the full-scale output voltage for its respective DAC. V (positive voltage). V than V
must be equal to or greater than ground
REFL
must be greater (more positive)
REFH
and less than or equal to VDD.
REFL
Output Buffer Amplifiers
The voltage outputs are precision unity-gain followers that slew up to 1V/µs. The outputs can swing from V V
. With a 0V to 5V output transition the amplifier
REFH
REFL
to
outputs typically settle to 1LSB in 40µs.
DIGITAL INTERFACE
The S9408 employs a common 4-wire serial interface. It is comprised of a Clock (CLK), Chip Select (CS#), Data In
(DI) and Data Out (DO). Data is clocked into the device on the clocks rising edge and out of the device on the clock’s falling edge. Data is shifted in and out MSB first. DO only becomes active after the device has been selected and after a valid read command and address has been re­ceived.
All data transfers are initiated after CS# goes low and a logic 1 is clocked into the device. This first data transfer is the start bit and must precede all operations. Following the start bit are two command bits used to specify which of four commands to execute. The next two bits are the address bits used to select one of the four DACs. The action of the next eight clock cycles will be dependent upon the command issued.
2
2015 2.2 8/2/00
SUMMIT MICROELECTRONICS, Inc.
Page 3
S9408
tratSC1C
0
A1A
0
dnammoC
100AA elbanEetirWVN 10 1AA nIataDetirW 110AA tuOataDdaeR 111AA llaceR
TABLE 1. COMMAND FORMAT
Internally there are four DACs and associated with each are two registers. There is one data register that is used by the DAC to hold the digital value it converts. There is
also one nonvolatile register that holds the default value that can be recalled into the data register during power­up or by executing the Recall command.
READ
Read operations are initiated by taking CS# low and clocking in a start bit followed by the read command and the address of the data register to be read. The next eight clocks will output on the DO pin the contents of the
selected data register. This read will not affect the contents of the register or the output of the DAC. Refer to Figure 1 for an illustration of the sequence of bus conditions for a read operation.
WRITE
Write operations are initiated by taking CS# low and clocking in a start bit followed by the write command and the address of the data register to be written. This action is followed by the host clocking eight bits of data into the
register, MSB first. The output of the selected DAC will change as the last bit is clocked into the device. At this point the clock counter will reset the command register, requiring a full sequence to be initiated in order to write to
the DAC again.
NOTE: This write operation does not affect the contents of the nonvolatile register. Therefore, the nonvolatile register can contain the power-on default settings (e.g. volume), and the write DAC command can be used to make situational adjustments.
Refer to Figure 2 for an illustration of the sequence of bus conditions for a write operation.
CS#
CLK
DI
S T A R T
DO
RDY/BSY#
SUMMIT MICROELECTRONICS, Inc.
CACA
1100
Hi Z
(Pulled up to VDD)
FIGURE 1. READ SEQUENCE
DD
2015 2.2 8/2/00
DDDDDD
10345672
2015 T fig01 2.0
Hi Z
3
Page 4
CS#
CLK
S9408
DI
DO
RDY/BSY#
VOUT
CS#
CLK
DI
S T A R T
CC
10
CDACDA
Hi Z
Rising Edge Sets NV Write Enable Latch
A
Address and Data are Don’t Care
D
01
(Pulled up to VDD)
FIGURE 2. WRITE SEQUENCE
CC
10
DDDDDD
DADA
DDDDDD
103456711 200
Rising Edge Starts NV Write
1034567120
2015 T fig02 2.0
NV Write Enable Latch is Reset
RDY/BSY#
FIGURE 3. NONVOLATILE WRITE SEQUENCE
NONVOLATILE WRITE
A nonvolatile write is a two step operation: it is initiated by taking CS# low and clocking in a start bit followed by the NV Enable command. At this point the host can take CS# back high or continue clocking in data. This data is don’t care and will be ignored by the S9408. If any command other than write follows NV enable the NV latch will be cleared.
Next, the host takes CS# low again and issues a write command and address and then clocks in the eight data
4
2015 2.2 8/2/00
2015 T fig03 2.0
bits to be programmed. The host will then bring CS# HIGH and the data will be latched into the data register and a nonvolatile write operation will commence.
The status of the nonvolatile write can be monitored on the RDY/BSY# pin. A logic low indicates the write is still in
progress and the S9408 will not be accessible to the host; a logic high indicates the write has completed and the S9408 is ready for the next command. Refer to Figure 3
for an illustration of the sequence of bus conditions for a nonvolatile write operation.
SUMMIT MICROELECTRONICS, Inc.
Page 5
S9408
RECALL COMMAND
The recall command will retrieve data from the selected nonvolatile register and write it into the data register of the
associated DAC. This operation is initiated by taking CS# low and clocking in a start bit followed by the recall
command and the address of the nonvolatile register to be recalled. The eight bits of data are dont care, so CS# can
be taken high any time after the address bits are clocked in. Refer to Figure 4 for an illustration of the sequence of
bus conditions for a Recall operation.
CS#
CLK
S T A R T
CACA
1100
V
DI
OUT
Power-on recall
Whenever the S9408 is powered on the DAC output values will be returned to the selected default setting. The
default setting can be the nonvolatile register contents or all zeroes. The state of the 00/REG# pin will determine
which operation will be performed. If it is tied to ground (or left floating) the nonvolatile register contents will be re­called. Conversely, if it is tied to VDD the S9408 will recall
zeroes.
FIGURE 4. RECALL COMMAND SEQUENCE
2015 T fig04 2.0
SUMMIT MICROELECTRONICS, Inc.
2015 2.2 8/2/00
5
Page 6
S9408
ABSOLUTE MAXIMUM RATINGS
VDD to GND .................................................................... -0.5V to +7V
Digital Inputs to GND ............................................ -0.5V to VDD+0.5V
Analog Inputs to GND........................................... -0.5V to VDD+0.5V
Digital Outputs to GND ......................................... -0.5V to VDD+0.5V
Analog Outputs to GND ........................................ -0.5V to VDD+0.5V
Temperature Under Bias ........................................... -55°C to +125°C
Storage Temperature ................................................-65°C to +150°C
Lead Soldering (10 Sec Max) .................................................... 300°C
RECOMMENDED OPERATING CONDITIONS
Condition Min Max
Temperature -40°C +85°C
V
DD
RELIABILITY CHARACTERISTICS (Over recommended operating conditions unless otherwise specified)
lobmySretemaraPniMxaMtinU
Stresses listed under Absolute Maximum Ratings may cause perma­nent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside those listed in the operational sections of this specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability.
+2.7V +5.5V
2015 PGM T2 1.2
V
PAZ
I
HTL
T
RD
N
DNE
ytilibitpecsuSDSE0002V
pu-hctaL001Am
noitneteRataD001sraeY
ecnarudnE000,000,1selcyCegarotS
DC ELECTRICAL CHARACTERISTICS (Over recommended operating conditions unless otherwise specified)
lobmySretemaraPsnoitidnoCniMpyTxaMtinU
I
DD
I
BS
I
HI
I
LI
V
HI
V
LI
V
HO
V
LO
)1eton(
erotsgnirudtnerrucylppuS
tnerrucylppusybdnatSV=SC tnerrucegakaeltupnIV tnerrucegakaeltupnIV
egatlovtupnilevelhgiH2V
egatlovtupnilevelwoL08.0V
egatlovtuptuolevelhgiHAµ004=HOIV
egatlovtuptuolevelwoL
V=SC
LI
HI
V=
NI
DD
V0=1<01 Aµ
NI
3.0 V
DD
8.15.2Am
062005Aµ
1<01Aµ
,Am1=LOIVDD;V5=
,Am4.0=LOIV
V7.2=
DD
3.0
DD
V
4.0V
Note 1: IDD is the supply current drawn while the EEPROM is being updated.
6
2015 2.2 8/2/00
SUMMIT MICROELECTRONICS, Inc.
Page 7
S9408
AC ELECTRICAL CHARACTERISTICS VDD = +4.5V to +5.5V, V
Symbol Parameter Conditions Min. Typ. Max. Units
REFH
= VDD, V
= 0V, TA = -40°C to +85°C, unless otherwise specified
REFL
f
C
t
WH
t
WL
t
CS
t
CSS
t
CSH
t
SU
t
H
t
V
t
HO
t
DIS
t
BUSY
Notes: 1. All timing measurements are defined at the point of signal crossing VDD/2.
Clock Frequency DC 1 MHz Minimum CLK High Time 500 ns Minimum CLK Low Time 300 ns Minimum CS High Time 150 ns CS Setup Time 100 ns CS Hold Time 0 ns Data In Setup Time CL = 100pF 50 ns Data In Hold Time See Note 1 50 ns Output Valid Time 150 ns Data Out Hold Time 0 ns Output Disable Time 400 ns Write Cycle Time 3.3 5 ms
2015 PGM T5 1.1
t
CS
CS#
CLK
DI
DO
RDY/BSY#
t
t
CSS
t
t
SU
Hi Z
H
t
WL
t
V
WH
t
CSH
t
t
HO
DIS
Hi Z
2015 T fig05 2.0
FIGURE 5. AC TIMING DIAGRAM
SUMMIT MICROELECTRONICS, Inc.
2015 2.2 8/2/00
7
Page 8
DAC DC ELECTRICAL CHARACTERISTICS VDD = 2.7V to 5.5V, V
REFH
= VDD, V
= 0V, TA = -40°C to +85°C, unless otherwise specified
REFL
ytreporPlobmySretemaraPsnoitidnoCniMpyTxaMtinU
S9408
LNIytiraenil-nonlargetnII
ycaruccA
LNDytiraenil-nonlaitnereffiDI
V
HFER
V
LFER
R
secnerefeR
NI
R
G
V
I
L
R
V
HFER
RCT
NI
NI
SFE
SZegatlovtesffotuptuO00=D
TUO
V
VCT
TUO
TUO
TUO
egatlovtupnIV egatlovtupnIDNGV
Vot
LFER
ecnatsiserk04
Rfotneiciffeoc.pmeT
NI
hctamecnatsisertupnI5.0±1±%
rorreniagelacs-lluFFF=D
tneiceiffeoc.pmet
tnerrucdaoltuptuopmA002 0001Aµ
ecnatsisertuptuopmA
DAOL
DAOL
V
DD
I
DAOL
Aµ001=5.01±BSL
)1eton(Aµ001=1.05.0±BSL
LFER
003006Cº/mpp
XEH
XEH
I,V5=
DAOL
Aµ05=
05.25 Vm
)1eton(
Aµ001=V5
V3
01
02
V
DD
hFER
1±BSL
05Cº/Vµ
V V
golanA
tuptuO
RRSPnoitcejerylppusrewoPI
t
S
BSL1otemitgnilttesCAD
DAOL
Aµ01=1V/BSL
Fp01V5
V3Fp01
63 72
04 53
sµ sµ
e
N
DHTnoitrotsidcinomrahlatoT
WBBd3htdiwdnaB
Note 1: Guaranteed but not tested
esiontuptuopmAV,zHk1=f
V5=09Vn zH
DD
V
HFER
V
HFER
V
NI
V,V5.2=
V,zHk1=f
NI
V,V5.2=
Vm001=
SMR
,V5=
DD
V1=
SMR
,V5=
DD
80.0%
003zHk
8
2015 2.2 8/2/00
SUMMIT MICROELECTRONICS, Inc.
Page 9
S9408
20 Pin SOIC (.300) Package
0.291 - 0.299
(7.391 - 7.595)
0.010 - 0.029
(0.254 - 0.737)
0.009 - 0.013
(0.229 - 0.330)
x45°
0.016 - 0.050
(0.406 - 1.270)
0° to 8°
typ
0.093 - 0.104
(2.362 - 2.642)
0.050
(1.270)
0.496 - 0.512
(12.598 - 13.005)
0.014 - 0.019
(0.356 - 0.482)
0.394 - 0.419
(10.007 - 10.643)
0.037 - 0.045 (0.940 - 1.143
0.004 - 0.012
(0.102 - 0.305)
41.5
41.0
40.5
40.0
RESISTANCE (kΩ)
39.5
39.0 –40 90
TEMPERATURE (ºC)
VL = GND VH = 5.5V VH = 4.5V VH = 2.7V
25
FIGURE 6. VL to VH END-TO-END RESISTANCE
OVER TEMPERATURE
20pn SOIC ILL.1
2015 T fig06 2.0
SUMMIT MICROELECTRONICS, Inc.
2015 2.2 8/2/00
9
Page 10
ORDERING INFORMATION
S9408
Base Part Number
S9408
Special order
*
P
Package
P = 20 Pin PDIP S = 20 Pin SOIC
2015 T ree 2.0
*
NOTICE
SUMMIT Microelectronics, Inc. reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. SUMMIT Microelectronics, Inc. assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained herein reflect representative operating parameters, and may vary depending upon a users specific application. While the information in this publication has been carefully checked, SUMMIT Microelectronics, Inc. shall not be liable for any damages arising as a result of any error or omission.
SUMMIT Microelectronics, Inc. does not recommend the use of any of its products in life support or aviation applications where the failure or malfunction of the product can reasonably be expected to cause any failure of either system or to significantly affect their safety or effectiveness. Products are not authorized for use in such applications unless SUMMIT Microelectronics, Inc. receives written assurances, to its satisfaction, that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; and (c) potential liability of SUMMIT Microelectronics, Inc. is adequately protected under the circumstances.
© Copyright 2000 SUMMIT Microelectronics, Inc.
10
2015 2.2 8/2/00
SUMMIT MICROELECTRONICS, Inc.
Loading...