Page 1
SUMMIT MICROELECTRONICS, Inc. • 300 Orchard City Drive, Suite 131 • Campbell, CA 95008 • Telephone 408-378-6461 • Fax 408-378-6586 • www.summitmicro.com
1
S93662/S93663
© SUMMIT MICROELECTRONICS, Inc. 2000
2012 2.0 4/18/00
Characteristics subject to change without notice
Precision Supply-Voltage Monitor and Reset Controller
SUMMIT
MICROELECTRONICS, Inc.
FEATURES
• Precision Monitor & RESET Controller
— RESET and RESET Outputs
— Guaranteed RESET Assertion to VCC = 1V
— 200ms Reset Pulse Width
— Internal 1.26V Reference with ±1% Accuracy
— ZERO External Components Required
• Memory
— 4K-bit Microwire Memory
— S93662
– Internally Ties ORG Low
– 100% Compatible With all 8-bit
Implementations
–
Sixteen Byte Page Write Capability
— S93663
– Internally Ties ORG High
– 100% Compatible With all 16-bit
Implementations
– Eight Word Page Write Capability
OVERVIEW
The S93662 and S93663 are precision power supervisory circuits providing both active high and active low
reset outputs.
Both devices have 4k-bits of E2PROM memory that is
accessible via the industry standard microwire bus. The
S93662 is configured with an internal ORG pin tied low
providing a 8-bit byte organization and the S93663 is
configured with an internal ORG pin tied high providing
a 16-bit word organization. Both the S93662 and
S93663 have page write capability. The devices are
designed for a minimum 100,000 program/erase cycles
and have data retention in excess of 100 years.
BLOCK DIAGRAM
+
–
GND
V
CC
8
5
RESET#
6
V
TRIP
RESET
PULSE
GENERATOR
5kHz
OSCILLATOR
RESET
CONTROL
MODE
DECODE
ADDRESS
DECODER
WRITE
CONTROL
DATA I/O
E2PROM
MEMORY
ARRAY
RESET
7
1.26V
SK
2
DI
3
CS
1
2012 T BD 2.0
DO
4
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S93662/S93663
2012 2.0 4/18/00
PIN FUNCTIONS
Pin Name Function
CS Chip Select
SK Clock Input
DI Serial Data Input
DO Serial Data Output
V
CC
+2.7 to 6.0V Power Supply
GND Ground
RESET/RESET# RESET I/O
PIN CONFIGURATION
DEVICE OPERATION
APPLICATIONS
The S93662/663 is ideal for applications requiring low
voltage and low power consumption. This device provides microcontroller RESET control and can be manually resettable.
RESET CONTROLLER DESCRIPTION
The S93662/663 provides a precision reset controller
that ensures correct system operation during brownout
and power-up/-down conditions. It is configured with two
open drain reset outputs; pin 7 is an active high output
and pin 6 is an active low output.
During power-up, the reset outputs remain active until
VCC reaches the V
TRIP
threshold. The outputs will con-
tinue to be driven for approximately 200ms after reach-
ing V
TRIP
. The reset outputs will be valid so long as V
CC
is ≥1.0V. During power-down, the reset outputs will begin
driving active when VCC falls below V
TRIP
.
The reset pins are I/Os; therefore, the S93662/663 can
act as a stabilization circuit for an externally applied
reset. The inputs are edge triggered; that is, the RESET
input will initiate a reset time-out after detecting a low to
high transition and the RESET# input will initiate a reset
time-out after detecting a high to low transition. Refer to
the applications Information section for more details on
device operation as a debounce/reset extender circuit.
It should be noted the reset outputs are open drain.
When used as outputs driving a circuit they need to be
either tied high (RESET#) or tied to ground (RESET)
through the use of pull-up or pull-down resistors. Refer to
the applications aid section for help in determining the
value of resistor to be used. Internally these pins are
weakly pulled up (RESET#) and pulled down (RESET):
therefore, if the signals are not being used the pins may
be left unconnected.
GENERAL OPERATION
The S93662/663 is a 4096-bit nonvolatile memory intended for use with industry standard microprocessors.
The S93663 is organized as X16, seven 11-bit instructions control the reading, writing and erase operations of
the device. The S93662 is organized as X8, seven 12bit instructions control the reading, writing and erase
operations of the device. The device operates on a
single 3V or 5V supply and will generate on chip, the high
voltage required during any write operation.
Instructions, addresses, and write data are clocked into
the DI pin on the rising edge of the clock (SK). The DO
pin is normally in a high impedance state except when
reading data from the device, or when checking the
ready/busy status after a write operation.
The ready/busy status can be determined after the start
of a write operation by selecting the device (CS high) and
polling the DO pin; DO low indicates that the write
operation is not completed, while DO high indicates that
the device is ready for the next instruction. See the
Applications Aid section for detailed use of the ready
busy status.
The format for all instructions is: one start bit; two op code
bits and either eight (x16) or nine (x8) address or instruction bits.
CS
SK
DI
DO
V
CC
RESET
RESET#
GND
1
2
3
4
8
7
6
5
8-Pin PDIP
or 8-Pin SOIC
2012 T PCon 2.0
Page 3
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S93662/S93663
2012 2.0 4/18/00
Read
Upon receiving a READ command and an address
(clocked into the DI pin), the DO pin of the S93662/663
will come out of the high impedance state and, will first
output an initial dummy zero bit, then begin shifting out
the data addressed (MSB first). The output data bits
will toggle on the rising edge of the SK clock and
are stable after the specified time delay
(t
PD0
or t
PD1
).
Write
After receiving a WRITE command, address and the
data, the CS (Chip Select) pin must be deselected for a
minimum of 250ns (t
CSMIN
). The falling edge of CS will
start automatic erase and write cycle to the memory
location specified in the instruction. The ready/busy
status of the S93662/663 can be determined by selecting the device and polling the DO pin.
Erase
Upon receiving an ERASE command and address, the
CS (Chip Select) pin must be deselected for a minimum
of 250ns (t
CSMIN
). The falling edge of CS will start the
auto erase cycle of the selected memory location. The
ready/busy status of the S93662/663 can be determined by selecting the device and polling the DO pin.
Once cleared, the content of a cleared location returns
to a logical “1” state.
Erase/Write Enable and Disable
The S93662/663 powers up in the write disable state.
Any writing after power-up or after an EWDS (write
disable) instruction must first be preceded by the EWEN
(write enable) instruction. Once the write instruction is
enabled, it will remain enabled until power to the device
is removed, or the EWDS instruction is sent. The EWDS
instruction can be used to disable all S93662/663 write
and clear instructions, and will prevent any accidental
Figure 1. Sychronous Data Timing
Figure 2. Read Instruction Timing
SK
2012 ILL 3 1.0
DI
CS
DO
t
DIS
t
PD0,tPD1
t
CSMIN
t
CSS
t
DIS
t
DIH
t
SKHI
t
CSH
VALID VALID
DATA VALID
t
SKLOW
SK
2012 ILL4 1.0
CS
DI
DO
t
CS
STANDBY
t
HZ
HIGH-ZHIGH-Z
11 0
ANA
N–1
A
0
0
DND
N–1
D1D
0
t
PD0
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S93662/S93663
2012 2.0 4/18/00
writing or clearing of the device. Data can be read
normally from the device regardless of the write enable/
disable status.
Erase All
Upon receiving an ERAL command, the CS (Chip
Select) pin must be deselected for a minimum of 250ns
(t
CSMIN
). The falling edge of CS will start the self clocking
clear cycle of all memory locations in the device. The
clocking of the SK pin is not necessary after the device
has entered the self clocking mode. The ready/busy
status of the S93662/663 can be determined by selecting the device and polling the DO pin. Once cleared, the
contents of all memory bits return to a logical “1” state.
Write All
Upon receiving a WRAL command and data, the CS
(Chip Select) pin must be deselected for a minimum of
250ns (t
CSMIN
). The falling edge of CS will start the self
clocking data write to all memory locations in the device.
The clocking of the SK pin is not necessary after the
device has entered the self clocking mode. The ready/
busy status of the S93662/663 can be determined by
selecting the device and polling the DO pin. It is not
necessary for all memory locations to be cleared before
the WRAL command is executed.
Page Write
93662 - Assume WEN has been issued. The host will
then take CS high, and begin clocking in the start bit,
write command and 9-bit byte address immediately
followed by the first byte of data to be written. The host
can then continue clocking in 8-bit bytes of data with
each byte to be written to the next higher address.
Internally the address pointer is incremented after
receiving each group of eight clocks; however, once
the address counter reaches x xxxx 1111 it will roll over
to x xxxx 0000 with the next clock. After the last bit is
clocked in no internal write operation will occur until CS
is brought low.
93663 - Assume WEN has been issued. The host will
then take CS high, and begin clocking in the start bit,
write command and 8-bit byte address immediately
followed by the first 16-bit word of data to be written.
The host can then continue clocking in 16-bit words of
data with each word to be written to the next higher
address. Internally the address pointer is incremented
after receiving each group of sixteen clocks; however,
once the address counter reaches xxxx x111 it will roll
over to xxxx x000 with the next clock. After the last bit
is clocked in no internal write operation will occur until
CS is brought low.
Continuous Read
This begins just like a standard read with the host
issuing a read instruction and clocking out the data
byte [word]. If the host then keeps CS high and
continues generating clocks on SK, the S93662/663
will output data from the next higher address location.
The S93662/663 will continue incrementing the address and outputting data so long as CS stays high. If
the highest address is reached, the address counter
will roll over to address 0000. . CS going low will reset
the instruction register and any subsequent read must
be initiated in the normal manner of issuing the command and address.
Page 5
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S93662/S93663
2012 2.0 4/18/00
Figure 3. Write Instruction Timing
Figure 4. Erase Instruction Timing
Figure 5. EWEN/EWDS Instruction Timing
SK
2012 ILL 5 1.0
CS
DI
DO
t
CS
STANDBY
HIGH-Z
HIGH-Z
101
ANA
N-1
A
0
D
N
D
0
BUSY
READY
STATUS
VERIFY
t
SV
t
HZ
t
EW
SK
2012 ILL6 1.0
CS
DI
DO
STANDBY
HIGH-Z
HIGH-Z
1
A
N
A
N-1
BUSY READY
STATUS VERIFY
t
SV
t
HZ
t
EW
t
CS
11
A
0
SK
2012 ILL 7 1.0
CS
DI
STANDBY
10
0
*
* ENABLE=1 1
DISABLE=00
Page 6
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S93662/S93663
2012 2.0 4/18/00
Figure 7. WRAL Instruction Timing
INSTRUCTION SET
Instruction Start Opcode Address Data Comments
Bit x8 x16 x8 x16
READ 1 10 A8–A0 A7–A0 Read Address AN–A0
ERASE 1 11 A8–A0 A7–A0 Clear Address AN–A0
WRITE 1 01 A8–A0 A7–A0 D7–D0 D15–D0 Write Address AN–A0
EWEN 1 00 11xxx xxxx 11xxx xxx Write Enable
EWDS 1 00 00xxx xxxx 00xxx xxx Write Disable
ERAL 1 00 10xxx xxxx 10xxx xxx Clear All Addresses
WRAL 1 00 01xxx xxxx 01xxx xxx D7–D0 D15–D0 Write All Addresses
2012 PGM T5 1.1
SK
2012 ILL 10 1.0
CS
DI
DO
t
CS
HIGH-Z
10 1
BUSY READY
STATUS VERIFY
t
SV
t
HZ
t
EW
00
STANDBY
D
O
D
N
Figure 6. ERAL Instruction Timing
SK
2012 ILL 8 1.0
CS
DI
DO
t
CS
HIGH-Z
HIGH-Z
10 1
BUSY READY
STATUS VERIFY
t
SV
t
HZ
t
EW
00
STANDBY
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S93662/S93663
2012 2.0 4/18/00
ABSOLUTE MAXIMUM RATINGS*
Temperature Under Bias ....................................................................................................................................–55°C to +125°C
Storage Temperature .........................................................................................................................................–65°C to +150°C
Voltage on any Pin with Respect to Ground
(1)
............................................................................................–2.0V to +VCC +2.0V
VCC with Respect to Ground.................................................................................................................................. –2.0V to +7.0V
Package Power Dissipation Capability (Ta = 25°C).............................................................................................................1.0W
Lead Soldering Temperature (10 seconds)........................................................................................................................ 300°C
Output Short Circuit Current
(2)
...........................................................................................................................................100mA
*COMMENT
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to
any absolute maximum rating for extended periods may affect device performance and reliability.
Note:
(1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20ns. Maximum DC
voltage on output pins is VCC +0.5V, which may overshoot to VCC +2.0V for periods of less than 20ns.
(2) Output shorted for no more than one second. No more than one output shorted at a time.
(3) This parameter is tested initially and after a design or process change that affects the parameter.
(4) Latch-up protection is provided for stresses up to 100mA on address and data pins from –1V to VCC +1V.
D.C. OPERATING CHARACTERISTICS (over recommended operating conditions unless otherwise specified)
Limits
Symbol Parameter Min. Typ. Max. Units Test Conditions
I
CC
Power Supply Current 3 mA DI = 0.0V, fSK = 1MHz
(Operating) VCC = 5.0V, CS = 5.0V,
Output Open
I
SB
Power Supply Current 50 µA CS = 0V
(Standby) Reset Outputs Open
I
LI
Input Leakage Current 2 µA VIN = 0V to V
CC
I
LO
Output Leakage Current 10 µA V
OUT
= 0V to VCC,
(Including ORG pin) CS = 0V
V
IL1
Input Low Voltage -0.1 0.8 V 4.5V-VCC<5.5V
V
IH1
Input High Voltage 2 VCC+1 V
V
IL2
Input Low Voltage 0 VCC × 0.2 V 1.8V-VCC<2.7V
V
IH2
Input High Voltage VCC × 0.7 VCC+1 V
V
OL1
Output Low Voltage 0.4 V 4.5V-VCC<5.5V
V
OH1
Output High Voltage 2.4 V IOL = 2.1mA
IOH = -400µA
V
OL2
Output Low Voltage 0.2 V 1.8V-VCC<2.7V
V
OH2
Output High Voltage VCC-0.2 V IOL = 1mA
IOH = -100µA
2012 PGM T3 1.1
RELIABILITY CHARACTERISTICS
Symbol Parameter Min. Max. Units Reference Test Method
N
END
(3)
Endurance 100,000 Cycles/Byte MIL-STD-883, Test Method 1033
T
DR
(3)
Data Retention 100 Years MIL-STD-883, Test Method 1008
V
ZAP
(3)
ESD Susceptibility 2000 Volts MIL-STD-883, Test Method 3015
I
LTH
(3)(4)
Latch-Up 100 mA JEDEC Standard 17
2012 PGM T2 1.1
Temperature Min Max
Commercial 0°C +70°C
Industrial -40°C +85°C
RECOMMENDED OPERATING CONDITIONS
2012 PGM T7 1.0
Page 8
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S93662/S93663
2012 2.0 4/18/00
Limits
VCC=2.7V-4.5V VCC=4.5V-5.5V Test
SYMBOL PARAMETER Min. Max. Min. Max. UNITS Conditions
t
CSS
CS Setup Time 100 50 ns
t
CSH
CS Hold Time 0 0 ns VIL = 0.45V
t
DIS
DI Setup Time 200 100 ns VIH = 2.4V
t
DIH
DI Hold Time 200 100 ns CL = 100pF
t
PD1
Output Delay to 1 0.5 0.25 µs VOL = 0.8V
t
PD0
Output Delay to 0 0.5 0.25 µs VOH = 2.0v
t
HZ
(1)
Output Delay to High-Z 200 100 ns
t
EW
Program/Erase Pulse Width 10 10 ms
t
CSMIN
Minimum CS Low Time 0.5 0.25 µs
t
SKHI
Minimum SK High Time 0.5 0.25 µs
t
SKLOW
Minimum SK Low Time 0.5 0.25 µs
t
SV
Output Delay to Status Valid 0.5 0.25 µs CL = 100pF
SK
MAX
Maximum Clock Frequency DC 500 DC 1000 KHZ
Note:
(1) This parameter is tested initially and after a design or process change that affects the parameter.
Note:
(1) This parameter is tested initially and after a design or process change that affects the parameter.
A.C. CHARACTERISTICS (over recommended operating conditions unless otherwise specified)
CL = 100pF
2012 PGM T6 1.0
PIN CAPACITANCE
Symbol Test Max. Units Conditions
C
OUT
(1)
OUTPUT CAPACITANCE (DO) 5 pF V
OUT
=OV
C
IN
(1)
INPUT CAPACITANCE (CS, SK, DI, ORG) 5 pF VIN=OV
2012 PGM T4 1.0
Page 9
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S93662/S93663
2012 2.0 4/18/00
Figure 8. RESET Timing Diagram
RESET CIRCUIT AC and DC ELECTRICAL CHARACTERISTICS
2.7 5 Volt-A 5 Volt-B
Symbol Parameter Min Max Min Max Min Max Unit
V
TRIP
Reset Trip Point 2.55 2.7 4.25 4.5 4.50 4.75 V
t
PURST
Power-Up Reset Timeout 130 270 130 270 130 270 ms
t
RPD
V
TRIP
to RESET Output Delay 5 5 5 µs
V
RVALID
RESET# Output Valid 1 1 1 V
t
GLITCH
Glitch Reject Pulse Width 30 30 30 ns
V
OLRS
RESET# Output Low Voltage IOL=1mA 0.4 0.4 0.4 V
V
OHRS
RESET Output High I
OH
VCC-.75 VCC-.75 VCC-.75 V
2012 PGM T1 1.1
V
CC
V
RVALID
V
TRIP
t
PURST
RESET#
RESET
2012 T fig08 2.0
t
GLITCH
t
RPD
t
PURST
t
RPD
Page 10
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S93662/S93663
2012 2.0 4/18/00
.228 (5.80)
.244 (6.20)
.016 (.40)
.035 (.90)
.020 (.50)
.010 (.25)
x45°
.0192 (.49)
.0138 (.35)
.061 (1.75)
.053 (1.35)
.0098 (.25)
.004 (.127)
.05 (1.27) TYP.
.275 (6.99) TYP.
.030 (.762) TYP.
8 Places
.050 (1.27) TYP.
.050 (1.270) TYP.
8 Places
.157 (4.00)
.150 (3.80)
.196 (5.00)
1
.189 (4.80)
FOOTPRINT
8pn JEDEC SOIC ILL.2
.375
(9.525)
PIN 1 INDICATOR
.015 (.381) Min.
.130 (3.302)
.100 (2.54)
TYP.
.018 (.457)
TYP.
.060 ± .005
(1.524) ± .127
TYP.
.130 (3.302)
SEATING PLANE
.070 (1.778)
.0375 (0.952)
.300 (7.620)
5°-7°TYP.
(4 PLCS)
.350 (8.89)
.009 ± .002
(.229 ± .051)
0°-15°
.250
(6.350)
8pn PDIP/P ILL.3
8 Pin SOIC (Type S) Package JEDEC (150 mil body width)
8 Pin PDIP (Type P) Package
Page 11
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S93662/S93663
2012 2.0 4/18/00
Frequently the reset controller will be deployed on a PC board that provides a peripheral function to a system.
Examples might be modem or network cards in a PC or a PCMCIA card in a laptop. In instances like this the peripheral
card may have a requirement for a clean reset function to insure proper operation. The system may or may not provide
a reset pulse of sufficient duration to clear the peripheral or to protect data stored in a nonvolatile memory.
The I/O capability of the RESET pins can provide a solution. The system’s reset signal to the peripheral can be fed
into the S93662/663 and it in turn can clean up the signal and provide a known entity to the peripheral’s circuits. The
figure below shows the basic timing characteristics under the assumption the reset input is shorter in duration than
t
PURST
. The same reset output affect can be attained by using the active high reset input.
When planning your resistor pull-up and pull-down values, use the following chart to help determine min. resistances.
Condition Min Typ Max Units
VCC = 1.0V, IOL=100µA 0.3 V
VCC = 1.2V, IOL=100µA 0.3 V
VCC = 3.0V, IOL=500µA 0.3 V
VCC = 3.6V, IOL=500µA 0.3 V
VCC = 4.5V, IOL=750µA 0.3 V
VCC = 1.0V, IOL=100µA 0.4 V
VCC = 1.2V, IOL=150µA 0.4 V
VCC = 3.0V, IOL=750µA 0.4 V
VCC = 3.6V, IOL=1mA 0.4 V
VCC = 4.5V, IOL=1mA 0.4 V
VCC = 1.0V, IOH=400µA VCC-0.75 V
VCC = 1.2V, IOH=800µA VCC-0.75 V
VCC = 3.0V, IOH=800µA VCC-0.5 V
VCC = 3.6V, IOH=800µA VCC-0.5 V
VCC = 4.5V, IOH=800µA VCC-0.5 V
Worst Case RESET Sink/Source Capabilities at Various VCC Levels
Parameter Symbol
RESET# Output V
OL
Voltage
RESET# Output V
OL
Voltage
RESET Output V
OH
Voltage
2012 PGM T5 1.0
RESET#
Input
RESET#
Output
RESET
Output
2012 T fig09 2.0
t
PURST
Page 12
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S93662/S93663
2012 2.0 4/18/00
Ready/Busy Status
During the internal write operation the S93662/663 memory array is inaccessible. After starting the write operation
(taking CS low) the host can implement a 10ms time-out routine or alternatively it can employ a polling routine that tests
the state of the DO pin.
After starting the write, testing for the status is easily accomplished by taking CS high and testing the state of DO. If
it is low the device is still busy with the internal write. If it is high the write operation has completed.
For the polling routine the host has the option of toggling CS for each test of DO, or it can place CS high and then
intermittently test DO. SK is
not required for any of these operations. Once the device is ready, it will continue to drive
DO high whenever the S93662/663 is selected. The ready state of DO can be cleared by clocking in a start bit; this
start bit can either be the beginning of a new command sequence or it can be a dummy start bit with CS returning low
before the host issues a new command.
SK
2012 ILL 13 1.0
CS
DI
DO
t
CS
HIGH-Z
HIGH-Z
STATUS CLEARED
BUSY READY
STATUS VERIFY
t
SV
t
HZ
t
EW
Page 13
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S93662/S93663
2012 2.0 4/18/00
ORDERING INFORMATION
Blank = Tube
T = Tape & Reel
A = 4.5V to 5.5V V
TRIP
min. @ 4.25V
B = 4.5V to 5.5V V
TRIP
min. @ 4.50V
2.7 = 2.7V to 5.5V V
TRIP
min. @ 2.55V
S93662
P
A
T
Base Part Number
Package
P = 8 lead PDIP
S = 8 lead 150mil SOIC
S93662 = 8-bit configuration
S93663 = 16-bit configuration
Tape & Reel Option
Operating V oltage Range
2012 Tree 2.0
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S93662/S93663
2012 2.0 4/18/00
NOTICE
SUMMIT Microelectronics, Inc. reserves the right to make changes to the products contained in this publication in order to improve
design, performance or reliability. SUMMIT Microelectronics, Inc. assumes no responsibility for the use of any circuits described
herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent
infringement. Charts and schedules contained herein reflect representative operating parameters, and may vary depending upon
a user’s specific application. While the information in this publication has been carefully checked, SUMMIT Microelectronics, Inc.
shall not be liable for any damages arising as a result of any error or omission.
SUMMIT Microelectronics, Inc. does not recommend the use of any of its products in life support applications where the failure or
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety
or effectiveness. Products are not authorized for use in such applications unless SUMMIT Microelectronics, Inc. receives written
assurances, to its satisfaction, that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; and
(c) potential liability of SUMMIT Microelectronics, Inc. is adequately protected under the circumstances.
© Copyright 2000 SUMMIT Microelectronics, Inc.
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