The RF2363 is a dual-band Low Noise Amplifier
designed for use as a front-end for 950MHz GSM/
1850 MHz DCS applications and may be used for dualband cellular/PCS applications. The 900MHz LNA is a
single-stage amplifier; the 1900MHz LNA is a 2-stage
amplifier. The part may also be tuned for applications in
other frequency bands. The device has an excellent combination of low noise figure and high linearity at a very low
supply current. It is packaged in a very small industry
standard SOT 8-lead plastic package.
DUAL-BAND 3V LOW NOISE AMPLIFIER
• General Purpose Amplification
• Commercial and Consumer Systems
1.44
1.04
0.15
0.05
0.127
1.59
1.61
2.80
3.00
2.60
3.00
*When Pin 1 is in upper
left, text reads downward
(as shown).
RF Micro Devices, Inc.
7625 Thorndike Road
Greensboro,NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Rev B2 010129
4-199
Page 2
RF2363
Absolute Maximum R atings
ParameterRatingUnit
Supply Voltage-0.5 to +6.0V
Input RF Level+10dBm
Operating Ambient Temperature-40 to +85°C
Storage Temperature-40 to +150°C
DC
Preliminary
Caution! ESD sensitive device.
RF Micro Devices believes thefurnished information iscorrect andaccurate
at the time of this printing. However,RF Micro Devices reserves the right to
make changes to its products without notice. RF Micro Devices does not
assume responsibility for the use of the described product(s).
4
GENERAL PURPOSE
Parameter
Min.Typ.Max.
Specification
UnitCondition
Overall
RF Frequency Range800 to 1000MHz
1800 to 2000MHz
950 MHz Performance
Gain161820dB
Isolation16dBEN1=0V
Gain Step34dBGain - Isolation
Noise Figure1.3dB
AMPLIFIERS
Output IP3+17+24dBm
Input P1dB-10dBm
Reverse Isolation20dB
Input VSWR1.8:12:1No external matchi n g
Output VSWR1.8:12:1With external match as per GSM/DCS Appli-
1850 MHz Performance
Gain2021.524dB
Isolation10dBEN2=0V
Gain Step31.5dBGain - Isolation
Noise Figure1.4dB
Output IP3+16+22dBm
Input P1dB-12dBm
Reverse Isolation30dB
Input VSWR1.7:12:1No external matchi n g
Output VSWR1.7:12:1With external match as per GSM/DCS Appli-
T= 25°C, RF=950MHz, VCC=2.8V,
EN1=2.8 V, EN2=0V
cation Schematic
T= 25°C, RF=1850MHz, VCC=2.8V,
EN2=2.8V,EN1=0V
cation Schematic
LNA Select
“Enable” VoltageV
“Disable” Voltage0V
CC
Power Supply
Voltage2.8VSpecifications
2.5 to 5.0VOperating limits
Current Consumption5mA900MHz LNA Enabled, 1900MHz LNA Dis-
RF output pin for ~900MHz LNA. This pin is an open-collector output. It
must be biased to either V
inductor. It is typically matched to 50Ω with a shunt bias/matching
inductor and series blocking/matching capacitor. Refer to ap plication
schematics.
Ground connection.
NOTE: Ground traces on pins2 and 7 are equivalent to a small amount
of inductance (~0.75nH). The dimension s of these lines are as follows.
Pin 2: L=56mils, W=15mils, H=31mils
Pin 7: L=56mils, W=15mils, H=31mils
Dielectric is FR-4.
or pin 4 through a choke or matching
CC
RF IN1
Pin 7
To Bias
Circuits
RF OUT1
LNA2LNA1
Pin 2
3RFOUT2
4EN1
5EN2
6RFIN2
7GND
8RFIN1
RF output pin for ~1900MHz LNA. This pin is an open-collector output.
It must be biased to either V
inductor. It is typically matched to 50Ω with a shunt bias/matching
inductor and series blocking/matching capacitor. Refer to ap plication
schematics.
Enable pin for ~900MHz LNA . A voltage equal to the supply voltage
LNA. This pin should be disabled (0V) when the ~ 1900MHz LNA is in
use.
Enable pin for ~1900MHz LN A. A voltage equal to the supply voltage
LNA. This pin should be disabled (0V) when the ~900MHz LNA is in
use. See package drawing for description of pin orientation.
RF input pin for ~1900MHz. This pin is matched to approximately 50Ω
at DCS/PCS frequencies. AnexternalAC coupling capacitor is required
at this pin.
Same as pin 2.See pin 2.
RF input pin for~900MHz. This pin is matched to approximately 50Ω at
GSM/Cellular frequencies. An external AC coupling capacitor is
required at this pin.
or pin 4 through a choke or matching
CC
RF IN2
See pin 3.
See pin 3.
See pin 1.
EN2
RF OUT2
4
AMPLIFIERS
GENERAL PURPOSE
Rev B2 010129
4-201
Page 4
RF2363
Preliminary
RF2363 Theory of Operation and Application Information
4
The RF2363 contains two independent low noise
amplifiers which have been optimized for dual-band
applications in the GSM (905MHz to 960MHz) and
DCS (1805MHz to 1880 M Hz) frequency bands. Fabricated using heterojunction bipolar transistor (HBT)
technology, the RF2363 delivers high linear gain at a
very low noise figure and low power consumption.
Internal temperature compensation keeps the gain
tightly controlled over temperature extremes (typically
less than 1dB of gain variation from -40°C to +85°C at
2.8 V). A 50Ω input impedance allows the part to be
connected to standard receiver front end filters without
additional matching components.
MODE CONTROL
The RF2363 incorporates two enable pins (EN1 and
EN2) for biasing the desired LNA according to the table
AMPLIFIERS
below.
GENERAL PURPOSE
EN1EN2Mode
GNDGNDPower Down
GNDVCC1900MHz LNA On
VCCGND900MHz LNA On
900MHz LNA
The 900MHz LNA is a single-stage, common emitter
amplifier. Since the input pin contains a DC bias, an AC
coupling capacitor is required at this pin. An external
bias inductor from the output pin (RF OUT1) to VCC
provides DC biasing for the amplifier transistor and
assists in matching the output impedance to the next
receiver stage. A capacitor having a good RF bypass
characteristic at the frequency of operation should be
placed as close as possible to the supply voltage side
of the bias inductor; a low frequency bypass capacitor
should also be included. The EN1 pin supplies VCC to
the bias circuits of the LNA and should also be effectively bypassed with both low and high frequency
capacitors.
1900MHz LNA
The 1900MHz LNA is implemented by two common
emitter stages in cascade. The first stage is biased
through an external inductor at the EN2 pin. This
inductor also acts as an interstage match; a resistor in
parallel with the inductor is recommended to 'de-Q' the
inductor, thus providing a broader band interstage
match. An external bias inductor from the output pin
(RF OUT2) to VCC provides DC biasing for the second
stage transistor and assists in matching the output
impedance to the next r eceiver stage. Low and high
frequency bypass capacitors should be used on the
supply side of both the EN2 and RF OUT2 bias inductors. An AC coupling capacitor is required at the RF
IN2 pin.
LAYOUT CONSIDERATIONS
To provide optimal balance of gain and linearity, a small
amount of inductance is required in the ground traces
of the PCB. The recommended inductance is between
0.5 and 1.0nH, with 0.75nH used on the Evaluation
Board. Depending on the application, more gain with
less linearity or more linearity with less gain may be
desired. Appropriate adjustment of the ground inductance can accomplish these objectives. Minimizing the
ground inductance will maximize the gain at the
expense of linearity while increasing the ground inductance will increase the linearity at the expense of gain.
It is important to remember that the pin 7 ground inductance affects the performance of both LNAs, while the
pin 2 ground inductance affects only the 1900MHz
LNA.
4-202
Rev B2 010129
Page 5
Preliminary
EN1
EN2
RF IN2
RF IN1
Application Sche matic (GSM/DCS)
100 pF10 nF
47 pF10 nF
1k
3.9 nH47 pF10 nF
Ω
5
22 nF
6
7
22 nF
81
Note orientationof
package inthis schematic.
4
3
2
12 nH
100 pF10 nF
3.3 nH
2pF
RF2363
V
CC
RF OUT2
1pF
4
RF OUT1
V
CC
AMPLIFIERS
GENERAL PURPOSE
Evaluation Board Schemati c
(Download Bill of Materials from www.rfmd.com.)
EN1
EN2
C12
10 nF
J3
RF IN2
J4
RF IN1
Notes:
Ground traceson pins 2 and 7 are equivalent to a small
amount ofinductance (-1 nH). The dimensions of these
lines areas follows.