Datasheet RP1-H-6V, RP1-H-9V, RP1-4.5V, RP1-5V, RP1-6V Datasheet (NAIS)

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Page 1
LOW PROFILE HIGH
RP-RELA YS
10.6
.417
9
.748
4
.157
mm inch
FREQUENCY RELAY
• High frequency relay with the low profile of 4 mm .157 inch
• Excellent high frequency characteristics Isolation: Min. 10dB (at 1.8 GHz) Insertion loss: Max. 1.0dB (at 1.8 GHz) V.S.W.R.: Max. 1.3 (at 1.8 GHz)
• High sensitivity in small size Size: 10.6 × 9 × 4 mm .417 × .354 × .157 inch Nominal operating power: 140 mW
SPECIFICATIONS
Contact
Arrangement
Contact material Initial contact resistance, max.
(By voltage drop 6 V DC 0.1 A)
Rating
High frequency characteristics (
Impedance 50Ω
Expected life (min. opera­tions)
Movable Stationary
Nominal switch­ing capacity
Isolation
Insertion loss
)
V.S.W.R. Mechanical
(at 180 cpm) Electrical
(at 20 cpm)
Coil (at 25°C, 68°F)
Voltage type
1.5 to 12 V DC 24 V DC
1 Form C
Silver alloy
Gold-clad silver
50 mΩ
Contact switching power: 1 W (Max. 1.8 GHz); Contact carrying power: 3 W (Max. 1.2 GHz) 1 W (Max. 1.8 GHz)
0.1 A 30 V DC
Min. 15 dB (at 1 GHz) Min. 10 dB (at 1.8 GHz)
Max. 0.5 dB (at 1 GHz) Max. 1 dB (at 1.8 GHz)
Max. 1.2 (at 1 GHz) Max. 1.3 (at 1.8 GHz)
6
5×10
105 (0.1 A 30 V DC)
105 (1 W at 1.8 GHz;
V.S.W.R.: max. 1.3)
Nominal operating power
140 mW 270 mW
Characteristics
Max. operating speed (at rated load) Initial insulation resistance* Initial breakdown
2
voltage
*
Operate time*3 (at nominal voltage) Release time(without diode)*
(at nominal voltage)
Temperature rise
Shock resistance
Vibration resistance
Conditions for operation, transport and storage
(Not freezing and condensing at low temperature)
Unit weight
Remarks
* Specifications will vary with foreign standards certification ratings.
1
Measurement at same location as “Initial breakdown voltage” section
*
2
Detection current: 10mA
*
3
Excluding contact bounce time
*
4
Half-wave pulse of sine wave: 11ms, detection time: 10µs
*
5
Half-wave pulse of sine wave: 6ms
*
6
Detection time: 10µs
*
Between open contacts Between contacts and coil
1
3
Functional* Destructive*
Functional*
Destructive
Ambient temp.
Humidity
4
5
6
Min. 1,000 MΩ at 500 V DC
Max. 50°Cwith nominal coil voltage across coil and at nominal switching capacity
at double amplitude of 3 mm
at double amplitude of 5 mm
20 cpm
750 Vrms for 1 min.
1,500 Vrms for 1 min.
Max. 3 ms
(Approx. 1.5 ms)
Max. 2 ms
(Approx. 1 ms)
Min. 500 m/s Min. 1,000 m/s2 {100 G}
10 to 55 Hz
10 to 55 Hz
–40°C to 70°C
–40°F to 158°F
5 to 85% R.H.
Approx. 1 g .04 oz
2
{50 G}
TYPICAL APPLICATIONS
• Antenna switching of mobile phone
• Switching signal of measuring equipment
ORDERING INFORMATION
1Ex. RP H
1:1 Form C
Note: Standard packing; Carton: 50 pcs. Case 1,000 pcs.
Terminal shape Coil voltage (DC)
Nil: Standard PC board terminal H: Self-clinching terminal
3V
1.5, 3, 4.5, 5, 6, 9, 12, 24 V
93
Page 2
RP
TYPES ANE COIL DATA
Part No.
Standard PC
board terminal
Self-clinching
terminal
RP1-1.5V RP1-H-1.5V RP1-3V RP1-H-3V RP1-4.5V RP1-H-4.5V RP1-5V RP1-H-5V RP1-6V RP1-H-6V RP1-9V RP1-H-9V RP1-12V RP1-H-12V RP1-24V RP1-H-24V
Nominal voltage,
(at 20°C 68°F)
Pick-up
V DC
12 24
voltage, max.
1.5 3
4.5 5 6 9
18
V DC
1.125
2.25
3.375
3.75
4.5
6.75 9
Drop-out
voltage, min.
V DC
0.15
0.3
0.45
0.5
0.6
0.9
1.2
2.4
Coil
resistance,
Ω (±10%)
16
64.3 145 178 257 579
1,028 2,133
Nominal
operating
current,
mA (±10%)
93.8
46.7
31.1 28
23.3
15.6
11.7
11.3
Nominal
operating
power,
mW 140
140 140 140 140 140 140 270
Maximum.
allowable
voltage,
V DC
2.25
4.5
6.75
7.5 9
13.5 18
28.8
DIMENSIONS
Standard PC board terminal PC board pattern (Copper-side view)
3.75
.157
3.5
.138
4
.148
(0.25)
(.010)
2.54
.100
10.6
.417
0.5
.020
2.54
.100
.354
7.62
.300
9
0.25
.010
Self-clinching terminal
3.75
.157
3.5
.138
4
.148
(0.25)
(.010)
2.54
.100
10.6
.417
0.5
.020
2.54
.100
.354
7.62
.300
9
0.25
.010
Schematic (Bottom view)
General tolerance: ±0.3 ±.012
5.08
.200
6-1 dia.
6-.039 dia.
Tolerance: ±0.1 ±.004
123
–+
654
Direction indication
Deenergized condition
REFERENCE DATA
Sample: RP1-6V Measuring method: Impedance 50 Ω Measuring tool:
6–1.60 dia
6–1.00 dia
.039 dia
18.00
.709
0.60
.024
7.62
.300
.063 dia
18.92
.745
1.94
.076
6–2.30 dia
.090 dia
5.08
.200
Soldering SMA connector
26–0.80 dia
.031 dia
4.22
9.82
.166
.387
mm inch
PC board
• Double-sided through hole
• Material: Glass-epoxy resin
• t= 1.0mm .039 inch
• Copper plated thickness: 35 µm
• Insertion loss • Return loss • V.S.W.R
1. High frequency characteristics
• Isolation
100
90 80 70 60 50
Isolation, dB
40 30 20 10
0
2.54
.100
7.62
.300
0.80 0.4 1.0 Frequency, GHz
mm inch
1.61.41.20.60.2 2.0
1.8
5
4
3
2
Insertion loss, dB
1
0
94
N.O. (Terminal Nos. 5-6)
N.C. (Terminal Nos. 4-5)
0.80 0.4 1.0 Frequency, GHz
1.81.61.41.20.60.2 2.0
100
90 80 70 60 50
Return loss, dB
40 30 20 10
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
N.O. (Terminal Nos. 5-6)
N.C. (Terminal Nos. 4-5)
Frequency, GHz
3.0
2.8
2.6
2.4
2.2
2.0
V.S.W.R.
1.8
1.6
1.4
1.2
1.0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Frequency, GHz
N.C. N.O.
Page 3
2. Coil temperature rise
Sample: RP1-6V; No. of samples: n = 5 Carrying current: 0.1 A Ambient temperature: 25°C 77°F
100
90 80 70 60 50 40
Temperature rise, °C
30 20 10
0
80 100 120 150
Coil applied voltage, %V
4. Mechanical life
Sample: RP1-5V; No. of samples: n = 8
• Change of pick-up, drop-out voltage
12
10
8
3. Operate/release time
Sample: RP1-9V; No. of samples: n = 50
• With diode
12
10
8
6
Time, ms
4
2
0
70 80 100 120 150
Coil applied voltage, %V
Operate time Release time
Max. Max. Min. Min.
5. Electrical life (0.1 A 30 V DC)
Sample: RP1-6V; No. of samples: n = 6
• Change of pick-up/drop-out voltage
12
10
8
• Without diode
12
10
8
6
Time, ms
4
2
Max. Min. Max. Min.
0
70 80 100 120 150
Coil applied voltage, %V
• Change of contact resistance
120
100
80
Operate time Release time
RP
6
4
Pick-up/drop-out voltage, V
2
Pick-up voltage
Drop-out voltage 100 1,00050050
No. of operations, ×10
Max. Min.
Max. Min.
4
6. Ambient temperature characteristics
Sample: RP1-6V; No. of samples: n = 5
40
Drop-out voltage
20
Rate of change, %
–40 –20 02040 60 80
–20
–40
Pick-up voltage
Ambient temperature, °C
8.-(1) Influence of adjacent mounting
Sample: RP1-12V; No. of samples: n = 6
6
Pick-up voltage
4
Pick-up/drop-out voltage, V
2
Drop-out voltage
No. of operations, ×10
Max. Min. Max.
Min.
4
7. Contact resistance distribution (initial)
Sample: RP1-6V; No. of samples: n = 25
50
40
30
Quantity
20
10
0
2824 30
Contact resistance, mΩ
383634322622 40
8.-(2) Influence of adjacent mounting
Sample: RP1-12V; No. of samples: n = 6
60
40
Contact resistance, mΩ
20
3020100
No. of operations, ×10
Max. Min.
3020100
4
8.-(3) Influence of adjacent mounting
Sample: RP1-12V; No. of samples: n = 6
5
0
–5
5
0
–5
Rate of change, % Rate of change, %
0
Inter-relay distance, (mm, inch)
Pick-up voltage
Drop-out voltage
5
.197
10
.394
OFF
OFF
ON
ON
OFF
ON
5
0
–5
5
0
–5
Rate of change, % Rate of change, %
0
Inter-relay distance, (mm, inch)
Pick-up voltage
Drop-out voltage
5
.197
10
.394
OFF OFF
OFF
ON ON
ON
5
0
–5
5
0
–5
Rate of change, % Rate of change, %
0
Inter-relay distance, (mm, inch)
Pick-up voltage
Drop-out voltage
5
.197
10
.394
OFF
ON
95
Page 4
RP
9. High frequency switching test (1.2 GHz, 1 W)
Sample: RP1-6V; No. of samples: n = 6 Ambient temperature: 20°C 68°F
• Change of pick-up/drop-out voltage
• Change of contact resistance
Trans­mission
RP relay
T1 T2
T1 T2
ON
0.2s 0.2s
1.5s 1.5s
Dummy load (50Ω) WD-2351
Transmission: RF Tranceiver IC-1201 (ICOH)
OFF
NOTES
1. Packing direction
Relays are packed in a tube with the ori­entation stripe (PIN NO. 1) toward the green stopper.
Orientation (indicates PIN No. 1) stripe
Stopper (green)
2. Automatic mounting
To maintain the internal function of the relay, the chucking pressure should not exceed the values below. Chucking pressure* in the direction A:
4.9 N {500 gf} or less
12
10
8
6
4
Pick-up/drop-out voltage, V
2
Pick-up voltage
Drop-out voltage
No. of operations, ×10
Max. Min.
Max. Min.
4
Chucking pressure* in the direction B:
9.8 N {1 kgf} or less Chucking pressure* in the direction C:
9.8 N {1 kgf} or less Please chuck the portion. Avoid chucking the center of the relay. In addition, excessive chucking pressure to the pinpoint of the relay should be avoid­ed.
CB
A
(4)
(5)
(6)
*Value of chucking pressure is shown by the value of weight pressed on the portion (4 mm .157 inch dia.).
• Direction A • Direction B • Direction C
3
2
1
mm inch
546
3
.118
6
.236
23
1
120
100
80
60
40
Contact resistance, mΩ
20
151050
No. of operations, ×10
3. Soldering
Preheat according to the following condi­tions.
Temperature 100°C 212°F or less
Time Within 1 minute
Soldering should be done at 250°C
482°F within 5 s.
Max. Min.
151050
4
For Cautions for Use, see Relay Technical Information (Page 48 to 76).
96
9/1/2000 All Rights Reserved, © Copyright Matsushita Electric Works, Ltd.
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