Datasheet RF2484, RF2484PCBA Datasheet (RF Micro Devices)

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5
MODULATORS AND
UPCONVERTERS
Preliminary
Product Description
Ordering Information
Features
Functional Block Diagram
RF Micro Devices, Inc. 7625 Thorndike Road Greensboro,NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Optimum Technology Matching® Applied
Si BJT GaAs MESFETGaAs HBT Si Bi-CMOS
SiGe HBT
Si CMOS
GND
QREF
IREF
ISIG
QSIG
GND
VCC
PD
RF OUT
GND
GND
GND
VCC
GND
GND
LO
Σ
-45° +45°
5
13
12
11
10
14
7 86 9
15161
2
3
4
RF2484
DIRECT QUADRATURE MODULATOR
• Dual-Band CDMA Base Stations
• TDMA/TDMA-EDGE Base Stations
• GSM-EDGE/EGSM Base Stations
• W-CDMA Base Stations
• WLAN and WLL Systems
• GMSK,QPSK,DQPSK,QAM Modulation
The RF2484 is a monolithic integrated quadrature modu­lator IC capable of universal direct modulation for high­frequency AM, PM, or compound carr iers. This low-cost IC features excellent linearity, noise floor, and over-tem­perature carrier suppression performance. The device implements differential amplifiers for the modulation inputs, 90° carrier phase shift network, carrier limiting amplifiers, two matched double-balanced mixers, sum­ming amplifier, and an output RF amplifier which will drive 50 from 800MHz to 2500MHz. It is packaged in a small industry-standard LCC 16-pin plastic package.
• Typical Carrier Suppression >35dBc, Sideband Suppression >35dBc over temperature with highly linear operation
• Noise Floor better than -152 dBm/Hz from 800MHz to 2200MHz
• Single 5V Power Supply
RF2484 Direct Quadrature Modulator RF2484 PCBA Fully Assembled Evaluation Board
5
Rev A2 010829
3.75
3.75
+
1.50 SQ
4.00
4.00
1
0.45
0.28
3.20
1.60
0.75
0.50
12°
INDEX AREA
3
1.00
0.90
0.75
0.65
0.05
0.00
NOTES:
5 Package Warpage: 0.05 max.
4 Pins 1 and 9 are fused.
Shaded Pin is Lead 1.1 Dimension applies to plated terminal and is measured between
0.10 mm and 0.25 mm from terminal tip.
2
The terminal #1 identifier and terminal numbering convention shall conform to JESD 95-1 SPP-012. Det ails of terminal #1 identifier are optional, but must be loc ated within the zone indicated. The identif ier may be either a mold or marked feature.
3
0.80 TYP
2
1
Dimensions in mm.
Package Style: LCC, 16-Pin
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Preliminary
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MODULATORS AND
UPCONVERTERS
Absolute Maximum Ratings
Parameter Rating Unit
Supply Voltage -0.5 to +7.5 V
DC
Input LO and RF Levels +10 dBm Operating Ambient Temperature -40 to +85 °C Storage Temperature -40 to +150 °C
Parameter
Specification
Unit Condition
Min. Typ. Max.
LO Input
T= 25°C, VCC=5V,V
REF
=4.1V;IandQ
driven single-ended Frequency Range 800 2500 MHz Power Level -6 +6 dBm Input Impedance 45- j95 At 880MHz
52-j54 At 1960MH z 58-j50 At 2140MH z 63-j40 At 2400MH z
Modulation Input
Frequency Range DC 250 MHz Reference Voltage (V
REF
)4.1V
Input Resistance 30 k Input B ias Current 40 µA
RF Output (880MHz)
LO= -5dBm at 880MHz; Single s ideband
testing unless otherwise noted CDMA Output Channel Power -12 dBm For ACPR=-72dBc; I&Q Amplitude =1.1V
PP
(single-ended) CDMA ACPR -72 dBc Channel Power=-12dBm; see TestSetup for
detailed information Carrier Suppression 50 dBc T=25°C; P
OUT
=-10 dBm; optimized I,Q DC
offsets Carrier Suppression
over Temperature
35 dBc Temperature cycled from -40°C to +85°C
after optimization at T=25°C; P
OUT
=-10 dBm
Sideband Suppression 50 dBc T=25°C; P
OUT
=-10 dBm; optimized I,Q
amplitude and phase balanc e Sideband Suppression
over Temperature
35 dBc Temperature cycled from -40°C to +85°C
after optimization at T=25°C; P
OUT
=-10 dBm
Broadband Noise Floor -152.5 dBm/Hz At 20MHz offset, 30kHz res BW, V
CC
=5V;
ISIG, QSIG, IREF, and QREF tied to V
REF
EVM 2.3 % See Test Setup for detailed information Phase Error 1 ° RMS See Test Setup for detailed information Rho .9993 See Test Setup for detailed info rmation Output Impedance 28- j72
RF Output (1960 MHz)
LO=-5 dBm at 1960MHz; Single sideband
testing unless otherwise noted PCS CDMA Output Power -13 dBm For ACPR=-72dBc; I&Q Amplitude=1.2V
PP
(single-ended) PCS CDMA ACPR -72 dBc Channel Power=-13dBm; see Test Setup for
detailed information Carrier Suppression 50 dBc T=25°C; P
OUT
=-13 dBm; optimized I,Q DC
offsets Carrier Suppression
over Temperature
35 dBc Temperature cycled from -40°C to +85°C
after optimization at T=25°C; P
OUT
=-13 dBm
Sideband Suppression 50 dBc T=25°C; P
OUT
=-13 dBm; optimized I,Q
amplitude and phase balanc e Sideband Suppression
over Temperature
35 dBc Temperature cycled from -40°C to +85°C
after optimization at T=25°C; P
OUT
=-13 dBm
Caution! ESD sensitive device.
RF Micro Devices believesthe furnished information is correct and accurate at the time of this printing. However, RF Micro Devices reserves the right to make changes to its products without notice. RF Micro Devices does not assume responsibilityfor the use of the described product(s).
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MODULATORS AND
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Parameter
Specification
Unit Condition
Min. Typ. Max.
RF Output (1960MHz) cont’d
Broadband Noise Floor -154.5 dBm/Hz At 20MH z offset, 30kHz res BW, VCC=5V;
ISIG, QSIG, IREF, and QREF tied to V
REF
EVM 2.3 % See Test Setup for detailed information Phase Error 1 ° RMS See Test Setup for detailed information Rho .9988 See Test Setup for detailed information Output Impedance 46- j22
RF Output (2140MHz)
LO= -5dBm at 2140MHz; Singl e sideband testing unless otherwise noted
W-CDMA Output Channel Power -16 dBm For ACPR=-60dBc; I&Q Amplitude=1.4V
PP
(single-ended)
W-CDMA ACPR -60 dBc Channel Power=-16dBm; see TestSetup for
detailed information
Carrier Suppression 50 dBc T=25°C; P
OUT
=-13dBm; optimized I,Q DC
offsets
Carrier Suppression
over Temperature
35 dBc Temperature cycled from -40°C to +85°C
after optimization at T=25°C; P
OUT
=-13dBm
Sideband Suppression 50 dBc T=25°C; P
OUT
=-13dBm; optimized I,Q
amplitude and phase balance
Sideband Suppression
over Temperature
35 dBc Temperature cycled from -40°C to +85°C
after optimization at T=25°C; P
OUT
=-13dBm
Broadband Noise Floor -152 dBm/Hz At 20MHz offset, 30kHz res BW, VCC=5V;
ISIG, QSIG, IREF, and QREF tied to V
REF
EVM 5.9 % See Test Setup for detailed information Phase Error 2.4 ° RMS See Test Setup for detailed information Rho .9961 See Test Setup for detailed information Output Impedance 58- j16
Power Down
Turn On/Off Time 100 ns PD Input Resistance 50 k Power Control “ON” 2.8 V Threshold voltage Power Control “OFF” 1.0 1.2 V Threshold voltage
Power Supply
Voltage 5.0 V Specifications
4.5 6.0 V Operating Limits
Current 66 70 mA
25 µA Power Down
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MODULATORS AND
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Pin Function Description Interface Schematic
1GND
Ground connection. This pin should be connected directly to the ground plane.
2GND
Same as pin 1.
3GND
Same as pin 1.
4LO
The input of the phase shifting network. This pin has an internal DC blocking capacitor. This port is voltage-driven so matching at different frequencies is generally not required.
5GND
Same as pin 1.
6VCC
Powersupply. An external capacitor is needed if no other low frequ ency bypass capacitor is nearby.
7PD
Power Down control. When this pin is "low," all circuits are shut off. A "low" is typically 1.2V or less at room temperature.When this pin is "high"(V
CC
), all circuits are operating normally. If PD is below VCC, out-
put power and performance will be degraded. Operating in this region is not recommended, although it might be useful in some applications where power control is req uired.
8RFOUT
RF Output. This pin has an internal DC blocking capacitor. At some fre­quencies, external matching may be needed to optimize output power. A s mall amount of DC current may be present at this output. As a result, if the voltage at this pin is measured using a high impedance probe, some DC voltage may be observed at this output.
9GND
Same as pin 1.
10 VCC
Same as pin 6.
11 GND
Same as pin 1.
12 GND
Same as pin 1.
13 Q SIG
Baseband input to the Q mixer. This pin is DC coupled. The input drive level determines output power and linearity performance; for better car­rier suppression, sideband suppression, and dynamic range, the drive level should be as high as possible to meet the required linearity perfor­mance. The recommended DC level for this pin is 4.1V.
For optimum carrier suppression, the DC voltages on I REF, Q REF, I SIG and Q SIG should be adjusted slightly to compensate for inherent undesired internal DC offs ets; for optimum sideband suppression, phase and signal amplitude on IREF, Q REF, I SIG and Q SIG should be adjusted slightly to compensate for inherent undesired internal off­sets. See RFMD AN0001 for more detail.
14 I SIG
Baseband input to the I mixer. This pin is DC coupled. The input drive level determines output power and linearity performance; for better car­rier suppression, sideband suppression, and dynamic range, the drive level should be as high as possible to meet the required linearity perfor­mance. The recommended DC level for this pin is 4.1V; see pin 13 fo r more information.
15 I REF
Reference voltage for the I mixer. This voltage should be the same as the DC voltage supplied to the I SIG pin. A voltage of 4.1V is recom­mended; see pin 13 for more information.
The SIG and RE F inputs are inputs of a differential amplifier. Therefore the REF and SIG inputs are interchangeable. If swapping the I SIG and I REF pins, the Q SIG and Q REF also need to be swapped to maintain the correct phase. It is also possible to drive the SIG and RE F inputs in a d ifferential mode. This will increase the gain.
LO
200
PD
V
CC
RF OUT
100
1p
V
CC
100
1p
V
CC
100
1p
V
CC
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MODULATORS AND
UPCONVERTERS
Pin Function Description Interface Schematic
16 Q REF
Reference voltage for the Q mixer. This voltage should be the same as the DC voltage supplied to the Q SIG pin. A voltage of 4.1V is recom­mended; see pin 13 for more information.
Pkg
Base
GND
Ground connection. The package base should be connected to the ground plane.
100
1p
V
CC
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MODULATORS AND
UPCONVERTERS
CDMA/W-CDMA Test Setup
General
The above setup was used to evaluate the RF2484 under CDMA and W-CDMA modulation conditions. Due to test equipment limitations, a DC-level shifting board was required to provide the appropriate DC ref­erence voltage (4.1V) for the I and Q pins. I and Q were driven single-endedly; differential drive may improve perfor mance. A PC-controlled Rohde & Schwarz AMIQ generated the CDMA I and Q signals. In order to reduce AMIQ noise contributions to adja­cent channel power, W-CDMA baseband signals were filtered using a high order low pass filter before appli­cation to the R F2484.
EVM, Phase Error, and Rho
To measure EVM, phase error, and Rho, signals were generated using the AMIQ and decoded with the Agi­lent VSA. For CDMA Cellular and PCS, I and Q input signals were generated with the Pilot Channel active, 32x oversampling and base station equifilters. For W­CDMA, the Common Pilot Channel was active with 8x oversampling and a root cosine filter. In all cases, rela­tive signal amplitude levels were adjusted to optimize signal quality.
CDMA Modulation Setup (Cellular and PCS)
To measure ACPR, I and Q input signals were gener­ated using the following settings:
• Pilot Channel active
• Sync Channel active
• Paging Channel active
• 6 Traffic Channels active
• 32x Oversampling
• Base Station equifilter
W-CDMA Modulation Setup
To measure W-CDMA ACPR, I and Q input signals were generated using the following settings in the AMIQ:
• P-CPICH (Common Pilot Channel) active
• P-SCH (Sync Channel) active
• P-CCPCH (Primary Common Control Physical Channel) active
• P-ICH (Page Indicator Channel) Active
• DL-DPCCH (Dedicated Physical Control Channel) active
• 6 DPCH (Dedicated PhysicalChannels) active
•8xOversampling
Rohde & Schwarz
AMIQ 1110.2003.02
RF2484 DC Level Shift
Control Board
RF2484
Evaluation Board
Rohde & Schwarz
FSIQ 1119.6001.26
Hewlett-Packard
8665B
ISIG
RF OUT
LO IN
IREF QSIG QREF
Agilent 66332A
VCC VPD
Hewlett-Packard
6624A
Agilent 89441
Vector Signal Analyzer
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MODULATORS AND
UPCONVERTERS
Application Schematic
-45° +45°
5
13
12
11
10
14
7 86 9
15161
2
3
4LO
VCC PD RF OUT
VCC
QSIG
ISIG
QREF
IREF
100 nF3pF
100 nF3pF
100 nF3pF
100 nF 100nF
Σ
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MODULATORS AND
UPCONVERTERS
Evaluation Board Schema t ic
(Download Bill of Materials from www.rfmd.com.)
VCC
VREF/QREF
IREF
C8
100 nF
C7
3pF
C6
100 nF
C5
3pF
C2
100 nF
C1
3pF
C3
3pFC4100 nF
J2
LO
J1
RFOUT
VCC
J4
QSIG
J3
ISIG
R1a*
0
R1
0
U1
-45° +45°
5
13
12
11
10
14
7 86 9
15161
2
3
4
Σ
P1
1 2 3
CON3
P1-1 VCC
GND GND
P2
1 2 3
CON3
P2-3 IREF
GND
P2-1 VREF/QREF
2484400-
NOTES:
1. R1 is installed for non-independent control of I and Q reference voltages. R1a gives independent control of reference voltages.
2. Components with * following the reference designator should not be populated on the evaluation board.
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UPCONVERTERS
Evaluation Board Layout
Board Size 2.0" x 2.0"
Board Thickness 0.028”, Board Material FR-4
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MODULATORS AND
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RF2484 CellularCDMA Spectra at VariousOutput Levels
(ACPR @ 885kHz, Vcc= 5.0V, Vref= 4.1V, T = 25°C)
-100
-90
-80
-70
-60
-50
-40
-30
-20
877.5 878 878.5 879 879.5 880 880.5 881 881.5 882 882.5
Frequency (MHz)
Power (dBm)
CP = -10.6dBm; ACPR = -70 dBc
CP = -12.0dBm; ACPR = -72 dBc
CP = -14.7dBm; ACPR = -73 dBc
CP = -9.5dBm; ACPR = -68 dBc
Note: Below~-90dBm, test setup noise inhibits accurate ACP measurement.
RF2484 Output Power versus I, Q Input Voltage Level
(Vcc = 5.0V, Vref = 4.1V,T = 25°C,Single Sideband)
-20
-15
-10
-5
0
5
0 200 400 600 800 1000 1200 1400 1600
I, Q Input Voltage Level (mVp)
SSB Output Power (dBm)
880 MHz 1960 MHz 2140 MHz
RF2484 PCS CDMA Spectra at Various Output Levels
(ACPR@ 885 kHz, Vcc = 5.0V,Vref = 4.1V,T = 25°C)
-100
-90
-80
-70
-60
-50
-40
-30
-20
1957.5 1958 1958.5 1959 1959.5 1960 1960.5 1961 1961.5 1962 1962.5
Frequency (MHz)
Power (dBm)
CP = -12.9dBm; ACPR = -72 dBc
CP = -14.3dBm; ACPR = -73 dBc
CP = -11.1dBm; ACPR = -71 dBc
R
F2484 Output ChannelPowervs I, Q Input Voltage Level
(Vcc = 5.0V, Vref = 4.1V,T = 25°C,CDMA/W-CDMA Mod.)
-30
-25
-20
-15
-10
-5
250 500 750 1000 1250 1500 1750 2000 2250 2500
I, Q I nputVoltage Level (mVpp)
Output Channel Power (dBm)
880 MHz CDMA Signal
1960 MHz CDMA Signal
2140 MHz W-CDMA Signal
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