S13MD01
S13MD01
8-pin DIP Type SSR
for Low Power Control
Features
■
1. Compact 8-pin dual-in-line package
2. RMS ON-state current (I
: 0.3Arms)
T
3. Repetitive peak OFF-state voltage is high.
4.
Isolation voltage between input and output (Viso : 4000Vrms)
5. Recognized by UL (No. E94758)
6. Approved by CAS (No. LR63705)
■
Application
1. Oil fan heaters
2. Microwave ovens
3. Refrigerators
■
Outline Dimensions
Internal connection diagram
568
1234
±
0.25
2.54
568
Anode
mark
* (Note) Terminals 1 , 3 and 4 are common ones of cathode.
To radiate the heat, solder all of the lead pins on the pattern of PWB.
S13MD01
1234
9.66
0.5
±
3.1
±
0.5
0.5
±
3.4
0.5
±
6.5
±
0.3
1.2
0.5
±
3.5
TYP.
0.5
±
0.1
0.5
0.26
θ: 0 to 13˚
Cathode
1
2
Anode
Cathode
3
Cathode
4
5 G
6 T
8 T
7.62
1
2
±
0.3
±
0.1
(Unit : mm)
θ
Absolute Maximum Ratings
■
(
Ta =25˚C
)
Parameter Symbol Rating Unit
Input
Forward current I
Reverse voltage V
RMS ON-state current I
Output
*1
Peak one cycle surge current
Repetitive peak OFF-state voltage V
*2
Isolation voltage
Operating temperature
Storage temperature
*3
Soldering temperature
*1 50Hz sine wave
*2 40 to 60% RH, AC for 1 minute, f=60Hz
*3 For 10 seconds
“ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”
I
V
T
T
T
F
R
T
surge
DRM
iso
opr
stg
sol
50 mA
6V
0.3 A
rms
3A
400 V
4 000 V
rms
- 25 to +80 ˚C
- 40 to +125 ˚C
260 ˚C
S13MD01
■
Electro-optical Characteristics
Parameter Symbol
Input
Forward voltage V
Reverse current I
Repetitive peak OFF-state current
Output
ON-state voltage V
Holding current I
Critical rate of rise of OFF-state voltage
Minimum trigger current I
Transfer
characteristics
Insulation resistance R
Turn-on time t
Fig. 1 RMS ON-state Current vs. Ambient
Temperature
0.8
0.7
)
rms
0.6
(A
T
0.5
0.4
0.3
0.2
RMS ON-state current I
0.1
0
- 25 0 25 50 75 100
Ambient temperature Ta (˚C)
60
F
R
I
DRM
T
H
dv/dt 2 )• RatedV
FT
ISO
on
(Ta=25˚C)
Conditions
MIN. TYP. MAX. Unit
IF= 20mA - 1.2 1.4 V
VR=3V - - 10 µA
V
= Rated - - 100 µ A
DRM
IT= 0.3A - - 3.0 V
VD=6V - - 25 mA
=(1/ 100 - - V/µs
DRM
= 100Ω
= 6V, R
V
D
L
DC500V, 40to 60% RH 5x10
VD= 6V, RL= 100Ω
= 20mA
I
F
- - 10 mA
10
1x10
11
- Ω
- - 100 µ s
Fig. 2 Forward Current vs. Ambient
Temperature
60
50
40
(mA)
F
30
20
Forward current I
10
0
- 25 0 25 75 100
Ambient temperature Ta (˚C)
55 8080 50
S13MD01
Fig. 3 Forward Current vs. Forward Voltage
200
100
50
(mA)
F
20
10
5
Forward current I
2
1
0 0.5 1.0 1.5 2.0 2.5 3.0
Forward voltage VF (V)
= -
T
25˚C
a
50˚C
25˚C
-
0˚C
25˚C
Fig. 5 ON-State Voltage vs. Ambient
Temperature (S13MD01)
1.4
1.3
(V)
1.2
T
1.1
1.0
ON-state voltage V
0.9
I
T
= 0.3A
Fig. 4 Minimum Trigger Current vs.
Ambient Temperature (S13MD01)
(mA)
FT
12
10
8
6
4
2
VD=6V
R
L
Minimum trigger current I
0
- 30 0 20 40 60 80 100
Ambient Temperature Ta (˚C)
Fig. 6 Relative Holding Current vs.
Ambient Temperature (S13MD01)
3
10
(25˚C) x100%
H
(t˚C)/I
H
2
10
= 100Ω
=6V
V
D
0.8
-30
0 20406080100
Ambient Temperature Ta (˚C)
Fig. 7 ON-State Current vs. ON-State Voltage
0.5
0.4
(A)
T
0.3
0.2
ON-state current I
0.1
0
0 0.5 1.5
ON-state voltage VT (V)
(S13MD01)
IF= 20mA
Ta= 25˚C
1.0
Relative holding current I
10
-30
0 20406080100
Ambient temperature Ta (˚C)
Fig. 8 Turn-on Time vs. Forward Current
100
(µ s)
on
10
Turn-on time t
1
10 20 30 40 50
Forward current IF (mA)
(S13MD01)
VD=6V
R
= 100Ω
L
Ta= 25˚C
100
Basic Operation Circuit
■
+ V
S13MD01
R
CC
1
2
8
Load
)
AC supply voltage
Input signal
Load current
(for resistance load)
D
1
V
1
Tr1
(1) DC Drive (2) Pulse Drive (3) Phase Control
SSR
3
6
Z
Zs : Surge absorption circuit
S
AC 100V (S13MD01
Notes (1) If large amount of surge is loaded onto Vcc or the driver circuit, add a diode D1 between terminals 2 and 3 to prevent reverse
bias from being applied to the infrared LED.
(2) Be sure to install a surge absorption circuit. An appropriate circuit must be chosen according to the load
(for CR, choose its constant). This must be carefully done especially for an inductive load.
(3) For phase control, adjust such that the load current immediately after the input signal is applied will be more than 30mA.
■
Precautions for Use
(1) All pins must be soldered since they are also used as heat sinks (heat radiation fins).
In designing, consider the heat radiation from the mounted SSR.
(2) For higher radiation efficiency that allows wider thermal margin, secure a wider round pattern for Pin No. 8
when designing mounting pattern. The rounded part of Pin No. 5 (gate) must be as small as possible.
Pulling the gate pattern around increases the change of being affected by external noise.
●
As for other general cautions, refer to the chapter "Precautions for Use" (Page 78 to 93).
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