Page 1
S101D01/S101D02/S201D01/S201D02
S101D01/S101D02
S201D01/S201D02
1. Compact
(16-pin dual-in-line package type
2. RMS ON-state current IT: 1.2Arms
3. Built-in zero-cross circuit
(S101D02 , S201D02
4. Recognised by UL, file No. E94758
5. Approved by CSA, No. LR63705
■ Applications
1. Fan heaters
2. Microwave ovens
3. Refrigerators
4. Air conditioners
■ Model Line-ups
For 100V
For phase control
No built-in zero-
cross circuit
Built-in zerocross circuit
lines
S101D01 S201D01
S101D02
)
)
For 200V
lines
S201D02
16-Pin DIP Type SSR for Low
Power Control
■ Outline Dimensions■ Features
Internal connection diagram
16
2 Anode
3 Cathode
11
,
9
15
16
16
Anode
mark
❈ Zero-cross circuit for S101D02 /S201D02
13
15
2 34567
T
1
13
T
2
Gate
NC
15
234567
2.54
19.82
11
9
*To radiate the heat, solder
the lead pins to , on
the pattern of the PWB
without using a socket such
that there is no open pin left.
11
13
A
±
0.25
±
0.5
1.2
0.5
±
3.4
❈ Zero-cross
circuit
9
±
0.2
0.5
(
Unit : mm
9
4
7
A(Model No.
0.5
S101D01
±
S101D02
6.5
S201D01
S201D02
7.62
0.5
±
3.5
TYP.
0.5
0.26
±
0.1
θ : 0 to 13˚
)
)
±
0.3
±
0.1
θ
■ Absolute Maximum Ratings
Rating
50
6
1.2
12
4 000
- 25 to + 85
- 40 to + 125
260
Input
Output
Parameter Symbol Unit
Forward current I
Reverse voltage V
RMS ON-state current I
*1
Peak one cycle surge current I
Repetitive peak OFF-state voltage
*2
Isolation voltage V
Operating temperature T
Storage temperature T
*3
Soldering temperature T
F
R
T
surge
V
DRM
iso
opr
stg
sol
S101D01/S101D02 S201D01/S201D02
400 600
*1 50Hz, sine wave
*2 40 to 60%RH, AC 60Hz for 1 minute
*3 For 10 seconds
“ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”
(
Ta= 25˚C
A
V
)
mA
V
rms
A
V
rms
˚C
˚C
˚C
Page 2
S101D01/S101D02/S201D01/S201D02
■ Electrical Characteristics
Parameter
Input
Output
Transfer
characteristics
Fig. 1 RMS ON-state Current vs.
Fig. 3 Forward Current vs.
Forward voltage V
Reverse current I
Repetitive
peak OFF-state
current
S101D01 / S101D02
S201D01 / S201D02
ON-state voltage V
Holding current I
Zero-cross voltage
Critical rate of
rise of OFF-state
voltage
S101D02 / S201D02
S101D01 / S101D02
S201D01 / S201D02
Minimum trigger current I
Isolation resistance R
Turn-on time t
Ambient Temperature
1.6
1.4
)
1.2
Arms
(
T
1.0
0.8
0.6
0.4
RMS ON-state current I
0.2
0
- 25 0 25 50 75 100
Forward Voltage
200
100
)
50
mA
(
F
20
10
5
Forward current I
2
Ambient temperature Ta (˚C
40 85
0˚C
25˚C
50˚C
25˚C
-
= 75˚C
a
T
Symbol
FIF
R
I
DRM
TIT
H
V
OX
dV/dt
FT
ISO
on
(
Ta = 25˚C
Conditions MIN. TYP. MAX. Unit
= 20mA - 1.2 1.4 V
VR=3V - - 10
V
= 400V - - 10
DRM
= 600V - - 10
V
DRM
-5
-4
-4
= 1.2A - - 1.7 V
VD=6V
Resistance load, I
V
= 1/ • 400V 200 - - V/µ s
DRM
V
= 1/ • 600V 100 - - V/µ s
DRM
= 15mA
F
2
2
- - 25 mA
- - 35 V
VD= 6V, RL= 100Ω - - 10 mA
DC500V, 40 to 60%RH
VD= 6V, RL= 100Ω, IF= 20mA
5x101010
- - 100 µs
11
- Ω
)
A
A
A
Fig. 2 Forward Current vs.
Ambient Temperature
80
70
)
60
mA
(
50
F
40
30
Forward current I
20
10
0
)
- 25 0 25 50 75 100
Ambient temperature Ta (˚C
55 85
)
Fig. 4 Minimum Trigger Current vs.
Ambient Temperature
12
)
10
mA
(
FT
8
6
4
Minimum trigger current I
2
(
S101D01
VD=6V
R
= 100 Ω
L
)
1
0.50 1.0 1.5 2.0 2.5 3.0
Forward voltage V
0
)
(V
F
- 30 0 20 40 60 80 100
Ambient temperature Ta (˚C
)
Page 3
S101D01/S101D02/S201D01/S201D02
Fig. 5 Minimum Trigger Current vs.
Ambient Temperature
12
)
10
mA
(
FT
8
6
4
Minimum trigger current I
2
0
- 30 0 20 40 60 80 100
(
S101D02 , S201D02
Ambient temperature Ta (˚C
V
D
R
L
)
=6V
= 100Ω
Fig. 7 ON-state Voltage vs.
Ambient Temperature
1.4
1.3
)
V
(
1.2
T
1.1
1.0
ON-state voltage V
0.9
0.8
- 30 0 20 40 60 80 100
Ambient temperature T
a
IT= 1.2A
)
(˚C
Fig. 6 Minimum Trigger Current vs.
)(
Ambient Temperature
12
)
10
mA
(
FT
8
6
4
Minimum trigger current I
2
0
- 30 0 20 40 60 80 100
Ambient temperature T
S201D01
V
D
R
L
(˚C
a
=6V
= 100Ω
)
)
Fig. 8 Relative Holding Current vs.
Ambient Temperature
=6V
V
3
10
100(%)
x
)
25˚C
(
H
/I
)
t˚C
(
H
2
10
Relative holding current I
1
10
- 30 0 20 40 60 80 100
Ambient temperature T
D
)
(˚C
a
Fig. 9 ON-state Current vs.
ON-state Voltage
1.2
= 20mA
I
F
T
= 25˚C
a
1.0
)
A
0.8
(
T
0.6
0.4
ON-state current I
0.2
0
0 0.5 1.0 1.5
ON-state voltage V
T
Fig.10 Turn-on Time vs. Forward Current
(
100
90
80
70
60
)
50
µ s
(
40
on
30
20
Turn-on time t
10
)
(V
10
20 30 40 50 100
Forward current I
S101D01
(mA
F
V
R
T
)
=6V
D
= 100Ω
L
= 25˚C
a
)
Page 4
S101D01/S101D02/S201D01/S201D02
Fig.11 Turn-on Time vs. Forward Current Fig.12 Turn-on Time vs. Forward Current
(
100
)
50
µ s
(
40
on
30
20
Turn-on time t
10
10 30 40 50 100
S101D02 , S201D02
20
Forward current IF (mA
VD=6V
R
T
)
)(
200
= 100Ω
L
= 25˚C
a
)
100
µ s
(
on
50
40
Turn-on time t
30
20
10 30 40 50 100
20
Forward current I
F
(mA
S201D01
V
=6V
D
= 100Ω
R
L
= 25˚C
T
a
)
■ Basic Operation Circuit
R
+V
Tr1
1
D
1
CC
V
1
13
2
SSR
3
11
ZS: Surge absorption circuit
Load
AC 100V (S101D01 / S101D02
Z
S
AC 200V (S201D01 / S201D02
)
)
)
(3)
Phase Control
between terminals 2
1
AC supply voltage
Input signal
Load current
(
for resistance load
)
(1)
DC Drive
(2)
Pulse Drive
Notes 1) If large amount of surge is loaded onto VCC or the driver circuit, add a diode D
and 3 to prevent reverse bias from being applied to the infrared LED.
2) Be sure to install a surge absorption circuit.
An appropriate circuit must be chosen according to the load (for CR, choose its constant). This must be
carefully done especially for an inductive load.
3) For phase control, adjust such that the load current immediately after the input signal is applied will be
more than 60mA.
(
Precautions for Use
)
1) All pins must be soldered since they are also used as heat sinks (heat radiation fins). In designing, take into the
heat radiation from the mounted SSR.
2) For higher radiation efficiency that allows wider thermal margin, secure a wider round pattern for Pin 13 when
designing mounting pattern. The rounded part of Pin 15 (gate) must be as small as possible. Pulling the gate
pattern around increases the change of being affected by external noise.
3) As for other general cautions, refer to the chapter “ Precautions for Use ”
9
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