Datasheet RF2641, RF2641PCBA, RF2642PCBA Datasheet (RF Micro Devices)

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MIXERS

Product Description

Ordering Information

Typical Applications

Features

Functional Block Diagram

RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro,NC 27409, USA

Tel [phone]

Fax [phone]

http://www.rfmd.com

Optimum Technology Matching® Applied

Si BJT GaAs MESFETGaAs HBT
Si Bi-CMOS

ü

SiGe HBT

Si CMOS

1

2

3

4

8

7

6

5

IF-

IF+

BYP

LO-

RF OUT

VCC

GND

LO+

RF2641

CDMA UPCONVERTER/BPSK MODULATOR

• PCS/Cellular CDMA Systems

• PHS 1500/ WLAN 2400 Systems

• General Purpose Upconverter

• BPSK Modulation

• Micro-Cell PCS Base Stations

• Portable Battery-Powered Equipment

The RF2641 is a complete upconverter designed for cel­lular and PCS applications.This device may also be used
to directly BPSK modulate a carrier. The unit operates at

3.0 V and is designed as par t of the RFMD PCS/Cellular
CDMA Chip Set, consisting of a Transmit IF AGC Amp,
this Transmit Upconverter, a Receive LNA/Mixer, and a
Receive IF AGC Amp.

• Supports Dual Mode Operation

• +5.5dBm Output Intercept Point

• 7dB Conversion Gain (836MHz)

• Single 3.0V Power Supply

• Miniature 8 Pin Package

• Double-Balanced Mixer

RF2641 CDMA Upconverter/BPSK Modulator
RF2641 PCBA Fully Assembled EvaluationBoard

6

Rev A5 010720

NOTES:

1. Shaded lead ispin 1.

2. All dimensions are exclusiveof
flash, protrusions or burrs.

3. Lead coplanarity: 0.002 with
respect to datum "A".

0.012

6° MAX

0° MIN

0.021

+0.004

0.006

+0.002

0.192

+ 0.008

0.0256

0.118

+0.004sq.

0.006

+0.003

0.034

-A-

Package Style: MSOP-8

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Absolute Maximum Ratings

Parameter Rating Unit

Supply Voltage -0.5 to +5.0 V

DC

Input RF Power +3 dBm
Operating Ambient Temperature -30 to +80 °C
Storage Temperature -30 to +150 °C

Parameter

Specification

Unit Condition

Min. Typ. Max.

Overall

T=25°C, VCC=3.0V, IF=130MHz

RF Output Frequency Range 500 to 2500 MHz
Conversion Gain 5 7 dB RF out= 836MHz, LO=-3dBm@960MHz

4 dB RF out= 1880MHz, LO=-3dBm@2010MHz

Noise Figure 10 dB RF out= 836MHz

11 dB RF out=1880MHz

Output IP3 +3 +5.5 dBm P

IN

=-18dBm per Tone, RF out=836MHz

+4 P

IN

=-18dBm per Tone, RF out=1880MHz

Spurious Product Rejection 30 dBc Referenced to RF output

IF Input

IF Frequency DC to 300 MHz
Differential Input Impedance 260 Ω
IF to RF Output Isolation 30 dB
IF to LO Isolation 30 dB

LO Input

LO Frequency Range 300 to 2700 MHz
LO Level -6 to 0 dBm
LO to RF Output Leakage -15 -20 dBm
RF to LO Isolation 30 dB
LO Input VSWR 2:1 50Ω

Power Supply

Voltage 2.7 to 3.3 V
Current Consumption 13 16 mA

Caution! ESD sensitive device.

RF Micro Devices believes the furnished information is correct and accurate
at the time of this printing. However, RF Micro Devices reserves the right to
make changes to its products without notice. RF Micro Devices does not
assume responsibility for the use of the described product(s).

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Pin Funct ion Description Interface Schematic

1IF-

Balanced IF input pin. This pin is internally DC-biased and should be
DC-blocked if connected to a device with a DC levelpresen t. For single­ended input operation, one pin is used as an input and the other IF
input is AC-coupled to ground. The balanced, as well as single-ended,
input impedance is 260Ω.

2IF+

Same as pin 1, except complementary input. See Pin 1.

3BYP

Bypass pin for internal bias circuitry.Bypass with a 1nF capacitor.

4LO-

Balanced LO input pin. This pin is internally DC -biased and should be
DC-blocked if connected to a device with a DC levelpresen t. For single­ended input operation, one pin is u sed as an input and the other LO
input is AC-coupled to ground. The balanced, as well as single-ended,
input impedance is 50Ω.

5LO+

Same as pin 4, except complementary input. See Pin 4.

6GND

Ground connection. For best performance, keep traces physically short
and connect immediately to ground plane.

7VCC

Supply voltage pin. External bypassing is required. External RF, LO,
and IF bypassing is required. The trace length between the pin an d the
bypass capacitors should be minimized. The ground side of the bypass
capacitors should connect immediately to ground plane.

8RFOUT

RF output pin.

IF+IF-

130

Ω

130

Ω

BIAS

BYP

LO+LO-

BIAS

300

Ω

RF OUT

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Applicatio n Schematic

836MHz

Applicatio n Schematic

1880MHz

RF OUTIF-

IF+

LO

V

CC

1

2

3

4

8

7

6

5

12 nH

V

CC

1nF

1nF

1nF

12 pF

10 nF

2pF

10 nF

12 pF

RF OUTIF-

IF+

LO

V

CC

1

2

3

4

8

7

6

5

2.7 nH

V

CC

1nF

1nF

1nF

12 pF

10 nF

1.5 pF

10 nF

12 pF

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Evaluation Board Schematic

PCS Board

(Download Bill of Materials from www.rfmd.com.)

Evaluation Board Schematic

Cellular Board

1

2

3

4

8

7

6

5

C6

1.5 pF

50Ωµstrip

J3

RF OUT

L2

2.7 nH

VCC

C7

10 nF

C1

10 nF

C4

12 pF

C3

12 pF

50Ωµstrip

J1

LO

C2

1nF

T1

T4-1

L1

270 nH

C2

1nF

50Ωµstrip

J2

IF IN

2641400, R-

PCS Board

P1-1

P1

1
2
3

VCC
GND

1

2

3

4

8

7

6

5

C6

2pF

50Ωµstrip

J3

RF OUT

L2

12 nH

VCC

C7

10 nF

C1

10 nF

C4

12 pF

C3

12 pF

50Ωµstrip

J1

LO

C2

1nF

T1

T4-1

L1

270 nH

C2

1nF

50Ωµstrip

J2

IF IN

2641401, R-

Cellular Board

P1-1

P1

1
2
3

VCC
GND

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Evaluation Board Layout

Board Thickness 0.014”; Board Material FR-4