4/3/2/1-Phase PWM Controller with Embedded Drivers
for CPU Core Power Supply
General Description
The RT8857/A is a 4/3/2/1-phase synchronous buck
controller with 2 integrated MOSFET drivers for Intel
VR11.1/VR10.x and AMD K8/K8_M2 CPUs power
application. RT8857/A uses differential inductor DCR
current sense to achieve pha se current balance a nd active
voltage positioning. Other features include adjustable
operating frequency, adjustable soft start, power good
indication, external error-a mp compensation, over voltage
protection, over current protection, VRHOT sensing a n d
IMON f or various applications. RT8857/A comes to a small
footprint with WQFN-48L 7x7 pa ckage
Ordering Information
RT8857/A
Package Type
QW : WQFN-48L 7x7 (W-Type)
Operating Temperature Range
G : Green (Halogen Free with Commer cial Standard)
Features
12V Power Supply Voltage
4/3/2/1-Phase Power Conversion
2 Embedded MOSFET Drivers
Internal Regulated 5V Output
VID table for INTEL VR11.1/VR10.x and AMD K8/
K8_M2 CPUs
Continuous Differential Inductor DCR Current Sense
Adjustable Soft Start
Adjustable Frequency
Power Good Indication
Adjustable Over Current Protection
Over Voltage Protection
VRHOT Sensing with External Thermistor
IMON Output Current Indication
Power State Indicator (PSI)
Support MOSFET Power Stage Input Voltage (V
Down to 5V (RT8857A Only)
Small 48-Lead WQFN Package
RoHS Compliant and Halogen Free
IN
)
Support V
Support V
: 5/12V
IN
: 12V
IN
Note :
V
is the input voltage of MOSFET power stage.
IN
Richtek Green products are :
RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
Suitable for use in SnPb or Pb-free soldering processes.
Applications
Desktop CPU Core Power
Low V oltage, High Current DC/ DC Converter
(2) 1 : Open
(3) The voltage above are load independent for desktop and server platforms. For mobile platforms the voltage above
correspond to zero load current.
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Page 13
Functional Pin Description
Pin No. Pin Name Pin Function
1 FBRTN Negative Remote Sense Pin of Output Voltage.
2 QR1 Quick Response Setting Pins for Load Transition.
3 QR2 Quick Response Setting Pins for Load Transition.
4 SS/EN
5 COMP Output of error-amp and input of PWM comparator.
6 FB Inv erting input of error-amp.
7 OFS Connect this pin to GND or 5V by a resistor to set no-load offset voltage.
8 RT Connect this pin to GND by a resistor to adjust frequency.
9 ADJ Connect this pin to GND by a resistor to set load line.
10 IMAX
11 IMAXPSI OCP Setting in Power Saving Mode.
12 IMONFB Current Monitor Gain/Offset Adjustment.
13 IMON Current Monitor Output.
14, 17, 18, 21 ISP4, ISP3, ISP2, ISP1 Positive current sense pin of channel 1, 2, 3 and 4.
15, 16, 19, 20 ISN4, ISN3, ISN2, ISN1 Negative current sense pin of channel 1, 2, 3 and 4.
22 VRHOT Temperature Monitor Output.
23 TS EN Temperatur e Sense Input.
24 VCC5 5V LDO Output for System Power Supply.
25, 26 PWM4, PWM3 PWM Output for Channel 4 and Channel 3.
27, 35 BOOT2, BOOT1 Bootstrap Supply for Channel 2 and Channel 1.
28, 34 UGATE2, UGATE1 Upper Gate Driver for Channel 2 and Channel 1.
29, 33 PHASE2, PHASE1 Switching Node of Channel 2 and Channel 1.
30, 32 LGATE2, LGATE1 Lower Gate Driver for Channel 2 and Channel 1.
31 VCC12 IC Power Supply. Connect to 12V.
36 PWRGD Power Good Indicator.
37 EN/VTT VTT Voltage Detector Input.
38 to 45 VID7 to VID0 Voltage Identification Input for DAC.
47 PSI Power Status Indicator II.
48 VOUT Feedback of Regulated Output.
46 VIDSEL VID DAC Selection Pin.
49
(Exposed pad)
GND
Connect this pin to GND by a capacitor to adjust soft start time.
Pull this pin to GND to disable controller.
Negati ve input of OCP comparator. (Positive input of OCP comparator
is ADJ).
The exposed pad must be soldered to a large PCB and connected to
GND for maximum power dissipation.
RT8857/A
VID Table Selection
VIDSEL VID [7] Table
VTT X VR11
GND X VR10.x
VCC5 VTT K8
VCC5 GND K8_M2
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13
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RT8857/A
Function Block Diagram
RT
COMP
FB
OFS
VOUT
QR1/QR2
SS/EN
EN/VTT
VIDOFF
+
Modulator
Waveform
Generator
Offset
+
Transient
Response
Enhancement
OV
OC
POR
+
-
850mV
-
EA
+
+
-
150mV
Soft Start
and
Fault
Logic
OV
POR
+
-
+
-
+
-
+
-
Power-On
Reset
OE
OE
OE
+
-
Regulator
I_SEN1
5V
MOSFET
Driver
MOSFET
Driver
CH1
Current
SENSE
VCC12
VCC5
BOOT1
UGATE1
PHASE1
LGATE1
BOOT2
UGATE2
PHASE2
LGATE2
PWM3
PWM4
PSI
ISP1
ISN1
14
VIDSEL
VID7 to VID0
FBRTN
ADJ
IMAX/
IMAXPSI
IMONFB
GND
VID
Table
Generator
+
-
+
-
OC
Load Current
Monitor
IMON
+
-
-
Temperature
Monitor
TSEN
I_SEN2
AVG
+
-
+
I_SEN3
I_SEN4
CH2
Current
SENSE
CH3
Current
SENSE
CH4
Current
SENSE
ISP2
ISN2
ISP3
ISN3
ISP4
ISN4
VRHOT
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RT8857/A
Absolute Maximum Ratings (Note 1)
Supply Input Voltage----------------------------------------------------------------------------------------------−0.3V to 15V
BOOTx to PHASEx-----------------------------------------------------------------------------------------------−0.3V to 15V
BOOTx to GND
DC---------------------------------------------------------------------------------------------------------------------−0.3V to 30V
< 200ns --------------------------------------------------------------------------------------------------------------−0.3V to 42V
PHASEx to GND
DC---------------------------------------------------------------------------------------------------------------------−2V to 15V
< 200ns --------------------------------------------------------------------------------------------------------------−5V to 30V
Input/Output V oltage---------------------------------------------------------------------------------------------- −0.3V to (VCC5 +0.3)V
Power Dissipation, P
Junction T emperature--------------------------------------------------------------------------------------------- 150°C
Lead Temperature (Soldering, 10 sec.)-----------------------------------------------------------------------260°C
ESD Susceptibility (Note 2)
HBM (Human Body Mode) --------------------------------------------------------------------------------------2kV
MM (Ma chine Mode)---------------------------------------------------------------------------------------------- 200V
@ T
= 25°C
A
Recommended Operating Conditions (Note 3)
Supply V oltage, VCC12------------------------------------------------------------------------------------------ 12V ± 10%
Junction T emperature Range------------------------------------------------------------------------------------−40°C to 125°C
Ambient T emperature Range------------------------------------------------------------------------------------
0°C to 70°C
Electrical Characteristics
(VCC12 = 12V, V
Parameter Symbol Conditions Min Typ Max Unit
VCC12 Supply Input
VCC12 Supply Voltage VCC12 10.8 12 13.2 V
VCC12 Supply Current ICC -- 6 -- mA
VCC5 Power
VCC5 Supply Voltage VCC5 I
VCC5 Output Sourcing I
P ower-On Rese t
VCC12 Rising Threshold V
VCC12 Hysteres is V
Load Current Monitor
IMON Maximum Output
Voltage
EN/VTT
EN/VTT Rising Threshold V
Enable Hyster esis V
= 0V, TA = 25°C, unless otherwise specified)
GND
= 10mA (Note 6) 4.75 5.0 5.25 V
LOAD
10 -- -- mA
VCC5
VCC12TH
VCC12HY
VCC12 Rising 9.2 9.6 10.0 V
VCC12 Falling -- 0.9 -- V
--
EN/VTT Rising 0.80 0.85 0.90 V
ENVTT
ENVTTHY
EN/VTT Falling -- 100 -- mV
VTT
(Note 5)
-- V
To be continued
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RT8857/A
Parameter Symbol Conditions Min Typ Max Unit
Reference Voltage accuracy
1V to 1.6V 0.5 -- +0.5 %
DA C Accu ra cy
Error Amplifier
DC Gain ADC No Load -- 80 -- dB
Gain-Bandwidth GBW C
Slew Rate SR C
Output vo ltag e rang e V
Max Current I
COMP
EA_SLEW
Power Sequence
0.8V to 1V 5 -- +5 mV
0.5V to 0.8V 8 -- +8 mV
= 10pF -- 10 -- MHz
LOAD
= 10pF 10 -- -- V/us
LOAD
0.5 3.6 V
Slew 300 -- -- uA
PWRGD Low Voltage V
PGOOD
I
PWRGD
= 4mA -- -- 0.4 V
Soft-Start Delay TD1 -- 2 -- ms
V
Duration TD3 -- 0.8 -- ms
BOOT
PWRGD Delay TD5
Me asur ed the ti me fo rm V
to PWRGD = 1
BOOT
chang e
-- 1.6 -- ms
Current Sens e Am plifier
V
= 1.3V
Max Current I
Input Offset Voltage V
Running Frequency f
GMMAX
2 0 +2 mV
OSCS
R
OSC
R T Pin Voltage VRT R
Ramp Slope V
RAMP
R
CSP
Sink Current from CSN
= 40k 270 300 330 kHz
RT
= 40k 0.76 0.8 0.84 V
RT
= 40k -- 22 -- %/V
RT
100 -- -- uA
Soft Start
Soft Start Current I
VID Change Current I
Slew 12 16 20 uA
SS1
Slew 120 160 200 uA
SS2
Gate Driver
UGATE Drive Source R
UGATE Drive Sink R
LGATE Drive Source R
LGATE Drive Sink R
UGATEsr
UGATEsk
LGATEsr
LGATEsk
BOOT PHASE = 8V
250mA Source Current
BOOT PHASE = 8V
250mA Sink Current
V
= 8V -- 1 --
LGATE
-- 1 --
-- 1 --
250mA Sink Current -- 0.8 --
Protection
Over-Voltage Threshold V
O ver-Cu rrent Threshol d V
Sweep FB Voltage, VFB V
OVP
Sweep IMAX Voltage, V
OCP
IMAX
125 150 175 mV
EAP
V
10 0 +10 mV
ADJ
Dynamic Characteristic
UGATE Rise Time t
UGATE Fall Time t
LGATE Rise Time t
LGATE Fall Time t
rUGATE
fUGATE
rLGATE
fLGATE
-- 10 -- ns
Ciss = 3000p
-- 15 -- ns
-- 10 -- ns
-- 15 -- ns
To be continued
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RT8857/A
Parameter Symbol Conditions Min Typ Max Unit
Input Threshold
VID7 to VID0,
VIDSEL Rising Threshold
VID7 to VID0 Hysteresis V
PSI Rising Threshold
Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. Devices are ESD sensitive. Handling precaution is recommended.
Note 3. The device is not guaranteed to function outside its operating conditions.
Note 4. θ
Note 5. The maximum output voltage of power monitor will be restricted by EN/VTT pin input voltage.
Note 6. Test condition : RT8857/A normal operating, an extra static DC current load 10mA applying at VCC5 pin.
is measured in the natural convection at TA = 25°C on a effective single layer thermal conductivity test board of
JA
JEDEC thermal measurement standard.
V
ID7 to 0
V
IDSEL
ID7 to 0_Hy
V
PSI
VID7 to VID0 Rising,
,
VID SEL Ris in g
VID7 to VID0 Falling -- 25 -- mV
PSI Rising
--
--
1/2V
TT
12.5mV
1/2V
TT
12.5mV
+
-- V
+
-- V
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17
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RT8857/A
Application Information
RT8857/A is a 4/3/2/1-phase synchronous buck DC/DC
converter with 2 embedded MOSFET drivers. The internal
VID DAC is designed to interface with the Intel VR11.x/
10.x and AMD K8/K8_M2 compatible CPUs.
1200
1000
800
Frequency vs. R
RT
Power Ready Detection
During start-up, RT8857/A will dete ct VCC12, VCC5 an d
VTT. When VCC12 > 9.6V , VCC5 > 4.6V and VTT > 0.85V ,
POR will go high. POR (Power On Reset) is the internal
signal to indicate all powers are ready to let RT8857/A
and the companioned MOSFET drivers work properly.
When POR = L, RT8857/A will try to turn off both high
side and low side MOSFETs.
VCC12
VCC5
V
9.6V
4.6V
TT
0.85V
CMP
+
-
CMP
+
-
POR : Power On Reset
CMP
+
-
POR
Figure 1. Circuit for Power Ready Detection
Phase Detection
The number of operational phas e s is determined by the
internal circuitry that monitors the ISNn voltages during
start up. Normally, the RT8857/A operates as a 4-phase
PWM controller. Pull ISN4 and ISP4 to VCC5 programs
3-phase operation, pull ISN3 a nd ISP3 to VCC5 progra ms
2-phase operation, and pull ISN2 and ISP2 to VCC5
programs 1-pha se operation. RT8857/A detects the voltage
of ISN4, ISN3 and ISN2 at POR rising edge. At the rising
edge, RT8857/A detects whether the voltage of ISN4, ISN3
and ISN2 are higher than “VCC5 − 1V” respectively to
decide how many phases should be active. Phase
detection is only active during start up. When POR = H,
the number of operational phases is determined and
latched. The unused PWM pins can be connected to 5V
or GN D or left floating.
600
400
Frequency ( kH z)
200
0
04080120160200240280
RRT (k ohm)
(kΩ)
Figure 2. RRT vs Phase Switching Frequency
Soft Start
Output current of OPSS (I
V
DAC
OPSS
+
-
C
SS
SS
) is limited and variant
SS
SSQ
+
-
ADJ
R
ADJ
NTC
EAP
(ErrorAmp positive input)
Figure 4. Circuit for Soft Start and Dyn amic VID
The V
start-up time is set by a capacitor from the SS
OUT
pin to GND. In power_on_re set state (POR = L), the SS
pin is held at GND. After power_on_reset stae (POR = H)
and a n extra delay 1600us, VSS and V
V
SSQ
= V
BOOT
. When V
SSQ
= V
BOOT
begin to rise till
SSQ
, RT8857/A stays in
this state for 800us waiting for valid VID code sent by
CPU. After receiving valid VID code, V
continues
OUT
ramping up or down to the voltage spe cified by VID code.
Before PWRGD = H, output current of OPSS (ISS) is
limited to 8uA (ISS1). When PWR G D = H, ISS is limited to
80uA (ISS2). The soft start waveform is shown in Figure 5.
Phase Switching Frequency
The phase switching frequency of the R T8857/A is set by
an external resistor connected from the RT pin to GND.
The frequency follows the gra ph in Figure 2.
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Page 19
RT8857/A
A
V
VCC12
VCC5
V
DAC
SS
SSQ
PWRGD
TT
0.85V
9.6V
4.6V
T1T2T3
T4T5
Figure 5. Soft Start Waveforms
V
will trace V
OUT
V
is a small voltage signal which is proportional to
ADJ
I
. This voltage is used to generate loadline a nd will be
OUT
which is equal to “V
EAP
SSQ
− V
described later. T1 is the delay time from power_on_reset
state to the beginning of V
T1 = 1600μs + 0.6V x C
T2 is the soft start time from V
SS
rising.
OUT
/ I
(1)
SS1
= 0 to V
OUT
OUT
= V
SS
SSQ
V
ADJ
BOOT
BOOT
”.
.
Output Voltage Differential Sensing
The RT8857/A uses differential sensing by a high gain
low offset ErrorAmp. The CPU voltage is sensed between
the FB and FBRT N pins. A resistor (RFB) connects FB pin
and the positive remote sense pin of the CPU (V
CCP
FBRT N pin connects to the negative remote sense pin of
CPU (V
V
DAC
) directly. The ErrorAmp compares EAP (=
CCN
−V
) with the VFB to regulate the output voltage.
ADJ
No-Load Offset
In Figure 6, I
offset. Either I
OFSN
OFSN
or I
or I
are used to generate no-load
OFSP
is active during normal operation.
OFSP
It should be noted that users can only enable one polarity
of no-load offset. Do not connect OFS pin to GND and to
V
at the same ti me. Conne ct a resistor from OFS pin
CC5
to GND to activate I
OFSN
. I
flows through R
OFSN
ADJ
from
ADJ pin to GND. In this ca se, negative no-load offset voltage
(V
) is generated.
OFSN
V
OFSN
= I
OFSN
x R
= 0.8 x R
ADJ
ADJ/ROFS
(4)
).
T2 = V
T3 is the dwelling time for V
T4 is the soft start time from V
T4 ~= |V
BOOT
DAC
x C
- V
/ I
SS
BOOT
(2)
SS1
OUT
= V
OUT
= V
BOOT
BOOT
. T3 = 800us.
to V
| x CSS/ISS1 (3)
OUT
= V
DAC
T5 is the power good delay time, T5 ~= 1600us.
Dynamic VID
The RT8857/A can accept VID input changing while the
controller is running. This allows the output voltage (V
OUT
to change while the DC/DC converter is running and
supplying current to the load. This is commonly referred
to as VID on-the-fly (OTF). A VID OTF can occur under
either light or heavy load conditions. The CPU changes
the VID inputs in multiple steps from the start code to the
finish code. This change can be positive or negative.
Theoretically , V
should follow V
OUT
which is a staircase
DAC
waveform. In RT8857/A, a s mentioned in soft start session,
V
slew rate is limited by ISS2/CSS when PWR GD = H.
DAC
This slew rate limiter works as a low pass filter of V
and makes the bandwidth of V
smoothening V
staircase wavef orm, V
DAC
waveform finite. By
DAC
will no longer
OUT
DAC
overshoot or undershoot. On the other hand, CSS will
increa se the settling time of V
during VID OTF . In most
OUT
cas es, 1nF to 30nF cera mic capacitor is suitable for CSS.
Connect a resistor from OFS pin to VCC5 to activate I
I
flows through RFB from the V
OFSP
case, positive no-loa d offset voltage (V
to FB pin. In this
CCP
) is generated.
OFSP
.
When positive no-load offset is selected, the RT8857/A
will generate another internal 8uA current source to
eliminate dead zone problem of droop function. This 8uA
current will be injected into ADJ resistors, producing a
small initial negative no-load offset. Therefore, when OFS
pin is connected to VCC5 through a resistor , the positive
)
no-load offset ca n be calculated as :
VIR8uAR
6.48uA R
OFSPOFSPFBADJ
R
R
FB
OFS
DJ
RT8857/A provides wide range no-load positive of fset for
over-clocking application s. The I
cap ability can supply
OFSP
from 30uA to 640uA, which mea n s in Equation (5), R
can ra nge from 240kΩ to 10kΩ. Other resistances of R
exceeding this range can also provide no-load positive
offset but cannot be guara nteed by Equation (5).
OFSP
(5)
OFS
OFS
.
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RT8857/A
C2
C
FB
R
V
CCP
(Positive remote
sense pin of CPU)
(Negative remote
sense pin of CPU)
V
CCN
FB
R
ADJ
Figure 6. Circuit for V
FB
I
OFSP
-
EA
+
+
V
DAC
-
FBRTN
ADJ
Differential Sensing and No
OUT
+
-
EAP
R1
I
OFSN
C1
COMP
Load Offset
Load T r ansient Quick Response
RT8857/A utilizes a new quick response feature to supply
heavy load current demand during instantaneous load
application tra nsient. RT8857/A detects load tra nsient and
reacts via VOUT pin. When VOUT drops during load
application transient,the quick response comparator will
send asserted sign als to turn on high side MOSFET s a nd
turn off low side MOSFETs. The LA1 signal, which is a
weaker quick response sign al, will turn on only arbitrary
two channels', high side MOSFETs while turning off low
side MOSFET s also. The LA2 signal , which is a stronger
quick response signal, will turn on all channel's high side
MOSFETs while turning off low side MOSFETs also.
Therefore, the influence of total quick response function
of RT8857/A is adjustable, and the magnitude of quick
response is flexible via fine-tuning the resistors connected
to pin QR1 and QR2.
I
OUT
V
OUT
Output Current Sensing
The RT8857/A provides low input offset current-sense
amplifier (CSA) to monitor the output current of every
channel. Output current of CSA (IX[n]) is used for channel
current balance a nd active voltage position. In this inductor
current sensing topology , RS and CS must be set according
to the equation below :
L/DCR = RS x CS (6)
Then the output current of CSA will follow the equation
below :
IX = [IL x DCR − V
/R
(7)
CSN
OFS-CSA
+ 235n x (R
CSP
− R
CSN
)]
235nA is typical value of CSA input offset current.
V
OFS-CSA
RT8857/A is smaller than +/- 1mV. Usually, “V
235n x (R
is the input offset voltage of CSA. V
CSP
− R
)” is negligible except at very light
CSN
OFS-CSA
OFS-CSA
of
+
load and the equation can be simplified as the equation
below :
IX = IL x DCR/R
(8)
CSN
Loadline
Output current of CSA is summed and averaged in
RT8857/A. Then 0.5Σ(IX[n]) is sent to ADJ pin. Because
ΣIX[n] is a PTC (Positive T emperature Coef ficient) current,
an NTC (Negative Temperature Coefficient) resistor is
needed to connect ADJ pin to GND. If the NTC resistor is
properly selected to compensate the temperature
coefficient of IX[n], the voltage on ADJ pin will be
proportional to I
A, the positive input of ErrorAmp is “V
will follow “V
decreasing linearly with I
without temperature effect. In RT8857/
OUT
− V
DAC
− V
DAC
”, too. Thus, the output voltage
ADJ
is obtained. The loadline is
OUT
ADJ
”. V
OUT
defined as
LL(loadline) = ΔV
= 0.5 x DCR x R
OUT
/ΔI
OUT
= ΔV
/ΔI
ADJ
ADJ/RCSN
OUT
(9)
20
QR2
QR1
Figure 7
Briefly, the resistance of R
loadline. The temperature coefficient of R
sets the resistance of
ADJ
compensates
ADJ
the temperature effect of loadline.
Current Balance
In Figure 8, IX[n] is the current signal which is proportional
to current flowing through channel n. In Figure 9, the
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RT8857/A
current error signals I
n (= IX[n] − A V G(IX[n])) are used
ERR
to raise or lower the internal sawtooth waveforms
(RAMP[1] to RAMP[n]) which are compared with ErrorAmp
output (COMP) to generate PWM signal. The raised
sawtooth waveform will decrease the PWM duty of the
corresponding channel while the lowered will increase.
Eventually , current flowing through each channel will be
balanced.
L
DCR
C
CSA: Current Sense Amplifier
235nA
V
I
X
OFS_CSA
235nA
R
R
ISP
+
+
-
ISN
-
ISP
R
ISN
S
S
Figure 8. Circuit for Channel Current Sensing
COMP
I1
I2
I
, total
OUT
Constant ra tio
I1
I2
I
, total
OUT
Constant difference
Figure 10. Channel Current vs. Total Current
Over Current Protection (OCP)
RT8857/A provides sing phase OCP and multi-pha se OCP
according to the operation condition. In Figure 1 1, single
phase OCP (IMAXPSI) and multi-phase OCP (IMAX)
thresholds can be set by external resistors :
RAMP[1]
Interleaved
RAMP[n]
I
I
ERR
ERR
+
-
[1] x R
+
-
[n] x R
CB
CB
+
CMP
-
+
CMP
-
BUF
BUF
PWM[1]
PWM[n]
Figure 9. Circuit for Channel Current Bala nce
Channel Current Adjust
If channel current is not bala nced due to asymmetric PCB
layout of power stage, external resistors can be adjusted
to correct current imbalance. Figure 10 shows two type s
of current imbalance, constant ratio type and constant
difference type.
If the initial current distribution is constant ratio type,
according to Equation (8), reduce R
[1] can reduce IL[1]
CSN
and improve current bala nce. If the initial current distribution
is constant difference type, according to Equation (7),
increase R
[1] can reduce IL[1] and improve current
CSP
balance.
VV
IMAXCC5
VV
IMAXPSICC5
Once V
is larger than the negative input of CP
ADJ
R2 + R3
R1 + R2 + R3
R3
R1 + R2 + R3
(10)
(1 1)
comparator, OCP will be triggered and latched, and
RT8857/A will turn off both high side and low side
MOSFETs of all channels. A 20us delay after OCP
detection is used to prevent false trigger.
Over Voltage Protectiom (OVP)
The over voltage protection monitors the output voltage
via the FB pin. Once VFB exceeds “V
+ 150mV”, OVP
EAP
is triggered and latched. RT8857/A will try to turn on low
side MOSFET and turn of f high side MOSFET to protect
CPU. A 20us delay is used in OVP detection circuit to
prevent false trigger.
DS8857/A-00 February 2009www.richtek.com
21
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RT8857/A
V
CC5
R1
IMAX
R2
IMAXPSI
R3
Figure 1 1. Over Current Protection
ADJ
V
CC5
0.28 x V
0.33 x V
CC5
CC5
+
-
+
-
QS
VRHOT
R
R1
+
OCP
R
NTC
TSEN
Figure 13. Thermal Monitoring
Output Current Monitoring (IMON)
RT8857/A sen ses load current and output a voltage signal
to indicated the instanta neous load current status. Since
the sensed total current is injected into the resistors
connected to ADJ pin, ADJ voltage than is used for IMON
function as shown in Figure 12. Through the resistor
network R1, R2 and R3, IMON voltage will be proportional
to ADJ pin voltage a ccording to the Equation :
VVV
IMONADJTT
R3R3
R1 // R2 // R3R1
ADJ
IMONFB
V
R1
TT
+
-
R3
R2
V
TT
IMON
(12)
Figure 12. Output Current Monitoring
Thermal Monitoring (VRHOT)
RT8857/A provides thermal monitoring function via sensing
TSEN pin voltage. Through the voltage divider R1 a nd R
NTC
,
the voltage of TSEN is typically set to be higher than
0.33 x V
when ambient temperature is lower than
CC5
VRHOT a ssertion target. When a mbient temperature rises,
TSEN voltage will fall, and VRHOT signal will be set to
high if TSEN voltage drops below 0.28 x V
CC5
.
Accordingly, VRHOT will be reset to low once TSEN
voltage rises above 0.33 x V
resistance of R1 a nd R
can a ssert and de-a ssert VRHOT
NTC
. Correctly choose the
CC5
accurately at target a mbient te mperature.
Power State Indicator (PSI)
The RT8857/A supports PSI# function for V R11.1 CPUs
and platform users. The RT8857/A will monitor PSI pin
input voltage to change the operating state. When PSI is
high (higher than 1/2 V
+ 12.5mV), the RT8857/A
TT
operates as a full-cha nnel interleaving PWM controller and
all channels are a ctive. When in put voltage is low (lower
than V
+ 12.5mV), the RT8857/A will change to single
TT
phase operation mode a nd only channel 1 is a ctive. Since
channel 2 includes embedded driver, the RT8857/A will
automatically disable channel 2 by f orcing UGATE2 and
LGA TE2 into high impedance state when input voltage is
low. The R T8857/A will also disable cha nnel 3 and cha nnel
4 by sending continuous tri-state signals (~2.5V) from
PWM3 and PWM4 to external drivers when input voltage
is low. Therefore, 2 external drivers which support tri-state
shutdown should be used if PSI function is considered,
and the RT9619 is recommended to be the extern al drivers
for VR11.1 compatibility.
During PSI asserted period, e.g., in put voltage is low, if
the RT8857/A receives dynamic VID change command,
the RT8857/A will enter interle aving mode operation and
all channels will be a ctivated. PSI command will be ignored
during dyna mic VID operation, and PSI will be bla nked for
about 100us after dyna mic VID cha nge is completed.
Loop Compensation
The RT8857/A is a synchronous Buck converter with two
control loops : voltage loop and current balance loop. Since
the function of the current balance loop is to maintain the
current balance between ea ch active cha nnel, its influence
to converter stability will be negligible compared with the
voltage feedback loop. Therefore, to compensate the
22
DS8857/A-00 February 2009www.richtek.com
Page 23
RT8857/A
voltage loop will be the main task to maintain converter
stability.
The converter duty-to-output trans fer function Gd is :
V
OUT
G
d
1
D
SS
L
R
C
2
1
LC
(13)
2
and the modulator gain of the converter is :
1
F
m
V
P
Where V
is the output voltage of the converter, R is
OUT
(14)
the loading resistance, L and C are the output inducta nce
and capacitance, and VP is the peak-to-peak voltage of
ramp a pplied at modulator input. The overall loop gain after
compensation can be described as :
Loop Gain = T = Gd x F
x A (15)
m
Where A denotes as compensation gain. T o compensate
a typical voltage mode buck converter, there are two
ordinary compensation schemes, well known as type-II
compensator and type-III compensator . The choice of using
type-II or type-III compensator will be up to platform
designers, and the main concern will be the position of
the capacitor ESR zero and mid-frequency to highfrequency gain boost. Typically, the ESR zero of output
cap acitor will tend to stabilize the effe ct of output LC double
poles, hence the positon of the output cap acitor ESR zero
in frequency domain may influence the design of voltage
loop compensation. If F
ZERO,ESR
is <1/2F
where F
CO
CO
denotes cross-over frequency , type-II compensation will
be sufficient for voltage stability. If F
ZERO,ESR
is > 1/2F
CO
(or higher gain and phase margin is required at midfrequency to high-frequency), then type-III compensation
may be a better solution for voltage loop compensation.
C2
C1
R2
R1
-
EA
+
+
V
REF
-
Figure 14. T ype-II Compensation
R1 can be determined independently from DC
considerations. Normally choose R1 that the current
pa ssing by will be around 1mA. Therefore,
V
R1
REF
1mA
(16)
Then determine R2 by the boosted gain of loop gain at
crossover :
F
V
R2R1
Where V
P
VFF
IN(MAX)LCZERO, ESR
is the max input voltage of power stage,
IN(MAX)
ZERO, ESR
2
F
CO
(17)
VP is the peak-to-pea k voltage of ramp a pplied at modulator
input, F
ZERO,ESR
zero, and F
F
ZERO, ESR
F
LC
2LC
is the frequency of output cap acitor ESR
is the frequency of output LC :
LC
1
2RC
ESR
1
(18)
(19)
After determining the phase margin at crossover
frequency, the position of zero and pole produced by
type-II compensation network, FZ and F
can then be
P,
determined. The bode plot of type-II compensation is
shown in Figure15, where
A typical type-II compensation network is shown in
Figure 14.
F
Z
Gain (dB)
Frequency (Hz)
F
P
Figure 15. Bode Plot of T ype-II Compensation
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23
Page 24
RT8857/A
F
Z
F
P
F
can be determined by the following Equation :
Z
-1-1
tantan90
P.M. tan
By properly choosing F
1
2R2C1
1
2R2 (C1 // C2)
F
CO
FF
ZCO
-1
F
F
CO
F
ZERO, ESR
Z
to fit equation (22), C1 can then
Z
(20)
(21)
(22)
be determined by :
C1
1
2R2F
Z
(23)
and C2 ca n be determined by :
C2
2R2
1
2
F
FC1
CO
Z
1
(24)
A typical type-III compensation contains two zeros and
two poles where the extra one zero and one pole compared
with type-II compensation are added for stabilizing the
system when ESR zero is relatively far from LC double
poles in frequency domain. Figure16. and Figure.17 shows
the typical circuit and bode plot of the type-III compensation.
After determining desired phase margin, a ccording to the
following Equation :
F
-1-1
tantan45
CO
FF2
ZCO
F
P.M.
Z
(25)
and
2
F
F =
F
F
CO
P
F
Z
and F
Z
ratio to meet Equation (25). Again, R1 ca n be determined
Z
can be determined by choosing proper FCO to
P
(26)
by the Equation (16).
R2 can be determined by the following Equation :
2
VF
R2R1
PZ
VFF
IN(MAX)LCCO
F
CO
(27)
Other component values of the T ype-III compensation can
then be calculated as :
C1
2R2F
C2
2R2F
C3
2R1F
R3
2C3F
1
Z
1
P
C1
1
Z
1
P
1
(28)
(29)
(30)
(31)
C2
R3
R1
C3
+
-
C1
R2
-
EA
+
V
REF
Figure 16. T ype-III Compensation
FP = F
FZ = F
= F
Gain (dB)
Z1
Frequency (Hz)
= F
P1
P2
Z2
Figure 17. Bode Plot of the T ype-III Compensation
Layout Considerations
For best performance of the RT8857/A, the following
guidelines must be strictly followed :
Input bulk capacitors and MLCCS have to be put near
high side MOSFETs. The connection plane of input
capa citors a nd high side MOSFET s then can be kept a s
square a s possible.
The shape of phase planes (the connection plane
between high side MOSFETs, low side MOSFETs a nd
output inductors) have to be as s quare as possible. Long
traces, thin bars or separated isla nds must be avoided
in phase pla nes.
Keep snubber circuits or damping elements near its
objects. Phase RC snubbers have to be close to low
side MOSFETs, UGATE da mping re sistors have to be
close to high side MOSFET s, and boot to pha se da mping
resistors have to be close to high side MOSFETs and
phase planes. Also keep the traces of these snubbers
circuits as short as possible.
24
DS8857/A-00 February 2009www.richtek.com
Page 25
RT8857/A
The area of VIN plane (power stage 12V VIN) and V
plane (output bulk ca pa citors and inductors connection
plane) have to be as wide as possible. Long traces or
thin bars must be avoided in these planes. The plane
trace width must be wide enough to carry large input/
output current (40mil/A).
The following traces have to be wide and short : UGA TE,
LGATE, BOOT, PHASE, and VCC12. Make sure the
width of these traces are wide enough to carry large
driving current(at lea st 40mil).
The voltage feedback loop contains two traces, VCC
and VSS, which are Kelvin sensed from CPU socket or
output capa citors. These two traces are suggested a bove
10mil width and put away from high (di/dt) switching
elements such as high side MOSFETs, low side
MOSFETs, phase plane etc. The circuit elements of
voltage feedback loop, such as feedback loop short
resistors and voltage loop compensation RCs, have to
be kept near the RT8857/A a nd also away from switching
elements.
OUT
The current sense mechanism of the RT8857/A is fully
differential Kelvin sense. Therefore, the current sense
loops of the RT8857/A contain two tra ces : the positive
traces(ISP1 to ISP4) come from the positive node of
output inductors(the node connecting phase pla ne) a nd
the negative traces (ISN1 to ISN4) come from the
negative node of output inductors(the node connecting
output plane).
DO NOT conne ct the current sense traces from phase
plane or output pla ne. Only connect these traces from
both sides of output inductors can achieve the goal of
precise Kelvin sense. The current sense feedba ck loops
have to be routed away from switching elements, and
the current sense RC elements have to be put near
their respective ISN or ISP pins of the RT8857/A and
also away from noise switching elements. At lease 10
mil width is suggested for current sense feedba ck loops.
DS8857/A-00 February 2009www.richtek.com
25
Page 26
RT8857/A
Outline Dimension
2
DETAIL A
Pin #1 ID a nd T ie Bar Mark Option s
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit
design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be
guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.
26
W-Type 48L QFN 7x7 Package
Richtek Technology Corporation
Taipei Office (Marketing)
8F, No. 137, Lane 235, Paochiao Road, Hsintien City
Taipei County, Taiwan, R.O.C.
Tel: (8862)89191466 Fax: (8862)89191465
Email: [email protected]
0.014 0.018
DS8857/A-00 February 2009www.richtek.com
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