
Semiconductor
September 1998
RFM18N08, RFM18N10,
RFP18N08, RFP18N10
18A, 80V and 100V, 0.100 Ohm,
N-Channel Power MOSFETs
[ /Title
(RFM18
N08,
RFM18
N10,
RFP18N
08,
RFP18N
10)
Subject
(18A,
80V and
100V,
0.1 Ohm,
N-Channel
Power
MOSFETs)
Author
()
Key-
words
(Harris
Semiconductor, NChannel
Power
MOSFETs,
TO204AA,
TO220AB)
Creator
()
DOCIN
FO pdfmark
Features
• 18A, 80V and 100V
•r
• Related Literature
- TB334 “Guidelines for Soldering Surface Mount
= 0.100Ω
DS(ON)
Components to PC Boards”
Ordering Information
PART NUMBER PACKAGE BRAND
RFM18N08 TO-204AA RFM18N08
RFM18N10 TO-204AA RFM18N10
RFP18N08 TO-220AB RFP18N08
RFP18N10 TO-220AB RFP18N10
NOTE: When ordering, use the entire part number.
Packaging
JEDEC TO-204AA JEDEC TO-220AB
DRAIN
(FLANGE)
GATE (PIN 1)
SOURCE (PIN 2)
Description
These are N-Channel enhancement mode silicon gate
power field effect transistors designed for applications such
as switching regulators, switching converters, motor drivers,
relay drivers and drivers for high power bipolar switching
transistors requiring high speed and low gate drive power.
These types can be operated directly from integrated circuits.
Formerly developmental type TA17421.
Symbol
D
G
S
SOURCE
DRAIN
(TAB)
DRAIN
GATE
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper ESD Handling Procedures.
Copyright
© Harris Corporation 1998
5-1
File Number 1446.1

RFM18N08, RFM18N10, RFP18N08, RFP18N10
Absolute Maximum Ratings T
= 25oC, Unless Otherwise Specified
C
RFM18N08 RFM18N10 RFP18N08 RFP18N10 UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . V
Continuous Drain Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
DSS
DGR
D
DM
GS
D
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . .TJ,T
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s . . . . . . . . . . . . . . . .T
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . T
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
pkg
80 100 80 100 V
80 100 80 100 V
18
45
18
45
18
45
±20 ±20 ±20 ±20 V
100
0.8
100
0.8
75
0.6
-55 to 150 -55 to 150 -55 to 150 -55 to 150
300
L
260
300
260
300
260
18
45
75
0.6
300
260
A
A
W
W/oC
o
C
o
C
o
C
NOTE:
1. TJ= 25oC to 125oC.
Electrical Specifications T
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BV
DSSID
= 250µA, VGS = 0V
RFM18N08, RFP18N08 80 - - V
RFM18N10, RFP18N10 100 - - V
Gate Threshold Voltage V
GS(TH)VGS
Zero Gate Voltage Drain Current I
Gate to Source Leakage Current I
Drain to Source On Resistance (Note 2) r
Drain to Source On Voltage (Note 2) V
Turn-On Delay Time t
DS(ON)ID
DS(ON)ID
d(ON)VDD
Rise Time t
Turn-Off Delay Time t
d(OFF)
Fall Time t
Input Capacitance C
Output Capacitance C
Reverse-Transfer Capacitance C
Thermal Resistance Junction to Case R
DSSVDS
GSSVGS
r
f
ISSVDS
OSS
RSS
θJC
= VDS, ID = 250µA, (Figure 8) 2 - 4 V
= Rated BV
VDS = 0.8 x Rated BV
, VGS = 0V - - 1 µA
DSS
, VGS= 0V, TC = 125oC- - 25 µA
DSS
= ±20V, VDS = 0V - - ±100 nA
= 18A, VGS = 10V, (Figures 6, 7) - - 0.100 Ω
= 18A, VGS = 10V - - 1.8 V
= 50V, I
RL = 5.5Ω
(Figures 10, 11, 12)
≈ 9A, R
D
= 50Ω, VGS = 10V,
G
-6090ns
- 300 450 ns
- 150 225 ns
- 150 225 ns
= 25V, VGS = 0V, f = 1MHz,
(Figure 9)
- - 1700 pF
- - 750 pF
- - 300 pF
RFM18N08, RFM18N10 - - 1.25oC/W
RFP18N08, RFP18N10 - - 1.67oC/W
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage (Note 2) V
Diode Reverse Recovery Time t
SD
rr
NOTES:
2. Pulse test: width ≤ 300µs, duty cycle ≤ 2%.
3. Repetitive rating: pulse width is limited by maximum junction temperature.
ISD = 9A - - 1.4 V
ISD = 4A, dISD/dt = 100A/µs - 150 - ns
5-2

RFM18N08, RFM18N10, RFP18N08, RFP18N10
Typical Performance Curves
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0 50 100 150
TC, CASE TEMPERATURE (oC)
Unless Otherwise Specified
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE
TEMPERATURE
100
10
OPERATION IN
THIS AREA MAY BE
LIMITED BY r
1
, DRAIN CURRENT
D
I
0.1
1 10 100 1000
V
DC OPERA
DS(ON)
, DRAIN TO SOURCE VOLTAGE (V)
DS
TJ = MAX RATED
TC = 25oC
CURVES MUST BE DERATED
LINEARLY WITH INCREASE
IN TEMPERATURE
TION
20
18
16
14
12
10
8
6
, DRAIN CURRENT (A)
D
I
4
2
0
25 50 75 100 125 150
RFP18N08,
RFP18N10
, CASE TEMPERATURE (oC)
T
C
RFM18N08,
RFM18N10
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
35
30
25
20
15
, DRAIN CURRENT (A)
10
D
I
5
0
01234567
VG = 10VVG = 20V
PULSE DURATION = 80µs
DUTY CYCLE ≤ 2%
T
C
V
, DRAIN TO SOURCE (V)
DS
= 25oC
VG = 8V
VG = 7V
VG = 6V
VG = 5V
VG = 4V
8
FIGURE 3. FORWARD BIAS SAFE OPERATING AREA FIGURE 4. SATURATION CHARACTERISTICS
40
VDS = 10V
PULSE DURATION = 80µs
35
DUTY CYCLE ≤ 2%
= 25oC
T
C
30
25
20
15
10
, DRAIN TO SOURCE CURRENT
5
DS(ON)
I
0
0 2341 5678910
V
125oC
, GATE TO SOURCE VOLTAGE (V)
GS
25oC
-40oC
125oC-40oC
0.14
0.12
0.10
0.08
0.06
, DRAIN TO SOURCE
0.04
ON RESISTANCE (Ω)
DS(ON)
r
0.02
PULSE DURATION = 80µs
DUTY CYCLE ≤ 2%
T
= 25oC
C
= 10V
V
GS
0
01020303551525
, DRAIN CURRENT (A)
I
D
FIGURE 5. TRANSFER CHARACTERISTICS FIGURE 6. DRAIN TO SOURCE ON RESISTANCE vs
DRAIN CURRENT
5-3
125oC
25oC
-40oC

RFM18N08, RFM18N10, RFP18N08, RFP18N10
Typical Performance Curves
2.0
V
= 10V
GS
ID = 18A
PULSE DURATION = 80µs
1.5
1.0
ON RESISTANCE
0.5
NORMALIZED DRAIN TO SOURCE
0
-50 0 50 100 150 200
T
, JUNCTION TEMPERATURE (oC)
J
Unless Otherwise Specified (Continued)
FIGURE 7. NORMALIZED DRAIN TO SOURCE ON
RESISTANCE vs JUNCTION TEMPERATURE
2400
VGS = 0V, f = 1MHz
= CGS + C
C
2000
1600
1200
800
C, CAPACITANCE (pF)
400
0
0102030405060
VDS, DRAIN TO SOURCE VOLTAGE (V)
C
C
ISS
RSS
OSS
= C
GD
≈ CDS + C
1.4
VGS = V
DS
ID = 250µA
1.2
1
NORMALIZED GATE
0.8
THRESHOLD VOLTAGE
0.6
-50 0 50 100 150 200
, JUNCTION TEMPERATURE (oC)
T
J
FIGURE 8. NORMALIZED GATE THRESHOLD VOLTA GE vs
JUNCTION TEMPERATURE
100
GD
VDD = BV
GD
C
ISS
C
OSS
C
RSS
75
50
25
, DRAIN TO SOURCE VOLTAGE (V)
DS
V
0
20
DSS
0.75BV
0.50BV
0.25BV
DRAIN SOURCE VOLTAGE
I
G(REF)
I
G(ACT)
GATE
SOURCE
VOLTAGE
DSS
DSS
DSS
t, TIME (µs)
RL = 5.56Ω
I
G(REF)
= 10V
V
GS
VDD = BV
80
= 1mA
DSS
I
G(REF)
I
G(ACT)
10
8
6
4
2
, GATE TO SOURCE VOLTAGE (V)
GS
V
0
FIGURE 9. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
NOTE: Refer to Harris Application Notes AN7254 and AN7260.
FIGURE 10. NORMALIZED SWITCHING WAVEFORMS FOR
CONSTANT GATE CURRENT
5-4

RFM18N08, RFM18N10, RFP18N08, RFP18N10
Test Circuits and Waveforms
t
ON
t
d(ON)
t
R
L
+
V
R
G
DD
-
V
DS
0
r
90%
10%
DUT
V
GS
V
GS
10%
0
50%
PULSE WIDTH
FIGURE 11. SWITCHING TIME TEST CIRCUIT FIGURE 12. RESISTIVE SWITCHING WAVEFORMS
V
DS
D
S
CURRENT
I
D
SAMPLING
(ISOLATED
SUPPLY)
SAME TYPE
AS DUT
DUT
V
DS
V
DD
Q
g(TOT)
Q
gd
Q
gs
V
DS
0
I
G(REF)
0
12V
BATTERY
0
0.2µF
50kΩ
I
G(REF)
CURRENT
REGULATOR
0.3µF
G
IG CURRENT
SAMPLING
RESISTOR RESISTOR
t
d(OFF)
90%
V
GS
t
OFF
50%
t
f
90%
10%
FIGURE 13. GATE CHARGE TEST CIRCUIT FIGURE 14. GATE CHARGE WAVEFORMS
5-5