Datasheet RX1214B130Y Datasheet (Philips)

Page 1
DISCRETE SEMICONDUCTORS
DATA SH EET
RX1214B80W; RX1214B130Y
NPN microwave power transistors
Product specification Supersedes data of November 1994
1997 Feb 14
Page 2
NPN microwave power transistors RX1214B80W; RX1214B130Y
FEATURES
Suitable for short and medium pulse applications up to 1 ms pulse width, 10% duty factor
Diffused emitter ballasting resistors improve ruggedness
Interdigitated emitter-base structure provides high emitter efficiency
Gold metallization with barrier realizes very stable characteristics and excellent lifetime
Multicell geometry improves power sharing and reduces thermal resistance
Internal input and output prematching networks allow an easier design of circuits.
APPLICATIONS
Common-base class C broadband pulsed power amplifiers for radar applications in the 1.2 to 1.4 GHz band. Also suitable for long pulse, heavy duty operation within this band.
DESCRIPTION
NPN silicon planar epitaxial microwave power transistor in a SOT439A metal ceramic flange package, with base connected to flange.
QUICK REFERENCE DATA
Microwave performance up to T
=25°C in a common-base class C
mb
narrowband amplifier.
MODE OF
OPERATION
Class C RX1214B80W
Class C RX1214B130Y
CONDITIONS
= 500 µs;
t
p
δ = 10%
= 150 µs;
t
p
δ =5%
f
(GHz)
1.2 to
1.4
1.2 to
1.4
PINNING - SOT439A
PIN DESCRIPTION
1 collector 2 emitter 3 base connected to flange
handbook, 4 columns
Top view
1
2
Fig.1 Simplified outline and symbol.
V
(V)
CC
P
(W)
G
L
p
(dB)
40 80 7 35
50 130 7 35
c
b
33
e
MAM045
η
(%)
C
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO slab is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.
1997 Feb 14 2
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NPN microwave power transistors RX1214B80W; RX1214B130Y
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
CES
V
EBO
I
C
P
tot
T
stg
T
j
T
sld
Note
1. Up to 0.2 mm from ceramic.
collector-base voltage open emitter 65 V collector-emitter voltage open base 15 V collector-emitter voltage RBE=0Ω−60 V emitter-base voltage open collector 3V collector current (DC) tp≤ 150 µs; δ≤5% 9A total power dissipation Tmb<75°C; tp≤ 150 µs; δ≤5% 280 W storage temperature 65 +200 °C operating junction temperature 200 °C soldering temperature t 10 s; note 1 235 °C
Tmb (
MGA256
o
C)
300
handbook, halfpage
P
tot
(W)
200
100
0
50 50
tp= 150µs; δ = 5%; P
tot max
150
= 280 W.
Fig.2 Maximum power dissipation derating as a
function of mounting base temperature.
250
1997 Feb 14 3
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NPN microwave power transistors RX1214B80W; RX1214B130Y
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MAX. UNIT
R
th j-mb
R
th mb-h
Z
th j-h
Notes
1. See
“Mounting recommendations in the General part of handbook SC19a”
2. Equivalent thermal impedance under pulsed microwave operating conditions.
CHARACTERISTICS
=25°C unless otherwise specified.
T
mb
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
I
CBO
I
EBO
V
(BR)CES
thermal resistance from junction to mounting base Tj= 120 °C 1.75 K/W thermal resistance from mounting base to heatsink note 1 0.2 K/W thermal impedance from junction to heatsink tp= 150 µs; δ = 5%;
0.4 K/W
notes 1 and 2
.
collector cut-off current IE= 0; VCB=50V 6mA emitter cut-off current IC= 0; VEB= 1.5 V 0.6 mA collector-emitter breakdown voltage IC= 60 mA; VBE=0 60 V
APPLICATION INFORMATION
Microwave performance up to T
MODE OF
OPERATION
Class C t
CONDITIONS
= 150 µs; δ = 5% 1.2 to 1.4 50 130; typ. 140 7; typ. 7.5 35; typ. 39
p
t
= 500 µs; δ = 10% 1.2 to 1.4 40 typ. 80 typ. 8.5 typ. 40
p
=25°C in a common-base test circuit as shown in Fig.3.
mb
f
(GHz)
V
(V)
CC
P
(W)
L
G
(dB)
p
η
C
(%)
List of components (see Fig.3)
COMPONENT DESCRIPTION VALUE DIMENSIONS CATALOGUE NO.
L1 0.5 mm copper wire total length = 15 mm C1 trimmer capacitor 0.6 5 pF Tekelec, ref AT3-7271SL C2 chip capacitor C3 tantalum capacitor 10 µF, 50 V C4 feedthrough bypass capacitor Erie, ref.1250-003
1997 Feb 14 4
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NPN microwave power transistors RX1214B80W; RX1214B130Y
handbook, full pagewidth
handbook, full pagewidth
40 mm
30 mm 30 mm
40 mm
MBC725
C4
input
Substrate: Epsilam 10. Thickness: 0.635 mm. Permittivity: εr= 10.
Fig.3 Broadband test circuit.
1997 Feb 14 5
C3
L1
output
C2
C1
MBC726
10.3
Page 6
NPN microwave power transistors RX1214B80W; RX1214B130Y
10
handbook, halfpage
G
p
(dB)
9
8
7
6
5
1.1 1.2
Class C pulse operation; tp= 500 µs; δ = 5%. VCC= 50 V; PO= 130 W. Broadband test circuit as shown in Fig.3.
1.3 1.5
1.4
Fig.4 Power gain as a function of frequency.
MGA258
f (GHz)
45
handbook, halfpage
η
C
(%)
43
41
39
37
35
1.1 1.2 1.3 1.5
Class C pulse operation; tp= 500 µs; δ = 5%. VCC= 50 V; PO= 130 W. Broadband test circuit as shown in Fig.3.
Fig.5 Collector efficiency as a function
of frequency.
MGA257
1.4 f (GHz)
1997 Feb 14 6
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NPN microwave power transistors RX1214B80W; RX1214B130Y
1
handbook, full pagewidth
0.5
2
VCC= 50 V; ZO=10Ω; P
Fig.6 Input impedance as a function of frequency, associated with optimum load impedance.
handbook, full pagewidth
OUT
+
j
j
= 130 W.
0.2
0
0.2
0.5
0.5
1.2 GHz
Z
i
1.3
0.5 10.2 1052
1.4 GHz
1
1
5
10
10
5
2
MGA255
2
VCC= 50 V; ZO=10Ω; P
OUT
+ j
– j
= 130 W.
0.2
1.4 GHz
0
0.2
0.5
Z
L
1.3
0.5 10.2 1052
1.2 GHz
Fig.7 Load impedance as a function of frequency, associated with optimum input impedance.
1997 Feb 14 7
5
10
10
5
2
1
MGA254
Page 8
NPN microwave power transistors RX1214B80W; RX1214B130Y
PACKAGE OUTLINE
handbook, full pagewidth
3.3
2.9
0.15 max
3.3
seating plane
8.25
12.85 max
23 max
3.7
max
16.5
6
max
1.6 max
3
9.85 max
MBC881
2.7 min
10.3
10.0
2.7 min
1
2
Dimensions in mm. Torque on nut: max 0.4 Nm. Recommended screw: M3. Recommended pitch for mounting screw: 19 mm.
Fig.8 SOT439A.
1997 Feb 14 8
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NPN microwave power transistors RX1214B80W; RX1214B130Y
DEFINITIONS
Data Sheet Status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1997 Feb 14 9
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NPN microwave power transistors RX1214B80W; RX1214B130Y
NOTES
1997 Feb 14 10
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NPN microwave power transistors RX1214B80W; RX1214B130Y
NOTES
1997 Feb 14 11
Page 12
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Printed in The Netherlands 127147/00/02/pp12 Date of release: 1997 Feb 14 Document order number: 9397 750 01739
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