Multi-Phase PWM Controller for CPU Core Power Supply
General Description
RT9245 is a multi-pha se buck DC/DC controller integrated
with all control functions for Intel
VRD10.X-complia nt. The RT9245 could be operated with
2, 3 or 4 buck switching stages operating in interleaved
phase set automatically. The multiphase architecture
provides high output current while maintaining low power
dissipation on power devices and low stress on in put and
output cap acitors. The high equivalent operating frequency
also reduces the component dimension and the output
voltage ripple in load tra nsient.
RT9245 implements both voltage and current loops to
achieve good regulation, response and power stage
thermal balance.
RT9245 a pplies the DCR sensing technology newly . The
RT9245 extracts the ESR of output inductor as sense
component to deliver a precise load line regulation and
good thermal balance for next generation processor
a pplication.
®
GHz CPU which is
Features
zz
Multi-Phase Power Conversion with Automatic
z
zz
Phase Selection
zz
z 6-bits VRD10.x DAC Output with Active Droop
zz
Compensation for Fast Load Transient
zz
z Smooth V
zz
zz
z Power Stage Thermal Balance by DCR Current
zz
Transition at VID Jump
CORE
Sense
zz
z Hiccup Mode Over-Current Protection
zz
zz
z Programmable Switching Frequency (50kHz to
zz
400kHz per Phase), Under-V oltage Lockout a nd SoftStart
zz
z High Ripple Frequency Times Channel Number
zz
zz
z 28-TSSOP Package
zz
zz
z RoHS Compliant and 100% Lead (Pb)-Free
zz
Applications
®
z Intel
z Low Output V oltage, High Current DC-DC Converters
z V oltage Regulator Modules
Processors V oltage Regulator : VR D10.x
Current sense setting, droop tuning, V
initial offset
CORE
and over current protection are independent on
compensation circuit of voltage loop. The feature greatly
facilitates the flexibility of CPU power supply design a nd
tuning. The DAC output of R T9245 supports VRD10.x with
6-bit VID input, precise offset value & smooth V
transient at VID jump. The IC monitors the V
CORE
CORE
voltage
for PGOOD and over-voltage protection. Soft-start, overcurrent protection and progra mmable under-voltage lockout
are also provided to assure the safety of microprocessor
and power system. The R T9245 comes to a small footprint
package TSSOP-28.
Ordering Information
RT9245
Package Type
C : TSSOP-28
Operating Temperature Range
P : Pb Free with Commercial Standard
G : Green (Halogen Free with Commer cial Standard)
Pin Configurations
(TOP VIEW)
VID4
VID3
VID2
VID1
VID0
VID125
SGND
FB
COMP
PGOOD
DVD
SS
RT
VOSS
2
3
4
524
6
7
821
9
10
1118
12
13
14
TSSOP-28
Note :
RichTek Pb-free and Green products are :
`RoHS compliant and compatible with the current require ments of IPC/JEDEC J-STD-020.
`Suitable for use in SnPb or Pb-free soldering processes.
`100% matte tin (Sn) plating.
DAC voltage identification inputs for VRD10.x. These pins
are internally pulled to 1.2V if left open.
SGND (Pin 7)
V
differential sense negative input.
CORE
FB (Pin 8)
Inverting input of the internal error a mplifier.
COMP (Pin 9)
Output of the error amplifier and input of the PWM
comparator.
PGOOD (Pin 10)
Power good open-drain output.
D V D (Pin 1 1)
Programma ble power UVLO detection input. Tri p threshold
= 1.2V at V
SS (Pin 12)
Connect this SS pin to GND with a capacitor to set the
soft-start time interval. Pulling this pin below 1V (ramp
valley of sawtooth wave in pulse width modulator) would
make all PWMs low , turn on low side MOSFET s, a nd turn
off high side MOSFETs.
RT (Pin 13)
Switching frequency setting. Connect this pin to GN D with
a resistor to set the frequency.
DVD
rising.
IMAX (Pin 15)
Program mable over currert setting.
CSN (Pin 16)
Current sense negative input of all channels.
NC (Pin 17)
No Connection.
ADJ (Pin 18)
Current sense output for a ctive droop a djust. Conne ct a
resistor from this pin to GND to set the load droop.
PWM outputs for ea ch driven channel. Connect these pins
to the PWM input of the MOSFET driver. For systems
which use 3 channels, connect PWM4 high. T wo cha nnel
systems connect PWM3 high.
VCC (Pin 28)
IC power supply . Conne ct this pin to a 5V supply.
VOSS (Pin 14)
V
initial value offset. Connect this pin to GND with a
CORE
resistor to set the negative offset value. Connect this pin
to VCC to set positive offset value.
z Supply Voltage, V
z Input, Output or I/O V oltage---------------------------------------------------------------------------------- GND − 0.3V to V
z Package Thermal Resista nce
z Junction T emperature------------------------------------------------------------------------------------------ 150°C
z Lead T e mperature (Soldering, 10 sec.)-------------------------------------------------------------------- 260°C
z Storage T emperature Range --------------------------------------------------------------------------------- −65°C to 150°C
z ESD Susceptibility (Note 2)
HBM (Human Body Mode) ----------------------------------------------------------------------------------- 2kV
MM (Ma chine Mode)------------------------------------------------------------------------------------------- 200V
Recommended Operating Conditions (Note 3)
z Supply Voltage, V
z Ambient T emperature Range--------------------------------------------------------------------------------- 0°C to 70°C
z Junction T emperature Range--------------------------------------------------------------------------------- 0°C to 125°C
Parameter Symbol Test Conditions Min Typ Max Units
V
Supply Current
CC
Nominal Supply Current
Power-On Reset
I
CC
PWM 1,2,3,4 Open
--
12 16 mA
CC
+ 0.3V
POR Threshold
Hysteresis
V
Threshold
DVD
Trip (Low to High)
Hysteresis
V
CCRTH
V
CCHYS
V
DVDTP
V
DVDHYS
VCC Rising
0.2 0.5 -- V
Enable 1.1 1.2 1.3 V
--50--mV
4.0 4.2 4.5 V
Oscillator
Free Running Frequency
Frequency Adjustable Range
Ramp Amplitude
Ramp Valley
f
R
OSC
f
OSC_ADJ
ΔV
V
RV
RRT = 32kΩ
OSC
= 32kΩ
RT
50 -- 400 kHz
0.7 1.0 -- V
170 200 230 kHz
-- 1.9 -- V
Maximum On-Time of Each Channel 62 66 75 %
RT Pin Voltage
V
R
RT
= 32kΩ
RT
1.4 1.60 1.8 V
Reference and DAC
DACOUT Vol ta g e Accuracy
DAC (VID0-VID125) Input Low
DAC (VID0-VID125) Input High
DAC (VID0-VID125) Bias Current
VOSS Pin Voltage
ΔV
DAC
V
ILDAC
V
IHDAC
I
BIAS_DAC
R
V
VOSS
V
≥ 1V
DAC
< 1V
V
DAC
-- -- 0.4 V
0.8 -- -- V
25 50 75
= 100kΩ
VOSS
−1
−10
1.5 1.65 1.8 V
-- +1 %
-- +10 mV
μA
To be continued
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RT9245
Parameter Symbol Test Conditions Min Typ Max Units
Error Amplifier
DC Gain -- 85 -- dB
Gain-Bandwidth Product GBW -- 10 -- MHz
Slew Rate SR COMP = 10pF -- 3 --
V/μs
Current Sense GM Amplifier
CSN Full Scale Source Current
I
ISPFSS
CSN Current for OCP 150 -- --
100 -- --
μA
μA
Protection
SS Current
Over-Voltage Trip (VSEN/DACOUT)
IMAX Voltage
V
I
SS
Δ
OVT
R
V
IMAX
SS
IMAX
= 1V
130 140 150 %
= 32k
8 13 18
μA
1.4 1.60 1.8 V
Power Good
Output Low Voltage
Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are
for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for
extended periods may remain possibility to affect device reliability.
Note 2. Devices are ESD sensitive. Handling precaution recommended.
Note 3. The device is not guaranteed to function outside its operating conditions.
RT9245 is a multi-pha se DC/DC controller that precisely
regulates CPU core voltage and bala nces the current of
different power channels. The converter consisting of
RT9245 and its companion MOSFET driver RT9603/
RT9603A provides high quality CPUpower and all
protection functions to meet the requirement of modern
VRM.
RT9245
Load Droop
The sensed power channel current signals regulate the
reference of DAC to form an output voltage droop
proportional to the load current. The droop or so call “active
voltage positioning” can reduce the output voltage ripple
at load tran sient and the LC filter size.
Fault Detection
Voltage Control
RT9245 senses the CPU VCORE by SGND pin to sense
the return of CPU to minimize the voltage drop on PCB
trace at heavy load. OVP is sensed at FB pin. The internal
high accura cy VID DAC provides the reference voltage fo r
VRD10.X compliance. Control loop consists of error
amplifier, multi-phase pulse width modulator, driver and
power components. As conventional voltage mode PWM
controller, the output voltage is locked at the VREF of
error amplif ier a nd the error sign al is used as the control
signal of pulse width modulator. The PWM signals of
different channels are generated by comparison of EA
output and split-phase sawtooth wave. Power stage
trans forms VIN to output by PWM signal on-time ratio.
Current Balance
RT9245 senses the inductor current via inductor's DCR
for channel current balance and droop tuning. The
differential sensing GM a mplif ier converts the voltage on
the sense component (can be a sense resistor or the
DCR of the inductor) to current signal into internal balance
circuit.
The current balance circuit sums a nd averages the current
signals and then produces the bala ncing signals injected
to pulse width modulator. If the current of some power
channel is larger than average, the balancing signal
reduces that channels pulse width to keep current bala nce.
The use of single GM a mplifier vi a time sharing technique
to sense all inductor currents can reduce the of fset errors
and linearity variation between GMs. Thus it can greatly
improve signal processing especially when dealing with
such small signal a s voltage drop a cross DCR.
The chip detects FB for over voltage and power good
detection. The “hiccup mode” operation of over current
protection is adopted to reduce the short circuit current.
The in-rush current at the start up is suppressed by the
soft start circuit through clamping the pulse width and
output voltage.
Phase Setting and Converter Start Up
RT9245 interfac es with companion MOSFET drivers (like
RT9603, RT9602 series) for correct converter initialization.
The tri-state PWM output (high, low and high impeda nce)
senses its interface voltage when IC POR a cts (both VCC
and D V D trip). The channel is ena bled if the pin voltage is
1.2V less than VCC. Tie the PWM to VCC and the
corresponding current sense pins to GND or left float if
the channel is unused. For example, for 3-Channel
a pplication, connect PWM4 high.
Current Sensing Setting
RT9245 senses the current flowing through inductor via
its DCR for cha nnel current balance a nd droop tuning. The
differential sensing GM a mplifier converts the voltage on
the sense component (can be a sense resistor or the
DCR of the inductor) to current signal into internal circuit
(see Figure 1).
L
DCR
GMx
L
R
+
-
R
CSN
V
I IDCR VCR
XLC
C
=×=×=
R
CSN
DCR
C
I
x
Figure 1. Current Sense Circuit
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11
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RT9245
Figure 2 is the test circuit for GM. We apply test signal at
GM inputs and observe its signal process output at ADJ
pin. Figure 3 shows the variation of signal processing of
all channels. We observe zero offsets and good linearity
between phases.
GMx
I
x
L
V
+
V
-
ESR
CSP
CSN
R
CSN
1k
DCR
V
X
Figure 2. The T est Circuit of G M
GM
300
250
200
(mV)
150
ADJ
V
100
50
0
0255075100125150
Vx ( m V)
Figure 3. The Linearity of GMx
Figure 4 shows the time sharing technique of GM amplifier .
W e apply test signal at pha se 4 a nd observe the waveforms
at both pins of GM amplifier. The waveforms show time
sharing mechanism and the perfomance of GM to hold
both input pins equal when the shared time is on.
Time Sharing of GM
CH1:(2V/Div)
CH2:(50mV/Div)
CH3:(50mV/Div)
PWM3
V
CSP4
V
CSP4
V
CSN
and
V
CSN
Time (1μs/Div)
Figure 4
Over Current Protection
RT9245 uses an external resistor R
to set a
IMAX
programmable over current trip point. OCP comparator
compares each inductor current with this reference current.
RT9245 uses hiccup mode to eliminate fault detection of
OCP or reduce output current when output is shorted to
ground.
L
×⇔×
R
+
-
DCRI
COMMON
1/3 I
1/2 I
X
IMAX
V
1×
IMAX
R
2
IMAX
1
3
OCP Comparator
Figure 5. Over Current Comparator
Over Current Protection
CH1:(5V/Div)
CH2:(5V/Div)
PWM
12
V
SS
Time (25ms/Div)
Figure 6. The Over Current Protection in the soft start
interval
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RT9245
Over Current Protection
CH1:(5V/Div)
CH2:(5V/Div)
PWM
V
SS
Time (25ms/Div)
Figure 7. Over Current Protection at steady state
Current Ratio Setting
Thus if
Then
V××
C
L
DCR
=
R2
+
R2R1
C(R1//R2)
×=
IDCR
L
With internal current balance function,this phase would
share (R1+R2)/R2 times current than other phases.
Figure 9 &10 show different settings for the power stages.
Figure 1 1 shows the performance of current ratio compared
with conventional current balance function in Figure 12.
Figure 9. GM4 Setting for current ratio function
Figure 8. Application circuit f or current ratio setting
For some case with preferable current ratio instead of
current balance, the corresponding technique is provided.
Due to different physical environment of ea ch channel, it
is necessary to slightly adjust current loading between
channels. Figure 8 shows the a pplication circuit of GM f or
current ratio requirement. Applying KVL along L+DCR
branch a nd R1+C//R2 branch :
dI
L
L
dt
dV
CR
1
VFor
+=
dt
R2
=
C
+
V
(RIDCR
1L
R
RR
+
21C
V
R
2
RR
21
dV
C
2
C
×
C
dt
V)
++=×+
C
C
IDCR
L
Look for its corresponding conditions :
dI
L
L
dt
L
Let
DCR
L
C(R1//R2)
×=
dI
DCRC(R1//R2)IDCR
L
dt
IDCR
×+×××=×+
L
Figure 10. GM1~3 Setting f or current ratio function
35
30
25
20
(A)
L
I
15
10
5
0
0 153045607590
Current R atio Function
I
(A)
OUT
I
L4
I
L3
I
L2
I
L1
Figure 1 1
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RT9245
30
I
L3
I
25
20
15
(A)
L
I
10
5
0
0 20406080100
I
(A)
OUT
L4
I
L2
Figure 12
Current Balance Function
GMx
Ix
L
ESR
V
CSP
+
V
CSN
-
R
CSN2
R
DCR
C
CSN1
Assume the negative inductor valley current is −5A at no
load, then for
R
= 330Ω, R
CSN1
I
L1
1.3V5A 1m
R330
CSN2
R
CSN2
Choose R
−×Ω
≥
≤ 85.8kΩ
CSN2
= 160Ω, V
ADJ
Ω
= 82kΩ
OUT
= 1.300
Load Line without dead zone at light loads
1.31
1.3
1.29
1.28
(V)
1.27
CORE
V
1.26
1.25
1.24
1.23
0510152025
I
(A)
OUT
R
R
CSN2
CSN2
open
= 82k
Figure 14
Figure13. Application circuit of GM
For load line design, with a pplication circuit in Figure 13,
it can eliminate the dead zone of load line at light loads.
V
CSP
= V
+IL x DCR
OUT
if GM holds input voltages equal, then
V
For the lack of sinking capability of GM, R
= V
CSP
I
X
=+
=++
CSN
V
=+
RR
CSN2CSN1
VIDCR
OUTL
V
OUT
RR R
CSN2CSN2CSN1
IDCR
CSN
+×
RR
CSN2CSN1
×
L
IDCR
×
L
IDCRIDCR
××
LL
should be
CSN2
small enough to compensate the negative inductor valley
current especially at light loads.
V
RR
IDCR
CSN
CSN2CSN1
×
L
≥
VID on the Fly
With external pull up resistors tied to VID pins, RT9245
converters different VID codes from CPU into output
voltage. Figure 12 and Figure 13 show the waveforms of
VID on the fly function.
VID on the Fly (Falling)
PWM
V
CORE
V
FB
CH3:(500mV/Div)
CH4:(1V/Div)
VID125
CH1:(5V/Div)
CH2:(500mV/Div)
V
= 1.500, I
DAC
OUT
= 5A
Time (25μs/Div)
Figure 15
14
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Page 15
RT9245
PWM
V
CORE
V
FB
VID125
VID on the Fly (Rising)
CH3:(500mV/Div)
CH4:(1V/Div)
V
= 1.500, I
DAC
RB1
= 5A
OUT
Time (25μs/Div)
Figure 16
1/4 I
VOSS
-
EA
+
CH1:(5V/Div)
CH2:(500mV/Div)
Voltage Offset Function
1.284
1.282
1.28
1.278
(V)
1.276
CORE
V
1.274
1.272
1.27
1.268
5060708090100110
R
(kٛ)
(kΩ)
OSS
Figure 18
PGOOD Waveform
CH1:(500mV/Div)
CH2:(5V/Div)
CH3:(5V/Div)
V
DAC-VADJ
Figure 17
Output V oltage Offset Function
To meet Intel's requirement of initial offset of load line,
RT9245 provides progra mmable initial offset function. With
an external resistor R
to set offset current I
and voltage source at V
VOSS
. One quart of I
VOSS
flows through
VOSS
OSS
pin
RB1. Error amplif ier would hold the inverting pin equal to
V
DAC-VADJ
V
DAL
. Thus output voltage is subtracted from
− V
for a consta nt offset voltage.
ADJ
PGOOD Function
T o indicate the condition of multipha se converter , RT9245
provides PGOOD sign al through an open drain connection.
The waveforms of PGOOD function are shown in Figure
15.
V
CORE
PGOOD
V
SS
Time (10ms/Div)
Figure 19
VDD
R
PGOOD
V
PGOOD
Figure 20. PGOOD Test Circuit
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RT9245
Error Amplifier Characteristic
For fast response of converter to meet stringent output
current transient response, R T9245 provides large slew
rate capa bility and high gain-bandwidth perf ormance.
EA Falling Slew Rate
V
FB
V
COMP
CH1:(500mV/Div)
CH2:(2V/Div)
Time (250ns/Div)
Figure 21. EA Rising T ra nsient with 10pF Loa ding; Slew
Rate=10V/us
EA Rising Slew Rate
V
FB
V
COMP
Time (250ns/Div)
CH1:(500mV/Div)
CH2:(2V/Div)
Figure 22. EA Falling T ra nsient with 10pF Loading;
Slew Rate=8V/us
4.7k
4.7k
B
-
EA
+
V
REF
A
0dB
180°
Figure 23. Gain-Ba ndwidth Mea surement by signal A
divided by signal B
Figure 24. EA Frequency Response with closed loop gain set at 0db to observe gain-ba ndwidth product; -3dB at
10.86MHz
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16
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RT9245
Design Procedure Suggestion
a.Output filter pole and zero (Inductor, output capacitor
c.DAC offset voltage setting (VOSS pin & compen- sation
network resistor RB1).
Power Sequence & SS
D VD pin external resistor and SS pin ca p a citor .
1. Compensation Setting
a. Modulator Gain, Pole a nd Zero:
From the following formula:
Modulator Gain =VIN/V
where V
: ramp a mplitude of saw-tooth wave
RAMP
=12/2.4=5 (i.e 14dB)
RAMP
LC Filter Pole = = 1.45kHz and
ESR Zero =3.98kHz
b. EA Compensation Network:
Select R1 = 4.7k, R2 = 15k, C1 = 12nF, C2 = 68pF and
use the Type 2 compensation scheme shown in Figure
25. By calculation, the FZ = 0.88kHz, FP = 322kHz and
Middle Band Gain is 3.19 (i.e 10.07dB).
C2 68pF
C1
RB2
15k
RB1
4.7k
12nF
-
EA
+
PCB Layout
a.Kelvin sense for current sense GM a mplifier input.
b.Refer to layout guide for other items.
Voltage Loop Setting
Design Example
Given:
Apply for four pha se converter
VIN = 12V
V
= 1.5V
CORE
I
LOAD (MAX)
V
DROOP
= 100A
= 100mV at full load (1mΩ Load Line)
OCP trip point set at 40A for ea ch cha nnel (S/H)
DCR = 1mΩ of inductor at 25°C
L = 1.5μH
C
= 8000μF with 5mΩ equivalent ESR.
OUT
Figure 25. T ype 2 compensation network of EA
The bode plot of EA compensation is shown as Figure 26.
The bode plot of power stage is shown as Figure 27. The
total loop gain is in Figure 28.
3. Over-Current Protection Setting
Consider the temperature coefficient of copper
3900ppm/°C,
×
1
2
1
2
Let R
V
IMAX
R
IMAX
1.690V
R
IMAX
= 14kΩ
IMAX
1
3
3
×⇔×
R
1
×⇔×
DCRI
L
COMMON
1.39m40A
330
Ω×
Ω
4. Soft-Start Capacitor Selection
For most application cases, 0.1μF is a good engineering
value.
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RT9245
0dB
-180°
0dB
-180°
Figure 26. The Frequency Response of the Compensator Network
18
Figure 27. The Frequency Response of Power Stage
DS9245-06 March 2007www.richtek.com
Page 19
0dB
-180°
RT9245
Figure 28. The Loop Gain of Converter
Layout Guide
Place the high-power switching components first, a nd separate them from sensitive nodes.
1. Most critical path: the current sense circuit is the most sensitive part of the converter. The current sense
resistors tied to CSP1,2,3,4 and CSN should be located not more than 0.5 inch from the IC and away from
the noise switching nodes. The PCB trace of sense nodes should be parallel and as short as possible.
Kelvin connection of the sense component (additional sense resistor or Inductor DCR) ensures the accurate
stable current sensing.
Keep well Kelvin sense to ensure the stable operation!
2. Switching ripple current path:
a. Input ca pa citor to high side MOSFET.
b. Low side MOSFET to output ca pa citor.
c. The return path of input and output ca p a citor .
d. Separate the power and signal GND.
e. The switching nodes (the connection node of high/low side MOSFET a nd inductor) is the most noisy points.
Keep them away from sensitive small-signal node.
f. Reduce parasitic R, L by minimum length, enough copper thickness a nd avoiding of vi a.
3. MOSFET driver should be closed to MOSFET .
4. The compensation, bypass a nd other function setting components should be ne ar the IC and away from the noisy
power path.
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RT9245
L2
L1
V
OUT
C
OUT
R
L
SW1
V
IN
R
IN
C
V
IN
SW2
Figure 29. Power Stage Ripple Current Path
+12V
0.1uF
VCC
PVCC
IN
BST
DRVH
SW
RT9603
DRVL
GND
Locate near MOSFETs
Next to IC
C
BOOT
C
IN
+12V or +5V
L
O1
V
CORE
C
OUT
Kelvin
Sense
For Thermal Couple
Figure 30. Layout Consideration
R
CSN
PWM
RT
VOSS
SGND
CSN
CSPx
ADJ
COMP
RT9245
GND
VCC
FB
R
R
C
BP
C
C
C
FB
+5V
IN
Next to IC
Locate next
to FB Pin
20
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Page 21
η
Test Conditions :
V
: 12V
IN
RT9245
Figure 31. Layout of power stage
V
: 1.300V
OUT
F
: 200kHz
SW
I
: 80A
OUT
Phase Number : 4 Pha ses
U-MOSFET : IR3707 x 1 (9.5mΩ x 9.6nC)
L-MOSFET : IR81 13 x 2 (6.0mΩ x 22nC)
L : 1.5uH
DCR : 1m
C
: 1000uF x 8
IN
C
: 1000uF x 8
OUT
Snubber : 2R2+3.3nF
Air Speed : Using MAGIC MGA8012HS FAN with 5V DC drive.