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1/4 INCH CCD IMAGE SENSOR FOR CCIR CAMERA S5F429PX02
H-CCD
INTRODUCTION
The S5F429PX02 is an interline transfer CCD area image
sensor developed for CCIR 1/4 inch optical format video
cameras, surveillance cameras, object detectors and image
pattern recognizers. High sensitivity is on-chip micro lenses
and HAD (Hole Accumulated Diode) photosensors. This chip
features a field integration read out system and an electronic
shutter with variable charge storage time.
FEATURES
• High Sensitivity
• Optical Size 1/4 inch Format
• No Adjust Substrate Bias
• Low Dark Current
• Horizontal Register 3.3 to 5.0V Drive
• 14pin Ceramic DIP Package
• Field Integration Read Out System
• No DC Bias on Reset Gate
14Pin Cer - DIP
ORDERING INFORMATION
Device Package Operating
S5F429PX02-LAB0 14Pin Cer-DIP
-10 °C − +60 °C
STRUCTURE
• Number of Total Pixels: 537(H) × 597(V)
• Number of Effective Pixels: 500(H) × 582(V)
• Chip Size: 4.80mm(H) × 4.04mm(V)
• Unit Pixel Size: 7.30 µm(H) × 4.70 µm(V)
• Optical Blacks & Dummies: Refer to Figure Below
Vertical 1 Line (Even Field Only)
16 7 500 30
1 582 14
V-CCD
OUTP UT
Effective
Imagi ng
Area
Du mmy P ixels
Optical Black Pixels
E ffective Pixel s
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S5F429PX02 1/4 INCH CCD IMAGE SENSOR FOR CCIR CAMERA
BLOCK DIAGRAM
(Top View)
7
V
OUT
8 9 10 11 12 13 14
V
DD
6 5 4 3 2 1
GND NC
Vertical Shift Register CCD
GND
Φ
SUB
Φ
V1
Vertical Shift Register CCD
Horizontal Shift Register CCD
V
L
Φ
Φ
RG
V2
Φ
V3
Vertical Shift Register CCD
Φ
H1
Vertical Shift Register CCD
Φ
Φ
V4
H2
Figure 1. Block Diagram
PIN DESCRIPTION
Table 1. Pin Description
Pin Symbol Description Pin Symbol Description
1
2
3
4
Φ
Φ
Φ
Φ
V4
V3
V2
V1
Vertical register transfer clock 8
Vertical register transfer clock 9 GND GND
Vertical register transfer clock 10
Vertical register transfer clock 11
5 NC No connection 12
6 GND Ground 13
7
V
OUT
Signal output 14
Φ
V
Φ
Φ
Φ
DD
SUB
V
L
RG
H1
H2
Output stage drain bias
Substrate clock
Protection transistor bias
Reset gate clock
Horizontal register transfer clock
Horizontal register transfer clock
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1/4 INCH CCD IMAGE SENSOR FOR CCIR CAMERA S5F429PX02
ABSOLUTE MAXIMUM RATINGS
(NOTE)
Table 2. Absolute Maximum Ratings
Characteristics Symbols Min. Max. Unit
Substrate voltage SUB - GND -0.3 40 V
VDD, V
Vertical clock input voltage ΦV1, ΦV3, - GND
ΦV2, Φ
ΦV1, ΦV3, - V
ΦV2, Φ
ΦV1, ΦV2, ΦV3, Φ
Horizontal clock input voltage ΦH1, ΦH2 - V
ΦH1, ΦH2 - SUB
Voltage difference between vertical and
horizontal clock input pins
ΦV1, ΦV2, ΦV3, Φ
ΦH1, Φ
ΦH1, ΦH2 - Φ
OUT
V4
V4
H2
- SUB
- GND
L
- VL
L
V4
V4
V4
- SUB
-40 10 V
-0.3 30 V
-0.3 17 V
-0.3 30 V
-0.3 17 V
-40 10 V
-0.3 7 V
-30 7 V
15 V
16 V
-17 16 V
Output clock input voltage ΦRG - GND
ΦRG - SUB
Protection circuit bias voltage
Operating temperature
Storage temperature
NOTE: The device can be destroyed, if the applied voltage or temperature is higher than the absolute maximum rating voltage
or temperature.
VL - SUB
T
OP
T
STG
-0.3 16 V
-40 16 V
-40 10 V
-10 60 °C
-30 80 °C
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S5F429PX02 1/4 INCH CCD IMAGE SENSOR FOR CCIR CAMERA
DC CHARACTERISTICS
Table 3. DC Characteristics
Item Symbol Min. Typ. Max. Unit
Output stage drain bias
Protection circuit bias voltage
Output stage drain current
CLOCK VOLTAGE CONDITIONS
Table 4. Clock Voltage Conditions
Item Symbol Min. Typ. Max. Unit Remark
Read-out clock voltage
Vertical transfer clock voltage V
Horizontal transfer clock voltage V
V
VM1
V
VH1
VL1
HH1
, V
~ V
~ V
, V
V
V
I
VH3
VM4
VL4
HH2
DD
DD
14.55 15.0 15.45 V
L
The lowest vertical clock level
5 mA
14.55 15.0 15.45 V High level
-0.2 0.0 0.2 V Middle
-8.0 -7.5 -7.0 V Low
3.0 5.0 5.25 V High
V
HL1
Charge reset clock voltage V
Substrate clock voltage
V
, V
RGH
V
RGL
ΦSUB
HL2
-0.05 0.0 0.05 V Low
4.75 5.0 5.25 V High
-0.2 0.0 0.2 V Low
21.5 22.5 23.5 V Shutter
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1/4 INCH CCD IMAGE SENSOR FOR CCIR CAMERA S5F429PX02
V
=
V
-0.3V
DRIVE CLOCK WAVEFORM CONDITIONS
Read Out Clock Waveform
100%
90%
V
VH1,VVH3
10%
0%
Vertical Transfer Clock Waveform
tr twh tf
0V
¥Õ
V V H 1
¥Õ
V VH2
V 1
V 2
V V H H
V V L 1
V VL
V V HH V VHH
V
VHL
V
VL
V
VH
V V H H
V V H L
V
VL H
V
V
V
V VL H
V VL 2
V VL L
VVH= (V
VV L = (V V L 3 + VV L 4)/ 2
V¥ÕV= V
¥Õ
V 3
V
V H L
V V HL
V VHH
V V HL
V
VH3
V VL 3
VL L
¥Õ
V 4
VH
VHL
V
V
V VL
VH
V VH H
VHL
V V H4
V
VH H
V
VH
V VL H
V
VL L
V
VH H
V
VHL
V VL H
V
VL L
V
VH 1
+ V
VH 2
VL 4
)/2
V
VH H
= VVH+ 0.3V
V
VL
VVH L = VV H - 0. 3 V
VH n
- V
VL n (n = 1~4)
V
= V
V L
V L
+ 0.3V
VL H
VL L
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S5F429PX02 1/4 INCH CCD IMAGE SENSOR FOR CCIR CAMERA
V
Horizontal Transfer Clock Waveform Diagram
90%
10%
HL
Reset Gate Clock Waveform Diagram
RG waveform
V
RGLH
V
RGLL
tr twh
twl
Point A
V¥Õ
tf
H
twl
twh tftr
V
RGH
V
¥Õ
RG
V
+ 0.5V
RGL
V
RGL
¥Õ
H1 waveform
10%
V
is the maximum value and V
RGLH
in the diagram about to RG rise
V
RGL
= (V
RGLH
+ V
RGLL
)/2, V
Substrate Clock Waveform
V
SU B
FRG
100%
90%
10%
0%
is the minimum value of the coupling waveform in the period from Point A
RGLL
= V
RGH
- V
RGL
¥Õ
V
SU B
twhtr tf
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1/4 INCH CCD IMAGE SENSOR FOR CCIR CAMERA S5F429PX02
CLOCK EQUIVALENT CIRCUIT CONSTANT
Table 5. Clock Equivalent Circuit Constant
Item Symbol
Read-out clock
Vertical clock
Horizontal clock
Reset clock
Substrate clock
Φ
VH
ΦV1, Φ
ΦV3, Φ
Φ
H1
Φ
H2
Φ
RG
Φ
SUB
twh twl tr tf
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
2.5 0.5 0.5 µs
V2
V4
15 250 ns
41 46 41 46 6.5 9.5 6.5 9.5 ns
41 46 41 46 6.5 9.5 6.5 9.5 ns
11 14 76 80 6.0 5.0 ns
1.5 2.0 0.5 0.5 µs
Unit
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S5F429PX02 1/4 INCH CCD IMAGE SENSOR FOR CCIR CAMERA
V
3¥ÕV
4
EQUIVALENT CIRCUIT PARAMETERS
Table 6. Equivalent Circuit Parameters
Item Symbol Typ. Unit Remark
Capacitance between vertical transfer clock and GND C
Capacitance between vertical transfer clocks C
C
Capacitance between horizontal transfer clock and GND
Capacitance between horizontal transfer clocks
Capacitance between substrate clock and GND
Vertical transfer clock serial resistor
R
Vertical transfer clock ground resistor
Horizontal transfer clock serial resistor
Reset gate clock serial resistor
ΦV1
C
ΦV2
ΦV12
ΦV23
C
ΦH1
ΦV1
R
R
ΦH1
, C
, C
, C
, C
C
ΦV13
C
ΦV24
, C
C
ΦH12
C
ΦSUB
~ R
ΦVGND
, R
R
ΦRG
ΦV3
ΦV4
ΦV34
ΦV41
ΦH2
ΦV4
ΦH2
680 pF
820 pF
180 pF
180 pF
60 pF
60 pF
30 pF
30 pF
180 pF
40 Ω
15 Ω
10 Ω
100 Ω
¥Õ
C
¥Õ
V13
VGND
C¥Õ
V2
V3
¥Õ
V2
R
C¥Õ
R
¥Õ
V2
R¥Õ
H1
¥Õ
H1
V23
¥Õ
V3
C¥Õ
H12
¥Õ
C
H1
R¥Õ
C
H2
¥Õ
H2
¥Õ
H2
C¥Õ
R
¥Õ
V1
¥Õ
R
V1
C
V41
C
C¥Õ
¥Õ
V4
¥Õ
C
V12
¥Õ
V1
¥Õ
V24
V4
C¥Õ
V34
C
¥Õ
R
¥Õ
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1/4 INCH CCD IMAGE SENSOR FOR CCIR CAMERA S5F429PX02
OPERATING CHARACTERISTICS
Device Temperature = 25 °C
Table 7. Operating Characteristics
Item Symbol Min. Typ. Max. Unit Remark
Sensitivity S 85 95 mV/lux 1
Saturation signal
Y
SAT
800 mV 2
Smear SM 0.007 0.01 % 3
Blooming margin BM 1,000 times 4
Uniformity U 20 % 5
Dark signal
Dark shading
(NOTE)
(NOTE)
Image lag
Flicker Y
NOTE: Test Temperature = 60 °C
D 2 mV 6
∆D 2 mV 7
Y
LAG
F
Y
0.5 % 8
2 % 9
TEST CONDITION
1. Use a light source with color temperature of 3,200K hallogen lamp and CM-500S for IR cut filter.
The light source is adjusted in accordance with the average value of Y signals indicated in each item.
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S5F429PX02 1/4 INCH CCD IMAGE SENSOR FOR CCIR CAMERA
TEST METHODS
1. Measure the light intensities (L) when the averaged illuminance output value (Y) is the standard illuminance
output value, 150mV (YA) and when half of 150mV (1/2 YA).
1
Y
---YA–
A
-----------------------------=
L
–
Y
A
).
Y
SM
-----------
Y
A
2
L
1
---
Y
A
2
1
1
----------×
-------× 100%()×=
500
10
S
2. Adjust the light intensity to 15 times of the value with which Y is YA, then measure the averaged illuminance
output value (Y = Y
SAT
3. Adjust the light intensity to 500 times of the value with which Y is YA, then remove the read-out clock and drain
the signal in photosensors by the electronic shutter operation in all the respective horizontal blanking times with
the other clocks unchanged. Measure the maximum illuminance output value (YSM).
SM
4. Adjust the light intensity to 1,000 times of the value with which Y is YA, then inspect whether there is blooming
phenomenon or not.
5. Measure the maximum and minimum illuminance output value (Y
MAX
, Y
) when the light intensity is adjusted
MIN
to make Y to be YA.
Y
–
MAXYMIN
U
------------------------------------100%()×=
Y
A
6. Measure YD with the horizontal idling time transfer level as reference, when the device ambient temperature is
60 °C and all of the light sources are shielded.
7. Follow test method 6, measure the maximum (D
∆DD
–=
MAXDMIN
) and minimum illuminance output (D
MAX
MIN
).
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1/4 INCH CCD IMAGE SENSOR FOR CCIR CAMERA S5F429PX02
8. Adjust the light intensity of Y signal output value by strobe light to 150mV (YA), calculate by below formula with
measuring the image lag signal which is qenerated by below timing diagram.
Y
LAGYlag
FLD
SG1
Strobe
Timing
Output
150⁄()100%()×=
Light
Y Signal
Output 150mV
Y
Lag
9. Adjust the light intensity of Y signal average value to 150mV (YA), calculate by below formula with measuring
the signal differences (∆Yf [mV]) between fields.
F
∆ YfYA⁄()100%()×=
Y
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S5F429PX02 1/4 INCH CCD IMAGE SENSOR FOR CCIR CAMERA
Spectral Response
SPECTRAL RESPONSE CHARACTERISTICS
Excluding Light Source Characteristics
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
400 425 450 475 500 525 550 575 600 625 650 675 700
Wave Length (nm)
12
Figure 2. Spectral Response Characteristics
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1/4 INCH CCD IMAGE SENSOR FOR CCIR CAMERA S5F429PX02
APPLICATION CIRCUITS
MA110
10µ/16V
+ -
100K
-7.5V
1µ/35V
CCD Out
1M
100
104
+-
3.9K
152
2SK1070
10µ/16V
7
VOUT
6
GND
5
NC
4
Φ
V1
3
Φ
V2
2
Φ
V3
1
Φ
V4
S5F429PX02
Φ
VDD
GND
SUB
Φ
Φ
Φ
RG
H1
H2
8
9
10
11
VL
12
13
14
+ -
103
10
15V
20
19
18 17
16
14
15
S5C7221X01
1 2
3 4
XSUB XV2 XV1 XSG1 XV3 XSG2 XV4
6
5
Figure 3. Application Circuits
7 8
12
13
11
9
10
10µ/16V
+ -
ΦH2Φ
H1
RG
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S5F429PX02 1/4 INCH CCD IMAGE SENSOR FOR CCIR CAMERA
READ-OUT CLOCK TIMING CHART
Unit: [µs]
HD
V1
Odd
Field
V2
V3
2.5
Even
Field
V4
V1
V2
V3
V4
38.5
1.2 1.5 2.5 2.0
0.3
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Figure 4. Read-out Clock Timing Chart
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1/4 INCH CCD IMAGE SENSOR FOR CCIR CAMERA S5F429PX02
CLOCK TIMING CHART (VERTICAL SYNC.)
FLD
VD
BLK
HD
SG1
SG2
V1
V2
V3
V4
CCD
OUT
CLP1
12345
620
625
582
581
10
1 3 5 531
15
20
2 4 6 2 4 6
25
310
582
581
315
325
320
1 3 587
330
335
340
2 4 6
82 4 6
1 3 5 7
Figure 5. Clock Timing Chart (Vertical Sync.)
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S5F429PX02 1/4 INCH CCD IMAGE SENSOR FOR CCIR CAMERA
CLOCK TIMING CHART (HORIZONTAL SYNC.)
5
3
2
1
7
5
3
2
1
16
15
10
5
3
2
1
30
25
20
15
10
5
3
2
1
500
495
490
V1
V2
V3
H1
HD
BLK
H2
RS
XSHP
XSHD
V4
SUB
CLP1
Figure 6. Clock Timing Chart (Horizontal Sync.)
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1/4 INCH CCD IMAGE SENSOR FOR CCIR CAMERA S5F429PX02
PACKAGE DIMENSIONS
(Unit = mm)
Glass
7583
4-R 0.50
#14
(L/F CL)
Y
Ceramicfr ame
Al2O390%Min. (black)
4-R 0.30
#8
0.38
Ceramic Base
Al2O390%Min. (black)
0.25
Lead Frame
Alloy 42
( Inner AI
Outer Sn )
1.27¡¾0.25
R0.70
4.13
2.50
1.27 x 6 = 7.62¡¾0.10
#1 #7
9.60¡¾0.12
Y
6.00¡¾0.10
10.00¡¾0.12
0.46¡¾0.10
1.27¡¾0.05
0.30¡¾0.10
5.40¡¾0.10
Glass
(7583)
10.00¡¾0.12
7.40¡¾0.10
XX
(L/F CL)
10.00¡¾0.12
0.90¡¾0.08
4-R0.50
2.600
1.00¡¾0.08
0.35¡¾0.08
0.80¡¾0.15
NOTES:
1. Max. Leakage by Hellium Detector :10-8atm. cc/sec at 10-5mmHg
2. Resistance Between Leads :Above 10100HM at 25¡É, 60% R>H
3. Insulation Resistance :Electrical leakage shall not exceed 5
nano AMP at 100V D.C
4. Ceamic Material :Min. 90% al203(black)
5. Lead Frame
- Coplanarity :0.25 Max. (after L/F attach)
- Planarity :0.076/mm, -0.102/mm
- Al clad
. Thickness :5um to 10um (for stamp)
. Thickness :2.5um to 12.7um (for etch)
. Coverage :Min. 0.762mm from lead tip
- Sn thickness :4um to 20um
6. Flatness
- DIE attach pad :Max. 0.051mm
- LID seal area :Max. 0.051mm
7. Other :In according to semi standards.
9.46¡¾0.12
10.16¡¾0.30
Figure 7. Package Dimensions
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S5F429PX02 1/4 INCH CCD IMAGE SENSOR FOR CCIR CAMERA
HANDLING INSTRUCTIONS
• Static Charge Prevention
CCD image sensors can be easily damaged by static discharge. Before handling, be sure to take the following
protective measures.
— Use non chargeable gloves, clothes or material. Also use conductive shoes.
— When handling directly, use an earth band.
— Install a conductive mat on the floor or working table to prevent generation of static electricity.
— Ionized air is recommended for discharging when handling CCD image sensor.
— For the shipment of mounted substrates, use boxes treated for the prevention of static charges.
• Soldering
— Make sure the package temperature does not exceed 80 °C.
— Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W
soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently.
— To dismount an imaging device, do not use a solder suction equipment. When using an electronic
disoldering tool, use a thermal controller of the zero cross on/off type and connect to ground.
• Dust and Dirt Protection
— Operate in the clean environments (around class 1000 will be appropriate).
— Do not either touch glass plates by hand or have object come in contact with glass surface. Should dirt
stick to a glass surface blow it off with an air blow(for dirt stuck through static electricity ionized air is
recommended).
— Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch
the glass.
— Keep in case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving
to a room with great temperature differences.
— When a protective tape is applied before shipping, just before use remove the tape applied electrostatic
protection. Do not reuse the tape.
• Do not expose to strong light (sun rays) for long period, color filter are discolored.
• Exposure to high temperature or humidity will affect the characteristics. accordingly avoid storage or
usage in such conditions.
• CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.
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