Datasheet RX5000 Datasheet (RFM)

Page 1
®
· Designed for Short-Range Wireless Control and Data Communications
· Supports RF Data Transmission Rates Up to 115.2 kbps
· 3 V, Low Current Operation plus Sleep Mode
· Stable, Easy to Use, Low External Parts Count
The RX5000 hybrid receiver is ideal for short-range wireless control and data applications where robust operation, small size, low power consumption and low cost are required. The RX5000 employs RFM’s amplifier-sequenced hybrid (ASH) architecture to achieve this unique blend of characteristics. All critical RF functions are contained in the hybrid, simplifying and speeding de sign-in. The RX5000 is sensitive and stable. A wide dynamic range log detector, in combination with digital AGC and a compound data slicer, provide robust performance in the presence of on-channel interference or noise. Two stages of SAW filtering provide excellent receiver out­of-band rejection. The RX5000 generates virtually no RF emissions, facilitating compliance with ETSI I-ETS 300 220 and similar regulations.
Absolute Maximum Ratings
Rating Value Units
Power Supply and All Input/Output Pins -0.3 to +4.0 V
Soldering Temperature (10 seconds) 250
-
o
C
o
C
RX5000
433.92 MHz Hybrid
Receiver
Electrical Characteristics (typical values given for 3.0 Vdc power supply, 25oC)
Characteristic Sym Notes Minimum Typical Maximum Units
Operating Frequency f
Modulation Type OOK/ASK
Data Rate 115.2 kbps
Receiver Performance, High Sensitivity Mode
Sensitivity, 2.4 kbps, 10-3 BER, AM Test Method 1 -109 dBm
Sensitivity, 2.4 kbps, 10-3 BER, Pulse Test Method 1 -103 dBm
Current, 2.4 kbps (R
Sensitivity, 19.2 kbps, 10-3 BER, AM Test Method 1 -105 dBm
Sensitivity, 19.2 kbps, 10-3 BER, Pulse Test Method 1 -99 dBm
Current, 19.2 kbps (R
Sensitivity, 115.2 kbps, 10-3 BER, AM Test Method 1 -101 dBm
Sensitivity, 115.2 kbps, 10-3 BER, Pulse Test Method 1 -95 dBm
Current, 115.2 kbps 3.8 mA
Receiver Performance, Low Current Mode
Sensitivity, 2.4 kbps, 10-3 BER, AM Test Method 1 -104 dBm
Sensitivity, 2.4 kbps, 10-3 BER, Pulse Test Method 1 -98 dBm
Current, 2.4 kbps (R
= 330 K) 2 3.0 mA
PR
= 330 K) 2 3.1 mA
PR
= 1100 K) 2 1.8 mA
PR
O
433.72 434.12 MHz
1
Page 2
Electrical Characteristics (typical values given for 3.0 Vdc power supply, 25oC)
Characteristic Sym Notes Minimum Typical Maximum Units
Receiver Out-of-Band Rejection, ±5% f
O
Receiver Ultimate Rejection R
Sleep Mode Current I
Power Supply Voltage Range V
R
±5%
ULT
S
CC
Power Supply Voltage Ripple 10 mV
Ambient Operating Temperature T
A
380dB
3 100 dB
0.7 µA
2.2 3.7 Vdc
P-P
-40 85
o
C
Notes:
1. Typical sensitivity data is based on a 10 measure OOK/ASK receiver sensitivity, the “100% AM” test method and the “Pulse” test method. Sensitivity data is given for both test meth
-3
bit error rate (BER), using DC-balanced data. There are two test methods commonly used to
-
ods. See Appendix 3.8 in the ASH Transceiver Designer’s Guide for the details of each test method, and for sensitivity curves for a 2.2 to
3.7 V supply voltage range at five operating temperatures. The application/test circuit and component values are shown on the next page and in the Designer’s Guide.
2. At low data rates it is possible to adjust the ASH pulse generator to trade-off some receiver sensitivity for lower operating current. Sensitiv ity data and receiver current are given at 2.4 kbps for both high sensitivity operation (R
= 330 K) and low current operation (RPR= 1100 K).
PR
3. Data is given with the ASH radio matched to a 50 ohm load. Matching component values are given on the next page.
4. See Table 1 on Page 8 for additional information on ASH radio event timing.
-
0.43" (10.9)
SM -20L Package D raw ing
0.38" (9.65)
0.08"
(2.03)
0.13" (3.30)
0.125" (3 .20 )
0.02" (0 .51 )
0.04" (1 .02 )
0.075" (1 .90 )
A S H Transceiver Pin O ut
19
18
17
16
15
14
13
12
RFIO
GND3
CNTRL0
CNTRL1
VCC2
PW IDTH
PRATE
THLD2
RREF
GND1
201
2
VCC1
AGCCAP
RXDATA
3
4
PKDET
5
BBOUT
6
CMPIN
7
8
TXM O D THLD1
LPFA D J
9
10
11
GND2
2
Page 3
ASH Receiver Application C ircuit
O O K C onfiguration
+ 3
VDC
C
DCB
+
R/S
GND3CNT
CNT
L
AT
RFIO
20
L
ESD
GND1
1
VCC
1
23456789
+ 3
VDC
Receiver Set-Up, 3.0 Vdc, -40 to +85
Item Symbol OOK OOK ASK Units Notes
Nominal NRZ Data Rate
Minimum Signal Pulse SP
Maximum Signal Pulse SP
AGCCAP Capacitor C
PKDET Capacitor C
BBOUT Capacitor C
BBOUT Resistor R
LPFAUX Capacitor C
LPFADJ Resistor
RREF Resistor
THLD2 Resistor
THLD1 Resistor
PRATE Resistor
PWIDTH Resistor
DC Bypass Capacitor C
RF Bypass Capacitor 1 C
Antenna Tuning Inductor L
Shunt Tuning/ESD Inductor L
VCC
RL0
RL1PWIDTHPRATE
TOP VIEW
PK
RF
DET
A1
R
BBO
C
RFB1
C
LPF
2
CMP
INBBOUT
C
BBO
DR
RPWR
AGC
PKD
BBO
BBO
R
R
REF
R
R
R
R
DCB
RFB1
ESD
DATA
0
NOM
MIN
MAX
LPF
LPF
TH2
TH1
PR
PW
AT
R
TH1
PR
1213141516171819
THLD1NC
RREF
11
R
GND2
RX
LPF
NC
ADJ
R
REF
10
LPF
D a ta O u tp u t
C
2.4 19.2 115.2 kbps see pages1&2
416.67 52.08 8.68 µs single bit
1666.68 208.32 34.72 µs 4 bits of same value
- - 2200 pF ±10% ceramic
- - 0.001 µF ±10% ceramic
0.1 0.015 0.0027 µF ±10% ceramic
12 0 0 K ±5%
0.0047 - - µF ±5%
300 100 15
100 100 100
- - 100
0010
330 330 160
270 to GND 270 to GND 1000 to Vcc
4.7 4.7 4.7 µF tantalum
100 100 100 pF ±5% NPO
56 56 56 nH 50 ohm antenna
220 220 220 nH 50 ohm antenna
ASH Receiver Application C ircuit
ASK Configuration
+ 3
VDC
C
DCB
+
VCC
TOP VIEW
PKD
RPWR
2
RX
CMP
DATA
INBBOUT
C
BBO
±1%, for 6 dB below peak
R/S
GND3CNT
L
AT
20
L
ESD
1
C
RFB1
CNT
RL0
RL1PWIDTHPRATE
RFIO
GND1 VCC
VDC
PK
AGC
DET
CAP
1
23456789
+ 3
C
C
AGC
K
K
K
K
K
K
R
TH1
PR
R
1213141516171819
THLD1THLD
RREF
GND2
LPF
NC
ADJ
TH2
2
11
R
10
R
LPF
D a ta O u tp u t
±5%
±1%
±1%, typical values
±5%
±5%
REF
CAUTION: Electrostatic Sensitive Device. Observe precautions when handling.
3
Page 4
ASH Receiver Theory of Operation
Introduction
RFM’s RX5000 series amplifier-sequenced hybrid (ASH) receivers are specifically designed for short-range wireless control and data communication applications. The receivers provide robust operation, very small size, low power consumption and low implementation cost. All critical RF functions are contained in the hybrid, simplifying and speeding design-in. The ASH receiver can be readily configured to support a wide range of data rates and protocol requirements. The receiver features virtually no RF emissions, making it easy to certify to short-range (unlicensed) radio regulations.
Amplifier-Sequenced Receiver Operation
The ASH receiver’s unique feature set is made possible by its sys tem architecture. The heart of the receiver is the amplifier­sequenced receiver section, which provides more than 100 dB of stable RF and detector gain without any special shielding or de coupling provisions. Stability is achieved by distributing the total RF gain over time. This is in contrast to a superheterodyne receiver, which achieves stability by distributing total RF gain over multiple frequencies.
Figure 1 shows the basic block diagram and timing cycle for an am plifier-sequenced receiver. Note that the bias to RF amplifiers RFA1 and RFA2 are independently controlled by a pulse generator, and
-
-
that the two amplifiers are coupled by a surface acoustic wave (SAW) delay line, which has a typical delay of 0.5 µs.
An incoming RF signal is first filtered by a narrow-band SAW filter, and is then applied to RFA1. The pulse generator turns RFA1 ON for 0.5 µs. The amplified signal from RFA1 emerges from the SAW delay line at the input to RFA2. RFA1 is now switched OFF and RFA2 is switched ON for 0.55 µs, amplifying the RF signal further. The ON time for RFA2 is usually set at 1.1 times the ON time for RFA1, as the filtering effect of the SAW delay line stretches the sig nal pulse from RFA1 somewhat. As shown in the timing diagram, RFA1 and RFA2 are never on at the same time, assuring excellent receiver stability. Note that the narrow-band SAW filter eliminates sampling sideband responses outside of the receiver passband, and the SAW filter and delay line act together to provide very high re ceiver ultimate rejection.
Amplifier-sequenced receiver operation has several interesting char acteristics that can be exploited in system design. The RF amplifiers in an amplifier-sequenced receiver can be turned on and off almost instantly, allowing for very quick power-down (sleep) and wake-up times. Also, both RF amplifiers can be off between ON sequences to trade-off receiver noise figure for lower average current consump tion. The effect on noise figure can be modeled as if RFA1 is on continuously, with an attenuator placed in front of it with a loss
-
equivalent to 10*log
(RFA1 duty factor), where the duty factor is the
10
average amount of time RFA1 is ON (up to 50%). Since an amplifier-sequenced receiver is inherently a sampling receiver, the overall cycle time between the start of one RFA1 ON sequence and
-
-
-
-
Antenna
R F Input
P1
RFA1 Out
D elay Line Out
A S H R e c e iv e r B lo c k D ia g r a m & T im in g C y c le
S A W F ilte r R F A 1 R F A 2
P1 P2
t
PW 1
t
PW 2
t
PRI
t
PRC
D elay Line
G enerator
RF Data Pulse
SAW
Pulse
D e te c to r &
Low -P ass
F ilte r
Data Out
P2
Figure 1
4
Page 5
Antenna
RFIO
ESD C hoke
20
SAW
CR Filter
R X5000 S eries A S H R eceiver B lock D iagram
CNTRL1 CNTRL0
18
17
Bias C ontrol
PRATE
SAW
D elay Line
AGC Set
G ain S elect
Pulse G enerator
& R F A m p B ia s
15
14
R
PR
PW IDTH
R
PW
RFA1 RFA2
Power Down C ontrol
Log
AGC CAP
V C C 1 : P in 2 V C C 2 : P in 1 6 G N D 1 : P in 1 G N D 2 : P in 1 0 G N D 3 : P in 1 9 N C : P in 8 R R EF : Pin 11 CMPIN: Pin 6
Detector
AGC
C ontrol
3
LPF AD J
C
AGC
Figure 2
Low -P ass
F ilte r
9
R
AGC Reset
BBOU T
DS2
Ref
BB
56
LPF
Peak
Detector
C
BBO
PKDET
4
AGC
C
PKD
dB Below Peak T hld
DS1
Ref Thld
Threshold
C ontrol
11 12
13
R
TH1
R
AND
THLD 2THLD 1
R
TH2
REF
RXDATA
7
the start of the next RFA1 ON sequence should be set to sample the narrowest RF data pulse at least 10 times. Otherwise, significant edge jitter will be added to the detected data pulse.
RX5000 Series ASH Receiver Block Diagram
Figure 2 is the general block diagram of the RX5000 series ASH receiver. Please refer to Figure 2 for the following discussions.
Antenna Port
The only external RF components needed for the receiver are the antenna and its matching components. Antennas presenting an im pedance in the range of 35 to 72 ohms resistive can be satisfactorily matched to the RFIO pin with a series matching coil and a shunt matching/ESD protection coil. Other antenna impedances can be matched using two or three components. For some impedances, two inductors and a capacitor will be required. A DC path from RFIO to ground is required for ESD protection.
Receiver Chain
The output of the SAW filter drives amplifier RFA1. This amplifier in cludes provisions for detecting the onset of saturation (AGC Set), and for switching between 35 dB of gain and 5 dB of gain (Gain Se lect). AGC Set is an input to the AGC Control function, and Gain Se lect is the AGC Control function output. ON/OFF control to RFA1 (and RFA2) is generated by the Pulse Generator & RF Amp Bias function. The output of RFA1 drives the SAW delay line, which has a nominal delay of 0.5 µs.
The second amplifier, RFA2, provides 51 dB of gain below satura
­tion. The output of RFA2 drives a full-wave detector with 19 dB of threshold gain. The onset of saturation in each section of RFA2 is detected and summed to provide a logarithmic response. This is added to the output of the full-wave detector to produce an overall detector response that is square law for low signal levels, and tran sitions into a log response for high signal levels. This combination provides excellent threshold sensitivity and more than 70 dB of detector dynamic range. In combination with the 30 dB of AGC
range in RFA1, more than 100 dB of receiver dynamic range is achieved.
The detector output drives a gyrator filter. The filter provides a three-pole, 0.05 degree equiripple low-pass response with excellent group delay flatness and minimal pulse ringing. The 3 dB bandwidth of the filter can be set from 4.5 kHz to 1.8 MHz with an external re­sistor.
The filter is followed by a base-band amplifier which boosts the de­tected signal to the BBOUT pin. When the receiver RF amplifiers
-
are operating at a 50%-50% duty cycle, the BBOUT signal changes about 10 mV/dB, with a peak-to-peak signal level of up to 685 mV. For lower duty cycles, the mV/dB slope and peak-to-peak signal level are proportionately less. The detected signal is riding on a
1.1 Vdc level that varies somewhat with supply voltage, tempera ture, etc. BBOUT is coupled to the CMPIN pin or to an external data recovery process (DSP, etc.) by a series capacitor. The correct value of the series capacitor depends on data rate, data run length, and other factors as discussed in the ASH Transceiver Designer’s
-
Guide.
When an external data recovery process is used with AGC, BBOUT
­must be coupled to the external data recovery process and CMPIN
­by separate series coupling capacitors. The AGC reset function is
driven by the signal applied to CMPIN.
When the receiver is placed in the power-down (sleep) mode, the output impedance of BBOUT becomes very high. This feature helps preserve the charge on the coupling capacitor to minimize data slicer stabilization time when the receiver switches out of the sleep mode.
Data Slicers
The CMPIN pin drives two data slicers, which convert the analog
­signal from BBOUT back into a digital stream. The best data slicer
choice depends on the system operating parameters. Data slicer DS1 is a capacitively-coupled comparator with provisions for an ad justable threshold. DS1 provides the best performance at low
-
-
5
Page 6
signal-to-noise conditions. The threshold, or squelch, offsets the comparator’s slicing level from 0 to 90 mV, and is set with a resistor between the RREF and THLD1 pins. This threshold allows a trade­off between receiver sensitivity and output noise density in the no-signal condition. For best sensitivity, the threshold is set to 0. In this case, noise is output continuously when no signal is present. This, in turn, requires the circuit being driven by the RXDATA pin to be able to process noise (and signals) continuously.
This can be a problem if RXDATA is driving a circuit that must “sleep” when data is not present to conserve power, or when it its necessary to minimize false interrupts to a multitasking processor. In this case, noise can be greatly reduced by increasing the thresh old level, but at the expense of sensitivity. The best 3 dB bandwidth for the low-pass filter is also affected by the threshold level setting of DS1. The bandwidth must be increased as the threshold is in creased to minimize data pulse-width variations with signal ampli
-
-
tude.
Data slicer DS2 can overcome this compromise once the signal level is high enough to enable its operation. DS2 is a “dB-below­peak” slicer. The peak detector charges rapidly to the peak value of each data pulse, and decays slowly in between data pulses (1:1000 ratio). The slicer trip point can be set from 0 to 120 mV below this peak value with a resistor between RREF and THLD2. A threshold of 60 mV is the most common setting, which equates to “6 dB below peak” when RFA1 and RFA2 are running a 50%-50% duty cycle. Slicing at the “6 dB-below-peak” point reduces the signal amplitude to data pulse-width variation, allowing a lower 3 dB filter bandwidth to be used for improved sensitivity.
DS2 is best for ASK modulation where the transmitted waveform has been shaped to minimize signal bandwidth. However, DS2 is subject to being temporarily “blinded” by strong noise pulses, which can cause burst data errors. Note that DS1 is active when DS2 is used, as RXDATA is the logical AND of the DS1 and DS2 outputs. DS2 can be disabled by leaving THLD2 disconnected. A non-zero DS1 threshold is required for proper AGC operation.
AGC Control
The output of the Peak Detector also provides an AGC Reset signal to the AGC Control function through the AGC comparator. The pur pose of the AGC function is to extend the dynamic range of the re
­ceiver, so that the receiver can operate close to its transmitter when running ASK and/or high data rate modulation. The onset of satura tion in the output stage of RFA1 is detected and generates the AGC Set signal to the AGC Control function. The AGC Control function then selects the 5 dB gain mode for RFA1. The AGC Comparator will send a reset signal when the Peak Detector output (multiplied by
0.8) falls below the threshold voltage for DS1.
A capacitor at the AGCCAP pin avoids AGC “chattering” during the time it takes for the signal to propagate through the low-pass filter and charge the peak detector. The AGC capacitor also allows the hold-in time to be set longer than the peak detector decay time to avoid AGC chattering during runs of “0” bits in the received data stream. Note that AGC operation requires the peak detector to be functioning, even if DS2 is not being used. AGC operation can be defeated by connecting the AGCCAP pin to Vcc. The AGC can be latched on once engaged by connecting a 150 kilohm resistor be
-
tween the AGCCAP pin and ground in lieu of a capacitor.
Receiver Pulse Generator and RF Amplifier Bias
The receiver amplifier-sequence operation is controlled by the Pulse Generator & RF Amplifier Bias module, which in turn is controlled by
the PRATE and PWIDTH input pins, and the Power Down (sleep) Control Signal from the Bias Control function.
In the low data rate mode, the interval between the falling edge of one RFA1 ON pulse to the rising edge of the next RFA1 ON pulse
is set by a resistor between the PRATE pin and ground. The in
t
PRI
terval can be adjusted between 0.1 and 5 µs. In the high data rate mode (selected at the PWIDTH pin) the receiver RF amplifiers oper ate at a nominal 50%-50% duty cycle. In this case, the start-to-start period t
for ON pulses to RFA1 are controlled by the PRATE re
PRC
sistor over a range of 0.1 to 1.1 µs.
In the low data rate mode, the PWIDTH pin sets the width of the ON
­pulse t
t
PW2
data rate mode). The ON pulse width t
to RFA1 with a resistor to ground (the ON pulse width
PW1
to RFA2 is set at 1.1 times the pulse width to RFA1 in the low
can be adjusted between
PW1
0.55 and 1 µs. However, when the PWIDTH pin is connected to Vcc througha1Mresistor, the RF amplifiers operate at a nominal 50%-50% duty cycle, facilitating high data rate operation. In this case, the RF amplifiers are controlled by the PRATE resistor as de scribed above.
Both receiver RF amplifiers are turned off by the Power Down Con trol Signal, which is invoked in the sleep mode.
Receiver Mode Control
The receiver operating modes – receive and power-down (sleep), are controlled by the Bias Control function, and are selected with the CNTRL1 and CNTRL0 control pins. Setting CNTRL1 and CNTRL0 both high place the unit in the receive mode. Setting CNTRL1 and CNTRL0 both low place the unit in the power-down (sleep) mode. CNTRL1 and CNTRL0 are CMOS compatible inputs. These inputs must be held at a logic level; they cannot be left unconnected.
Receiver Event Timing
Receiver event timing is summarized in Table 1. Please refer to this table for the following discussions.
Turn-On Timing
The maximum time t
required for the receive function to become
PR
operational at turn on is influenced by two factors. All receiver cir cuitry will be operational 5 ms after the supply voltage reaches
-
2.2 Vdc. The BBOUT-CMPIN coupling-capacitor is then DC stabi lized in 3 time constants (3*t ceiver operation for a 10 ms power supply rise time is:
-
=15ms+3*t
t
PR
BBC
). The total turn-on time to stable re
BBC
Sleep and Wake-Up Timing
The maximum transition time from the receive mode to the power-down (sleep) mode t
is 10 µs after CNTRL1 and CNTRL0
RS
are both low (1 µs fall time).
The maximum transition time t mode is 3*t
, where t
BBC
BBC
from the sleep mode to the receive
SR
is the BBOUT-CMPIN coupling-capacitor time constant. When the operating temperature is limited to 60 the time required to switch from sleep to receive is dramatically less for short sleep times, as less charge leaks away from the BBOUT­CMPIN coupling capacitor.
AGC Timing
The maximum AGC engage time t
is 5 µs after the reception of a
AGC
-30 dBm RF signal witha1µsenvelope rise time.
The minimum AGC hold-in time is set by the value of the capacitor at the AGCCAP pin. The hold-in time t in µs and C
AGC
is in pF.
AGH=CAGC
/19.1, where t
o
AGH
-
-
-
-
-
-
-
-
C,
is
6
Page 7
Peak Detector Timing
The Peak Detector attack time constant is set by the value of the ca pacitor at the PKDET pin. The attack time t
is in µs and C
t
PKA
stant t
PKD
= 1000*t
is in pF. The Peak Detector decay time con
PKD
.
PKA
PKA=CPKD
/4167, where
-
Pulse Generator Timing
In the low data rate mode, the interval t
between the falling edge
PRI
of an ON pulse to the first RF amplifier and the rising edge of the next ON pulse to the first RF amplifier is set by a resistor R
be
-
PR
tween the PRATE pin and ground. The interval can be adjusted be tween 0.1 and 5 µs with a resistor in the range of 51 K to 2000 K. The value of the R
= 404* t
R
PR
PRI
In the high data rate mode (selected at the PWIDTH pin) the re
is given by:
PR
+ 10.5, where t
is in µs, and RPRis in kilohms
PRI
­ceiver RF amplifiers operate at a nominal 50%-50% duty cycle. In this case, the period t
from the start of an ON pulse to the first
PRC
RF amplifier to the start of the next ON pulse to the first RF amplifier is controlled by the PRATE resistor over a range of 0.1 to 1.1 µs us ing a resistor of 11 K to 220 K. In this case R
R
= 198* t
PR
- 8.51, where t
PRC
is in µs and RPRis in kilohms
PRC
is given by:
PR
In the low data rate mode, the PWIDTH pin sets the width of the ON pulse to the first RF amplifier t
­ON pulse width to the second RF amplifier t
with a resistor RPWto ground (the
PW1
is set at 1.1 times
PW2
the pulse width to the first RF amplifier in the low data rate mode). The ON pulse width t
can be adjusted between 0.55 and 1 µs
PW1
with a resistor value in the range of 200 K to 390 K. The value of
is given by:
R
PW
R
PW
= 404* t
- 18.6, where t
PW1
is in µs and RPWis in kilohms
PW1
However, when the PWIDTH pin is connected to Vcc througha1M resistor, the RF amplifiers operate at a nominal 50%-50% duty cy
­cle, facilitating high data rate operation. In this case, the RF amplifi
ers are controlled by the PRATE resistor as described above.
LPF Group Delay
The low-pass filter group delay is a function of the filter 3 dB band width, which is set by a resistor R The minimum 3 dB bandwidth f and R
The maximum group delay t
­is in µs, f
is in kilohms.
LPF
in kHz, and R
LPF
FGD
LPF
to ground at the LPFADJ pin.
LPF
= 1445/R
LPF
= 1750/f
LPF
, where f
LPF
= 1.21*R
in kilohms.
LPF
, where t
LPF
-
-
-
is in kHz,
FGD
7
Page 8
PKD
in µs user selected; longer than t
AGH
in µs user selected
in µs slaved to attack time
PKA
PKA
and t
in pF, t
PKD
PKD
in kHz user selected
in kilohms user selected
LPF
LPF
in µs, f
in kHz, R
FGD
LPF
in pF user selected
BBO
in µs, C
BBC
Table 1
19.1 min CAGC in pF, t
AGC/
C
AGH
/4167 min C
PKD
C
PKA
min t
PKA
1000*t
0.1 to 5 µs range low data rate mode user selected mode
PRI
PKD
0.55 to 1 µs range low data rate mode user selected mode
PW1
range low data rate mode user selected mode
PW1
1.1*t
PW2
0.1 to 1.1 µs range high data rate mode user selected mode
PRC
max 1µs CNTRL0/CNTROL1 rise times time until receiver operational
BBC
+ 15 ms max 10 ms supply voltage rise time time until receiver operational
BBC
3*t
10 µs max 1µs CNTRL0/CNTROL1 fall times time until receiver is in power-down mode
5 µs max 1 µs rise time, -30 dBm signal RFA1 switches from 35 to 5 dB gain
3*t
C
0
PR
SR
RS
AGC
0.05 to 0.55 µs range high data rate mode user selected mode
PWH
min f
max t
LPF
LPF
1750/f
1445/R
LPF
FGD
min t
BBO
0.064*C
BBC
Event Symbol Time Min/Max Test Conditions Notes
Receiver Event Timing, 3.0 Vdc, -40 to +85
PKDET Decay Time Constant t
PRATE Interval t
Turn On to Receive t
RX to Sleep t
Sleep to RX t
AGC Hold-In t
PKDET Attack Time Constant t
AGC Engage t
PWIDTH RFA1 t
PWIDTH High (RFA1 & RFA2) t
PRATE Cycle t
PWIDTH RFA2 t
BBOUT-CMPIN Time Constant t
LPF 3 dB Bandwidth f
LPF Group Delay t
Page 9
Pin Descriptions
Pin Name Description
1 GND1 GND1 is the RF ground pin. GND2 and GND3 should be connected to GND1 by short, low-inductance traces.
2 VCC1
3 AGCCAP
4 PKDET
VCC1 is the positive supply voltage pin for the receiver base-band circuitry. VCC1 must be bypassed by an RF capacitor, which may be shared with VCC2. See the description of VCC2 (Pin 16) for additional information.
This pin controls the AGC reset operation. A capacitor between this pin and ground sets the minimum time the AGC will hold-in once it is engaged. The hold-in time is set to avoid AGC chattering. For a given hold-in time t the capacitor value C
C
= 19.1* t
AGC
A ±10% ceramic capacitor should be used at this pin. The value of C tween t
and 2.65* t
AGH
is:
AGC
, where t
AGH
, depending on operating voltage, temperature, etc. The hold-in time is chosen to allow
AGH
is in µs and C
AGH
AGC
is in pF
given above provides a hold-in time be
AGC
AGH
-
the AGC to ride through the longest run of zero bits that can occur in a received data stream. The AGC hold-in time can be greater than the peak detector decay time, as discussed below. However, the AGC hold-in time should not be set too long, or the receiver will be slow in returning to full sensitivity once the AGC is engaged by noise or interference. The use of AGC is optional when using OOK modulation with data pulses of at least 30 µs. AGC operation can be defeated by connecting this pin to Vcc. Active or latched AGC operation is required for ASK modulation and/or for data pulses of less than 30 µs. The AGC can be latched on once engaged by connect ing a 150 K resistor between this pin and ground, instead of a capacitor. AGC operation depends on a functioning peak detector, as discussed below. The AGC capacitor is discharged in the receiver power-down (sleep) mode.
This pin controls the peak detector operation. A capacitor between this pin and ground sets the peak detector at tack and decay times, which have a fixed 1:1000 ratio. For most applications, these time constants should be co ordinated with the base-band time constant. For a given base-band capacitor C
C
PKD
= 0.33* C
BBO
, where C
BBO
and C
PKD
are in pF
A ±10% ceramic capacitor should be used at this pin. This time constant will vary between t
, the capacitor value C
BBO
and 1.5* t
PKA
PKD
PKA
is:
with variations in supply voltage, temperature, etc. The capacitor is driven from a 200 ohm “attack” source, and decays through a 200 K load. The peak detector is used to drive the “dB-below-peak” data slicer and the AGC release function. The AGC hold-in time can be extended beyond the peak detector decay time with the AGC capacitor, as discussed above. Where low data rates and OOK modulation are used, the “dB-below-peak” data slicer and the AGC are optional. In this case, the PKDET pin and the THLD2 pin can be left unconnected, and the AGC pin can be connected to Vcc to reduce the number of external components needed. The peak detector capacitor is dis­charged in the receiver power-down (sleep) mode.
,
-
-
-
BBOUT is the receiver base-band output pin. This pin drives the CMPIN pin through a coupling capacitor C internal data slicer operation. The time constant t
t
= 0.064*C
BBC
BBO
, where t
is in µs and C
BBC
BBC
A ±10% ceramic capacitor should be used between BBOUT and CMPIN. The time constant can vary between t and 1.8*t
with variations in supply voltage, temperature, etc. The optimum time constant in a given circum
BBC
stance will depend on the data rate, data run length, and other factors as discussed in the ASH Transceiver De signer’s Guide. A common criteria is to set the time constant for no more than a 20% voltage droop during SP For this case:
5 BBOUT
= 70*SP
BBO
The output from this pin can also be used to drive an external data recovery process (DSP, etc.). The nominal out
, where SP
MAX
is the maximum signal pulse width in µs and C
MAX
C
put impedance of this pin is 1 K. When the receiver RF amplifiers are operating at a 50%-50% duty cycle, the BBOUT signal changes about 10 mV/dB, with a peak-to-peak signal level of up to 685 mV. For lower duty cycles, the mV/dB slope and peak-to-peak signal level are proportionately less. The signal at BBOUT is riding on a
1.1 Vdc value that varies somewhat with supply voltage and temperature, so it should be coupled through a ca pacitor to an external load. A load impedance of 50 K to 500 K in parallel with no more than 10 pF is recom mended. When an external data recovery process is used with AGC, BBOUT must be coupled to the external data recovery process and CMPIN by separate series coupling capacitors. The AGC reset function is driven by the signal applied to CMPIN. When the receiver is in power-down (sleep) mode, the output impedance of this pin becomes very high, preserving the charge on the coupling capacitor.
6 CMPIN
This pin is the input to the internal data slicers. It is driven from BBOUT through a coupling capacitor. The input impedance of this pin is 70 K to 100 K.
RXDATA is the receiver data output pin. This pin will drive a 10 pF, 500 K parallel load. The peak current available from this pin increases with the receiver low-pass filter cutoff frequency. In the power-down (sleep) mode, this pin
7 RXDATA
becomes high impedance. If required, a 1000 K pull-up or pull-down resistor can be used to establish a definite logic state when this pin is high impedance. If a pull-up resistor is used, the positive supply end should be con nected to a voltage no greater than Vcc + 200 mV.
8 NC This pin may be left unconnected or may be grounded.
for this connection is:
is in pF
BBO
BBO
is in pF
BBO
-
-
MAX
-
for
BBC
-
.
-
-
9
Page 10
Pin Name Description
This pin is the receiver low-pass filter bandwidth adjust. The filter bandwidth is set by a resistor R pin and ground. The resistor value can range from 330 K to 820 ohms, providing a filter 3 dB bandwidth f
4.5 kHz to 1.8 MHz. The resistor value is determined by:
9 LPFADJ
= 1445/ f
LPF
A ±5% resistor should be used to set the filter bandwidth. This will providea3dBfilter bandwidth between f and 1.3* f
with variations in supply voltage, temperature, etc. The filter provides a three-pole, 0.05 degree
LPF
, where R
LPF
is in kilohms, and f
LPF
LPF
is in kHz
R
equiripple phase response. The peak drive current available from RXDATA increases in proportion to the filter bandwidth setting.
10 GND2 GND2 is an IC ground pin. It should be connected to GND1 by a short, low inductance trace.
RREF is the external reference resistor pin. A 100 K reference resistor is connected between this pin and ground. A ±1% resistor tolerance is recommended. It is important to keep the total capacitance between ground, Vcc and
11 RREF
this node to less than 5 pF to maintain current source stability. If THLD1 and/or THDL2 are connected to RREF through resistor values less that 1.5 K, their node capacitance must be added to the RREF node capacitance and the total should not exceed 5 pF.
THLD2 is the “dB-below-peak” data slicer (DS2) threshold adjust pin. The threshold is set bya0to200Kresistor
between this pin and RREF. Increasing the value of the resistor decreases the threshold below the peak de
R
TH2
tector value (increases difference) from 0 to 120 mV. For most applications, this threshold should be set at 6 dB
12 THLD2
below peak, or 60 mV for a 50%-50% RF amplifier duty cycle. The value of the THLD2 resistor is given by:
R
= 1.67*V, where R
TH2
is in kilohms and the threshold V is in mV
TH2
A ±1% resistor tolerance is recommended for the THLD2 resistor. Leaving the THLD2 pin open disables the dB-below-peak data slicer operation.
The THLD1 pin sets the threshold for the standard data slicer (DS1) through a resistor R
TH1
old is increased by increasing the resistor value. Connecting this pin directly to RREF provides zero threshold. The value of the resistor depends on whether THLD2 is used. For the case that THLD2 is not used, the accept able range for the resistor is 0 to 100 K, providing a THLD1 range of 0 to 90 mV. The resistor value is given by:
13 THLD1
= 1.11*V, where R
TH1
For the case that THLD2 is used, the acceptable range for the THLD1 resistor is 0 to 200 K, again providing a
is in kilohms and the threshold V is in mV
TH1
R
THLD1 range of 0 to 90 mV. The resistor value is given by:
R
= 2.22*V, where R
TH1
is in kilohms and the threshold V is in mV
TH1
A ±1% resistor tolerance is recommended for the THLD1 resistor. Note that a non-zero DS1 threshold is required for proper AGC operation.
between this
LPF
LPF
from
LPF
to RREF. The thresh
-
-
-
14 PRATE
15 PWIDTH
16 VCC2
The interval between the falling edge of an ON pulse to the first RF amplifier and the rising edge of the next ON pulse to the first RF amplifier t justed between 0.1 and 5 µs with a resistor in the range of 51 K to 2000 K. The value of R
R
= 404* t
PR
+ 10.5, where t
PRI
is set by a resistor RPRbetween this pin and ground. The interval t
PRI
is in µs, and RPRis in kilohms
PRI
PR
PRI
is given by:
can be ad
A ±5% resistor value is recommended. When the PWIDTH pin is connected to Vcc througha1Mresistor, the RF amplifiers operate at a nominal 50%-50% duty cycle, facilitating high data rate operation. In this case, the period t
from start-to-start of ON pulses to the first RF amplifier is controlled by the PRATE resistor over a range of 0.1
PRC
to 1.1 µs using a resistor of 11 K to 220 K. In this case the value of R
R
= 198* t
PR
- 8.51, where t
PRC
is in µs and RPRis in kilohms
PRC
is given by:
PR
A ±5% resistor value should also be used in this case. Please refer to the ASH Transceiver Designer’s Guide for additional amplifier duty cycle information. It is important to keep the total capacitance between ground, Vcc and this pin to less than 5 pF to maintain stability.
The PWIDTH pin sets the width of the ON pulse to the first RF amplifier t pulse width to the second RF amplifier t pulse width t value of R
can be adjusted between 0.55 and 1 µs with a resistor value in the range of 200 K to 390 K. The
PW1
is given by:
PW
R
PW
= 404* t
- 18.6, where t
PW1
is set at 1.1 times the pulse width to the first RF amplifier). The ON
PW2
is in µs and RPWis in kilohms
PW1
A ±5% resistor value is recommended. When this pin is connected to Vcc througha1Mresistor, the RF amplifi
with a resistor RPWto ground (the ON
PW1
­ers operate at a nominal 50%-50% duty cycle, facilitating high data rate operation. In this case, the RF amplifier ON times are controlled by the PRATE resistor as described above. It is important to keep the total capacitance between ground, Vcc and this node to less than 5 pF to maintain stability. When using the high data rate operation with the sleep mode, connect the 1 M resistor between this pin and CNTRL1 (Pin 17), so this pin is low in the sleep mode.
VCC2 is the positive supply voltage pin for the receiver RF section. This pin must be bypassed with an RF capaci tor, which may be shared with VCC1. VCC2 must also be bypassed witha1to10µFtantalum or electrolytic ca
-
pacitor.
-
-
10
Page 11
Pin Name Description
CNTRL1 and CNTRL0 select the receiver modes. CNTRL1 and CNTRL0 both high place the unit in the receive mode. CNTRL1 and CNTRL0 both low place the unit in the power-down (sleep) mode. CNTRL1 is a
17 CNTRL1
high-impedance input (CMOS compatible). An input voltage of 0 to 300 mV is interpreted as a logic low. An input voltage of Vcc - 300 mV or greater is interpreted as a logic high. An input voltage greater than Vcc + 200 mV should not be applied to this pin. A logic high requires a maximum source current of 40 µA. Sleep mode requires a maximum sink current of 1 µA. This pin must be held at a logic level; it cannot be left unconnected.
CNTRL0 is used with CNTRL1 to control the receiver modes. CNTRL0 is a high-impedance input (CMOS compat ible). An input voltage of 0 to 300 mV is interpreted as a logic low. An input voltage of Vcc - 300 mV or greater is
18 CNTRL0
interpreted as a logic high. An input voltage greater than Vcc + 200 mV should not be applied to this pin. A logic high requires a maximum source current of 40 µA. Sleep mode requires a maximum sink current of 1 µA. This pin must be held at a logic level; it cannot be left unconnected.
19 GND3 GND3 is an IC ground pin. It should be connected to GND1 by a short, low inductance trace.
RFIO is the receiver RF input pin. This pin is connected directly to the SAW filter transducer. Antennas presenting an impedance in the range of 35 to 72 ohms resistive can be satisfactorily matched to this pin with a series match
20 RFIO
ing coil and a shunt matching/ESD protection coil. Other antenna impedances can be matched using two or three components. For some impedances, two inductors and a capacitor will be required. A DC path from RFIO to ground is required for ESD protection.
-
-
Note: Specifications subject to change without notice.
S M -2 0 L P C B P a d L a y o u t
.1 9 7 5
.1 7 2 5
.4 6 0 0
0.000
.1 4 0
0.000
D im ensions in inches
.2 1 2 5
.2 3 7 5
.3 8 2 5
.3 5 7 5
.3 1 7 5
.2 7 7 5
.2 3 7 5
.1 9 7 5
.1 5 7 5
.1 1 7 5 .1 0 2 5
.0 7 7 5
.2 7 0
.4 1 0
file: rx5000v.vp, 2003.07.17 rev
11
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