Datasheet RF2658, RF2658PCBA Datasheet (RF Micro Devices)

ü

5-61

5

MODULATORS AND

UPCONVERTERS

Product Description

Ordering Information

Typical Applications

Features

Functional Block Diagram

RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro,NC 27409, USA

Tel [phone]

Fax [phone]

http://www.rfmd.com

Optimum Technology Matching® Applied

Si BJT GaAs MESFETGaAs HBT
Si Bi-CMOS

SiGe HBT

Si CMOS

Gain

Control

Band Gap
Reference

GOUT

1

MODE

MOD OUT+

10

PD2

Q SIG

Q REF

I REF

I SIG

LO1-

LO1+

13

PD1

LO2+

LO2-

17

Quad.

÷

2

27

GC

RF OUT

Σ

MOD OUT­MIX IN­MIX IN+

24

25

2019

22

21

15

8
9

2
3

5
4

RF2658

TRANSMIT MODULATOR, IF AGC, AND

UPCONVERTER

• CDMA/FM Cellular Systems

• CDMA PCS Systems

• GSM/DCS Systems

• TDMA Systems

• Spread Spectrum Cordless Phones

• Wireless Local Loop Systems

The RF2658 isan integrated complete Quadrature Modu­lator, IF AGC amplifier, and Upconverter developed for
the transmit section of dual-mode CDMA/FM cellular and
PCS applications and for GSM/DCS and TDMA systems.
It is designed to modulate baseband I and Q signals,
amplify the resulting IF signals while providing 95dB of
gain control range, and perform the final upconversion to
UHF. Noise Figure, IP

3

, and other specifications are
designed to be compatible with the IS-98 Interim Stan­dard for CDMA cellular communications. This circuit is

part of RFM D’s line of complete solutions for digital radio
applications. The IC is manufactured on an advanced
15 GHz F

T

Silicon Bipolar process, and is supplied in a

28-lead plastic SSOPpackage.

• Similarto RF9958with increased IF range

• Supports Dual Mode Operation

• Digitally Controlled Power Down Modes

• 2.7V to 3.3V Operation

• Double-Balanced UHF Upconvert Mixer

•IFAGCAmpwith95dBGainControl

RF2658 Transmit Modulator, IF AGC, and Upconverter
RF2658 PCBA Fully Assembled Evaluation Board

5

Rev A8 010720

6.20

5.79

3.99

3.81

10.01

9.80

7°

8°
0°

1.27

0.38

0.25

0.10

1.73

1.47

0.635
TYP

0.36

0.23

TYP

0.25

0.10

PIN 1

INDENT

NOTES:

1. Shaded lead is Pin1.

2. Lead frame material: Copper 194

3. Mold flash shall not exceed 0.006 (0.15 mm) per end.

4. Interlead flash shall not exceed 0.010 (0.25 mm) per side.

5. All dimensions are excluding mold flash and protrusions.

Package Style: QSOP-28

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5

MODULATORS AND

UPCONVERTERS

Absolute Maximum Ratings

Parameter Rating Unit

Supply Voltage -0.5 to +5 V

DC

Power Down Voltage (VPD) -0.5toVCC+0.7 V
I and Q Levels, per pin 1 V

PP

LO1 Level, balanced +3 dBm
LO2 Level, balanced +6 dBm
Operating Ambient Temperature -40 to +85 °C
Storage Temperature -40 to +150 °C

Parameter

Specification

Unit Condition

Min. Typ. Max.

I/Q Modulator & AG C

T=25 °C, VCC=3.0V, Z

LOAD

=50Ω,

LO1=-8dBm@260MHz,
LO2=-3dBm@960MHz,
I SIG=Q SIG=300mV

PP

,

RF Output externally matched
I/Q Input Fr equency Range 0 to 20 MHz Balanced
I/Q Input Impedance 50 80 110 kΩ Balanced
I/Q Input Reference Level 0.6 V

DC

Per Pin
LO1/FM Frequency R ange 240 to 600 MHz

LO1/FM Input Level -15 -8 -5 dBm
LO1/FM Input Impedance 170 200 230 Ω Balanced
Sideband Suppression 35 40 dBc I/Q Amplitude adjusted to within ±20mV

30 dBc Unadjusted

Carrier Suppression 40 50 dBc I/Q DC Offset adjusted towithin ±20mV

30 dBc Unadjusted

Max Output, FM Mode +2.5 +4 dBm V

GC

=2.5 V

DC

Max Output, CDMA Mode -3 0 dBm VGC=2.5 V

DC

Min Output, CDMA Mode -95 -89 dBm VGC=0.5 V

DC

Adjacent Channel Power Rejec-

tion @ 885kHz

-55 dBc IS-95A CDMA Modulation
P

OUT

=-5dBm

Adjacent Channel Power Rejec-

tion @ 1.98MHz

-67 dBc IS-95A CDMA Modulation
P

OUT

=-5dBm

Output Noise Power -116 -111 dBm/Hz P

OUT

=-3dBm

Output Noise Power -164 -159 dBm/Hz P

OUT

<-70dBm

Output PowerAccuracy -3 +3 dB T=-20 to +85°C, Ref=25°C
Output Impedance 170 200 230 Ω Balanced

UHF Upconverter

Output externally matched

Conversion Gain -1 0.5 dB
Noise Figure (SSB) 15 dB
Output IP3 +14 dBm
IF Input Impedance 170 200 230 Ω Balanced
IF Input Frequency Range 120 to 300 MHz
LO2 Input Impedance 50 Ω Single Ended
LO2 Input Level -6 -3 0 dBm
LO2 Input Frequency Range 700 to 1100 MHz
RF to LO2 Isolation 20 dB

Power Supply

Supply Voltage 2.7 3.0 3.3
Current Consumption 43 mA Modulator and AGC only, CDMA Mode
Current Consumption 20 mA Mixer Only
Power Down Current 20 µA
V

PD

HIGH Voltage VCC-0.7

V

PD

LOW Voltage 0.5

Caution! ESD sensitive device.

RF Micro Devices believesthe furnishedinformation is correctand accurate
at the time of this printing. However, RF Micro Devices reserves the right to
make changes to its products without notice. RF Micro Devices does not
assume responsibility for the use of the described product(s).

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RF2658

Rev A8 010720

5

MODULATORS AND

UPCONVERTERS

Pin Funct ion Description Interface Schematic

1MODE

Selects between CDMA and FM mode. This is adigitally controlled
input. A logic “high” (≥V

CC

-0.7VDC) selects CDMA mode. A logic “low”

(≥0.5V

DC

) selects FM mode. In FM mode, this switch enables the FM

amplifier and turns off the I&Q modulator. The impedance on this p in is
30kΩ.

2QSIG

Baseband input tothe Qmixer. This pin isDC coupled. The DC level of

0.6V must be supplied to this pin to bias the transistor. Input imped­ance of this pin is 50kΩ m inimum.

3QREF

Reference voltage for the Q mixer. This voltage should be the same as
the DC voltage supplied to the Q SIG pin. For maximum c a rrier sup­pression, DC voltage on this pin relative to the Q SIG DC voltage may
be adjusted. Input impedance of this pin is 50kΩ minimum.

See pin 2.

4IREF

Reference voltage for the I mixer. This voltage should be the same as
the DC voltage supplied to the I SIG pin. For maximum carrier suppres­sion, DC voltage on this pin relative to the I SIG DC voltage may be
adjusted. Input impedance of this pin is 50kΩ minimum.

See pin 5.

5ISIG

Baseband input to the I mixer. This pin is DC coupled. The DC level of

0.6V must be supplied to this pin to bias the transistor. Input imped­ance of this pin is 50kΩ m inimum.

6GND1

Ground connection for all baseband circuits including bandgap,AGC,
flip-flop, modulator and FM amp. Keep traces physically short and con­nect immediately to ground plane for best performance.

7VCC1

Supply voltage for the LO1 flip-flo p andlimitin g amponly. This supply is
isolated to minimize the carrier leakage. A 1nF external bypass capaci­tor is required, and an additional 0.1µF will be required if no other low
frequency bypass capacitors are nearby.The trace length between the
pin and the bypass capacitors should be minimized. The ground side of
the bypass capacitors should connect immediately to ground plane.
The part is designed to work from 2.7V to 3.3 V supply.

8LO1+,FM+

One half of the balanced modulator LO1 input. The other half of the
input, LO1-, is AC grounded for single-ended input applications. The
frequency on these pins is divided by a factor of 2, hence the carrier
frequency for the modulator becomes one halfof the appliedfrequency.
The single-ended input impedance is 100Ω (balanced is 200Ω). This
pin is NOTinternally DC blocked. An external blocking capacitor (1nF
recommended) must be provided if the pin is connected to a device
with DC present. When FM mode is selected, the output of the flip-flop
divider circuit is switched to the AGC amplifier inputs andthemodulator
mixers are not used. Note that the frequency deviation input here will
be reduced by a factor of two, due to the frequency divider operation.

9LO1-,FM-

One half of the balanced modulator LO1 input. In single-ended applica­tions (100Ω input impedance), this pin is AC grounded with a 1nF
capacitor.

See pin 8.

10 BG OUT

Bandgap voltage reference. This voltage, constant overtemperature
and supply variation, is used to bias internal circuits. A 1nF external
bypass capacitor is required.

60 k

Ω

60 k

Ω

BIAS

MODE

8k

Ω

8k

Ω

Q SIG Q REF

BIAS BIAS

8k

Ω

8k

Ω

I SIG I REF

BIAS BIAS

100

Ω

100

Ω

LO1+, FM+ LO1-, FM-

V

CC1

V

CC1

5-64

RF2658

Rev A8 010720

5

MODULATORS AND

UPCONVERTERS

Pin Function Description Interface Schematic

11 VCC3

Supply voltage for the AGC and the Bandgap circuitry. A 1nF external
bypass capacitor is required and an additional 0.1µF will be required if
no other low frequency bypass capacitors are nearby. The trace length
between the pin and the bypass capacitors should be minimized. The
ground side of the bypass capacitors should c onnect immediately to
ground plane. The part is designed to work from 2.7V to 3.3V supply.

12 GND1

Same as pin 6.

13 PD1

Power down control for overall circuit. When logic “high” (≥VCC-0.7V),
all circuits are operating; when logic “low” (<0.5V), all circuits are

turned off. The input impedance of this pin is >10kΩ.

14 VCC4

Supply for the mixer stage only.The supply for the mixer is separated to
maximize IF to RF isolations and reduce the carrier leakage. A 100pF
external bypass capacitor is required and an additional 0.1µFwillbe
required if no other low f requency bypass capacitors are near by. The
trace length between the pin and the bypass capacitors should be min­imized. The ground side of the bypass capacitors should connect
immediately to ground plane. The part is designed to work from 2.7V to

3.3V supply.

15 PD2

Power down control for mixer only. When connected to pin 10 (BG
OUT) the mixercircuits are operating; when connected to ground
(≤0.5V), the mixer is turned off but all other circuits are operating.

16 GND2

Ground conn ection for the mixerstage. Keeptraces physically short
and connect immediately to ground plane for best performance.

17 RF OUT

RF output pin. An external shunt inductor to VCCplus a series blocking/
matching capacitor are required for 50Ω output.

18 DEC

Current mirror decoupling pin. A 1000pF external capacitor is required
to bypass this pin. The ground side of the bypass capacitors sh ould
connect immediately to ground plane.

19 LO2+

One half of the balanced mixerLO2 input. In single-ended applications,
the other half of the input, LO2- is AC grounded. This is a 50Ω imped­ance port. This pin is NOT internally DC blocked. An external blocking
capacitor (100pF recommended) must be provided if the pin is con­nected to a device with DC present.

20 LO2-

One half of the balance mixer LO2 input. In single ended applications,
this pin is AC grounded with a 100pF capacitor.

See pin 19.

21 MIX IN-

One half of the 200Ω balanced impedance input to the mixer stage.
This pin is NOT internally DC blocked. An external blocking capacitor
(2200pF recommended) must be provided if the pin is connected to a
device with DC present. If no IF filter is needed, this pin may be con­nected to MOD OUT+ through a DCblocking capacitor. An appropriate
matching n etwork may be needed if an IF filter is used.

22 MIX IN+

Same as pin 21, except complementary input. See pin 21.

10 k

Ω

PD1

1k

Ω

PD2

450

Ω

300

Ω

V

CC4

RF OUT

40

Ω

BIAS

40

Ω

BIAS

LO2+ LO2-

100

Ω

BIAS

100

Ω

BIAS

MIX IN- MIX IN+

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RF2658

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5

MODULATORS AND

UPCONVERTERS

Pin Funct ion Description Interface Schematic

23 GND2

Same as pin 16.

24 MOD OUT-

One half of the balanced AGC output port. The imp edance of this port
is 200Ω balanced. If no filtering is required, this pin can be connected
to the MIX IN- pin through aDC blocking capacitor. Thispin requires an
inductor to V

CC

to achieve full dynamic range. In order to maxim ize

gain, this inductor should be a high-Q type and should be parallel reso­nated out with a capacitor (see application schematic). This pin is NOT
DC blocked. A blocking capacitor of 2200pF is needed when this pin is
connected to a DC path. An appropriate matching network may be
needed if an IF filter is used.

25 MOD OUT+

Same as pin 24, except complementary output. See pin 24.

26 DEC

AGC decoupling pin. An external bypass capacitor of 10nF capacitor is
required. The trace length between the pin and the bypass capacitors
should be minimized. The ground side of the bypass capacitors should
connect immediately to ground plane.

27 GC

Analog gain control for AGC amplifiers. Valid control voltage ranges are
from 0.5V

DC

to 2.5VDC. The gain range for the AGC is 88dB. These

voltages are valid ONLY for a 37kΩ source impedance.

28 VCC2

Supply for the modulator stage only. A 10nF external bypass capacitor
is required and an additional 0.1µF will be required if no other low fre­quency bypass capacitors are nearby.The trace length between the pin
and the bypass capacitors should be minimi zed. The ground sideof the
bypass capacitors should connect immediately to ground plane. The
part is designed to work from 2.7V to 3.3V supply.

100Ω100

Ω

MOD OUT­MOD OUT+

V

CC3

V

CC3

21 k

Ω

GC

40 k

Ω

BIAS

5-66

RF2658

Rev A8 010720

5

MODULATORS AND

UPCONVERTERS

RF2658 Pin-Out

1

2

3

4

5

6

7

8

9

10

11

12

13

14

28

27

26

25

24

23

22

21

20

19

18

17

16

15

MODE

Q SIG

Q REF

I REF

I SIG

GND1

VCC1

LO1+

LO1-

BG OUT

VCC3

GND1

PD1

VCC4

VCC2

GC

DEC

MOD OUT+

MOD OUT-

GND2

MIX IN+

MIX IN-

LO2-

LO2+

DEC

RF OUT

GND2

PD2

5-67

RF2658

Rev A8 010720

5

MODULATORS AND

UPCONVERTERS

Application Schematic

1

2

3

4

5

6

7

8

9

10

11

12

13

14

28

27

26

25

24

23

22

21

20

19

18

17

16

15

MODE

Q SIG

Q REF

I REF

I SIG

GND1

VCC1

LO1+

LO1-

BG OUT

VCC3

GND1

PD1

VCC4

VCC2

GC

DEC

MOD OUT+

MOD OUT-

GND2

MIX IN+

MIX IN-

LO2-

LO2+

DEC

RF OUT

GND2

PD2

Q Signal

I Signal

Reference

10 nF

Mode Select

Gain Control

1nF

37 k

Ω

10 nF

V

CC

IF Filter,

DC Blocked

1000 pF

1nF

Power Down 2

100 pF

100 pF

LO2 In

L1

C1

RF Out

V

CC

1nF

10 nF

1nF

Power Down 1

V

CC

1nF

10 nF

100 pF

LO1/FM In

10 nF

V

CC

18 pF

82 nH

18 pF

82 nH

10 nF

5-68

RF2658

Rev A8 010720

5

MODULATORS AND

UPCONVERTERS

Evaluation Board Schema t ic

(Download Bill of Materials from www.rfmd.com.)

R3

0 Ω

MODE

Q SIG

Q REF

I REF

I SIG

GND1

VCC1

LO1+

LO1-

BG OUT

VCC3

GND1

PD1

VCC4

VCC2

GC

DEC

MOD OUT+

MOD OUT-

GND2

MIX IN+

MIX IN-

LO2-

LO2+

DEC

RF OUT

GND2

PD2

1

2

3

4

5

6

7

8

9

10

11

12

13

14

28

27

26

25

24

23

22

21

20

19

18

17

16

15

L2

12 nH

C7

1nH

VCC

C14

1.3 pF

C13

33 pF

L1

15 nH

50 Ωµstrip

J7

RF OUT

C11

1000 pF

C18

100 pF

50 Ωµstrip

J6

LO2 IN

C12

100 pF

C17

2.2 nF

C16

2.2 nF

50 Ωµstrip

J5

MIX IN

50 Ωµstrip

J4

MOD OUT

T1

1

C15

10 nF

T2

1

VCC

C8

10 nF

C10
1nF

R2

10 kΩR127 kΩ

VGC

C9

10 nF

VCC

C20
1 µF

C6

1nF

C5

1nF

C4

100 nF

C3

1nF

C1

1nF

50 Ωµstrip

J1

LO IN

VCC

PD1

J2

I SIG

C2

10 nF

C19
1 µF

I REF

J3

Q SIG

MODE

P2

1
2
3

P2-1 VCC

GND

P2-3 I REF

P1

1
2
3

P1-1 MODE

GND

P1-3 GC

GND

GND

PD1P3-4

P3

1
2
3
4
5

5-69

RF2658

Rev A8 010720

5

MODULATORS AND

UPCONVERTERS

Evaluation Board Layout

Board Size 2.689" x 2.521"

5-70

RF2658

Rev A8 010720

5

MODULATORS AND

UPCONVERTERS