Datasheet S93WD662P-2.7, S93WD662P-2.7T, S93WD662P-A, S93WD662P-AT, S93WD662P-B Datasheet (SUMMIT)
...Page 1
SUMMIT MICROELECTRONICS, Inc. • 300 Orchard City Drive, Suite 131 • Campbell, CA 95008 • Telephone 408-378-6461 • Fax 408-378-6586 • www.summitmicro.com
1
S93WD662/S93WD663
© SUMMIT MICROELECTRONICS, Inc. 2000
2013 2.0 3/21/00
Characteristics subject to change without notice
Precision Supply-Voltage Monitor and Reset Controller
With a Watchdog Timer and 4k-bit Microwire Memory
SUMMIT
MICROELECTRONICS, Inc.
FEATURES
• Precision Monitor & RESET Controller
— RESET and RESET# Outputs
— Guaranteed RESET Assertion to VCC = 1V
— 200ms Reset Pulse Width
— Internal 1.26V Reference with ±1% Accuracy
— ZERO External Components Required
• Watchdog Timer
— Nominal 1.6 Second Time-out Period
— Reset by Any Transition of CS
• Memory
— 4K-bit Microwire Memory
— S93WD662
– Internally Ties ORG Low
– 100% Compatible With all 8-bit
Implementations
– Sixteen Byte Page Write Capability
— S93WD663
– Internally Ties ORG High
– 100% Compatible With all 16-bit
Implementations
– Eight Word Page Write Capability
OVERVIEW
The S93WD662 and S93WD663 are precision power
supervisory circuits providing both active high and
active low reset outputs. Both devices incorporate a
watchdog timer with a nominal time-out value of 1.6
seconds.
Both devices have 4k-bits of E
2
PROM memory that is
accessible via the industry standard microwire bus. The
S93WD662 is configured with an internal ORG pin tied
low providing a 8-bit byte organization and the
S93WD663 is configured with an internal ORG pin tied
high providing a 16-bit word organization. Both the
S93WD662 and S93WD663 have page write capabil-
ity. The devices are designed for a minimum 100,000
program/erase cycles and have data retention in ex-
cess of 100 years.
BLOCK DIAGRAM
+
–
GND
V
CC
8
5
RESET#
6
V
TRIP
RESET
PULSE
GENERATOR
5kHz
OSCILLATOR
RESET
CONTROL
MODE
DECODE
ADDRESS
DECODER
WRITE
CONTROL
DATA I/O
E2PROM
MEMORY
ARRAY
RESET
7
1.26V
SK
2
DI
3
WATCHDOG
TIMER
CS
1
2013 T BD 2.0
Page 2
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S93WD662/S93WD663
2013 2.0 3/21/00
PIN FUNCTIONS
Pin Name Function
CS Chip Select
SK Clock Input
DI Serial Data Input
DO Serial Data Output
V
CC
+2.7 to 6.0V Power Supply
GND Ground
RESET/RESET# RESET I/O
PIN CONFIGURATION
DEVICE OPERATION
APPLICATIONS
The S93WD662/WD663 is ideal for applications requiring low voltage and low power consumption. This device
provides microcontroller RESET control and can be
manually resettable.
RESET CONTROLLER DESCRIPTION
The S93WD662/WD663 provides a precision reset controller that ensures correct system operation during
brownout and power-up/-down conditions. It is configured with two open drain reset outputs: pin 7 is an active
high output and pin 6 is an active low output.
During power-up, the reset outputs remain active until
VCC reaches the V
TRIP
threshold. The outputs will continue to be driven for approximately 200ms after reaching V
TRIP
. The reset outputs will be valid so long as V
CC
is ≥ 1.0V. During power-down, the reset outputs will
begin driving active when VCC falls below V
TRIP
.
The reset pins are I/Os; therefore, the S93WD662/
WD663 can act as a stabilization circuit for an externally
applied reset. The inputs are edge triggered; that is, the
RESET input will initiate a reset time-out after detecting
a low to high transition and the RESET# input will initiate
a reset time-out after detecting a high to low transition.
Refer to the applications Information section for more
details on device operation as a debounce/reset extender circuit.
It should be noted the reset outputs are open drain.
When used as outputs driving a circuit they need to be
either tied high (RESET#) or tied to ground (RESET)
through the use of pull-up or pull-down resistors. Refer
to the applications aid section for help in determining the
value of resistor to be used. Internally these pins are
weakly pulled up (RESET#) and pulled down (RESET).
If the signals are not being used the pins may be left
unconnected.
WATCHDOG TIMER DESCRIPTION
The S93WD662/WD663 has a watchdog timer with a
nominal time-out period of 1.6 seconds. Whenever the
watchdog times out, it will generate a reset output to both
pins 6 and 7. The watchdog timer is reset by any
transition on CS.
The watchdog timer will be held in a reset state during
power-on while VCC is less than V
TRIP
. Once VCC ex-
ceeds V
TRIP
the watchdog will continue to be held in a
reset state for the t
PURST
period. After t
PURST
it will be
released and the timer will begin operation. If either
reset input is asserted the watchdog timer will be reset
and remain in the reset condition until either t
PURST
has
expired or the reset input is released, whichever is
longer.
GENERAL OPERATION
The S93WD662/WD663 is a 4096-bit nonvolatile memory
intended for use with industry standard microprocessors. The S93WD663 is organized as X16, seven 11-bit
instructions control the reading, writing and erase operations of the device. The S93WD662 is organized as
X8, seven 12-bit instructions control the reading, writing
and erase operations of the device. The device operates
on a single 3V or 5V supply and will generate on chip, the
high voltage required during any write operation.
Instructions, addresses, and write data are clocked into
the DI pin on the rising edge of the clock (SK). The DO
pin is normally in a high impedance state except when
reading data from the device, or when checking the
ready/busy status after a write operation.
CS
SK
DI
DO
V
CC
RESET
RESET#
GND
1
2
3
4
8
7
6
5
8-Pin PDIP
or 8-Pin SOIC
2014 T PCon 2.0
Page 3
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S93WD662/S93WD663
2013 2.0 3/21/00
SK
2013 ILL 3 1.0
DI
CS
DO
t
DIS
t
PD0,tPD1
t
CSMIN
t
CSS
t
DIS
t
DIH
t
SKHI
t
CSH
VALID VALID
DATA VALID
t
SKLOW
The ready/busy status can be determined after the start
of a write operation by selecting the device (CS high)
and polling the DO pin; DO low indicates that the write
operation is not completed, while DO high indicates that
the device is ready for the next instruction. See the
Applications Aid section for detailed use of the ready
busy status.
The format for all instructions is: one start bit; two op
code bits and either eight (x16) or nine (x8) address or
instruction bits.
Read
Upon receiving a READ command and an address
(clocked into the DI pin), the DO pin of the S93WD662/
WD663 will come out of the high impedance state and,
will first output an initial dummy zero bit, then begin
shifting out the data addressed (MSB first). The output
data bits will toggle on the rising edge of the SK clock and
are stable after the specified time delay
(t
PD0
or t
PD1
).
Write
After receiving a WRITE command, address and the
data, the CS (Chip Select) pin must be deselected for a
minimum of 250ns (t
CSMIN
). The falling edge of CS will
start automatic erase and write cycle to the memory
location specified in the instruction. The ready/busy
status of the S93WD662/WD663 can be determined by
selecting the device and polling the DO pin.
Erase
Upon receiving an ERASE command and address, the
CS (Chip Select) pin must be deselected for a minimum
of 250ns (t
CSMIN
). The falling edge of CS will start the
auto erase cycle of the selected memory location. The
ready/busy status of the S93WD662/WD663 can be
Figure 1. Sychronous Data Timing
Figure 2. Read Instruction Timing
SK
2013 ILL4 1.0
CS
DI
DO
t
CS
STANDBY
t
HZ
HIGH-ZHIGH-Z
11 0
ANA
N–1
A
0
0
DND
N–1
D1D
0
t
PD0
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S93WD662/S93WD663
2013 2.0 3/21/00
determined by selecting the device and polling the DO
pin. Once cleared, the content of a cleared location
returns to a logical “1” state.
Erase/Write Enable and Disable
The S93WD662/WD663 powers up in the write disable
state. Any writing after power-up or after an EWDS
(write disable) instruction must first be preceded by the
EWEN (write enable) instruction.
Once the write instruction is enabled, it will remain enabled until power to
the device is removed, or the EWDS instruction is sent.
The EWDS instruction can be used to disable all
S93WD662/WD663 write and clear instructions, and
will prevent any accidental writing or clearing of the
device. Data can be read normally from the device
regardless of the write enable/disable status.
Erase All
Upon receiving an ERAL command, the CS (Chip Select) pin must be deselected for a minimum of 250ns
(t
CSMIN
). The falling edge of CS will start the self clocking
clear cycle of all memory locations in the device. The
clocking of the SK pin is not necessary after the device
has entered the self clocking mode. The ready/busy
status of the S93WD662/WD663 can be determined by
selecting the device and polling the DO pin. Once
cleared, the contents of all memory bits return to a
logical “1” state.
Write All
Upon receiving a WRAL command and data, the CS
(Chip Select) pin must be deselected for a minimum of
250ns (t
CSMIN
). The falling edge of CS will start the self
clocking data write to all memory locations in the device.
The clocking of the SK pin is not necessary after the
device has entered the self clocking mode. The ready/
busy status of the S93WD662/WD663 can be determined by selecting the device and polling the DO pin. It
is not necessary for all memory locations to be cleared
before the WRAL command is executed.
Page Write
93WD662 - Assume WEN has been issued. The host
will then take CS high, and begin clocking in the start
bit, write command and 9-bit byte address immediately
followed by the first byte of data to be written. The host
can then continue clocking in 8-bit bytes of data with
each byte to be written to the next higher address.
Internally the address pointer is incremented after
receiving each group of eight clocks; however, once
the address counter reaches x xxxx 1111 it will roll over
to x xxxx 0000 with the next clock. After the last bit is
clocked in no internal write operation will occur until CS
is brought low.
93WD663 - Assume WEN has been issued. The host
will then take CS high, and begin clocking in the start
bit, write command and 8-bit byte address immediately
followed by the first 16-bit word of data to be written.
The host can then continue clocking in 16-bit words of
data with each word to be written to the next higher
address. Internally the address pointer is incremented
after receiving each group of sixteen clocks; however,
once the address counter reaches xxxx x111 it will roll
over to xxxx x000 with the next clock. After the last bit
is clocked in no internal write operation will occur until
CS is brought low.
Continuous Read
This begins just like a standard read with the host
issuing a read instruction and clocking out the data
byte [word]. If the host then keeps CS high and
continues generating clocks on SK, the S93WD662/
WD663 will output data from the next higher address
location. The S93WD662/WD663 will continue
incrementing the address and outputting data so long
as CS stays high. If the highest address is reached, the
address counter will roll over to address 0000. .
CS going low will reset the instruction register and any
subsequent read must be initiated in the normal
manner of issuing the command and address.
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S93WD662/S93WD663
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Figure 3. Write Instruction Timing
Figure 4. Erase Instruction Timing
Figure 5. EWEN/EWDS Instruction Timing
SK
2013 ILL 5 1.0
CS
DI
DO
t
CS
STANDBY
HIGH-Z
HIGH-Z
101
ANA
N-1
A
0
D
N
D
0
BUSY
READY
STATUS
VERIFY
t
SV
t
HZ
t
EW
SK
2013 ILL6 1.0
CS
DI
DO
STANDBY
HIGH-Z
HIGH-Z
1
A
N
A
N-1
BUSY READY
STATUS VERIFY
t
SV
t
HZ
t
EW
t
CS
11
A
0
SK
2013 ILL 7 1.0
CS
DI
STANDBY
10
0
*
* ENABLE=1 1
DISABLE=00
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S93WD662/S93WD663
2013 2.0 3/21/00
Figure 7. WRAL Instruction Timing
SK
2013 ILL 10 1.0
CS
DI
DO
t
CS
HIGH-Z
10 1
BUSY READY
STATUS VERIFY
t
SV
t
HZ
t
EW
00
STANDBY
D
O
D
N
INSTRUCTION SET
Instruction Start Opcode Address Data Comments
Bit x8 x16 x8 x16
READ 1 10 A8–A0 A7–A0 Read Address AN–A0
ERASE 1 11 A8–A0 A7–A0 Clear Address AN–A0
WRITE 1 01 A8–A0 A7–A0 D7–D0 D15–D0 Write Address AN–A0
EWEN 1 00 11xxx xxxx 11xxx xxx Write Enable
EWDS 1 00 00xxx xxxx 00xxx xxx Write Disable
ERAL 1 00 10xxx xxxx 10xxx xxx Clear All Addresses
WRAL 1 00 01xxx xxxx 01xxx xxx D7–D0 D15–D0 Write All Addresses
2013 PGM T5 1.1
Figure 6. ERAL Instruction Timing
SK
2013 ILL 8 1.0
CS
DI
DO
t
CS
HIGH-Z
HIGH-Z
10 1
BUSY READY
STATUS VERIFY
t
SV
t
HZ
t
EW
00
STANDBY
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S93WD662/S93WD663
2013 2.0 3/21/00
ABSOLUTE MAXIMUM RATINGS*
Temperature Under Bias ....................................................................................................................................–55°C to +125°C
Storage Temperature .........................................................................................................................................–65°C to +150°C
Voltage on any Pin with Respect to Ground
(1)
.............................................................................................–2.0V to +VCC +2.0V
VCC with Respect to Ground.................................................................................................................................. –2.0V to +7.0V
Package Power Dissipation Capability (Ta = 25°C) .............................................................................................................1.0W
Lead Soldering Temperature (10 secs) .............................................................................................................................. 300°C
Output Short Circuit Current
(2)
...........................................................................................................................................100 mA
*COMMENT
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to
any absolute maximum rating for extended periods may affect device performance and reliability.
Note:
(1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC
voltage on output pins is VCC +0.5V, which may overshoot to VCC +2.0V for periods of less than 20 ns.
(2) Output shorted for no more than one second. No more than one output shorted at a time.
(3) This parameter is tested initially and after a design or process change that affects the parameter.
(4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to VCC +1V.
D.C. OPERATING CHARACTERISTICS (over recommended operating conditions unless otherwise specified)
Limits
Symbol Parameter Min. Typ. Max. Units Test Conditions
I
CC
Power Supply Current 3 mA DI = 0.0V, fSK = 1MHz
(Operating) VCC = 5.0V, CS = 5.0V,
Output Open
I
SB
Power Supply Current 50 µA CS = 0V
(Standby) Reset Outputs Open
I
LI
Input Leakage Current 2 µA VIN = 0V to V
CC
I
LO
Output Leakage Current 10 µA V
OUT
= 0V to VCC,
(Including ORG pin) CS = 0V
V
IL1
Input Low Voltage -0.1 0.8 V 4.5V-VCC<5.5V
V
IH1
Input High Voltage 2 VCC+1 V
V
IL2
Input Low Voltage 0 VCCX0.2 V 1.8V-VCC<2.7V
V
IH2
Input High Voltage VCCX0.7 VCC+1 V
V
OL1
Output Low Voltage 0.4 V 4.5V-VCC<5.5V
V
OH1
Output High Voltage 2.4 V IOL = 2.1mA
IOH = -400µA
V
OL2
Output Low Voltage 0.2 V 1.8V-VCC<2.7V
V
OH2
Output High Voltage VCC-0.2 V IOL = 1mA
IOH = -100µA
2013 PGM T3 1.1
Temperature Min Max
Commercial 0°C +70°C
Industrial -40°C +85°C
RECOMMENDED OPERATING CONDITIONS
2013 PGM T7 1.0
RELIABILITY CHARACTERISTICS
Symbol Parameter Min. Max. Units
N
END
(3)
Endurance 100,000 Cycles/Byte
T
DR
(3)
Data Retention 100 Years
V
ZAP
(3)
ESD Susceptibility 2000 Volts
I
LTH
(3)(4)
Latch-Up 100 mA
2013 PGM T2 1.1
Page 8
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S93WD662/S93WD663
2013 2.0 3/21/00
Limits
VCC=2.7V-4.5V VCC=4.5V-5.5V Test
SYMBOL PARAMETER Min. Max. Min. Max. UNITS Conditions
t
CSS
CS Setup Time 100 50 ns
t
CSH
CS Hold Time 0 0 ns VIL = 0.45V
t
DIS
DI Setup Time 200 100 ns VIH = 2.4V
t
DIH
DI Hold Time 200 100 ns CL = 100pF
t
PD1
Output Delay to 1 0.5 0.25 µs VOL = 0.8V
t
PD0
Output Delay to 0 0.5 0.25 µs VOH = 2.0v
t
HZ
(1)
Output Delay to High-Z 200 100 ns
t
EW
Program/Erase Pulse Width 10 10 ms
t
CSMIN
Minimum CS Low Time 0.5 0.25 µs
t
SKHI
Minimum SK High Time 0.5 0.25 µs
t
SKLOW
Minimum SK Low Time 0.5 0.25 µs
t
SV
Output Delay to Status Valid 0.5 0.25 µs CL = 100pF
SK
MAX
Maximum Clock Frequency DC 500 DC 1000 KHZ
Note:
(1) This parameter is tested initially and after a design or process change that affects the parameter.
Note:
(1) This parameter is tested initially and after a design or process change that affects the parameter.
PIN CAPACITANCE
Symbol Test Max. Units Conditions
C
OUT
(1)
OUTPUT CAPACITANCE (DO) 5 pF V
OUT
=OV
C
IN
(1)
INPUT CAPACITANCE (CS, SK, DI, ORG) 5 pF VIN=OV
2013 PGM T4 1.0
A.C. CHARACTERISTICS (over recommended operating conditions unless otherwise specified)
CL = 100pF
2013 PGM T6 1.0
Page 9
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S93WD662/S93WD663
2013 2.0 3/21/00
Figure 8. RESET Timing Diagram
RESET CIRCUIT AC and DC ELECTRICAL CHARACTERISTICS
2.7 5 Volt-A 5 Volt-B
Symbol Parameter Min Max Min Max Min Max Unit
V
TRIP
Reset Trip Point 2.55 2.7 4.25 4.5 4.50 4.75 V
t
PURST
Power-Up Reset Timeout 130 270 130 270 130 270 ms
t
RPD
V
TRIP
to RESET Output Delay 5 5 5 µs
V
RVALID
RESET# Output Valid 1 1 1 V
t
GLITCH
Glitch Reject Pulse Width 30 30 30 ns
V
OLRS
RESET Output Low Voltage IOL=1mA 0.4 0.4 0.4 V
V
OHRS
RESET# Output High I
OH
VCC-.75 VCC-.75 VCC-.75 V
2013 PGM T1 1.1
V
CC
V
RVALID
V
TRIP
t
PURST
RESET#
RESET
2013 T fig08 2.0
t
GLITCH
t
RPD
t
PURST
t
RPD
Page 10
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S93WD662/S93WD663
2013 2.0 3/21/00
.228 (5.80)
.244 (6.20)
.016 (.40)
.035 (.90)
.020 (.50)
.010 (.25)
x45°
.0192 (.49)
.0138 (.35)
.061 (1.75)
.053 (1.35)
.0098 (.25)
.004 (.127)
.05 (1.27) TYP.
.275 (6.99) TYP.
.030 (.762) TYP.
8 Places
.050 (1.27) TYP.
.050 (1.270) TYP.
8 Places
.157 (4.00)
.150 (3.80)
.196 (5.00)
1
.189 (4.80)
FOOTPRINT
8pn JEDEC SOIC ILL.2
.375
(9.525)
PIN 1 INDICATOR
.015 (.381) Min.
.130 (3.302)
.100 (2.54)
TYP.
.018 (.457)
TYP.
.060 ± .005
(1.524) ± .127
TYP.
.130 (3.302)
SEATING PLANE
.070 (1.778)
.0375 (0.952)
.300 (7.620)
5°-7°TYP.
(4 PLCS)
.350 (8.89)
.009 ± .002
(.229 ± .051)
0°-15°
.250
(6.350)
8pn PDIP/P ILL.3
8 Pin SOIC (Type S) Package JEDEC (150 mil body width)
8 Pin PDIP (Type P) Package
Page 11
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S93WD662/S93WD663
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Frequently the reset controller will be deployed on a PC board that provides a peripheral function to a system.
Examples might be modem or network cards in a PC or a PCMCIA card in a laptop. In instances like this the peripheral
card may have a requirement for a clean reset function to insure proper operation. The system may or may not provide
a reset pulse of sufficient duration to clear the peripheral or to protect data stored in a nonvolatile memory.
The I/O capability of the RESET pins can provide a solution. The system’s reset signal to the peripheral can be fed
into the S93WD662/WD663 and it in turn can clean up the signal and provide a known entity to the peripheral’s circuits.
The figure below shows the basic timing characteristics under the assumption the reset input is shorter in duration
than t
PURST
. The same reset output affect can be attained by using the active high reset input.
When planning your resistor pull-up and pull-down values, use the following chart to help determine min. resistances.
Condition Min Typ Max Units
VCC = 1.0V, IOL=100µA 0.3 V
VCC = 1.2V, IOL=100µA 0.3 V
VCC = 3.0V, IOL=500µA 0.3 V
VCC = 3.6V, IOL=500µA 0.3 V
VCC = 4.5V, IOL=750µA 0.3 V
VCC = 1.0V, IOL=100µA 0.4 V
VCC = 1.2V, IOL=150µA 0.4 V
VCC = 3.0V, IOL=750µA 0.4 V
VCC = 3.6V, IOL=1mA 0.4 V
VCC = 4.5V, IOL=1mA 0.4 V
VCC = 1.0V, IOH=400µA VCC-0.75 V
VCC = 1.2V, IOH=800µA VCC-0.75 V
VCC = 3.0V, IOH=800µA VCC-0.5 V
VCC = 3.6V, IOH=800µA VCC-0.5 V
VCC = 4.5V, IOH=800µA VCC-0.5 V
Worst Case RESET Sink/Source Capabilities at Various VCC Levels
Parameter Symbol
RESET# Output V
OL
Voltage
RESET# Output V
OL
Voltage
RESET Output V
OH
Voltage
2013 PGM T5 1.0
RESET#
Input
RESET#
Output
RESET
Output
2013 T fig09 2.0
t
PURST
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S93WD662/S93WD663
2013 2.0 3/21/00
Ready/Busy StatusReady/Busy Status
Ready/Busy StatusReady/Busy Status
Ready/Busy Status
During the internal write operation the S93WD662/WD663 memory array is inaccessible. After starting the write
operation (taking CS low) the host can implement a 10ms time-out routine or alternatively it can employ a polling routine
that tests the state of the DO pin.
After starting the write, testing for the status is easily accomplished by taking CS high and testing the state of DO. If
it is low the device is still busy with the internal write. If it is high the write operation has completed.
For the polling routine the host has the option of toggling CS for each test of DO, or it can place CS high and then
intermittently test DO. SK is not required for any of these operations. Once the device is ready, it will continue to drive
DO high whenever the S93WD662/WD663 is selected. The ready state of DO can be cleared by clocking in a start
bit; this start bit can either be the beginning of a new command sequence or it can be a dummy start bit with CS returning
low before the host issues a new command.
SK
2013 ILL 13 1.0
CS
DI
DO
t
CS
HIGH-Z
HIGH-Z
STATUS CLEARED
BUSY READY
STATUS VERIFY
t
SV
t
HZ
t
EW
Page 13
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2013 2.0 3/21/00
ORDERING INFORMATIONORDERING INFORMATION
ORDERING INFORMATIONORDERING INFORMATION
ORDERING INFORMATION
S93WD663
Base Part Number
S93WD663 = 16-bit configuration
S93WD662 = 8-bit configuration
Tape and Reel Option
Blank = Tube
T = Tape and Reel
Package
P = 8 Lead PDIP
S = 8 Lead 150mil SOIC
Operating Voltage Range
A = 4.5V to 5.5V V
TRIP
Min. @ 4.25V
B = 4.5V to 5.5V V
TRIP
Min. @ 4.50V
2.7 = 2.7V to 5.5V V
TRIP
Min. @ 2.55V
P -2.7 T
2012 ILL11 1.1
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S93WD662/S93WD663
2013 2.0 3/21/00
NOTICE
SUMMIT Microelectronics, Inc. reserves the right to make changes to the products contained in this publication in order to improve
design, performance or reliability. SUMMIT Microelectronics, Inc. assumes no responsibility for the use of any circuits described
herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent
infringement. Charts and schedules contained herein reflect representative operating parameters, and may vary depending upon
a user’s specific application. While the information in this publication has been carefully checked, SUMMIT Microelectronics, Inc.
shall not be liable for any damages arising as a result of any error or omission.
SUMMIT Microelectronics, Inc. does not recommend the use of any of its products in life support applications where the failure or
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety
or effectiveness. Products are not authorized for use in such applications unless SUMMIT Microelectronics, Inc. receives written
assurances, to its satisfaction, that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; and
(c) potential liability of SUMMIT Microelectronics, Inc. is adequately protected under the circumstances.
© Copyright 2000 SUMMIT Microelectronics, Inc.
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