Datasheet RMA-7 Specification

ALPHA RMA 7 FLUX GEL

DESCRIPTION

RMA 7 is a rosin based flux gel designed for surface mount processes and other demanding electronics assembly

applications, including rework, where post reflow cleaning is not required. Because of its unique activator package and
other special additives, RMA 7 flux gel is suitable to remain on the circuit board without cleaning

FEATURES & BENEFITS

• Excellent rheology

• Unique Flux Vehicle

• Wide process window

• High tack

• Excellent no clean reliability

APPLICATION

RMA 7 flux gel should be applied by printing, dispensing or brushing

RMA 7's activator system enables the flux to penetrate even moderately tarnished surfaces among the following

metals:

Silver Copper
Solder (Creams) Gold
Solder (Hot Dip) Tin (Hot Dip)
Cadmium (Plate) Tin (Plate)

RMA 7 can be successfully reflowed in infrared, convection, hot stage, hot bar, belt or vapor phase systems.

PROCESSING GUIDELINES

RMA 7 can be safely left on the circuit board after reflow without cleaning. If cleaning is desired, most commercially

available electronic assembly cleaning solvents are effective. Particularly effective is Alpha Auto Clean 40, which is a
semi-aqueous cleaner designed to meet the most demanding cleaning requirements with complete environmental
compatibility. Flux residues are also removable by saponification with Alpha 2110 in water.

High ambient temperatures should be avoided in the handling of RMA 7. Storage temperatures of 0° - 10°C are
sufficient to maintain RMA 7's nominal shelf life. RMA 7 should be permitted to achieve room temperature before
unsealing the package.

The production environment should be 18° - 27°C and 30% to 60% relative humidity. Production stencils can be
cleaned using Alpha SC1080 Fluid in a dedicated screen cleaning machine.

HEALTH & SAFETY

Observe standard precautions for handling and use. Use in well ventilated areas. DO NOT SMOKE. Avoid prolonged
or repeated contact with the skin by the use of solvent resistant gloves. Avoid contact with eyes.

Flammable, keep away from sparks and open flames. Empty containers can still be a flammable hazard from residual
vapours.

Remove skin splashes by immediate washing with soap and water.

In order to carry out your full COSHH assessment, consult the product Material Safety Data Sheet (MSDS)

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this
data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated.

PACKAGING

RMA 7 is available in a variety of sealed jars and cartridges for dispensing.

ALPHA RMA 7 TECHNICAL DATA

CATEGORY RESULTS PROCEDURES/REMARKS

CHEMICAL PROPERTIES

Activity Level ROL0 = J-STD Classification IPC J-STD-004
Halide Content Pass - Ag Chromate Test IPC J-STD-004,

Copper Mirror Test Pass

Copper Corrosion Test Pass, (No evidence of Corrosion) IPC J-STD-004,

IPC J-STD-004,

ELECTRICAL PROPERTIES

SIR (IPC 7 days
@ 85° C/85% RH)

Pass, > 2.4 x 109 ohms IPC J-STD-004

{Pass ≥ 1 x 108 ohm min}

PHYSICAL PROPERTIES

Color Clear, Colorless Flux Residue
Tack Force

>3.0 grams/mm

2

IPC J-STD-005

ALPHA RMA 7 PROCESSING GUIDLINES

STORAGE-HANDLING PRINTING REFLOW CLEANING

•Refrigerate to guarantee stability
@ 1-10°C

•Shelf life of refrigerated paste is
six months.

•Warm-up of jar or cartridge to
room temperature should be  6
hours.

•Do not remove worked flux gel
from stencil and mix with unused
flux gel in jar. This will alter rheology
of unused material.

SCREEN: Can be applied
through a mesh screen using
off-contact printing
method
SQUEEGEE: Polyurethane
blades are recommended
for screen printing, metal
blades for stencil printing.
PRESSURE: 0.15 to 0.25Kgs
per cm of print pattern.
STENCIL SEPARATION:
Slow
SQUEEGEE SPEED: 15-50
mm per second
DISPENSE PRESSURE :
Pressure should be similar
to that of adhesive dispensing.
Varies for each machine.

•Use convection, IR, or combination
ovens, belt, hot -plate,
vapor phase.

•Clean-dry air or nitrogen atmosphere.
PROFILE:

- Ramp @ 60-120°C/min. to
120-160°C.

- Dwell @ 120-160°C for 1.0-

1.5
minutes.

- Ramp @ 60-120°C/min to
215­220°C peak temp. Time
over
183°C for 30-60 seconds

- Ramp down to R.T. @ 90­120°C/min.

-Ensure solder is frozen at exit
of
last heated zone to avoid
disturbed joint defects.

•Although designed
as a no-clean flux system,
the residue may
be cleaned with:

• Autoclean 40 or

• Alpha 2110
saponifier with water.

• Clean stencils with
Alpha SC-1080 stencil
cleaner

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The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this
data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated.

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